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JPH0798718B2 - Liquid phase epitaxial growth system - Google Patents
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JPH0798718B2 - Liquid phase epitaxial growth system - Google Patents

Liquid phase epitaxial growth system

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Publication number
JPH0798718B2
JPH0798718B2 JP62332686A JP33268687A JPH0798718B2 JP H0798718 B2 JPH0798718 B2 JP H0798718B2 JP 62332686 A JP62332686 A JP 62332686A JP 33268687 A JP33268687 A JP 33268687A JP H0798718 B2 JPH0798718 B2 JP H0798718B2
Authority
JP
Japan
Prior art keywords
temperature
cooling
reaction tube
epitaxial growth
liquid phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62332686A
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Japanese (ja)
Other versions
JPH01176291A (en
Inventor
忠 犬飼
Original Assignee
東京エレクトロン東北株式会社
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Priority to JP62332686A priority Critical patent/JPH0798718B2/en
Publication of JPH01176291A publication Critical patent/JPH01176291A/en
Publication of JPH0798718B2 publication Critical patent/JPH0798718B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、液相エピタキシャル成長装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a liquid phase epitaxial growth apparatus.

(従来の技術) 液相エピタキシャル成長装置では、従来より徐冷降温法
が一般的であるが、新たな手法として温度差法が提案さ
れている。この温度差法について説明すると、第4図
(a),(b)に示すように溶液中に温度差を形成し、
この高温側T1に成長すべき結晶のソース結晶を浮遊し、
低温側T2に基板結晶を配置する。そして、高温側で余分
に溶解した溶質は、温度差ΔT=T1−T2による密度の差
に起因する密度拡散および温度差に起因する熱拡散によ
り低温側の基板に輸送される。
(Prior Art) In a liquid phase epitaxial growth apparatus, a gradual cooling and cooling method has been generally used, but a temperature difference method has been proposed as a new method. Explaining this temperature difference method, a temperature difference is formed in the solution as shown in FIGS. 4 (a) and 4 (b),
Float the source crystal of the crystal to be grown on this high temperature side T1,
The substrate crystal is placed on the low temperature side T2. Then, the extra solute dissolved on the high temperature side is transported to the substrate on the low temperature side by the density diffusion due to the difference in density due to the temperature difference ΔT = T1−T2 and the thermal diffusion due to the temperature difference.

溶質の輸送量は前記温度差によって決まり、従って、成
長炉の温度は一定で結晶成長が進行し、しかも徐冷降温
法におけるように結晶成長が溶媒中の溶質の溶解度によ
り律速されてしまうことがない。
The amount of solute transported is determined by the temperature difference. Therefore, the temperature of the growth furnace is constant and the crystal growth proceeds, and the crystal growth is rate-limited by the solubility of the solute in the solvent as in the slow cooling temperature-falling method. Absent.

このため、結晶成長は、溶質が基板上を泳動できるだけ
の熱エネルギーがあれば可能であるので、徐冷降温法と
比べて低温度で成長が可能となる利点がある。
For this reason, crystal growth is possible if the solute has enough thermal energy to migrate on the substrate, so that there is an advantage that the growth can be performed at a lower temperature as compared with the slow cooling temperature decreasing method.

ここで、前記温度差法を採用した場合には、成長炉の炉
内温度に上下で温度差をつけるようにする必要がある。
Here, when the temperature difference method is adopted, it is necessary to make a temperature difference between the upper and lower temperatures in the growth furnace.

(発明が解決しようとする問題点) 上述した液相エピタキシャル成長装置で温度差法を実施
するとすれば、反応管内で上下方向で温度差をつける必
要があるが、従来は反応管の軸方向で温度差をつけるも
のしか提供されてなく、温度差法を好適に実施すること
ができる液相エピタキシャル成長装置が提供されていな
かった。
(Problems to be Solved by the Invention) If the temperature difference method is carried out in the liquid phase epitaxial growth apparatus described above, it is necessary to make a temperature difference in the vertical direction within the reaction tube. Only a device that makes a difference is provided, and a liquid phase epitaxial growth apparatus that can preferably perform the temperature difference method has not been provided.

