JPH088440B2 - Semiconductor chip observing apparatus and observing method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor chip observing apparatus, in which outer leads extending from the semiconductor chip are landed on a transparent landing plate and observed by a camera below. It was done.

(Prior Art) It is known as a so-called TAB method that a semiconductor is mounted on a film carrier made of a synthetic resin such as polyimide, and then the film carrier is punched by a cutter to form a semiconductor chip. Mounting such a semiconductor chip on a substrate is generally referred to as outer lead bonding. In this outer lead bonding, very fine outer leads extending from the semiconductor at a very small pitch are formed on the substrate. Since the outer leads must be matched, the outer leads are observed with a camera in advance and their positions are precisely detected.

(Problems to be solved by the invention) By the way, the film carrier is a bendable tape and is managed by being wound around a reel. Therefore, the outer lead formed by punching out the film carrier is bent by curling. Often. Mounting a semiconductor on a film carrier is generally called inner lead bonding. This inner lead bonding is performed by thermocompression bonding the inner leads of the film carrier to the electrode parts formed on the circuit surface of the semiconductor. As a result, thermal stress is generated at that time, and the leads are easily deformed.

FIG. 9 shows a state in which the outer lead L of the semiconductor chip P bent and deformed in this way is observed by the camera 100. Since the outer lead L is bent and deformed, its correct position can be observed. Therefore, even if the semiconductor chip P is mounted on the substrate 101 based on this observation result, the outer lead L cannot be accurately matched with the electrode portion 102 of the substrate 101. Reference numeral 103 is a nozzle of a transfer head that sucks the semiconductor chip P.

Therefore, the present invention provides a semiconductor chip observing apparatus and an observing method capable of correcting a bending deformation of an outer lead of a semiconductor chip manufactured by a flexible film carrier and correcting the bending deformation correctly by a camera. The purpose is to do.

(Means for Solving the Problems) To this end, the present invention is directed to a camera, a light source section provided above the camera, and a semiconductor that is located between the camera and the light source section and is attracted to a nozzle of a transfer head. Corrects the bending deformation of the outer leads by landing the bendable outer leads of the chip, and configures a semiconductor chip observation device with a transparent landing plate for positioning all the outer leads at the focal length of the camera. did.

In addition, the semiconductor chip is attracted to the lower end of the nozzle of the transfer head, and the bendable outer lead is landed on the upper surface of the transparent landing plate to correct the bending deformation of the outer lead. While maintaining the above, the outer lead landing on the landing plate was observed by irradiating light from above with a camera arranged below the landing plate.

Further, preferably, the height of the upper surface of the landing plate is made to coincide with the height of the upper surface of the substrate on which the semiconductor chip is mounted in a later process.

(Operation) According to the above configuration, even if the outer leads are bent and deformed by landing the outer leads on the landing plate, this bending deformation is corrected and all the outer leads are at the same focal length position of the camera. Positioned on the level,
Can be clearly observed with the same accuracy. Further, by matching the height of the upper surface of the landing plate with the height of the upper surface of the substrate, it is possible to mount the landing plate on the substrate with high accuracy in the process after observation.

In addition, the outer lead is landed on the landing plate with the nozzle of the transfer head adsorbing the semiconductor chip, and by observing with the camera while maintaining this adsorbed state, the nozzle can adsorb and release the semiconductor chip. It is possible to mount the semiconductor chip on the substrate with high accuracy and high speed by eliminating the accompanying positional displacement of the semiconductor chip and the occurrence of loss time.

Example 1 Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor chip observation apparatus,
Reference numeral 1 denotes an XY table composed of an X table 2 and a Y table 3. A camera 6 is mounted on a support plate 4 extending from the Y table 3 via a micrometer 5. The micrometer 5 moves the camera 6 up and down to adjust the focal length. MX and MY are an X motor and a Y motor.

Reference numeral 10 is a table plate provided on the upper side of the XY table 1, and a bracket 13 is mounted on the upper surface of the table plate via an X rail 11 and a slider 12 so as to be slidable in the X direction. 14 is a cylinder, 15 is its rod, and rod 15
Is connected to the bracket 13, and when the rod 15 moves forward and backward, the bracket 13 slides in the X direction.

Reference numeral 20 denotes a landing stage mounted on the upper portion of the bracket 13, to which a transparent landing plate 21 such as a glass plate is mounted. As described above, the landing plate 21 slides in the X direction by the operation of the cylinder 14, moves forward above the camera 6 and moves back laterally. 22,23 is landing stage 2
The light sources are plate-like light sources arranged opposite to each other at a distance t above 0 and are supported by support arms 24 and 25. This interval t serves as a passage for the nozzle 27 of the transfer head 26 that adsorbs the semiconductor chip P. Reference numeral 28 denotes a movable stage which moves in the X-direction and allows the semiconductor chip P mounted on the movable stage to move to the light source section.
Carry in below 22,23. L is an outer lead formed by punching out a film carrier, and C is a semiconductor mounted on the outer lead L by inner lead bonding.

