JPH0799786B2 - Light transmitting cap and method of manufacturing the same - Google Patents
Light transmitting cap and method of manufacturing the sameInfo
- Publication number
- JPH0799786B2 JPH0799786B2 JP61270118A JP27011886A JPH0799786B2 JP H0799786 B2 JPH0799786 B2 JP H0799786B2 JP 61270118 A JP61270118 A JP 61270118A JP 27011886 A JP27011886 A JP 27011886A JP H0799786 B2 JPH0799786 B2 JP H0799786B2
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- cap
- light
- oxide film
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、半導体レーザー装置などに用いられる光透過
用キャップおよびその製造方法に関する。Description: TECHNICAL FIELD The present invention relates to a light transmitting cap used in a semiconductor laser device and the like, and a method for manufacturing the same.
（従来の技術） 従来、例えば半導体レーザー装置に搭載される半導体レ
ーザー素子は金属枠に光透過部材を封着したキャップに
より気密封止される。このキャップの金属枠は頂部に透
孔が穿設されたキャップ（帽子）状に形成され、透孔は
ガラス等からなる光透過部材によって封着される。ま
た、金属枠は金属製であるので、耐蝕性向上のためのめ
っきが施される。(Prior Art) Conventionally, for example, a semiconductor laser element mounted on a semiconductor laser device is hermetically sealed by a cap in which a light transmitting member is sealed in a metal frame. The metal frame of this cap is formed in the shape of a cap (cap) having a through hole at the top, and the through hole is sealed by a light transmitting member made of glass or the like. Further, since the metal frame is made of metal, it is plated to improve the corrosion resistance.
通常、光透過部材をキャップの金属枠に封着する場合に
は、まず金属枠に低融点ガラスを溶着し、この低融点ガ
ラスを再溶融することによりガラス等からなる光透過部
材を封着している。Usually, when sealing the light-transmitting member to the metal frame of the cap, first, the low-melting glass is welded to the metal frame, and the light-transmitting member made of glass or the like is sealed by remelting the low-melting glass. ing.
前記低融点ガラスはその下地となる金属枠との濡れ性を
向上させるため、あらかじめ金属枠を酸化性雰囲気中で
加熱し、金属枠表面に金属酸化膜を形成した後、金属枠
に溶着される。In order to improve the wettability of the low melting point glass with the underlying metal frame, the metal frame is heated in an oxidizing atmosphere in advance to form a metal oxide film on the surface of the metal frame and then welded to the metal frame. .
この金属酸化膜は後工程のめっき処理の妨げになるた
め、めっき前にあらかじめ酸処理し、金属枠表面の金属
酸化膜を除去した後、ニッケルめっき等の耐蝕めっきが
なされる。Since this metal oxide film hinders the plating process in the subsequent step, it is acid-treated in advance before plating to remove the metal oxide film on the surface of the metal frame, and then corrosion-resistant plating such as nickel plating is performed.
第３図は従来のキャップの一例を示す断面図である。FIG. 3 is a sectional view showing an example of a conventional cap.
10はキャップ、12はキャップ10の金属枠、14は光透過板
である。この光透過板14の表面上には反射防止膜が施さ
れる。16は低融点ガラスであり、これを溶融することに
より光透過板14を金属枠12に封着する。18は金属枠12頂
部に開口する透孔、20は金属枠12表面に施されるニッケ
ルめっき等の耐蝕めっきである。従来のキャップ10は図
示するように金属枠12の封着部を除く表面に耐蝕めっき
が施される。10 is a cap, 12 is a metal frame of the cap 10, and 14 is a light transmitting plate. An antireflection film is provided on the surface of the light transmitting plate 14. Reference numeral 16 is a low melting point glass, and the light transmitting plate 14 is sealed to the metal frame 12 by melting the glass. Reference numeral 18 is a through hole opened at the top of the metal frame 12, and 20 is a corrosion-resistant plating such as nickel plating applied to the surface of the metal frame 12. As shown in the figure, the conventional cap 10 is provided with corrosion-resistant plating on the surface of the metal frame 12 excluding the sealing portion.