また、近年半割れ状の割型ヒータを反応管の上下に配置
し、上下のヒータを別々に温度コントロールできる炉体
も提供されているが、これらの周囲には断熱材が配置さ
れる構成であるので、熱拡散が悪く、上記コントロール
によっても反応管内部の上下で温度差をつけることが実
質的に困難となっていた。
In recent years, there has been provided a furnace body in which half-split split heaters are arranged above and below the reaction tube, and the temperature of the upper and lower heaters can be controlled separately. However, a heat insulating material is arranged around these furnace bodies. Therefore, the heat diffusion was poor, and it was substantially difficult to make a temperature difference between the upper and lower parts inside the reaction tube even by the above control.

そこで、本発明の目的とするところは、上述した従来の
問題点を解決し、反応管内の上下の温度に温度差を容易
に付けることができると共に、その保守が容易である温
度差法による液相エピタキシャル成長装置を提供するこ
とにある。
Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to make a temperature difference between upper and lower temperatures in a reaction tube easily, and to maintain the liquid by a temperature difference method. It is to provide a phase epitaxial growth apparatus.

[発明の構成] (問題点を解決するための手段) 本発明は、加熱された横置き反応管内で、成長させる材
料が過飽和温度に設定された溶液を基板の上面に接する
ようにして、基板上に前記材料の結晶を成長させる液相
エピタキシャル成長装置において、第一の加熱手段及び
第一の冷却手段を具備し、前記反応管内の上側の温度を
設定する上側温度設定手段と、第二の加熱手段及び第二
の冷却手段を具備し、前記反応管内の下側の温度を設定
する下側温度設定手段と、前記上側及び下側温度設定手
段の周囲に配置された断熱材と、前記第一の加熱手段及
び第一の冷却手段と、前記第二の加熱手段及び第二の冷
却手段との各々の加熱温度及び冷却温度を独立に制御し
て、前記反応管内の上側を高温とし、下側を低温とする
温度差を形成する温度制御手段と、を有することを特徴
とする。
[Structure of the Invention] (Means for Solving Problems) In the present invention, a substrate in which a solution in which a material to be grown is set to a supersaturation temperature is brought into contact with the upper surface of the substrate in a heated horizontal reaction tube A liquid phase epitaxial growth apparatus for growing a crystal of the above material, which comprises a first heating means and a first cooling means, an upper temperature setting means for setting an upper temperature in the reaction tube, and a second heating means. Means and a second cooling means, lower temperature setting means for setting the temperature of the lower side in the reaction tube, heat insulating material arranged around the upper and lower temperature setting means, the first Of the heating means and the first cooling means, and the heating temperature and the cooling temperature of each of the second heating means and the second cooling means are independently controlled to make the upper side in the reaction tube a high temperature and the lower side. The temperature that forms the temperature difference And having a control means.

(作用) 温度差法を実施する液相エピタキシャル成長装置では、
反応管内の上側に成長すべき材料を過飽和に含んだ溶液
を配置し、この溶液を基板の上面に接する際に、溶液側
を高温とし、基板側を低温として、この温度差による密
度の差に起因する密度拡散及び前記温度差に起因する熱
拡散によって、高温側で余分に溶解した溶質を低温側の
基板に輸送して基板上で結晶成長を行っている。
(Operation) In the liquid phase epitaxial growth apparatus that implements the temperature difference method,
A solution containing the material to be grown in supersaturation is placed on the upper side in the reaction tube, and when this solution is in contact with the upper surface of the substrate, the solution side is set to a high temperature and the substrate side is set to a low temperature, and the difference in density due to this temperature difference is Due to the resulting density diffusion and the thermal diffusion due to the temperature difference, the solute excessively melted on the high temperature side is transported to the low temperature side substrate to perform crystal growth on the substrate.