This observation device has the above-mentioned configuration, and then the second
The observation method will be described with reference to FIGS.

With the landing stage 20 retreated to the side, the movable stage 28 moves forward, and the semiconductor chip P mounted on the movable stage 28 is carried in between the camera 6 and the light source units 22 and 23 (Fig. 2 (a)). ). At the same time, the nozzle 27 of the transfer head 26 enters the space t between the light source units 22 and 23, sucks up the semiconductor chip P on the movable stage 28 and takes it up, and the movable stage 28 retreats sideways ( The same figure (b)). Next, the landing stage 20 enters between the camera 6 and the semiconductor chip P,
((C) in the figure), then, the nozzle 27 descends, the outer lead L is landed on the landing plate 21, and then the XY table 1 is operated to move the camera 6 in the XY direction.
The outer leads L extending from the four sides of the semiconductor C are observed ((d) in the figure). At this time, the light source units 22 and 23 are turned on, so that the silhouette of the outer lead L can be clearly observed by the camera 6. Next, the nozzle 27 moves up to transfer the semiconductor chip P to the next step, and the landing stage 20 retreats laterally ((e) in the figure).

FIG. 3 shows a state in which the outer lead L is landed on the landing plate 21 in the step (d). As described above, the outer lead L is bent and deformed due to the curling of the film carrier and thermal stress. However, when the outer lead L is landed on the landing plate 21, this bending deformation is corrected.
Therefore, it is possible to correctly observe the positional deviation of the outer leads L with the camera 6 and to mount the outer leads L while accurately matching them with the electrode portions of the substrate in a later step.

By the way, the nozzle 27 itself has a height error due to bending deformation due to heat during the inner lead bonding described above. Therefore, if there is a difference in height between the upper surface of the landing plate 21 at the observation position and the upper surface of the substrate (not shown) on which the semiconductor chip P is mounted, the semiconductor chip P
There is a relative displacement between the outer lead L and the electrode portion of the substrate. Therefore, it is desirable that the height of the upper surface of the landing plate 21 is made to coincide with the height of the upper surface of the substrate on which the semiconductor chip P is mounted. As shown in FIG. 4, the semiconductor chip P may be directly transferred and landed on the landing plate 21 by the nozzle 27 and observed by the camera 6. In this case, the movable table 28 is not necessary.

(Second Embodiment) In the second embodiment, the nozzle 27 is provided between the light source units 22 and 23.
Since there is a space t for entering and exiting, uneven illumination occurs, and the outer leads L extending in four directions from the semiconductor C cannot be observed uniformly and clearly. Therefore, in this embodiment, means for solving such a difficulty will be described.

In FIG. 5, the support arms 24 and 25 are supported by the movable blocks 31 and 32. This movable block 31,32
Slides back and forth in the Y direction along the guide rod 33. 3
Reference numerals 4 and 35 denote support blocks for the guide rod 33, and 36 denotes a fixed plate mounted on the tip of the guide rod 33. The fixed plate 36 and the movable blocks 31 and 32 are coupled by a coil spring material 37, and the spring force thereof causes the light source unit
22 and 23 are urging toward closing. Also movable block 3
A wedge-shaped cam 38 is attached to the lower part of 1,32. 38a is a cam surface. Further, cam followers 39 are axially attached to both sides of the landing stage 20. Therefore, when the stage 20 moves forward and backward in the X direction, the cam plate 38 moves forward and backward in the Y direction in synchronization with this, and the light source units 22 and 23 open and close. In addition, a groove 40 into which the nozzle 27 is fitted is cut out at the joint between the light source units 22 and 23.

Therefore, as shown by the solid line in FIG. 6, the landing stage
When 20 moves backward and the movable stage 28 enters,
The light source units 22 and 23 are open, and the nozzle 27 enters from the interval t between them to take up the semiconductor chip P on the movable stage 28. In addition, the movable stage 28 retreats and the landing stage
When 20 enters, the cam follower 39 rolls on the cam surface 38a, and the light source units 22 and 23 close (see the chain line in FIG. 6). In this state, the nozzle 27 fits into the groove 40 and is surrounded by the light source units 22 and 23. Therefore, the light from the light source units 22 and 3 is transmitted to the semiconductor chip P.
The outer leads L extending in the four directions can be uniformly irradiated and clearly observed by the camera 6.

