JPH0793397B2 - Electronic computer cooling system - Google Patents
Electronic computer cooling systemInfo
- Publication number
- JPH0793397B2 JPH0793397B2 JP62086663A JP8666387A JPH0793397B2 JP H0793397 B2 JPH0793397 B2 JP H0793397B2 JP 62086663 A JP62086663 A JP 62086663A JP 8666387 A JP8666387 A JP 8666387A JP H0793397 B2 JPH0793397 B2 JP H0793397B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- electronic computer
- corrosion
- cooling water
- cooling liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子計算機の冷却装置に係り、特に冷却装置の
部材の腐食状態がモニタリングされ、耐食信頼性の大き
い冷却装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic computer, and more particularly to a cooling device having a high corrosion resistance by monitoring the corrosion state of members of the cooling device.
電子計算機は年々、高密度，大容量化されるに従い、半
導体LSIの発熱密度が大幅に上昇する傾向にある。従
来、電子計算機の冷却方式は、フアンにより風を内部に
送り込む所謂強制空冷方式が用いられて来た。しかし、
上述の如く電子計算機の大容量化に伴ない発熱量が増え
ているため、強制空冷から液体冷却が必要になつて来
た。As the density and capacity of electronic computers increase year by year, the heat generation density of semiconductor LSIs tends to increase significantly. Conventionally, a so-called forced air cooling method has been used as a cooling method for an electronic computer, in which wind is blown inside by a fan. But,
As described above, the amount of heat generated is increasing with the increase in capacity of electronic computers, so that liquid cooling has become necessary from forced air cooling.
従来の液体による冷却方式は、特開昭60−160149号，特
開昭60−160150号，特開昭52−16981号等に開示されて
いるように、LSI発熱素子を効率良く冷却することを主
体としたものである。液体による冷却方式として、第２
図に示すような可撓ベローズを有する冷却構造体が知ら
れている。即ち、可撓性を有するステンレス鋼或いはニ
ツケル製のベローズ１に冷却水ヘツダ２、及び冷却板３
（例えばSiC）からなる構成部材を接合し、冷却水を流
す。また基板５上に設置されたLSIチツプ４を冷却板３
に接触させ、LSIチツプ４の発熱を冷却板３に熱伝達
し、更に冷却板３を冷却液によつて冷却し、除熱がなさ
れる。ここで冷却液としては種々の観点から水が最も一
般的に用いられる。A conventional liquid cooling method is to cool an LSI heating element efficiently, as disclosed in JP-A-60-160149, JP-A-60-160150, JP-A-52-16981 and the like. It is mainly used. The second cooling method using liquid
A cooling structure having a flexible bellows as shown in the figure is known. That is, a flexible stainless steel or nickel bellows 1, a cooling water header 2, and a cooling plate 3 are provided.
The constituent members made of (for example, SiC) are joined, and cooling water is flown. In addition, the LSI chip 4 installed on the substrate 5 is attached to the cooling plate 3.
, The heat of the LSI chip 4 is transferred to the cooling plate 3, and the cooling plate 3 is further cooled by a cooling liquid to remove heat. Here, water is most commonly used as the cooling liquid from various viewpoints.
この冷却構造体は種々の材流で構成されている。このた
め、これらの各種の構成材料はハンダ若しくはロウ材料
により接合される。この接合は冷却構造体の組立及び補
修等のために融点の異なつた数種のハンダが使用され
る。例えば、第２図に示す冷却構造体において３種類の
接合部があり、ベローズ１と冷却板３との接合部Ａには
Au−Ge（融点365℃）、冷却水路本体とベローズ１との
接合部ＢにはIn−Ag−Pb（融点149℃）、及び冷却ヘツ
ダフタと冷却水ヘツダ２との接合部ＣにはSn−Ag（融点
221℃）のハンダが使用される。構成部材はこれらのハ
ンダにより水密に接合され、冷却水が流される。This cooling structure is composed of various material streams. Therefore, these various constituent materials are joined by solder or brazing material. In this joint, several kinds of solder having different melting points are used for assembling and repairing the cooling structure. For example, in the cooling structure shown in FIG. 2, there are three kinds of joints, and the joint A between the bellows 1 and the cooling plate 3 is
Au-Ge (melting point 365 ° C), In-Ag-Pb (melting point 149 ° C) at the joint B between the cooling water channel body and the bellows 1, and Sn-at the joint C between the cooling header and the cooling water header 2. Ag (melting point
221 ° C) solder is used. The components are watertightly joined by these solders, and cooling water is flowed.