ここで、本発明では反応管内の上側を高温とし、下側を
低温とする温度差を形成すべく該反応管の上下に温度設
定手段を設け、それぞれの温度設定手段は温度制御手段
により独立制御可能な加熱手段と冷却手段とが備えら
れ、さらに周囲を断熱材で覆われる構成をなす。
Here, in the present invention, temperature setting means is provided above and below the reaction tube in order to form a temperature difference in which the upper side of the reaction tube is at a high temperature and the lower side is at a low temperature, and each temperature setting means is independently controlled by the temperature control means. A possible heating means and cooling means are provided, and the surroundings are covered with a heat insulating material.

このような構成をなすことで、周囲を断熱材で覆われて
熱の拡散が困難である反応管において、高温側の熱の影
響で低温側が温度上昇することを防ぐことができる。す
なわち、反応管の上下に設けられた冷却手段が熱拡散の
働きをすることで、周囲からの熱拡散が困難である反応
管にあっても、該反応管内に上記温度差を確実に形成す
ることができる。
With such a configuration, it is possible to prevent the temperature of the low temperature side from rising due to the heat of the high temperature side in the reaction tube which is surrounded by the heat insulating material and in which it is difficult to diffuse the heat. That is, since the cooling means provided above and below the reaction tube functions to diffuse heat, even in a reaction tube where it is difficult to diffuse heat from the surroundings, the temperature difference is surely formed in the reaction tube. be able to.

また、上記冷却手段にいわゆる蒸気圧温度制御法を採用
すれば、反応管内部の均熱性を向上させることができ
る。
Further, if a so-called vapor pressure temperature control method is adopted for the cooling means, it is possible to improve the soaking property inside the reaction tube.

さらに、前記温度設定手段を割型とし上下に開閉自在と
すれば、装置の保守を容易化することができる。
Further, if the temperature setting means is of a split type and can be opened and closed freely, maintenance of the device can be facilitated.

(実施例) 以下、本発明の一実施例を図面を参照して説明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.

この液相エピタキシャル成長装置は、分割型の構造を有
する加熱炉10と、この加熱炉10内に配置され、円筒部内
の中空領域をプロセス領域とした石英反応管20と、前記
石英反応管20の周囲で上下に分割可能に配置され、壁面
内に冷却媒体を循環可能に収容し、上下に2分割された
半割れ部21a,21bを重ねることで円筒状に形成された冷
却媒体循環部21と、前記半割れ部21a,21bの一端側にそ
れぞれ接続され、前記熱媒体を冷却する冷却部30a,30b
と、この冷却部30a,30bの前記熱媒体の蒸気圧制御を行
う圧力制御部40a,40bを有して構成されている。
This liquid phase epitaxial growth apparatus is a heating furnace 10 having a split type structure, a quartz reaction tube 20 disposed in the heating furnace 10 and having a hollow region in a cylindrical portion as a process region, and the periphery of the quartz reaction tube 20. And a cooling medium circulating portion 21 which is arranged so as to be vertically separable, accommodates a cooling medium in a wall surface in a circulatory manner, and has half-split portions 21a and 21b which are vertically divided into two parts are overlapped with each other, Cooling portions 30a, 30b, which are respectively connected to one end sides of the half-split portions 21a, 21b and cool the heat medium.
And the pressure control units 40a and 40b for controlling the vapor pressure of the heat medium in the cooling units 30a and 30b.

前記加熱炉10は、例えば電気抵抗式の加熱炉であり、本
実施例の場合、第2図に示すように前記反応管20の上下
で2分割された割型炉構造となっている。
The heating furnace 10 is, for example, an electric resistance type heating furnace, and in the case of the present embodiment, as shown in FIG. 2, it has a split type furnace structure in which the reaction tube 20 is divided into upper and lower parts.