(Example 3) Since inner lead bonding is performed by thermocompression bonding the inner lead to the electrode portion of the semiconductor,
The outer lead L is easily deformed by heat. Therefore, a nozzle for surely landing the outer lead L thus thermally deformed on the landing plate 21 or the substrate will be described.

In FIG. 7 (a), 51 is a jig having a hook-shaped cross section attached to the nozzle 27, the lower end surface of which is the semiconductor chip P.
The posture of the outer lead L is corrected by pressing the horizontal portion of the outer lead L extending from the outer lead L. In the figure, the chain line indicates the outer lead L that is bent due to thermal deformation or the like. Further, as shown in FIG.
Even when mounted on the vehicle, the posture of the outer lead L is corrected. By thus providing the jig 51 on the side of the nozzle 27, the bending deformation of the outer lead L can be corrected and the outer lead L can be reliably landed on the landing plate 21 or the substrate 50. As described above, it is desirable that the heights H1 and H2 of the landing plate 21 on which the outer leads L land and the upper surface of the substrate 50 are the same.

FIG. 8 (a) shows a nozzle 52 which is advantageous for adsorbing the semiconductor chip P coated with the bond B for protecting the circuit on the circuit surface.
Is shown. A lower end portion 52a of the nozzle 52 is branched laterally to adsorb the horizontal portion of the outer lead L. Further, according to the nozzle 52, as shown in FIG. 7B, the semiconductor chip P having the circuit formed on the bottom surface and the outer leads L extending laterally from the bottom surface can also be adsorbed advantageously.

(Effects of the Invention) As described above, according to the present invention, the outer leads of a semiconductor chip manufactured by a film carrier which is easily bent and deformed to be bent easily are landed on a landing plate and then observed by a camera. Therefore, even if the outer leads are bent and deformed, this bending deformation is corrected and all the outer leads are positioned at the same level which is the focal length position of the camera, and can be clearly observed with the same accuracy. . Further, by matching the height of the upper surface of the landing plate with the height of the upper surface of the substrate, it is possible to mount the landing plate on the substrate with high accuracy in the process after observation.

In addition, the bending of the outer lead is corrected by landing the outer lead on the landing plate with the nozzle of the transfer head adsorbing the semiconductor chip, and the camera is observed while maintaining the adsorbed state and the corrected state by this nozzle. As a result, the semiconductor chip can be mounted on the substrate with high accuracy and high speed by eliminating the positional displacement of the semiconductor chip and the occurrence of loss time that accompany the nozzle sucking and releasing the semiconductor chip.

[Brief description of drawings]

1 shows an embodiment of the present invention. FIG. 1 is a perspective view of a semiconductor chip observing device, FIG. 2 is a side view of a process showing an observing process, and FIG. 3 is a semiconductor chip mounted on a landing plate. FIG. 4 is a perspective view of a state in which the apparatus is placed, FIG. 4 is a side view of another example during observation,
FIG. 5 is a perspective view of an observation apparatus of another embodiment, FIG. 6 is a plan view of the opening / closing means of the light source unit, and FIGS. 7 (a) and 7 (b) are side views of another embodiment of the nozzle. 8 (a) and 8 (b) are sectional views of still another embodiment of the nozzle, and FIG. 9 is a perspective view during observation by the conventional means. 6 …… Camera 21 …… Landing board 22,23 …… Light source 26 …… Transfer head 27,52 …… Nozzle L …… Outer lead P …… Semiconductor chip

Claims (4)

[Claims] 1. An observation device for a semiconductor chip having a plurality of bendable outer leads manufactured by punching out a film carrier, the camera, a light source section provided above the camera, and the camera. Corrects the bending deformation of the outer leads by landing the bendable outer leads of the semiconductor chip that is adsorbed by the nozzle of the transfer head between the light source parts, and positions all the outer leads at the focal length of the camera. And a transparent landing plate for observing the semiconductor chip. 2. The observation device for a semiconductor chip according to claim 1, wherein the height of the upper surface of the landing plate is matched with the height of the upper surface of a substrate on which the semiconductor chip is mounted in a later step. 3. A method of observing a semiconductor chip having a plurality of bendable outer leads manufactured by punching a film carrier, wherein the semiconductor chip is attracted to a lower end portion of a nozzle of a transfer head and is bendable. By correcting the bending deformation of the outer lead by landing the outer lead on the upper surface of the transparent landing plate, irradiating light from above while maintaining the suction state and the correction state by this nozzle, A method for observing a semiconductor chip, comprising observing the outer leads landing on the landing plate with a camera provided. 4. The method for observing a semiconductor chip according to claim 3, wherein the height of the upper surface of the landing plate is made to coincide with the height of the upper surface of a substrate on which the semiconductor chip is mounted in a later step.