冷却構造体において、上記接合部は異種の金属材料が接
触された状態で冷却水にさらされることになり、これら
の金属の電位差に起因する異種金属接触腐食が発生す
る。本発明者らの検討によれば、純水中における冷却装
置の構成部材、例えばステンレス鋼，ニツケル等は腐食
速度が約0.1μm/Yと非常に小さいのに対し、上記接合部
材、例えばハンダ材，ロウ材等をステンレス鋼と接触し
た場合の接合部の腐食速度は約100μm/Yと非常に大き
い。このために冷却構造体の耐食信頼性は上記冷却構成
材料の接合部の耐食性によつて大きく左右される。In the cooling structure, the joint portion is exposed to cooling water in a state where different kinds of metal materials are in contact with each other, and corrosion of different kinds of metal due to a potential difference between these metals occurs. According to the study by the present inventors, the corrosion rate of the components of the cooling device in pure water, such as stainless steel and nickel, is very small, about 0.1 μm / Y. When the brazing material comes into contact with stainless steel, the corrosion rate of the joint is about 100 μm / Y, which is extremely high. For this reason, the corrosion resistance of the cooling structure is greatly influenced by the corrosion resistance of the joint portion of the cooling constituent materials.
また、冷却水としては、不純物例えばCl-イオン等が含
まれていると冷却構成材料の腐食が促進されるので、不
純物の極度に除かれた純水が使用される。また、この純
水中の溶存酸素が可能な限り低濃度に抑えられることに
より一層防食効果が期待される。しかし、この様な純水
が用いられても上記接合部材料は他の構成部材の材料に
比し耐食性が劣ることは否定されない。Further, as the cooling water, if impurities such as Cl − ions are contained, corrosion of the cooling constituent material is promoted, so pure water free of impurities is used. Further, by suppressing the dissolved oxygen in this pure water to the lowest possible concentration, a further anticorrosion effect is expected. However, even if such pure water is used, it cannot be denied that the above-mentioned joining material is inferior in corrosion resistance to the materials of other constituent members.
また、最近開発されている大型電子計算機ではその性能
の優れている点もさることながら、信頼性が極めて重要
である。このために冷却装置の構成材料の腐食、特に接
合部の異常腐食（異種金属接触腐食）に伴なう冷却水の
漏洩は致命的な問題になつている。In addition, reliability is extremely important in a large-scale computer that has been recently developed, in addition to its excellent performance. For this reason, the leakage of the cooling water due to the corrosion of the constituent materials of the cooling device, particularly the abnormal corrosion of the joint (corrosion of dissimilar metals) has become a fatal problem.
上記従来技術の水冷却装置は、電子計算機の発熱部を冷
却する装置であるが、冷却装置材料の腐食、特に接合部
の異常腐食の検知、及びその対策については全く配慮さ
れておらず、耐食信頼性に問題があつた。従つて、本発
明の目的は上記従来技術の問題点を解決し、耐食信頼性
の高い電子計算機の冷却装置を提供することにある。The above-mentioned water cooling device of the prior art is a device that cools the heat generating part of the electronic computer, but corrosion of the cooling device, particularly detection of abnormal corrosion of the joint, and measures against it are not considered at all, corrosion resistance There was a problem with reliability. Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art and to provide a cooling device for a computer having high corrosion resistance and reliability.
本発明の電子計算機の冷却装置は、複数個の半導体を備
えたモジユールに冷却液を供給してなる電子計算機冷却
装置において、前記半導体素子に接して冷却構造体が設
けられ、前記冷却構造体の内部の構成部材、特に接合部
の部材が冷却液により腐食されて溶存される部材成分を
測定する測定装置、及び前記冷却構造体の部材成分の異
常腐食をモニタリングするモニタリング装置が設けられ
た装置である。A cooling device for an electronic computer of the present invention is an electronic computer cooling device in which a cooling liquid is supplied to a module having a plurality of semiconductors, wherein a cooling structure is provided in contact with the semiconductor element, In a device provided with a measuring device for measuring the internal components, particularly the components of the joint, which are corroded by the cooling liquid and measuring the dissolved component components, and a monitoring device for monitoring abnormal corrosion of the component components of the cooling structure. is there.