（発明が解決しようとする問題点） 上記キャップは例えば半導体レーザー装置では、半導体
レーザー素子を搭載するステムに接合され、半導体レー
ザ素子を気密封止している。(Problems to be Solved by the Invention) In a semiconductor laser device, for example, the cap is joined to a stem on which a semiconductor laser element is mounted, and hermetically seals the semiconductor laser element.
この半導体レーザー素子はステムに立設した放熱体に接
合され、半導体レーザー素子から発生するレーザー光
は、光透過部材を透過して外部へ放出される。この光透
過部材には反射防止膜などの処理が施されているが、半
導体レーザー素子から放出されるレーザー光が円錐状の
ビームとして発光する等のためにステム上面等によって
キャップ内部に反射・散乱される。This semiconductor laser element is joined to a heat radiator standing on the stem, and the laser light generated from the semiconductor laser element passes through the light transmitting member and is emitted to the outside. This light-transmissive member is treated with an anti-reflection film, but because the laser light emitted from the semiconductor laser element emits as a conical beam, it is reflected and scattered inside the cap by the top surface of the stem. To be done.
この散乱光はキャップ内で反射し、外部装置に誤認識さ
れること、また、散乱して光透過部材から外部に放出さ
れること等によって、レーザー光源のノイズの原因とな
る。The scattered light is reflected in the cap, is erroneously recognized by an external device, and is scattered and emitted to the outside from the light transmitting member, which causes noise of the laser light source.
半導体レーザー素子などのように、高精度が要求される
素子にあっては、信頼性を向上させるためにできるだけ
ノイズを低く抑えることが必要であり、したがって、散
乱光によるノイズを極力減少させなければならない。For devices that require high accuracy, such as semiconductor laser devices, it is necessary to keep noise as low as possible in order to improve reliability. Therefore, noise due to scattered light must be reduced as much as possible. I won't.
そこで、本発明は上記問題点を解消すべくなされたもの
であり、その目的とするところは、キャップ内における
光の散乱を抑え、散乱光に起因するノイズを減少させ、
それによって信頼性を向上させることができるキャップ
およびその製造方法を提供するにある。Therefore, the present invention has been made to solve the above problems, and its purpose is to suppress the scattering of light in the cap, to reduce the noise due to scattered light,
Accordingly, it is an object of the present invention to provide a cap and a method of manufacturing the cap that can improve reliability.
（問題点を解決するための手段） 本発明は上記問題点を解消するため次の構成をそなえ
る。(Means for Solving Problems) The present invention has the following configuration in order to solve the above problems.
すなわち、キャップ状に形成された金属枠に光透過部材
を封着して成る光透過用キャップにおいて、該キャップ
の前記金属枠の内面に前記金属枠の黒色の金属酸化膜を
有することを特徴とする。That is, in a light-transmissive cap formed by sealing a light-transmissive member in a metal frame formed in a cap shape, a black metal oxide film of the metal frame is provided on an inner surface of the metal frame of the cap. To do.
また、キャップ状に形成された金属枠に光透過部材を封
着して成る光透過用キャップの製造方法において、前記
金属枠を酸化性雰囲気中で加熱して該金属枠の表面に黒
色の金属酸化膜を形成し、前記光透過部材を封着した
後、前記金属枠の内面をゴム栓等により密封し前記金属
枠の内面の金属酸化膜をそのまま残して前記金属枠の外
面の前記金属酸化膜を除去し、前記金属枠の外面に耐蝕
めっきを施すことを特徴とする。In the method for manufacturing a light-transmitting cap, which is formed by sealing a light-transmitting member to a metal frame formed in a cap shape, the metal frame is heated in an oxidizing atmosphere to form a black metal on the surface of the metal frame. After forming an oxide film and sealing the light transmitting member, the inner surface of the metal frame is sealed with a rubber stopper or the like, and the metal oxide film on the inner surface of the metal frame is left as it is and the metal oxide on the outer surface of the metal frame is left as it is. The film is removed, and corrosion resistant plating is applied to the outer surface of the metal frame.
