JPH0815168B2 - Semiconductor chip observation device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip observing apparatus, in which an outer lead extending from the semiconductor chip is landed on a transparent landing body and is observed by a camera below.

[0002]

2. Description of the Related Art It is known as a so-called TAB method that a semiconductor is mounted on a film carrier made of a synthetic resin such as polyimide, and then the film carrier is punched by a punching device to form a semiconductor chip. There is.

Bonding such a semiconductor chip to a substrate is generally called outer lead bonding. In this outer lead bonding, very thin outer leads extending from the semiconductor at a very small pitch are provided on the substrate. Since it is necessary to match the formed ultra-fine electrode portion, the outer lead is observed with a camera in advance and its position is accurately detected.

[0004]

By the way, the film carrier is wound around a reel for management, and therefore the outer lead formed by punching out the film carrier is bent due to curling. There are many.

Bonding a semiconductor to a film carrier is generally called inner lead bonding. In this inner lead bonding, the inner lead of the film carrier is thermocompression bonded to an electrode portion formed on the circuit surface of the semiconductor. As a result, thermal stress is generated and the leads are easily deformed. The lead made of the film carrier is easily bent and deformed for various reasons.

FIG. 5 shows a state in which the outer lead L of the semiconductor chip P bent and deformed in this way is observed by the camera 100. However, since the outer lead L is bent and deformed, the correct position is set. Therefore, the outer lead L cannot be accurately matched with the electrode portion 102 of the substrate 101 even if the semiconductor chip P is mounted on the substrate 101 based on this observation result. Reference numeral 103 denotes a nozzle of a transfer head that sucks the semiconductor chip P.

Therefore, an object of the present invention is to provide means for correctly observing a bent and deformed outer lead.

[0008]

To this end, the present invention observes a transparent landing body on which the outer leads of the semiconductor chip attracted to the nozzle of the transfer head are landed, and the outer leads landing on the landing body. The camera and the static eliminator of this landing body constitute a semiconductor chip observation device.

[0009]

In the above structure, the outer lead of the semiconductor chip is landed on the transparent landing plate to correct the bending deformation, and is observed by the camera.

In this case, if the landing body is charged,
The dust in the air is adsorbed and adheres to the outer leads landing on the landing body, resulting in defective outer lead bonding. Therefore, the static eliminator prevents the landing body from being charged.

[0011]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor chip observing apparatus, in which XY is composed of an X table 2 and a Y table 3.
A camera 6 is attached to a support plate 4 which is a table and extends from the Y table 3 via a micrometer 5. The micrometer 5 moves the camera 6 up and down to adjust the focal length. MX and MY are an X motor and a Y motor.

Reference numeral 10 is a table plate provided on the upper side of the XY table 1, and a bracket 13 is mounted on the upper surface of the table plate via an X rail 11 and a slider 12 so as to be slidable in the X direction. 14 is a cylinder and 15 is its rod. The tip of the rod 15 is connected to the bracket 13, and the bracket 13 slides in the X direction as the rod 15 moves forward and backward.

Reference numeral 20 denotes a landing stage mounted on the upper portion of the bracket 13 and mounted with a transparent plate-shaped landing body 21 such as a glass plate. This landing body 21
As described above, the cylinder slides in the X direction by the operation of the cylinder 14, moves forward above the camera 6, and retracts laterally.

In FIG. 3, reference numeral 31 denotes an ion generator as a charge eliminating means. Ions generated by the ion generator 31 pass through a tube 32 and land from a blowout portion 33 formed around the landing body 21. The landing body 21 is discharged by blowing on the surface of the body 21. By removing the static electricity from the landing body 21 in this manner, dust in the air is adsorbed to the landing body 21 and prevented from adhering to the outer leads L landed on the landing body 21. As the charge eliminating means, other than this embodiment, for example, there is a means for bringing a conductive brush into contact with the landing body.

In FIG. 1, reference numerals 22 and 23 denote plate-shaped light source portions, which are arranged above the landing stage 20 at intervals t and are supported by support arms 24 and 25. This interval t serves as a passage for the nozzle 27 of the transfer head 26 that adsorbs the semiconductor chip P.

Reference numeral 28 denotes a movable stage, which moves in the X direction, and the semiconductor chip P mounted on the movable stage is moved to the light source section 22,
It is carried in below 23. L is an outer lead formed by punching out a film carrier, C is an outer lead L
The semiconductor is inner lead bonded on top.

