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JPH0799796B2 - Composite plate for electromagnetic wave shielding - Google Patents
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JPH0799796B2 - Composite plate for electromagnetic wave shielding - Google Patents

Composite plate for electromagnetic wave shielding

Info

Publication number
JPH0799796B2
JPH0799796B2 JP60204548A JP20454885A JPH0799796B2 JP H0799796 B2 JPH0799796 B2 JP H0799796B2 JP 60204548 A JP60204548 A JP 60204548A JP 20454885 A JP20454885 A JP 20454885A JP H0799796 B2 JPH0799796 B2 JP H0799796B2
Authority
JP
Japan
Prior art keywords
sheet
composite plate
electromagnetic wave
wave shielding
antistatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60204548A
Other languages
Japanese (ja)
Other versions
JPS6265499A (en
Inventor
健司 鍋田
勇 花原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP60204548A priority Critical patent/JPH0799796B2/en
Publication of JPS6265499A publication Critical patent/JPS6265499A/en
Publication of JPH0799796B2 publication Critical patent/JPH0799796B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Elimination Of Static Electricity (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、金属箔又は金属板の片面もしくは両面に、導
電性カーボンブラツクを少量含有する熱可塑性樹脂フイ
ルム又はシートを一体に積層し、その表面が制電性かつ
絶縁性を有し、さらに機械的強度、剛性、耐衝撃性及び
耐折強さ等に優れ、その上電磁波遮蔽効果が極めて良好
な、電子機器中の電子回路板間等の電磁波遮蔽用途に適
した複合板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention has a thermoplastic resin film or sheet containing a small amount of conductive carbon black, which is integrally laminated on one or both sides of a metal foil or a metal plate. Between electronic circuit boards in electronic devices, whose surface has antistatic and insulating properties, and also has excellent mechanical strength, rigidity, impact resistance, folding resistance, etc. The present invention relates to a composite board suitable for electromagnetic wave shielding applications.

〔従来の技術〕[Conventional technology]

電子機器中の電子回路板に取り付けられた、各種の電子
素子は、その作動に伴なつて不要な電磁波を周囲に輻射
して居り、近接する電子素子に誤動作やノイズを発生す
ることがある。
Various electronic elements attached to an electronic circuit board in an electronic device may radiate unnecessary electromagnetic waves to the surroundings as they operate, causing malfunctions and noise in adjacent electronic elements.

そこで、従来より、短絡防止の為、表面に熱可塑性樹脂
フイルム又はシートを貼着した板金で筐体を形成し、電
磁波を遮蔽したり、両面に熱可塑性樹脂フイルム又はシ
ートを貼着した板金又は金属箔を電子回路板間に挿入す
る事により、回路板間の容量結合を防止する事が行なわ
れている。
Therefore, conventionally, in order to prevent a short circuit, a housing is formed of a sheet metal having a thermoplastic resin film or sheet attached to the surface thereof, and electromagnetic waves are shielded, or a sheet metal having a thermoplastic resin film or sheet attached to both surfaces thereof, or By inserting a metal foil between electronic circuit boards, capacitive coupling between the circuit boards is prevented.

しかしながら、一般に熱可塑性樹脂フイルム又はシート
は、体積固有抵抗及び表面固有抵抗値が共に高く、絶縁
材料として適しているが、表面固有抵抗値が高い為に摩
擦や接触により、非常に帯電し易く、これを電磁波遮蔽
用板金又は金属箔の絶縁層として使用した場合、静電放
電により電子回路板に付設したICの機能を破壊するの
で、それを改善する方法が色々と提案されている。
However, generally, the thermoplastic resin film or sheet has both a high volume resistivity and a high surface resistivity value and is suitable as an insulating material, but due to the high surface resistivity value, it is very easily charged by friction or contact, When this is used as an electromagnetic wave shielding sheet metal or an insulating layer of a metal foil, the function of the IC attached to the electronic circuit board is destroyed by electrostatic discharge, so various methods for improving it have been proposed.

例えば、 (1)熱可塑性樹脂フイルム又はシートの表面に帯電防
止剤を塗付する方法。
For example, (1) a method of applying an antistatic agent on the surface of a thermoplastic resin film or sheet.

