JPH0814028B2 - Fine pattern structure and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to the ratio of the thickness (plate thickness) of a substrate sheet to the hole diameter or slit width, that is, plate thickness / hole diameter or plate thickness / slit width (hereinafter, aspect ratio). The present invention relates to a fine pattern structure having a fine through-hole pattern having a ratio of 1 or more) and a manufacturing method thereof.

[Conventional technology]

The fine pattern structure is used for lead frames, various metal masks, shadow masks, circuit boards, connectors, encoders, slit plates, various filters, etc., but the manufacturing method is generally performed by pressing or etching. There is. In addition, a processing method using ion milling or laser to form holes or slits having a large aspect ratio, or a plurality of plates processed into the same shape by reducing the plate pressure as disclosed in JP-A-51-40869 A method of superposing is also proposed.

[Problems to be Solved by the Invention]

However, it is difficult to form a through-hole pattern having an aspect ratio of 1 or more by the conventional pressing method or etching method, and in the method of stacking a plurality of plates, the relative positions of the plurality of plates can be accurately determined. Since it is extremely difficult, it is difficult to obtain a product with a high through-hole pattern size and thickness.

Further, the above-mentioned method using ion milling or laser processing has a low processing speed, which may cause damage to a portion that is not desired to be processed and may increase the cost of processing equipment.

Therefore, an object of the present invention is to provide a fine pattern structure that can easily control the aspect ratio to a high value of 1 or more, and is advantageous in manufacturing cost and production efficiency, and a method for manufacturing the same.

[Means for solving the problem]

In order to solve the above-mentioned problems, the present invention takes measures to form a through hole obliquely with respect to the thickness direction of the base sheet and thereby control the aspect ratio to 1 or more.

That is, the present invention is a fine pattern structure in which a fine through hole pattern penetrating in the thickness direction of the base sheet is formed, and each through hole of the through hole pattern is in the thickness direction of the base sheet. The present invention provides a fine pattern structure which penetrates in an oblique direction and has an aspect ratio of 1 or more.

Further, according to the present invention, a first resist pattern partitioned by openings is formed on the front surface of the base material sheet, and a second resist pattern partitioned by openings corresponding to the first resist pattern is formed on the back surface. The first and second layers are formed by spraying an etching solution from the front and back surfaces of the base sheet.
In the method of manufacturing a fine pattern structure in which the base sheet is etched through the opening of the resist pattern in the thickness direction to form a fine through-hole pattern, the opening of the first resist pattern and the corresponding A manufacturing method characterized in that these resist patterns are formed at positions displaced from each other such that the positional relationship between the second resist pattern and the opening is diagonally opposed to each other, and then the etching is performed. It is a thing.

[Action]

In the fine pattern structure of the present invention, since each through hole of the through hole pattern penetrates obliquely with respect to the thickness direction of the base sheet, when viewed from a direction perpendicular to the surface of the base sheet. The hole diameter or the slit width of the through hole is apparently reduced, so that the aspect ratio can be remarkably increased.

Further, in the manufacturing method of the present invention, in order to form the oblique through-holes described above, the resist patterns formed on the front and back surfaces of the base sheet are formed with a slight offset so that the openings are diagonally opposed to each other. By etching through these openings, through-holes that naturally skew are formed,
This makes it possible to easily control the aspect ratio of the through-hole pattern to 1 or more.

〔Example〕

 Hereinafter, the present invention will be described with reference to the illustrated embodiments.

First, as shown in FIG. 1A, a resist pattern 3 partitioned by openings 2 is formed on the front and back surfaces of a base material sheet 1 made of a thin metal plate used for a lead frame or the like, for example. In the resist pattern 3, wide portions 3a and narrow portions 3b are alternately formed via the openings 2. The resist pattern 3 on the front surface of the base sheet 1 has a resist pattern on the back surface directly below the wide portion 3a. The narrow portions 3b are formed so as to be offset from each other so that they are located. Therefore, each opening 2 of the resist pattern 3 on the front surface of the substrate sheet 1 diagonally opposes each opening 2 of the resist pattern 3 on the corresponding back surface as indicated by a broken line a.