また、本冷却装置の前記測定装置は電気伝導度測定装置
又は／及びイオン分析装置が使用され、また前記冷却構
造体の部材がステンレス鋼，ニツケル等であり、その部
材の接合部の材質はAu−Ge,Sn−Ag,In−Ag−Pb等からな
るハンダ材、あるいはロウ材が用いられる。Further, the measuring device of the present cooling device is an electric conductivity measuring device and / or an ion analyzer, and the member of the cooling structure is stainless steel, nickel, etc., and the material of the joint portion of the member is Au. A solder material or a brazing material made of -Ge, Sn-Ag, In-Ag-Pb or the like is used.
また、前記モニタリング装置は、前記測定装置の測定値
に応じて冷却液を浄化装置に導入する制御装置、及び前
記冷却構造体の部材の異常腐食を表示する警報装置に接
続されており、更に冷却液の純度測定値に応じて自動的
に冷却液を通常の循環流路から浄化装置への導流路に切
り換える流路制御装置に接続されていることが好適であ
る。Further, the monitoring device is connected to a control device that introduces a cooling liquid into the purifying device according to the measurement value of the measuring device, and an alarm device that displays abnormal corrosion of the member of the cooling structure, and further cooling It is preferable that the cooling liquid is connected to a flow passage control device that automatically switches the cooling liquid from a normal circulation flow passage to a guiding flow passage to the purification device according to the measured value of the purity of the liquid.
尚、電子計算機の冷却液系統の特定場所に冷却液の電気
伝導側定装置やイオン分析装置が備えられる。その特定
場所は冷却液が電子計算機を出た後の流路で、冷却液の
浄化装置の前が望ましい。この浄化装置としてイオン交
換樹脂塔及び脱酸素樹脂塔が設けられる。冷却液として
防食の点から純水が使用されるが、腐食により生成した
イオン類及びリークにより混入される酸素は浄化装置で
除去され、冷却水の純度が一定に保たれるようにされ
る。In addition, a cooling liquid electric conduction side measuring device and an ion analyzing device are provided at a specific location of the cooling liquid system of the electronic computer. The specific place is the flow path after the cooling liquid exits the computer, and is preferably in front of the cooling liquid purifying device. An ion exchange resin tower and a deoxygenating resin tower are provided as this purifying device. Pure water is used as the cooling liquid from the viewpoint of anticorrosion, but the ions generated by the corrosion and the oxygen mixed by the leak are removed by the purifying device so that the purity of the cooling water is kept constant.
本発明は、冷却液系統に設けられたイオン分析装置によ
り、冷却液、特に冷却水中の個々のイオン量をイオン種
別に連続的に測定する。この測定により特定のイオン種
が増えつづけると構成金属材料との関連で、冷却液系統
のどの部位に使われている材料の腐食が激しいか推定で
きる。更に、材料の組成比と冷却液中に溶出されたイオ
ン種の量を対比することにより、金属材料のある種の成
分のみが溶出される選択腐食などの異常腐食が察知され
る。即ち、通常の状態では冷却装置の構成部材は腐食に
より溶出されるイオン成分量が極く微量であるが、接合
部材料は腐食され易いので、その接合部の部材成分の溶
出が著しく大きくなる。この冷極構造体の接合には、成
分の異なつた数種のハンダ材が使用されているので、腐
食により冷却液中に溶出された成分の種類及び量を測定
解析することにより、腐食部の位置及び腐食状況を推測
することができる。例えば接合部ハンダの異種金属接触
腐食により溶出されたハンダ成分が測定され、Pb、Sn,I
n,Ag,Ge等が連続的に測定，解析される。各ハンダ特有
の成分検出により、どの部位の接合個所に異種金属接触
腐食が発生しておるかが推測される。According to the present invention, the amount of individual ions in the cooling liquid, particularly in the cooling water, is continuously measured for each ion type by the ion analyzer provided in the cooling liquid system. As a result of this measurement, if the number of specific ionic species continues to increase, it is possible to estimate in which part of the coolant system the material used in the coolant system is severely corroded in relation to the constituent metal materials. Further, by comparing the composition ratio of the material with the amount of ionic species eluted in the cooling liquid, abnormal corrosion such as selective corrosion in which only certain components of the metal material are eluted can be detected. That is, in a normal state, the constituent members of the cooling device have a very small amount of ionic components eluted by corrosion, but the joint material is easily corroded, so that the component components of the joint are significantly eluted. Since several types of solder materials with different components are used for joining this cold electrode structure, by measuring and analyzing the type and amount of the components eluted in the coolant due to corrosion, The location and corrosion situation can be inferred. For example, the solder components eluted due to the corrosion of dissimilar metals in the joint solder are measured, and Pb, Sn, I
n, Ag, Ge, etc. are continuously measured and analyzed. By detecting the component peculiar to each solder, it is presumed at which part of the joint where the dissimilar metal contact corrosion occurs.