すなわち、断面半円形のヒータ素線11a,11bを反応管20
の周囲の上下に配置し、その周囲にさらに上下で分割さ
れた断熱材12a,12bを配置している。そして、上側のヒ
ータ素線11a,断熱材12aと、下側のヒータ素線11b,断熱
材12bとは、それぞれステンレスカバー13a,13bに取り付
けられていて、このステンレスカバー13a,13bを開閉用
支点14a,14bを支点として開閉自在に支持している。
That is, the heater wires 11a and 11b having a semicircular cross section are connected to the reaction tube 20.
Are arranged above and below the perimeter of the above, and the heat insulating materials 12a and 12b that are further divided into the top and the bottom are arranged around the perimeter of the above. The upper heater wire 11a and the heat insulating material 12a and the lower heater wire 11b and the heat insulating material 12b are attached to the stainless covers 13a and 13b, respectively. It supports openably and closably with 14a and 14b as fulcrums.

また、前記冷却媒体循環部21の半割れ部21a,21bも同様
に前記ステンレスカバー13a,13bに取り付けられ、上下
に開閉可能となっている。
Similarly, the half-split portions 21a and 21b of the cooling medium circulation portion 21 are also attached to the stainless steel covers 13a and 13b and can be opened and closed vertically.

半割れ部21a,21b内に配置される前記反応管20内には、
上下に分離されたボートをスライドすることで、結晶成
長を実行するようになっている。すなわち、第3図に示
すように、ボート22は上下に分離されていて、相互に図
中x方向にスライド可能となっている。ボート22の上側
には例えばGa等の原料溶液(溶解前にあっては塊状態)
23を収容する溶液溜め部24が設けられ、この溶液溜め部
24の底はなく、前記溶液23はボート22の下の部分の表面
に接するようになっている。尚、成長させる半導体結晶
を薄膜の種類に応じて、溶液溜め部24を複数設けること
ができる。また、ボート22の下の部分には原料のウエハ
25及び基板のウエハ26を入れるための窪み27が設けられ
ている。
In the reaction tube 20 arranged in the half-cracked portion 21a, 21b,
Crystal growth is performed by sliding the boats that are vertically separated. That is, as shown in FIG. 3, the boat 22 is vertically separated and is slidable in the x direction in the figure. On the upper side of the boat 22, for example, a raw material solution such as Ga (a solid state before being dissolved)
A solution reservoir 24 that accommodates 23 is provided.
There is no bottom 24 and the solution 23 is adapted to contact the surface of the lower part of the boat 22. A plurality of solution reservoirs 24 can be provided depending on the type of thin film to be grown semiconductor crystals. Also, the raw wafers are
A depression 27 is provided for receiving the wafer 25 and the wafer 26 of the substrate.

次に、作用について説明する。Next, the operation will be described.

先ず、液相エピタキシャル成長を簡単に説明すると、ボ
ート22を前記反応管20内に配置し、まず、溶液溜め部24
の下側には原料ウエハ25及び基板ウエハ26がいずれも接
しない位置に設定し、反応管20内を真空に引く。次に、
高純度の水素を反応管20内に流し、加熱炉10によって温
度を上昇させ、溶液溜め部24内の塊である原料23を溶解
する。
First, the liquid phase epitaxial growth will be briefly described. First, the boat 22 is arranged in the reaction tube 20, and first, the solution reservoir 24
The lower side is set at a position where neither the raw material wafer 25 nor the substrate wafer 26 is in contact, and the inside of the reaction tube 20 is evacuated. next,
High-purity hydrogen is flown into the reaction tube 20, the temperature is raised by the heating furnace 10, and the raw material 23, which is a lump in the solution reservoir 24, is dissolved.

その後、この溶液溜め部24の下側と前記原料ウエハ25が
接するようにロッド操作によって設定し、溶液である例
えばGa中に原料25である例えばGaAsが飽和するまでその
位置に設定しておく。溶液23中に原料25が飽和したら、
冷却を開始し、その後所定時間経過したら前記溶液溜め
部24の下側と前記基板26が接するように設定する。こう
して基板26上に例えばGaAs等の結晶が成長することにな
る。
After that, the lower side of the solution reservoir 24 and the raw material wafer 25 are set by the rod operation so as to be in contact with each other, and set at that position until the raw material 25, for example, GaAs is saturated in the solution, for example, Ga. When the raw material 25 is saturated in the solution 23,
The cooling is started, and after a lapse of a predetermined time, the lower side of the solution reservoir 24 and the substrate 26 are set in contact with each other. Thus, a crystal such as GaAs grows on the substrate 26.