（実施例） 以下に本発明の好適な実施例を添付図面に基づいて詳細
に説明する。(Embodiment) A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
第１図は、本発明に係る実施例を示す光透過用キャップ
の断面図である。FIG. 1 is a sectional view of a light transmitting cap showing an embodiment according to the present invention.
図で従来例と同一の部材については同一の番号を付す。
12はキャップ本体をなす鉄−ニッケル−コバルト合金、
鉄−ニッケル合金等の金属からなるキャップ状に形成さ
れた金属枠である。この金属枠12の光透過部材が封着さ
れる頂部には透孔18が穿設され、金属枠12の下部は、半
導体レーザー素子等を収容するため開口し、この開口部
22の周縁にはステム等と接合するためのフランジ24が設
けられている。In the figure, the same members as those in the conventional example are designated by the same reference numerals.
12 is an iron-nickel-cobalt alloy forming the cap body,
It is a metal frame formed of a metal such as an iron-nickel alloy in a cap shape. A through hole 18 is formed in the top of the metal frame 12 where the light transmitting member is sealed, and a lower portion of the metal frame 12 is opened to accommodate a semiconductor laser element or the like.
A flange 24 for joining with a stem or the like is provided on the periphery of 22.
20は金属枠12表面に施された耐蝕めっきであり、電解ニ
ッケルめっきあるいは無電解ニッケルめっき等がなされ
たものである。Reference numeral 20 denotes a corrosion resistant plating applied to the surface of the metal frame 12, which is plated with electrolytic nickel or electroless nickel.
26は前記金属枠12の内面に施された金属酸化膜であり、
封着部を除く金属枠の内面全体にわたって被われる。こ
の金属酸化膜は前記金属枠12を酸性雰囲気中で加熱処理
して形成したものであり、化学的に安定な黒色の酸化皮
膜である。26 is a metal oxide film applied to the inner surface of the metal frame 12,
It covers the entire inner surface of the metal frame excluding the sealing portion. The metal oxide film is formed by heating the metal frame 12 in an acidic atmosphere, and is a chemically stable black oxide film.
14は透孔18に低融点ガラス16を介して封着される光透過
板である。Reference numeral 14 is a light transmission plate sealed in the through hole 18 via the low melting point glass 16.
つぎに、上述したキャップの製造方法について説明す
る。Next, a method for manufacturing the above-mentioned cap will be described.
まず、所定のキャップ状に成形された金属枠12を酸化性
雰囲気中で加熱し、金属枠12の全表面に金属枠12の金属
酸化膜26を形成する。First, the metal frame 12 formed in a predetermined cap shape is heated in an oxidizing atmosphere to form the metal oxide film 26 of the metal frame 12 on the entire surface of the metal frame 12.
つぎに、金属酸化膜26が形成された金属枠12の透孔18の
金属枠内面側周縁部に低融点ガラス16を溶着する。そし
て、この低融点ガラス16上に光透過板14を載置し、加熱
することにより低融点ガラス16を溶融し光透過板14を金
属枠12に気密に封着する。Next, the low melting point glass 16 is welded to the peripheral edge of the through hole 18 of the metal frame 12 on which the metal oxide film 26 is formed on the inner surface side of the metal frame. Then, the light transmitting plate 14 is placed on the low melting glass 16 and heated to melt the low melting glass 16 and hermetically seal the light transmitting plate 14 to the metal frame 12.