また、電気伝導度測定装置により冷却液の電気伝導度を
測定して、冷却装置材料全体の平均的な腐食量が同時に
検出される。水中における電気伝導度は水中におけるイ
オンにより電子が運ばれることにより行なわれる。従つ
て冷却水の電気伝導度が高くなることは、水中に存在す
るイオン量が増えることに対応する。冷却水中のイオン
は水の解離によるH+,OH-の他に冷却装置構成材料の腐食
に伴なつて溶出される金属イオンに依存する。すなわ
ち、冷却装置構成材料の腐食と冷却水の電気伝導度の相
関関係を予め把握しておいて、電気伝導度の変化を連続
測定することにより、冷却装置の部材の腐食の総量を知
り、腐食程度が検出される。Further, the electric conductivity of the cooling liquid is measured by the electric conductivity measuring device, and the average amount of corrosion of the entire cooling device material is simultaneously detected. The electrical conductivity in water is achieved by the electrons carried by the ions in the water. Therefore, the increase in the electric conductivity of the cooling water corresponds to the increase in the amount of ions existing in the water. Ions in the cooling water depend not only on H + and OH − due to the dissociation of water, but also on the metal ions eluted along with the corrosion of the components of the cooling device. That is, the correlation between the corrosion of the cooling device constituent material and the electric conductivity of the cooling water is grasped in advance, and the total amount of corrosion of the members of the cooling device is known by continuously measuring the change in the electric conductivity. The degree is detected.
上記のようにイオン分析装置及び電気伝導度測定装置か
らの測定値をモニタリング装置で測定値と比較し、測定
値が設定値より大きくなれば、冷却液は自動的に通常の
流路から切り換えて浄化装置に送られ、冷却液中の金属
イオン，溶存酸素をイオン交換樹脂や脱酸素樹脂により
除去する。これに併せて冷却液中に溶存する金属イオン
量が多くなれば警報装置に表示し、冷却装置部材の点
検，補修を早急に耐策できる。従つて電子計算機の冷却
装置に電気伝導度測定系及びイオン分析系、これに加え
て浄化装置を作動させるモニタリング装置が設けられて
いるので、電子計算機の冷却装置は高い信頼性を有し得
る。As described above, the measured values from the ion analysis device and electric conductivity measurement device are compared with the measured values by the monitoring device, and if the measured value becomes larger than the set value, the cooling liquid is automatically switched from the normal flow path. The metal ions and dissolved oxygen in the cooling liquid sent to the purifier are removed by the ion exchange resin and the deoxygenating resin. Along with this, if the amount of metal ions dissolved in the cooling liquid increases, an alarm is displayed and an alarm and inspection of the cooling device members can be promptly taken. Therefore, since the cooling device for the electronic computer is provided with the electric conductivity measuring system and the ion analyzing system, and in addition to this, the monitoring device for operating the purifying device, the cooling device for the electronic computer can have high reliability.