ここで、本実施例では従来の徐冷降温法に代えて温度差
法を採用している。従って、上記作用での冷却の際に、
反応管20内の上下方向で温度差がつくように制御してい
る。
Here, in the present embodiment, the temperature difference method is adopted in place of the conventional slow cooling and cooling method. Therefore, during cooling by the above action,
The temperature is controlled so that there is a vertical temperature difference in the reaction tube 20.

すなわち、本実施例では加熱炉10として上下に分割した
半割れヒータを採用しているので、上下のヒータ素線11
a,11bへの通電制御によって、ヒータ温度を上下で異な
るように温度制御している。
That is, in this embodiment, since the heating furnace 10 employs a half-split heater divided into upper and lower parts, the upper and lower heater wires 11
By controlling the energization of a and 11b, the temperature of the heater is controlled to be different in the upper and lower directions.

しかし、この上下のヒータ制御だけでは反応管20内の上
下で温度差を付けることが困難であるのは、前述した通
りである。
However, as described above, it is difficult to make a temperature difference between the upper and lower sides of the reaction tube 20 only by controlling the upper and lower heaters.

そこで、本実施例では反応管20の周囲に配置した冷却媒
体循環部21の半割れ部21a,21bの壁面内に熱媒体を収容
し、この熱媒体の蒸気圧をコントロールする構成として
いる。
Therefore, in this embodiment, the heat medium is housed in the wall surfaces of the half-split portions 21a and 21b of the cooling medium circulation portion 21 arranged around the reaction tube 20, and the vapor pressure of the heat medium is controlled.

すなわち、熱力学的原理によれば、熱媒体の圧力をコン
トロールすることで、この熱媒体を循環している冷却媒
体循環部21を温度コントロール可能であり、したがっ
て、この冷却媒体循環部21を周囲に有する反応管20の内
の温度をコントロールすることが可能である。
That is, according to the thermodynamic principle, by controlling the pressure of the heat medium, it is possible to control the temperature of the cooling medium circulation unit 21 that circulates the heat medium. It is possible to control the temperature inside the reaction tube 20 provided in the above.

しかも、本実施例では冷却媒体循環部21を上下で分割し
た半割れ部21a,21bとして構成し、このコントロールを
反応管20の上下で異なるように実行すれば、反応管20内
の上側領域を高温とし、下側領域を低温とするような温
度差設定が可能である。
Moreover, in the present embodiment, the cooling medium circulation portion 21 is configured as upper and lower half-split portions 21a and 21b, and if this control is performed differently above and below the reaction tube 20, the upper region within the reaction tube 20 is It is possible to set the temperature difference such that the temperature is high and the lower region is low.

尚、上記実施例のように、冷却手段として蒸気圧温度制
御法を採用することで、反応管20内部の均熱性を向上
し、±0.01℃の高い均熱性をも確保することができる。
By adopting the vapor pressure temperature control method as the cooling means as in the above embodiment, the soaking property inside the reaction tube 20 can be improved and a high soaking property of ± 0.01 ° C. can be secured.

尚、本発明は上記実施例に限定されるものではなく、本
発明の要旨の範囲内で種々の変形実施が可能である。
The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention.

本発明は反応管20内の上下方向で温度差を付けるため
に、下側に冷却手段を配置するものであれば足り、必ず
しも上記実施例のように上下方向でそれぞれ冷却手段を
有するものでなくても良い。
The present invention only needs to have a cooling means on the lower side in order to make a temperature difference in the vertical direction in the reaction tube 20, and does not necessarily have a cooling means in the vertical direction as in the above embodiment. May be.

上記実施例のように上側領域にも冷却手段としての蒸気
圧制御による冷却部を配置することで、反応管20内の均
熱性を向上させるとができる。
By arranging a cooling unit as a cooling means by controlling vapor pressure in the upper region as in the above embodiment, it is possible to improve the thermal uniformity in the reaction tube 20.