(2)熱可塑性樹脂フイルム又はシートの表面に導電性
塗料を塗工する方法。
(2) A method of applying a conductive paint on the surface of a thermoplastic resin film or sheet.

(3)特開昭57−205145号公報に見られる様に、共押出
により熱可塑性樹脂フイルム又はシートの表面に導電層
を積層する方法等がある。
(3) As disclosed in JP-A-57-205145, there is a method of laminating a conductive layer on the surface of a thermoplastic resin film or sheet by coextrusion.

しかしながら、(1)の方法は、塗付直後は帯電防止効
果を示すが、長く使用している間に水分により流出した
り、表面の摩擦により帯電防止剤が除去されたりして、
帯電防止効果を失なう上に、ICや金属筐体に腐食を発生
するので、好ましい方法ではない。
However, the method (1) has an antistatic effect immediately after coating, but it may flow out due to moisture during long use, or the antistatic agent may be removed by friction on the surface.
This is not a preferable method because it loses the antistatic effect and causes corrosion to the IC and the metal case.

(2)の方法は基材樹脂の密着に必要な樹脂が限定さ
れ、かつ塗付が不均一となり易く、表面の摩擦に弱く表
面層が剥れて帯電防止効果を失なう上に剥離片による火
災の危険もあり、不適当な方法である。
In the method (2), the resin necessary for the adhesion of the base resin is limited, the coating is likely to be non-uniform, the surface layer is vulnerable to peeling, and the antistatic effect is lost. This is an unsuitable method because it may cause a fire.

一方(3)の方法は、帯電防止効果の持続性では非常に
有効な方法であるが、表面固有抵抗が低く、電子回路板
間の絶縁性は保持するが、IC端子間の絶縁性が保持出来
ず、適当な方法ではない。
On the other hand, the method (3) is very effective in maintaining the antistatic effect, but the surface resistivity is low and the insulation between the electronic circuit boards is maintained, but the insulation between the IC terminals is maintained. No, it's not the right way.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

本発明は、かかる欠点を解決するものであり、金属箔又
は金属板の片面もしくは両面に、導電性カーボンラツク
を少量含有する熱可塑性樹脂フイルム又はシートを一体
に積層し、その表面が帯電性かつ絶縁性を有し、さらに
機械的強度、剛性、耐衝撃性及び耐折強さ等に優れ、そ
の上電磁波遮効果が極めて良好な、電子機器中の電子回
路板間等の電磁波遮蔽用途に適した複合板を提供せんと
するものである。
The present invention is to solve such drawbacks, one or both sides of a metal foil or a metal plate, a thermoplastic resin film or sheet containing a small amount of conductive carbon rack is integrally laminated, the surface of which is electrostatic and Suitable for electromagnetic wave shielding applications such as between electronic circuit boards in electronic devices, which have insulating properties, and also have excellent mechanical strength, rigidity, impact resistance, folding resistance, etc. It is intended to provide a composite board.

〔問題点を解決する為の手段〕[Means for solving problems]

すなわち本発明は、20〜2000μm厚の金属箔又は金属板
の片面もしくは両面に、樹脂100重量部に対して導電性
カーボンラツクを2〜20重量部含有し、しかもその表面
固有抵抗値が1010Ω〜1016Ωである、熱可塑性樹脂フイ
ルム又はシートを一体に積層してなることを特徴とす
る。
That is, the present invention contains 2 to 20 parts by weight of conductive carbon rack to 100 parts by weight of resin on one or both sides of a metal foil or a metal plate having a thickness of 20 to 2000 μm, and has a surface specific resistance value of 10 10 It is characterized by integrally laminating a thermoplastic resin film or sheet having an Ω to 10 16 Ω.

以下本発明を更に詳細に説明する。The present invention will be described in more detail below.

本発明の金属箔又は金属板(以下電磁波遮蔽層という)
は、銅、亜鉛、真鍮、ベリリウム、錫、鉄、鋼及びパー
マロイ等であり、好ましくは近接界における磁界遮蔽を
考慮すると、透磁率が100を越える金属箔又は金属板が
用いられる。
Metal foil or metal plate of the present invention (hereinafter referred to as electromagnetic wave shielding layer)
Is copper, zinc, brass, beryllium, tin, iron, steel, permalloy, or the like, and preferably a metal foil or a metal plate having a magnetic permeability of more than 100 is used in consideration of magnetic field shielding in the near field.