本発明の電子計算機の冷却装置を第１図に示す。冷却水
６は電気伝導度0.1μs/cmの高純度の純水が使用され
る。この冷却水６はポンプ７により電子計算機８の複数
個の半導体を備えたモジユールの冷却部に送られ、熱交
換されて発熱したLSI素子は冷却されると同時に、冷却
水６は昇温され、冷却水タンク９に流入される。冷却水
タンク９内には冷凍機10に連結された熱交換器11が設け
られており、電子計算機内の発熱体を冷却して昇温され
た冷却水６は冷却水タンク９の中で再び冷却される。次
いで冷却水タンク９から出た冷却水６は再び流量制御装
置17で制御され、電子計算機８の冷却部に送られる。こ
のとき、冷却水６はその一部が冷却水分岐バルブ12でサ
ンプリング流路の冷却水サンプリング管13を通つて電気
伝導度測定装置14に導入され、冷却水６の電気伝導度が
測定される。次いで冷却水６はイオン分析装置15に導入
され、冷却水６の中のイオンの種類と測定され、測定後
の水はドレン管16から排出される。その電気伝導度によ
り冷却水６中に溶存する金属量が分析されて腐食量が検
出される。また、イオン分析により、例えば冷却水６中
のInが多量に検出された場合は、冷却水ヘツダフタと冷
却水ヘツダ本体２との接合部Ｃ（第２図参照）、或いは
Snが多量に検出された場合は冷却水流路本体２とベロー
ズ１との接合部13（第２図参照）、或いはGeが多量に検
出された場合はベローズ１と冷却板３との接合部Ａ（第
２図参照）の腐食が異常に進行されていることが検知さ
れる。尚、サンプリングされる冷却水６は極めて少量
で、ドレン管16から放出されても影響は余り無い。FIG. 1 shows a cooling device for an electronic computer according to the present invention. As the cooling water 6, high-purity pure water having an electric conductivity of 0.1 μs / cm is used. This cooling water 6 is sent by a pump 7 to a cooling unit of a module equipped with a plurality of semiconductors of an electronic computer 8 to cool the LSI element which has been heat-exchanged to generate heat, and at the same time, the cooling water 6 is heated. It flows into the cooling water tank 9. A heat exchanger 11 connected to the refrigerator 10 is provided in the cooling water tank 9, and the cooling water 6 that has been heated by cooling the heat generating element in the electronic computer is again stored in the cooling water tank 9. To be cooled. Next, the cooling water 6 discharged from the cooling water tank 9 is again controlled by the flow rate control device 17 and sent to the cooling section of the electronic computer 8. At this time, a part of the cooling water 6 is introduced into the electric conductivity measuring device 14 through the cooling water branch valve 12 through the cooling water sampling pipe 13 of the sampling flow path, and the electric conductivity of the cooling water 6 is measured. . Next, the cooling water 6 is introduced into the ion analyzer 15, the type of ions in the cooling water 6 is measured, and the measured water is discharged from the drain pipe 16. The amount of metal dissolved in the cooling water 6 is analyzed by the electric conductivity, and the amount of corrosion is detected. Further, when a large amount of In in the cooling water 6 is detected by ion analysis, for example, the joint C between the cooling water header and the cooling water header 2 (see FIG. 2), or
When a large amount of Sn is detected, the joint 13 between the cooling water flow path body 2 and the bellows 1 (see FIG. 2), or when a large amount of Ge is detected, the joint A between the bellows 1 and the cooling plate 3 It is detected that the corrosion (see FIG. 2) has progressed abnormally. The cooling water 6 to be sampled is extremely small, and even if it is discharged from the drain pipe 16, it has little effect.
また、電気伝導度測定装置14及びイオン分析装置15には
制御装置18が接続され、電気伝導度及びイオン分析測定
値が入力される。また制御装置は冷却水６を浄化装置20
に導入する流量制御バルブ19、及び冷却水６の循環路の
流量制御バルブ17に接続される。制御装置18には予めイ
ンプツトされた基準とされる電気伝導度及びイオン種の
量と腐食との相関関係により、測定された電気伝導度及
びイオン種の量から腐食状態が解析される。若し解析に
より測定された冷却水６の電気伝導度及びイオン種の量
が設定値以上になつたとき、制御装置18の指示により流
量制御バルブ17を閉じ、流量制御バルブ19を開き、冷却
水６は浄化装置20に導入される。浄化装置20はイオン交
換樹脂、及び脱酸素樹脂が充填され、冷却水６中の金属
イオンや溶存酸素が除去される。冷却水６は浄化装置20
で浄化され、ポンプ７により電子計算機８の冷却部に送
られる。また、再び冷却水６の電気伝導度及びイオン量
が設定値以下に戻れば、制御装置18の制御により自動的
に流量制御バルブ17を開き、流量制御バルブ19を閉じ、
冷却水６は通常の冷却系路に流され、電子計算機８は冷
却される。Further, a control device 18 is connected to the electric conductivity measuring device 14 and the ion analyzing device 15, and the electric conductivity and the ion analysis measurement value are input. In addition, the controller controls the cooling water 6 to the purifying device 20.