ついで、金属枠12表面に耐蝕めっきを施すが、この光透
過板14が封着された状態では、金属枠12表面に金属酸化
膜が形成されているので、めっき前に酸処理を行う。こ
の酸処理は、第２図に示すように、前記金属枠12の内面
をゴム栓28などの弾性体等によって密封し、金属枠の内
側に処理液が侵入しないようにして行う。これによっ
て、金属枠12の内面は酸処理されず、金属枠12の外面の
み酸処理されて金属酸化膜が除去される。この酸処理は
金属酸化膜の除去とめっきの前処理を兼ねて行うことが
できる。つづいて、電解ニッケル、あるいは無電解ニッ
ケルめっき等を施すことにより金属枠12の外面に耐蝕め
っきが施され、所望のキャップを得ることができる。Then, the surface of the metal frame 12 is subjected to corrosion-resistant plating. Since the metal oxide film is formed on the surface of the metal frame 12 when the light transmitting plate 14 is sealed, an acid treatment is performed before the plating. As shown in FIG. 2, this acid treatment is performed by sealing the inner surface of the metal frame 12 with an elastic body such as a rubber stopper 28 so that the treatment liquid does not enter the inside of the metal frame. As a result, the inner surface of the metal frame 12 is not acid-treated, but only the outer surface of the metal frame 12 is acid-treated to remove the metal oxide film. This acid treatment can be performed both as the removal of the metal oxide film and the pretreatment of plating. Subsequently, electrolytic nickel plating, electroless nickel plating, or the like is performed to perform corrosion-resistant plating on the outer surface of the metal frame 12, so that a desired cap can be obtained.
上述したキャップは、内面に黒色の金属酸化膜が形成さ
れているから、光を吸収する効率が大きく、光を反射し
ないという効果がある。したがって、金属枠の内面にニ
ッケルめっきなどが施されて、光の反射率が大きい従来
のキャップにくらべ、光がキャップ内面で散乱すること
を極めて低く抑えることができる。Since the above-mentioned cap has the black metal oxide film formed on the inner surface, it has a high efficiency of absorbing light and an effect of not reflecting light. Therefore, nickel plating or the like is applied to the inner surface of the metal frame, so that the scattering of light on the inner surface of the cap can be suppressed to an extremely low level as compared with a conventional cap having a high light reflectance.
また、金属酸化膜は化学的に安定であるので、キャップ
内面の耐蝕性にもなんら問題がない。Moreover, since the metal oxide film is chemically stable, there is no problem in the corrosion resistance of the inner surface of the cap.
なお、本発明に係る製造方法は、金属酸化膜を除去する
酸処理時に、所定部分の金属酸化膜をそのまま残すこと
を特徴とするものであり、光透過部材として光透過板や
レンズ状光透過部材を用いて、低融点ガラスで封着する
ほか、ガラス部材などを金属枠に載置して溶融すること
により板状、レンズ状等の所望の形状して形成して封着
してもよいことはもちろんである。The manufacturing method according to the present invention is characterized by leaving a predetermined portion of the metal oxide film as it is during the acid treatment for removing the metal oxide film, and as a light transmitting member, a light transmitting plate or a lens-like light transmitting member. In addition to sealing with a low-melting glass using a member, a glass member or the like may be placed in a metal frame and melted to form a plate-shaped, lens-shaped, or other desired shape, and then sealed. Of course.
（発明の効果） 上述したように、本発明に係るキャップおよびその製造
方法によれば、キャップ内面に金属酸化膜を形成したか
らキャップ内面におけるレーザー光などの散乱を防止す
ることができ、キャップ内の散乱光に起因するノイズを
極めて低く抑えることができる。(Effects of the Invention) As described above, according to the cap and the method for manufacturing the same of the present invention, since the metal oxide film is formed on the inner surface of the cap, it is possible to prevent scattering of laser light and the like on the inner surface of the cap, and The noise caused by the scattered light can be suppressed to an extremely low level.
また、その製造においては、従来の製造工程中に組込む
ことができるから、製造が容易であるという著効を奏す
ることができる。Further, in the manufacturing, since it can be incorporated in the conventional manufacturing process, the remarkable effect that the manufacturing is easy can be achieved.
以上本発明につき好適な実施例を挙げて種々説明した
が、本発明はこの実施例に限定されるものではなく、発
明の精神を逸脱しない範囲内で多くの改変を施し得るの
はもちろんのことである。Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to the embodiments and many modifications can be made without departing from the spirit of the invention. Is.
