JPH0790520B2 - Ceramic substrate dividing device - Google Patents

Description

The present invention relates to a method for dividing a ceramic substrate.

[Prior Art] In a ceramic substrate, a large number of individual pieces of a final shape are continuously provided in a vertical and horizontal direction on a rectangular substrate through dividing lines.
A circuit pattern is printed on each individual piece. And
After mounting chip parts such as ICs, diodes, capacitors, etc. on each individual piece, the rectangular ceramic board is divided into strips, and then the strips are divided into individual pieces of the final shape. Although there is a machine, it lacks reliability and versatility, so these series of divisions were mostly done manually.

[Problems to be Solved by the Invention] However, in the past, it was inefficient because the ceramic substrate was divided by hand, and the ceramics on which the chip parts were mounted by the fingers of the operator due to the manual work. There was a reliability problem because it touched the substrate.

The present invention is a method for solving such a problem, and a ceramic substrate dividing method capable of surely dividing a ceramic substrate without impairing the electrical characteristics of an IC chip, a resistor, a capacitor, etc. mounted on a ceramic substrate body. The purpose is to provide.

[Means for Solving the Problem] The present invention is provided with a pusher 1 and a conveying means 4 for conveying a ceramic substrate 2 having an initial shape, and a dividing line 3 of the ceramic substrate 2 provided at an end portion of the conveying means 4. In order to divide the dividing line 3 into the fulcrum pins 6 in the dividing rotor 5 and the circuit board 2 whose lower surface is supported by the fulcrum pins 6 in order to obtain a plurality of circuit boards 2 from the dividing lines 3. And a split pin 7 attached to the outer circumference of the split rotor 5 so as to apply a force in the swing direction to the upper surface of the circuit board 2, and an elastic body 9 is applied to the outer circumference of the split pin 7. It is a device for dividing a ceramic substrate.

[Operation] To describe the divided state of the ceramic substrate, the ceramic substrate is supplied onto the ceramic substrate transport guide with the dividing line upward.

When the pusher required for transport moves in the direction of the arrow, the ceramic substrate is transported to the split rotor side, and the split pin is moved to the position indicated by the alternate long and short dash line in FIGS. 3 (A), 3 (B) and 3 (C). When the ceramic substrate is displaced, a force in the swing direction is applied to the edge of the ceramic substrate, and the pressing pressure of the dividing pins is concentrated and divided on the dividing line of the ceramic substrate (FIGS. 3A and 3B).
(C)).

That is, it is possible to divide the ceramic substrate into dummy and separate pieces. The divided individual piece ceramic substrate is conveyed to the discharge guide.

Since the outer circumference of the split pin is made of an elastic body, even if a circuit element such as an IC chip, a resistor, or a capacitor is mounted on the substrate body, it can be split without impairing the electrical characteristics of each of these elements, and Burrs are less likely to occur.

[Examples] The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic side view showing a state before division of an embodiment of a ceramic substrate dividing method according to the present invention, and FIG. 2 is a schematic side view showing an operating state at the time of division of an embodiment of a ceramic substrate dividing method according to the present invention. (A) is an explanatory view showing a divided state of the dummy, FIG. 3 (B) is an explanatory view showing a divided state of the individual piece, and FIG. 3 (C) is a divided state when the dummy is on both sides of the substrate. It is an explanatory view shown.

In FIG. 1, reference numeral 1 is a pusher for conveying a ceramic substrate, 2 is a ceramic substrate conveyed by the pusher, 3 is a divided V-shaped groove portion of the substrate, 4 is a substrate guide, 5 is a divided rotor, 6 is a fulcrum pin, Reference numeral 7 is a split pin that moves around a fulcrum, and an elastic body 9 is attached to the outer circumference.

In FIG. 3 (A), 10 is a dummy of the ceramic substrate, FIG. 3 (B) is an individual piece of the ceramic substrate, and FIG. 3 (C) is a dummy on both sides of the ceramic substrate. ing.

[Effects of the Invention] As is clear from the above description, according to the present invention, the following excellent effects are exhibited.

That is, by aligning the position of the divided V-shaped groove portion of the ceramic substrate with the fulcrum pin and applying a force in the swing direction to the substrate edge with the dividing pin, dummy division and individual piece division can be advantageously performed along the scribe line.

Further, it is possible to automate the dummy division and the individual one-side division of the double-sided mounting board, and the division accuracy (burr accuracy) is improved.

Further, since the outer circumference of the split pin is made of an elastic body, it can be split without damaging the ceramic substrate. Moreover, the cost for dividing the ceramic substrate can be reduced, and since the divided shape is stable and there is no odd-shaped product, there are great advantages that there is no trouble for the mount user.

[Brief description of drawings]

The drawings show the outline of a substrate dividing mechanism for carrying out the present invention. FIG. 1 is a schematic side view showing a state before division of an embodiment of a ceramic substrate dividing method according to the present invention, and FIG. 2 is a ceramic substrate dividing method according to the present invention. FIG. 3 (A) is a schematic side view showing an operating state during division of an example, FIG. 3 (A) is an explanatory view showing a dummy division state, FIG. 3 (B) is an explanatory view showing a division state of individual pieces, and FIG. 3 (C). 6] is an explanatory view showing a divided state when there are dummies on both sides of the substrate. 3 to split V-shaped groove of ceramic substrate 5 to split rotor 6 to fulcrum pin 7 to split pin 9 to elastic body

Claims (2)

[Claims] 1. A pusher 1 and a conveying means 4 for conveying a ceramic substrate, and an end portion of the conveying means 4, which is provided on an end portion of the conveying means 4 and acts on a dividing line 3 of the ceramic substrate 2. In order to divide the fulcrum pin 6 of the split rotor 5 for obtaining the circuit board 2 and the circuit board 2 whose lower surface is supported by the fulcrum pin 6 from the dividing line 3, a force in the swing direction is applied to the upper surface of the circuit board 2. Split rotor 5 to add
A dividing device for a ceramic substrate, comprising: a dividing pin 7 attached to the outer circumference of the. 2. The ceramic substrate dividing device according to claim 1, wherein an elastic body 9 is provided on an outer periphery of the dividing pin 7.