金属箔又は金属板の厚味は20〜2000μm、好ましくは30
〜1000μmであり、20μm未満では充分な電磁波遮蔽効
果が得られず、一方2000μmを越えると軽量小型化が要
求される用途には使用が出来なくなる。また本発明の酸
化しやすい金属箔又は金属板を用いる場合には、酸化防
止の目的で、クロメート処理、亜鉛メツキ処理等の表面
処理されたものを使用するのが良い。次に本発明に用い
る熱可塑性樹脂フイルム又はシート(以下表面制電性絶
縁層という)の樹脂としては、例えば、ポリエチレン樹
脂、ポリプロピレン樹脂、ポリスチレン樹脂、ABS樹
脂、ポリエチレンテレフタレート樹脂など汎用の熱可塑
樹脂や芳香族ポリエーテル樹脂、ポリカーボネート樹
脂、ポリエーテルスルホン、ポリイミドなど耐熱性の熱
可塑性樹脂が挙げられる。なかでも高周波数領域におけ
る誘電損失を小さくする為には、tan δの小さい、ポリ
エチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹
脂、ABS樹脂が最も良好である。
The thickness of the metal foil or metal plate is 20 to 2000 μm, preferably 30
If it is less than 20 μm, a sufficient electromagnetic wave shielding effect cannot be obtained. On the other hand, if it exceeds 2000 μm, it cannot be used for applications requiring lightweight and small size. When the metal foil or metal plate of the present invention which is easily oxidized is used, it is preferable to use a surface-treated one such as chromate treatment or zinc plating treatment for the purpose of preventing oxidation. Next, examples of the resin of the thermoplastic resin film or sheet (hereinafter referred to as the surface antistatic insulating layer) used in the present invention include general-purpose thermoplastic resins such as polyethylene resin, polypropylene resin, polystyrene resin, ABS resin, polyethylene terephthalate resin. And heat-resistant thermoplastic resins such as aromatic polyether resin, polycarbonate resin, polyether sulfone, and polyimide. Among them, polyethylene resin, polypropylene resin, polystyrene resin, and ABS resin, which have a small tan δ, are the most preferable in order to reduce the dielectric loss in the high frequency region.

本発明の表面制電性絶縁層は、機械的強度、剛性、耐衝
撃性及び耐折強さの様な物性を、電磁波遮蔽層の金属箔
又は金属板によつてもたせることが出来るので、上記の
様な物性はそれほど強く要求されるものではなく、電磁
波遮蔽層と接着剤層との接着性を、充分に高める事が重
要である。
Since the surface antistatic insulating layer of the present invention can impart physical properties such as mechanical strength, rigidity, impact resistance and folding strength by the metal foil or metal plate of the electromagnetic wave shielding layer, Such physical properties are not so strongly required, and it is important to sufficiently enhance the adhesiveness between the electromagnetic wave shielding layer and the adhesive layer.

この目的から、表面制電性絶縁層については、添加剤や
他の樹脂成分を添加したり、コロナ処理や前処理剤の塗
付等の公知の手段を用いる事もある。
For this purpose, the surface antistatic insulating layer may be added with an additive or another resin component, or a known means such as corona treatment or application of a pretreatment agent may be used.

本発明に用いるカーボンブラツクは、例えば下記の様な
特性を満した導電性カーボンブラツクが使用される。
The carbon black used in the present invention is, for example, a conductive carbon black satisfying the following characteristics.

ストラクチヤーが発達している。 The structure is well developed.

粒子径が小さい。 The particle size is small.

表面積が大きい(細孔が多い)。 Large surface area (large number of pores).

大電子を捕束する不純物が少ない。 There are few impurities that trap large electrons.

グラフアイト化が進んでいる。 Graphite conversion is progressing.