また、冷却手段としては、均熱性の確保の面からいえば
蒸気圧制御によるものが好ましいが、例えば石英管内に
冷媒を通すことで反応管20の下側領域を冷却するもので
も良く、冷却手段としては他の種々の手法を採用するこ
とができる。
Further, as the cooling means, it is preferable to use vapor pressure control from the viewpoint of ensuring uniform heating, but for example, cooling means may be used to cool the lower region of the reaction tube 20 by passing a refrigerant through a quartz tube. As for, various other methods can be adopted.

また、上記実施例は横型炉について説明したが、縦型炉
の場合にも同様に実施することが可能である。尚、横型
炉の場合には一端からボートを挿入し他端から取り出す
というトンネル方式が可能となり、スループットの大幅
な向上を図ることができるという効果がある。
Further, although the above-described embodiment has been described with respect to the horizontal furnace, it can be similarly carried out in the case of a vertical furnace. In the case of a horizontal furnace, a tunnel system in which a boat is inserted from one end and taken out from the other end is possible, which has the effect of significantly improving throughput.

さらに、上述した冷却手段の一例である冷却媒体循環部
21としては、必ずしも反応管20と別個に設けるものでは
なく、反応管20の壁面自体を冷却媒体循環部として構成
することもできる。
Furthermore, a cooling medium circulation unit that is an example of the above-described cooling unit.
21 is not necessarily provided separately from the reaction tube 20, and the wall surface of the reaction tube 20 itself may be configured as a cooling medium circulation unit.

次に、上述した蒸気圧による温度制御を気相エピタキシ
ャル成長装置に適用した例について説明する。
Next, an example in which the above temperature control by vapor pressure is applied to a vapor phase epitaxial growth apparatus will be described.

気相エピタキシャル成長装置では、例えばハライド系,
ハイドライド系では、反応管の軸方向で温度差を付ける
必要がある。
In the vapor phase epitaxial growth apparatus, for example, a halide system,
In the hydride system, it is necessary to make a temperature difference in the axial direction of the reaction tube.

この場合、第5図に示すように、反応管50のほぼ中心に
熱媒体を収容した循環部51を配置し、その両側にそれぞ
れ独立して温度制御可能な加熱炉52,53を反応管50の周
囲に配置する。また、前記循環部51内の熱媒体を冷却す
る冷却部54と、この熱媒体の蒸気圧を制御する圧力制御
部55を設けた点は前記実施例と同様である。
In this case, as shown in FIG. 5, a circulation part 51 containing a heat medium is arranged substantially in the center of the reaction tube 50, and heating furnaces 52 and 53 capable of independently controlling the temperature are provided on both sides of the circulation part 51. Place it around. Further, the cooling unit 54 for cooling the heat medium in the circulation unit 51 and the pressure control unit 55 for controlling the vapor pressure of the heat medium are provided in the same manner as in the above embodiment.

このような気相エピタキシャル成長装置では、反応管50
の長手方向で温度差を付ける必要があるが、従来より高
温側の熱影響により低温側が温度上昇してしまい、この
ことを防止するためには熱影響を受けない距離に設定す
る必要があり、装置が大型化していた。
In such a vapor phase epitaxial growth apparatus, the reaction tube 50
Although it is necessary to make a temperature difference in the longitudinal direction of, the temperature on the low temperature side rises due to the heat effect on the higher temperature side than before, and in order to prevent this, it is necessary to set a distance that is not affected by heat. The device was upsized.

上記の例では高温側と低温側の間に蒸気圧制御による冷
却手段を備えているので、高温側の熱を拡散することが
でき、従来のように大きな距離を取る必要がないのでコ
ンパクトなシステムで大きな温度差を有する炉体を作成
することができる。
In the above example, the cooling means by vapor pressure control is provided between the high temperature side and the low temperature side, so the heat on the high temperature side can be diffused, and there is no need to take a large distance as in the conventional system, so a compact system. It is possible to create a furnace body having a large temperature difference.