It is connected to a flow rate control valve 19 which is introduced into the tank and a flow rate control valve 17 in the circulation path of the cooling water 6. The control device 18 analyzes the corrosion state from the measured electrical conductivity and the amount of ionic species based on the correlation between the electrical conductivity and the amount of ionic species and the corrosion, which are used as a reference and are previously filled. If the electric conductivity and the amount of ionic species of the cooling water 6 measured by the analysis reach or exceed the set values, the flow control valve 17 is closed and the flow control valve 19 is opened according to the instruction of the control device 18, 6 is introduced into the purification device 20. The purifying device 20 is filled with an ion exchange resin and a deoxidizing resin to remove metal ions and dissolved oxygen in the cooling water 6. Cooling water 6 is purification device 20
And is sent to the cooling unit of the electronic computer 8 by the pump 7. When the electric conductivity and the amount of ions of the cooling water 6 are returned to the set values or less, the flow control valve 17 is automatically opened and the flow control valve 19 is closed by the control of the control device 18.
The cooling water 6 is caused to flow through the normal cooling system path, and the electronic computer 8 is cooled.
更に、制御装置18には警報装置21が付帯される。制御装
置18により電気伝導度の積算値が計算され、これにより
冷却水６中の溶存する金属濃度から冷却装置材料の腐食
総量が警報装置21に表示される。同時に、制御装置18に
よりイオン種の解析結果及びイオン量の積算値の解析結
果から、冷却装置の腐食された接合部、及びその接合部
の材料の異常腐食について警報が表示される。Further, the control device 18 is provided with an alarm device 21. The control device 18 calculates the integrated value of the electric conductivity, whereby the total corrosion amount of the cooling device material is displayed on the alarm device 21 from the concentration of the dissolved metal in the cooling water 6. At the same time, the control device 18 displays an alarm about the corroded joint of the cooling device and the abnormal corrosion of the material of the joint from the analysis result of the ion species and the analysis result of the integrated value of the ion amount.
本発明の電子計算機の冷却装置は、冷却液の電気伝導度
測定値及びイオン分析装置が設けられて冷却装置の構成
部材の腐食状況、特に異常腐食を検出し、モニタリング
装置により冷却液の浄化、及び警報を表示するように構
成されているので、冷却系統の腐食による冷却液の漏洩
等のトラブルを事前に予測して対策することが可能とな
り、極めて高い信頼性を有する冷却装置にすることがで
きる。The cooling device of the electronic computer of the present invention is provided with an electric conductivity measurement value and an ion analysis device of the cooling liquid, detects the corrosion state of the constituent members of the cooling device, particularly abnormal corrosion, and purifies the cooling liquid by the monitoring device. Also, since it is configured to display an alarm, it becomes possible to predict and take measures against troubles such as leakage of the cooling liquid due to corrosion of the cooling system in advance, and it is possible to provide a cooling device with extremely high reliability. it can.
第１図は本発明の電子計算機の冷却装置の構成図を示
し、第２図は可撓ベローズ水冷却構造体の断面図を示
す。 １……ベローズ、２……冷却水ヘツダ、３……冷却板、
４……LSIチツプ、５……基板、６……冷却水、７……
ポンプ、８……電子計算機、９……冷却水タンク、10…
…冷凍機、14……電気伝導度測定装置、15……イオン分
析装置、18……制御装置（モニタリング装置）、20……
浄化装置、21……警報装置、A,B,C……接合部。FIG. 1 is a block diagram of a cooling device for a computer according to the present invention, and FIG. 2 is a sectional view of a flexible bellows water cooling structure. 1 ... Bellows, 2 ... Cooling water head, 3 ... Cooling plate,
4 ... LSI chip, 5 ... Substrate, 6 ... Cooling water, 7 ...
Pump, 8 ... Electronic computer, 9 ... Cooling water tank, 10 ...
… Refrigerator, 14 …… Electrical conductivity measuring device, 15 …… Ion analyzer, 18 …… Control device (monitoring device), 20 ……
Purification device, 21 …… Alarm device, A, B, C …… Joint part.