また、添加量は2〜20重量部、好ましくは7〜15重量部
であり、2重量部未満では、表面帯電防止絶縁層の表面
固有抵抗値が上昇し、さらに誘電損率値が減少する為
に、帯電防止性能を損ない、電子機器中の電子回路板と
金属筐体とを電気的に絶縁する絶縁板の用途に適さず、
20重量部を越えると、表面固有抵抗値が減少する為に、
IC端子間の絶縁性が保持できず、これも又絶縁板の用途
に適さない。
Further, the addition amount is 2 to 20 parts by weight, preferably 7 to 15 parts by weight. If it is less than 2 parts by weight, the surface specific resistance value of the surface antistatic insulating layer increases and the dielectric loss factor value further decreases. In addition, the antistatic performance is impaired, and it is not suitable for use as an insulating plate that electrically insulates an electronic circuit board in an electronic device from a metal housing.
If the amount exceeds 20 parts by weight, the surface specific resistance value decreases,
Insulation between IC terminals cannot be maintained, which is also not suitable for use as an insulating plate.

次に本発明品を製造するには、まず、導電性カーボンブ
ラツクを少量含有する熱可塑性樹脂フイルム又はシート
を、T−ダイ成形法インフレーシヨン成形法・カレンダ
ー法及び溶剤キヤスト法等の方法で形成した後、金属箔
又は金属板と、押出ラミネート・ドライラミネート及び
エマルジヨンラミネート等の方法で、一体化する事で得
られる。
Next, in order to produce the product of the present invention, first, a thermoplastic resin film or sheet containing a small amount of conductive carbon black is prepared by a method such as T-die molding method inflation molding method / calender method and solvent cast method. After being formed, it can be obtained by integrating with a metal foil or a metal plate by a method such as extrusion lamination, dry lamination, and emulsion lamination.

この様な方法で得られた、本発明の制電性かつ絶縁性を
有する電磁波遮蔽用複合板全体の肉厚は、0.1〜10mm、
好ましくは0.2〜2mm程度であり、肉厚が0.1mm未満で
は、絶縁板としての強度が不足し、一方肉厚が10mmを超
える事は挿入スペースに限度がある為に好ましくない。
Obtained by such a method, the total thickness of the electromagnetic shielding composite plate of the present invention having antistatic and insulating properties is 0.1 to 10 mm,
The thickness is preferably about 0.2 to 2 mm, and if the wall thickness is less than 0.1 mm, the strength as an insulating plate is insufficient, while if the wall thickness exceeds 10 mm, it is not preferable because the insertion space is limited.

〔実施例〕〔Example〕

以下本発明を実施例により、さらに詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to Examples.

実施例1 耐衝撃性ポリスチレン樹脂は電気化学工業(株)商品名
「デンカスチロールHI−E−4」、カーボンブラツクは
電気化学工業(株)商品名「デンカアセチレンブラツ
ク」を用い、さらにこれにステアリン酸を加え表に示す
ような組成で配合し、その配合物を140℃に加熱された
バンバリーミキサー中に投入し、溶融混練し混合物が19
0℃に達した時点で取出し、直ちにミキシングロールに
てシート状に冷却、粉砕しペレツトとした。これを直径
40m/mの押出機(L/D=24)の供給口より押出機内に供給
し溶融して200℃の単層シートダイに供給し、肉厚0.5m/
mの表面制電性絶縁シートを形成した後、そのシート片
面と肉厚20μmの鋼箔(東洋鋼板(株)製商品名アイア
ンフオイルIF)とをウレタン糸接着剤でドライラミネー
トを行ない、一体化することで、板全体としての厚さ0.
52m/mの複合板を得た。得られた複合板の両層間の密着
力は十分であり剥離することは不可能であつた。この複
合板は、表に示す通り、帯電防止性、絶縁性電磁遮蔽効
果および機械的強度等の性能において、いずれもすぐれ
たものであつた。
Example 1 The impact-resistant polystyrene resin used was Denka Styrol HI-E-4, a trade name of Denki Kagaku Kogyo Co., Ltd., and the carbon black was Denka acetylene black, a trade name of Denka Kagaku Kogyo Co., Ltd. Acid is added and blended in the composition shown in the table, and the blended mixture is put into a Banbury mixer heated to 140 ° C. and melt-kneaded to form a mixture of 19
When it reached 0 ° C, it was taken out, immediately cooled into a sheet with a mixing roll, and pulverized into a pellet. This is the diameter
It is supplied into the extruder through the 40m / m extruder (L / D = 24) supply port, melted and supplied to a 200 ° C single-layer sheet die, with a wall thickness of 0.5m /
After forming a surface antistatic insulating sheet of m, one side of the sheet and 20 μm thick steel foil (TOYO STEEL CO., LTD. product name Ironfoil IF) are dry-laminated with urethane thread adhesive and integrated. As a result, the total thickness of the board is 0.
A 52 m / m composite plate was obtained. The adhesive force between the two layers of the obtained composite plate was sufficient and peeling was impossible. As shown in the table, this composite plate was excellent in all properties such as antistatic property, insulating electromagnetic shielding effect, and mechanical strength.