In this state, the etching liquid is sprayed from the front and back surfaces of the base material sheet 1 as in the conventional case. As a result, the base sheet 1 is isotropically etched from the openings 2 of the resist pattern 3 to form through holes 4 oblique to the thickness direction of the base sheet 1 as shown in FIG. 1 (B). Then, the resist pattern 3 is removed by dissolution to obtain a fine pattern structure 5 as shown in FIG. 1 (C).

In this case, the hole diameter or slit width of the through hole is represented by "W", which is the width in the direction perpendicular to the surface of the base material sheet 1 as shown in the figure, and the aspect ratio is 1 with respect to the plate thickness "T" of the base material sheet 1. The above small values can be maintained.

FIG. 2 shows another embodiment of the present invention. The method for forming a resist pattern on a base sheet is basically the same as that of the embodiment shown in FIG. 1 except for the only difference. That is, the narrow portion 3b of the resist pattern is formed by halftone dots. Therefore, the narrow portion 3b is also etched at a slow speed, but the etching progresses, and the shape after the etching step is uneven as shown in FIG. 2 (B). However, the aspect ratio (T / W) can be controlled to 1 or more as in the embodiment of FIG.

FIG. 3 shows still another example of the present invention, in which a resist pattern 3 in which openings 2 are partitioned at equal intervals is formed on both front and back surfaces of a base material sheet 1. However, also in this case, the resist pattern 3 on the front surface is provided so as to be slightly displaced from the resist pattern 3 on the back surface, and as a result, the openings 2 on the front and back surfaces are diagonally opposed to each other as indicated by a broken line "a". It becomes a positional relationship. Base sheet 1 in this state
By performing the etching from the front and back surfaces of FIG. 1, the through holes 4 are formed in a state of being oblique to the thickness direction of the base material sheet 1 as in the case of the embodiment of FIG. ), The aspect ratio (T / W) can be controlled to 1 or more.

The size of the aspect ratio can be appropriately determined in consideration of the size of the opening of the resist pattern, the size of the positional deviation between the openings of the resist pattern on the front and back of the base sheet, and the like.

〔The invention's effect〕

As described above in detail, according to the present invention, since each through hole of the transparent pattern penetrating in the thickness direction of the base sheet is formed obliquely with respect to this thickness direction, a fine pattern having an aspect ratio of 1 or more is formed. The pattern structure can be manufactured at low cost and with high precision, there is no need to bond two base material sheets together as in the past, and there is a risk of damaging the processed part as in conventional ion milling or laser processing. There is a remarkable effect such as no.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a method of manufacturing a fine pattern structure of the present invention in the order of steps, and FIGS. 2 and 3 are sectional views showing other embodiments of the present invention. 1 ... Substrate sheet, 2 ... Opening part, 3 ... Resist pattern, 4 ... Through hole, 5 ... Fine pattern structure.

Claims (2)

[Claims] 1. A fine pattern structure having a fine through hole pattern penetrating in the thickness direction of a base sheet, wherein each through hole of the through pattern is in the thickness direction of the base sheet. A fine pattern structure, which penetrates in an oblique direction and has an aspect ratio of 1 or more. 2. A first resist pattern partitioned by openings in the front surface of a base sheet, and a second resist pattern similarly partitioned by openings in the back surface corresponding to the first resist pattern. To form a fine through-hole pattern by spraying an etching solution from the front and back surfaces of the base sheet to etch the base sheet in the thickness direction through the openings of the first and second resist patterns. In the method for manufacturing a pattern structure, the positional relationship between the opening of the first resist pattern and the corresponding opening of the second resist pattern is offset from each other such that they are diagonally opposed to each other. A manufacturing method characterized by forming these resist patterns and then performing the above etching.