Claims (5)
液を供給してなる電子計算機の冷却装置において、前記
半導体素子に接して冷却構造体が設けられ、前記冷却構
造体の内部の構成部材が冷却液により腐食されて溶存さ
れる部材成分を測定する測定装置、及び前記冷却構造体
の部材成分の異常腐食をモニタリングするモニタリング
装置が設けられていることを特徴とする電子計算機の冷
却装置。1. A cooling device for an electronic computer, comprising a module comprising a plurality of semiconductors, supplied with a cooling liquid, wherein a cooling structure is provided in contact with the semiconductor element, and a component inside the cooling structure is provided. A cooling device for an electronic computer, comprising: a measuring device that measures a component component that is corroded by a cooling liquid and is dissolved; and a monitoring device that monitors abnormal corrosion of the component component of the cooling structure.
装置が電気伝導度測定装置又は／及びイオン分析装置で
あることを特徴とする電子計算機の冷却装置。2. A cooling device for an electronic computer according to claim 1, wherein the measuring device is an electric conductivity measuring device and / or an ion analyzing device.
て、前記冷却構造体の部材がステンレス鋼、ニツケルで
あり、その部材の接合部がAu−Ge,Sn−Ag,In−Ag−Pbか
らなるハンダ材又はロウ材であることを特徴とする電子
計算機の冷却装置。3. The member according to claim 1 or 2, wherein the member of the cooling structure is stainless steel or nickel, and the joint portion of the member is Au-Ge, Sn-Ag, In-Ag-. A cooling device for a computer, which is a solder material or a brazing material made of Pb.
かの項において、前記モニタリング装置が、前記測定装
置の測定値に応じて冷却液を浄化装置に導入する制御装
置、及び前記冷却構造体の部材の異常腐食を表示する警
報装置に接続されたことを特徴とする電子計算機の冷却
装置。4. The control device according to any one of claims 1 to 3, wherein the monitoring device introduces a cooling liquid into the purification device according to a measurement value of the measurement device, and A cooling device for a computer, which is connected to an alarm device for displaying abnormal corrosion of a member of a cooling structure.
タリング装置は、冷却液の純度測定値に応じて自動的に
冷却液を通常の循環流路から浄化装置への導流路へ切り
換える流路制御装置に接続されていることを特徴とする
電子計算機の冷却装置。5. The flow device according to claim 4, wherein the monitoring device automatically switches the cooling liquid from a normal circulation flow path to a guiding flow path to the purification device in accordance with a measured value of the purity of the cooling liquid. A cooling device for an electronic computer, which is connected to a road control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62086663A JPH0793397B2 (en) | 1987-04-08 | 1987-04-08 | Electronic computer cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62086663A JPH0793397B2 (en) | 1987-04-08 | 1987-04-08 | Electronic computer cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63251779A JPS63251779A (en) | 1988-10-19 |
| JPH0793397B2 true JPH0793397B2 (en) | 1995-10-09 |
Family
ID=13893271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62086663A Expired - Lifetime JPH0793397B2 (en) | 1987-04-08 | 1987-04-08 | Electronic computer cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793397B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07117330B2 (en) * | 1989-12-19 | 1995-12-18 | 株式会社日立製作所 | Electronic computer cooling system |
| JP4317722B2 (en) * | 2003-08-28 | 2009-08-19 | 浜松ホトニクス株式会社 | Solid state laser equipment |
| JP2006312154A (en) * | 2005-05-09 | 2006-11-16 | Toshiba Mitsubishi-Electric Industrial System Corp | Cooling water device |
| JP4809377B2 (en) * | 2008-01-10 | 2011-11-09 | 富士通株式会社 | Cooling system for electronic equipment |
| WO2019167232A1 (en) * | 2018-03-01 | 2019-09-06 | 東芝三菱電機産業システム株式会社 | Cooling device and method for treating cooling water |
| CN118684385B (en) * | 2024-07-22 | 2026-03-17 | 宁波汉杰特液体分离技术有限公司 | A coolant purification resin, a purification resin column, and its application. |
-
1987
- 1987-04-08 JP JP62086663A patent/JPH0793397B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63251779A (en) | 1988-10-19 |
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