実施例2 実施例1と同様の肉厚20μmの銅箔の両面に、肉厚0.25
m/mの表面制電性絶縁シートを、ウレタン糸接着剤でド
ライラミネートを行ない、複合板全体の厚さ0.52m/mの
三層構成とした以外は、実施例1と同様な条件で作業を
行ない複合板を得た。
Example 2 A copper foil having a thickness of 20 μm similar to that of Example 1 was provided on both sides with a thickness of 0.25
Working under the same conditions as in Example 1 except that the m / m surface antistatic insulating sheet was dry laminated with a urethane thread adhesive to form a three-layer structure with a total composite plate thickness of 0.52 m / m. The composite plate was obtained.

この複合板は、表に示す通り、帯電防止性、絶縁性、機
械的強度等の性能においていずれも秀れたものであつ
た。
As shown in the table, this composite plate was excellent in all properties such as antistatic property, insulating property and mechanical strength.

実施例3 導電層に混入させるカーボンブラツクとして、ケツチエ
ンブラツク日本EC(株)商品名「ケツチエンブラツクE
C」を、表に示す配合組成で混入させた以外は、実施例
1と同様の条件で作業を行ない、肉厚0.52m/mの複合板
を得た。この複合板は、表に示す通り、帯電防止性、絶
縁性、電磁遮蔽効果および機械的強度等の性能において
いずれも秀れたものであつた。
Example 3 As a carbon black to be mixed in the conductive layer, KETCHEN BLACK Japan EC Co., Ltd., trade name "KETCHEN BLACK E
C "was mixed in the composition shown in the table, and the same operation as in Example 1 was carried out to obtain a composite plate having a wall thickness of 0.52 m / m. As shown in the table, this composite plate was excellent in all properties such as antistatic property, insulating property, electromagnetic shielding effect and mechanical strength.

実施例4 表面制電性絶縁シートの樹脂成分として耐衝撃性ポリス
チレン樹脂の代りに、ABS樹脂として電気化学工業
(株)商品名「デンカABS GR−2000」を用いた以外は、
実施例1と同様の条件で作業を行ない、肉厚0.52m/mの
シートを得た。このシートは、表に示す通り、帯電防止
性、絶縁性電磁遮蔽効果および機械的強度等の性能にお
いて、いずれも秀れたものであつた。
Example 4 In place of the impact-resistant polystyrene resin as the resin component of the surface antistatic insulating sheet, Denka Chemical Industry Co., Ltd. trade name "Denka ABS GR-2000" was used as the ABS resin, except that
Work was performed under the same conditions as in Example 1 to obtain a sheet having a wall thickness of 0.52 m / m. As shown in the table, this sheet was excellent in all properties such as antistatic property, insulating electromagnetic shielding effect and mechanical strength.

実施例5 電磁波遮蔽層として、肉厚1000μmの鋼板を用い、複合
板全体の厚さを1.5m/mとした以外は、実施例1と同様な
条件で作業を行ない複合板を得た。
Example 5 A composite plate was obtained under the same conditions as in Example 1 except that a steel plate having a thickness of 1000 μm was used as the electromagnetic wave shielding layer and the total thickness of the composite plate was 1.5 m / m.

この複合板は、表に示す通り、帯電防止性、絶縁性、電
磁遮蔽効果および機械的強度等の性能において、いずれ
も秀れたものであつた。
As shown in the table, this composite plate was excellent in all properties such as antistatic property, insulating property, electromagnetic shielding effect and mechanical strength.