This observing apparatus has the above-mentioned structure, and an observing method will be described with reference to FIGS. 2 (a) to 2 (e).

With the landing stage 20 retreated to the side, the movable stage 28 moves forward, and the semiconductor chip P mounted on the movable stage 28 is carried in between the camera 6 and the light source units 22 and 23 (see FIG. a)).

At the same time, the nozzle 27 of the transfer head 26
Enters the space t between the light source units 22 and 23, and the movable stage 2
The semiconductor chip P on 8 is sucked up and taken up, and the movable stage 28 retreats sideways ((b) of the same figure).

Next, the landing body 21 enters between the camera 6 and the semiconductor chip P ((c) in the figure), and then the nozzle 27 descends to land the outer lead L on the landing body 21.
Next, by operating the XY table 1 and moving the camera 6 in the XY directions, the outer leads L extending from the four sides of the semiconductor C are observed through the landing body 21 (FIG. 3D).

At this time, the light source portions 22 and 23 are turned on, and therefore the silhouette of the outer lead L can be clearly observed by the camera 6. Next, the nozzle 27 moves up to transfer the semiconductor chip P to the next step, and the landing body 21
Moves to the side ((e) in the figure).

FIG. 3 shows a state in which the outer lead L is landed on the landing body 21 in the step of FIG. As described above, the outer lead L is bent and deformed due to the curling of the film carrier and thermal stress, but this bending deformation is corrected by landing on the landing body 21, and therefore the camera 6 allows the outer lead L to be corrected. By properly observing the positional deviation of the leads L and the like, the outer leads L can be accurately matched and bonded to the electrode portions of the substrate in a later step.

Further, dust is prevented from adhering to the outer leads L by spraying ions onto the landing body 21 to remove the charge. The timing at which the ions are blown out from the blowing portion 33 is preferably before the outer lead L lands on the landing body 21 so as not to hinder the observation by the camera 6.

By the way, the nozzle 27 itself has a height error due to bending deformation due to heat during the above-mentioned inner lead bonding. Therefore, the upper surface of the landing body 21 at the observation position and the semiconductor chip P
If there is a difference in height on the top surface of the board (not shown) on which the
A relative displacement occurs between the outer lead L of the semiconductor chip P and the electrode portion of the substrate. Therefore, it is desirable that the height of the upper surface of the landing body 21 is made to coincide with the height of the upper surface of the substrate on which the semiconductor chip P is mounted.

As shown in FIG. 4, the semiconductor chip P is directly transferred and landed on the landing body 21 by the nozzle 27.
It may be observed by the camera 6, and in this case, the movable table 28 is unnecessary.

[0027]

As described above, the present invention provides a transparent landing body for landing the outer leads of the semiconductor chip attracted to the nozzle of the transfer head, and a camera for observing the outer leads landing on the landing body. Since the static eliminator of this landing body constitutes the semiconductor chip observation device,
Correct the posture of the outer leads extending from the semiconductor,
It is possible to observe with high precision by a camera, and it is possible to prevent dust from adhering to the outer leads and to bond the outer leads to the substrate well.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor chip observation apparatus according to a first embodiment of the present invention.

2A is a side view of the semiconductor chip observing apparatus according to the first embodiment during observation, FIG. 2B is a side view of the semiconductor chip observing apparatus according to the first embodiment during observation, and FIG. Side view of the semiconductor chip observing apparatus according to the first embodiment during observation (d) is a side view of the semiconductor chip observing apparatus according to the first embodiment during observation (e) is a semiconductor chip according to the first embodiment Side view of the observation device during observation

FIG. 3 is a perspective view of the semiconductor chip observing apparatus according to the first embodiment with a semiconductor chip mounted on a landing body.

FIG. 4 is a side view of the semiconductor chip observing apparatus according to the second embodiment of the present invention during observation.

FIG. 5 is a perspective view during observation of a conventional semiconductor chip observation apparatus.

[Explanation of symbols]

 6 camera 21 landing body 26 transfer head 27 nozzle 31 ion generator L outer lead P semiconductor chip

Claims (1)

[Claims] 1. A transparent landing body for landing an outer lead of a semiconductor chip adsorbed by a nozzle of a transfer head, a camera for observing the outer lead landing on the landing body, and a discharging means for the landing body. An observation device for a semiconductor chip, which is provided.