[発明の効果] 以上説明したように、本発明によれば反応管内の上下で
確実に温度差を付けることができるので、温度差法によ
る液相エピタキシャル成長を容易に実現することができ
る。
[Effects of the Invention] As described above, according to the present invention, since a temperature difference can be surely made between the upper and lower sides of the inside of the reaction tube, liquid phase epitaxial growth by the temperature difference method can be easily realized.

また、冷却手段として蒸気圧温度制御法を採用すれば、
反応管内部の均熱性を向上させることができる。
If the vapor pressure temperature control method is adopted as the cooling means,
The soaking property inside the reaction tube can be improved.

さらに、上記温度差の形成手段として反応管の上下で開
閉自在とした割型温度設定手段を採用することで、該割
型温度設定手段及び反応管の保守を容易に行うことがで
きる。
Furthermore, by adopting the split mold temperature setting means that can be opened and closed above and below the reaction tube as the means for forming the temperature difference, the split mold temperature setting means and the reaction tube can be easily maintained.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明を適用した液相エピタキシャル成長装置
を説明するための概略斜視図、 第2図は第1図中の加熱手段を示す割型ヒータの断面
図、 第3図は第1図の反応管内に挿入されるスライドボート
を示す概略説明図、 第4図は温度差法を説明するための概略説明図、 第5図は蒸気圧制御による冷却部を備えた気相エピタキ
シャル成長装置の概略斜視図である。 10……加熱手段、 20……反応管、 21a,21b,30a,30b,40a,40b……冷却手段、
FIG. 1 is a schematic perspective view for explaining a liquid phase epitaxial growth apparatus to which the present invention is applied, FIG. 2 is a sectional view of a split type heater showing a heating means in FIG. 1, and FIG. FIG. 4 is a schematic explanatory view showing a slide boat inserted in a reaction tube, FIG. 4 is a schematic explanatory view for explaining a temperature difference method, and FIG. 5 is a schematic perspective view of a vapor phase epitaxial growth apparatus equipped with a cooling unit by vapor pressure control. It is a figure. 10 ... heating means, 20 ... reaction tube, 21a, 21b, 30a, 30b, 40a, 40b ... cooling means,