比較例1〜2 耐衝撃性ポリスチレン樹脂は電気化学工業(株)商品名
「デンカスチロールHI−E−4」、カーボンブラツクは
電気化学工業(株)商品名「デンカアセチレンブラツ
ク」を用いさらにこれにステアリン酸を加え表に示すよ
うな組成で配合し、その配合物を140℃に加熱されたバ
ンバリーミキサー中に投入し、溶融混練し混合物が190
℃に達した時点で取出し、直ちにミキシングロールにて
シート状に冷却、粉砕しペレツトとした。これを直径40
m/mの押出機(L/D=24)の供給口より押出機内に供給し
溶融して200℃の単層シートダイに供給し、肉厚0.5m/m
の表面制電性絶縁シートを形成した後、肉厚20μmの鉄
箔(東洋鋼板社製、商品名アイアンフオイルIF)とウレ
タン糸接着剤でドライラミネートを行ない、一体化する
ことで、板全体としての厚さ0.52m/mの複合板を得た。
Comparative Examples 1 and 2 The impact-resistant polystyrene resin is Denka Styrol HI-E-4, a trade name of Denki Kagaku Kogyo KK, and the carbon black is Denka acetylene black, a trade name of Denki Kagaku Kogyo Co., Ltd. Stearic acid was added and blended in the composition shown in the table. The blended mixture was put into a Banbury mixer heated to 140 ° C, and melt-kneaded to obtain a mixture of 190
When the temperature reached ℃, it was taken out, immediately cooled with a mixing roll into a sheet and crushed into pellets. Diameter 40
It is fed into the extruder from the feed port of the m / m extruder (L / D = 24), melted and fed to a 200 ° C single layer sheet die, with a wall thickness of 0.5 m / m
After forming the surface anti-static insulating sheet of, the iron foil with a thickness of 20 μm (product name: Ironfoil IF, manufactured by Toyo Steel Co., Ltd.) and urethane thread adhesive are dry laminated and integrated to form the entire plate. A composite plate with a thickness of 0.52 m / m was obtained.

この複合板の帯電防止性、絶縁性、電磁遮蔽効果および
物性測定結果を表に示す。
The antistatic property, insulating property, electromagnetic shielding effect and physical property measurement results of this composite plate are shown in the table.

比較例3 電磁波遮蔽層として、肉厚5000μmの鋼板を用い、複合
板全体の厚さを5.5m/mとした以外は、比較例1と同様な
条件で作業を行ない複合板を得た。
Comparative Example 3 A composite plate was obtained under the same conditions as in Comparative Example 1 except that a steel plate having a thickness of 5000 μm was used as the electromagnetic wave shielding layer and the total thickness of the composite plate was 5.5 m / m.

この複合板の帯電防止性、絶縁性、電磁波遮蔽効果およ
び物性測定結果を表に示す。
The antistatic property, insulating property, electromagnetic wave shielding effect and physical property measurement results of this composite plate are shown in the table.

なお実施例および比較例における試験方法は次の方法に
より行なつた。
The test methods in Examples and Comparative Examples were as follows.

1.表面固有抵抗……JIS K−6911に準拠、川口電機
(株)、常温測定箱、超絶縁計使用 2.誘電損率……JIS K−6911に準拠、安藤電気(株)誘
電体損測定装置使用 3.帯電電荷量……樹脂シート表面を乾燥綿布で摩擦し
(20往復)、フアラデーケージ内で、発生電荷量を測定
する。
1.Surface resistivity: JIS K-6911 compliant, Kawaguchi Denki Co., Ltd., room temperature measuring box, super insulation meter used 2. Dielectric loss factor: JIS K-6911 compliant, Ando Electric Co., Ltd. dielectric loss Using the measuring device 3. Charged charge: Rub the surface of the resin sheet with a dry cotton cloth (20 strokes) and measure the generated charge in the Faraday cage.

4.電磁波遮蔽効果……図面に示す如く、導電管中にサン
プルをセツトし、インピーダンスの不適合による電磁波
の遮蔽効果を測定した。
4. Electromagnetic wave shielding effect: As shown in the drawing, the sample was set in a conductive tube and the electromagnetic wave shielding effect due to impedance mismatch was measured.

5.引張強さ……JIS K−6734に準拠インストロンにより
1分間50mmの引張り速さで引張り試験を行ない破断する
までの、最大荷重を測り、引張り強さとした。
5. Tensile strength: In accordance with JIS K-6734, a tensile test was performed with an Instron at a tensile speed of 50 mm for 1 minute, and the maximum load until breakage was measured and defined as the tensile strength.