第１図は本発明に係るキャップの実施例を示す断面図、
第２図はキャップの製造方法を示す断面図、第３図はキ
ャップの従来例を示す断面図である。 10……キャップ、12……金属枠、14……光透過板、16…
…低融点ガラス、18……透孔、20……耐蝕めっき、22…
…開口部、24……フランジ、26……金属酸化膜、28……
ゴム栓。FIG. 1 is a sectional view showing an embodiment of a cap according to the present invention,
FIG. 2 is a sectional view showing a cap manufacturing method, and FIG. 3 is a sectional view showing a conventional example of the cap. 10 ... Cap, 12 ... Metal frame, 14 ... Light transmitting plate, 16 ...
… Low melting glass, 18… Through hole, 20… Corrosion resistant plating, 22…
… Aperture, 24 …… Flange, 26 …… Metal oxide film, 28 ……
Rubber stopper.
Claims (2)
材を封着して成る光透過用キャップにおいて、 該キャップの前記金属枠の内面に前記金属枠の黒色の金
属酸化膜を有することを特徴とする光透過用キャップ。1. A light-transmitting cap formed by sealing a light-transmitting member to a metal frame formed in a cap shape, wherein a black metal oxide film of the metal frame is provided on an inner surface of the metal frame of the cap. A light-transmitting cap.
材を封着して成る光透過用キャップの製造方法におい
て、 前記金属枠を酸化性雰囲気中で加熱して該金属枠の表面
に黒色の金属酸化膜を形成し、 前記光透過部材を封着した後、 前記金属枠の内面をゴム栓等により密封し前記金属枠の
内面の金属酸化膜をそのまま残して前記金属枠の外面の
前記金属酸化膜を除去し、 前記金属枠の外面に耐蝕めっきを施すことを特徴とする
光透過用キャップの製造方法。2. A method of manufacturing a light-transmissive cap, which comprises sealing a light-transmissive member in a metal frame formed in a cap shape, wherein the metal frame is heated in an oxidizing atmosphere to form a surface on the metal frame. After forming a black metal oxide film and sealing the light transmission member, the inner surface of the metal frame is sealed with a rubber stopper or the like to leave the metal oxide film on the inner surface of the metal frame as it is, and A method for manufacturing a light-transmissive cap, characterized in that the metal oxide film is removed, and an outer surface of the metal frame is subjected to corrosion-resistant plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61270118A JPH0799786B2 (en) | 1986-11-13 | 1986-11-13 | Light transmitting cap and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61270118A JPH0799786B2 (en) | 1986-11-13 | 1986-11-13 | Light transmitting cap and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63124483A JPS63124483A (en) | 1988-05-27 |
| JPH0799786B2 true JPH0799786B2 (en) | 1995-10-25 |
Family
ID=17481796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61270118A Expired - Fee Related JPH0799786B2 (en) | 1986-11-13 | 1986-11-13 | Light transmitting cap and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0799786B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2789721B2 (en) * | 1989-10-18 | 1998-08-20 | 松下電器産業株式会社 | Method of manufacturing semiconductor laser device |
| TW289872B (en) * | 1992-12-24 | 1996-11-01 | Sharp Kk | |
| US11561338B2 (en) | 2019-09-30 | 2023-01-24 | Nichia Corporation | Light-emitting module |
| US11112555B2 (en) | 2019-09-30 | 2021-09-07 | Nichia Corporation | Light-emitting module with a plurality of light guide plates and a gap therein |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039880A (en) * | 1983-08-12 | 1985-03-01 | Hitachi Ltd | Light-emitting device |
| JPS6142936A (en) * | 1984-08-06 | 1986-03-01 | Shinko Electric Ind Co Ltd | Manufacture of body structure with light transmitting window |
-
1986
- 1986-11-13 JP JP61270118A patent/JPH0799786B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63124483A (en) | 1988-05-27 |
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