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】加熱された横置き反応管内で、成長させる
材料が過飽和温度に設定された溶液を基板の上面に接す
るようにして、基板上に前記材料の結晶を成長させる液
相エピタキシャル成長装置において、 第一の加熱手段及び第一の冷却手段を具備し、前記反応
管内の上側の温度を設定する上側温度設定手段と、 第二の加熱手段及び第二の冷却手段を具備し、前記反応
管内の下側の温度を設定する下側温度設定手段と、 前記上側及び下側温度設定手段の周囲に配置された断熱
材と、 前記第一の加熱手段及び第一の冷却手段と、前記第二の
加熱手段及び第二の冷却手段との各々の加熱温度及び冷
却温度を独立に制御して、前記反応管内の上側を高温と
し、下側を低温とする温度差を形成する温度制御手段
と、 を有することを特徴とする液相エピタキシャル成長装
置。
1. A liquid phase epitaxial growth apparatus for growing a crystal of a material to be grown on a substrate by bringing a solution of the material to be grown, which is set at a supersaturation temperature, into contact with the upper surface of the substrate in a heated horizontal reaction tube. An upper temperature setting means for setting an upper temperature in the reaction tube, a first heating means and a first cooling means, and a second heating means and a second cooling means in the reaction tube Lower temperature setting means for setting the lower temperature, a heat insulating material arranged around the upper and lower temperature setting means, the first heating means and the first cooling means, the second Independently controlling the heating temperature and the cooling temperature of each of the heating means and the second cooling means, a temperature control means for forming a temperature difference in which the upper side in the reaction tube has a high temperature and the lower side has a low temperature, Liquid phase characterized by having Epitaxial growth apparatus.
【請求項2】前記第一及び第二の冷却手段は、反応管の
周囲で密封されて循環する冷却媒体と、 該冷却媒体を冷却する冷却部と、 冷却媒体の蒸気圧を制御して前記冷却部での温度コント
ロールを行う圧力制御部と、 で構成されることを特徴とする特許請求の範囲第1項記
載の液相エピタキシャル成長装置。
2. The first and second cooling means are a cooling medium which is sealed and circulated around a reaction tube, a cooling section which cools the cooling medium, and a vapor pressure of the cooling medium to control the vapor pressure of the cooling medium. The liquid phase epitaxial growth apparatus according to claim 1, wherein the liquid phase epitaxial growth apparatus comprises: a pressure control unit that controls the temperature in the cooling unit.
【請求項3】加熱された横置き反応管内で、成長させる
材料が過飽和温度に設定された溶液を基板の上面に接す
るようにして、基板上に前記材料の結晶を成長させる液
相エピタキシャル成長装置において、 第一の加熱手段及び第一の冷却手段を具備し、前記反応
管内の上側の温度を設定する上側温度設定手段と、 第二の加熱手段及び第二の冷却手段を具備し、前記反応
管内の下側の温度を設定する下側温度設定手段と、 前記上側及び下側温度設定手段の周囲に配置され、か
つ、上下で分割された第一及び第二の断熱材と、 前記第一の加熱手段及び第一の冷却手段と、前記第二の
加熱手段及び第二の冷却手段との各々の加熱温度及び冷
却温度を独立に制御して、前記反応管内の上側を高温と
し、下側を低温とする温度差を形成する温度制御手段
と、 ヒンジを介して開閉可能な上側カバー及び下側カバー
と、 を有し、 前記第一の加熱手段、第一の冷却手段及び第一の断熱材
を前記上側カバーに固定し、 前記第二の加熱手段、第二の冷却手段及び第二の断熱材
を前記下側カバーに固定したことを特徴とする液相エピ
タキシャル成長装置。
3. A liquid phase epitaxial growth apparatus for growing a crystal of a material to be grown on a substrate by bringing a solution of the material to be grown, which is set to a supersaturation temperature, into contact with the upper surface of the substrate in a heated horizontal reaction tube. An upper temperature setting means for setting an upper temperature in the reaction tube, a first heating means and a first cooling means, and a second heating means and a second cooling means in the reaction tube Lower temperature setting means for setting the temperature of the lower side of the, and the first and second heat insulating material arranged around the upper and lower temperature setting means, and divided into upper and lower, the first The heating temperature and the cooling temperature of each of the heating means and the first cooling means and the second heating means and the second cooling means are independently controlled to make the upper side in the reaction tube a high temperature and the lower side to Temperature control hand that creates a temperature difference to be low A step, and an upper cover and a lower cover that can be opened and closed via a hinge, fixing the first heating means, the first cooling means, and the first heat insulating material to the upper cover, A liquid phase epitaxial growth apparatus, characterized in that a second heating means, a second cooling means and a second heat insulating material are fixed to the lower cover.
JP62332686A 1987-12-29 1987-12-29 Liquid phase epitaxial growth system Expired - Lifetime JPH0798718B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62332686A JPH0798718B2 (en) 1987-12-29 1987-12-29 Liquid phase epitaxial growth system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62332686A JPH0798718B2 (en) 1987-12-29 1987-12-29 Liquid phase epitaxial growth system

Publications (2)

Publication Number Publication Date
JPH01176291A JPH01176291A (en) 1989-07-12
JPH0798718B2 true JPH0798718B2 (en) 1995-10-25

Family

ID=18257746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62332686A Expired - Lifetime JPH0798718B2 (en) 1987-12-29 1987-12-29 Liquid phase epitaxial growth system

Country Status (1)

Country Link
JP (1) JPH0798718B2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4877765A (en) * 1972-01-18 1973-10-19
JPS5061767U (en) * 1973-10-06 1975-06-06
JPS632889A (en) * 1986-06-20 1988-01-07 Dowa Mining Co Ltd Liquid phase crystal growth device

Also Published As

Publication number Publication date
JPH01176291A (en) 1989-07-12

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