6.耐折強さ……JIS−P−8115紙および板紙のMIT形試験
により耐折強さ試験方法に準じて行なつた。張力500g、
毎分175回の速度で折り曲げ、折り曲げ角度は75度で行
なつた。シートの流れ方向にサンプルをとつた試験片を
タテ方向、シートの流れ方向と直角にサンプルをとつた
試験片をヨコ方向とし、JIS−Z−8401(数値の丸め
方)に従い平均値で値を示した。
6. Folding endurance: JIS-P-8115 MIT test of paper and paperboard was performed according to the folding endurance test method. Tension 500g,
It was bent at a speed of 175 times per minute, and the bending angle was 75 degrees. The test piece with the sample in the sheet flow direction is the vertical direction, and the test piece with the sample in the sheet flow direction is the horizontal direction, and the average value is determined according to JIS-Z-8401 (Rounding number). Indicated.

〔発明の効果〕〔The invention's effect〕

以上説明した通り、本発明は金属箔又は金属板と、導電
性カーボンブラツクを少量含有する熱可塑性樹脂フイル
ム又はシートとを、一体に積層することにより、帯電防
止性、絶縁性、電磁波遮蔽効果および機械的強度のすぐ
れた、複合板が得られる効果がある。
As described above, the present invention is a metal foil or a metal plate, and a thermoplastic resin film or sheet containing a small amount of conductive carbon black, by integrally laminated, antistatic properties, insulation, electromagnetic wave shielding effect and There is an effect that a composite plate having excellent mechanical strength can be obtained.

【図面の簡単な説明】[Brief description of drawings]

図面は、電磁波遮蔽効果を測定する装置の概略説明図で
ある。 1……導波管、2……サンプル、3……50Ω同軸ケーブ
ル、4……スペクトラムアナライザー、5……トラツキ
ングジエネレーター
The drawings are schematic illustrations of an apparatus for measuring an electromagnetic wave shielding effect. 1 ... Waveguide, 2 ... Sample, 3 ... 50Ω coaxial cable, 4 ... Spectrum analyzer, 5 ... Tracking generator

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】20〜2000μm厚の金属箔又は金属板の片面
もしくは両面に、樹脂100重量部に対して導電性カーボ
ンブラツクを2〜20重量部含有し、しかもその表面固有
抵抗値が1010Ω〜1016Ωである、熱可塑性樹脂フイルム
又はシートを一体に積層してなる、制電性かつ絶縁性を
有する電磁波遮蔽用複合板。
1. A metal foil or metal plate having a thickness of 20 to 2000 μm contains 2 to 20 parts by weight of a conductive carbon black with respect to 100 parts by weight of a resin, and has a surface specific resistance value of 10 10. A composite plate for electromagnetic wave shielding having an antistatic property and an insulating property, which is obtained by integrally laminating a thermoplastic resin film or a sheet having an Ω to 10 16 Ω.
JP60204548A 1985-09-18 1985-09-18 Composite plate for electromagnetic wave shielding Expired - Lifetime JPH0799796B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60204548A JPH0799796B2 (en) 1985-09-18 1985-09-18 Composite plate for electromagnetic wave shielding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60204548A JPH0799796B2 (en) 1985-09-18 1985-09-18 Composite plate for electromagnetic wave shielding

Publications (2)

Publication Number Publication Date
JPS6265499A JPS6265499A (en) 1987-03-24
JPH0799796B2 true JPH0799796B2 (en) 1995-10-25

Family

ID=16492330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60204548A Expired - Lifetime JPH0799796B2 (en) 1985-09-18 1985-09-18 Composite plate for electromagnetic wave shielding

Country Status (1)

Country Link
JP (1) JPH0799796B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634469B2 (en) * 1986-07-14 1994-05-02 オリエント時計株式会社 Method for manufacturing electromagnetic shield housing
JPH0572196U (en) * 1990-12-28 1993-09-28 株式会社エービーシー商会 Electromagnetic wave shield interior material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212198A (en) * 1982-06-03 1983-12-09 住友ベークライト株式会社 Electromagnetic shield

Also Published As

Publication number Publication date
JPS6265499A (en) 1987-03-24

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