JPH0821702B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

The present invention relates to a solid-state imaging device using a charge-coupled device (CCD), and more particularly to a solid-state imaging device in which the charge-coupled device is hermetically sealed. The present invention relates to a device and a manufacturing method thereof.

(Prior Art) Conventionally, the above-mentioned solid-state image pickup device is generally composed of a ceramic laminated body. However, since the one using this ceramic is considerably expensive, for example, as shown in FIG. Those using plastics as shown have been developed.

That is, the lead 2a of the lead frame 2 is introduced from the side wall into the inside of the bottomed cylindrical envelope 1 that is formed of an opaque plastic material and opens upward, and is located at the center of the envelope 1. Then, the central bed portion 2b of the lead frame 2 is arranged.

A semiconductor chip (solid-state image sensor) 3 of a CCD image sensor is bonded to the center of the bed 2b via a conductive adhesive layer 4, and a plurality of semiconductor chips 3 are formed on the inner surface of the semiconductor chip 3. Electrode (not shown) and envelope 1
The inner lead at the tip of the lead 2a introduced from the side wall of the is connected by a bonding wire 5 of aluminum, gold or the like, respectively.

Further, the transparent substrate 6 is fixed to the upper surface of the envelope 1, that is, the side on which light is introduced, by an epoxy resin adhesive 7 or the like to form a solid-state imaging device.

In addition, the applicant previously filed Japanese Patent Application No. 60-131371 (Japanese Patent Application Laid-Open No. 61-28
No. 8670), a solid-state image sensor mounted on the bed portion of the lead frame and connected to the inner leads of the lead frame by bonding wires, and a seal made of a transparent resin that seals the solid-state image sensor and the inner leads. A stopper and a cover made of an opaque resin that covers an outer peripheral portion of the sealing portion and has an opening that serves as a light incident portion to the solid-state imaging device. One with a protruding protrusion was proposed.

(Problems to be Solved by the Invention) However, in the structure shown in FIG. 7, the inside of the envelope is closer to the resin interface between the lead and the envelope and the interface of the adhesive such as epoxy resin to which the transparent substrate is attached. Water infiltrates into the inner surface of the transparent substrate and adheres to the inner surface of the transparent substrate as water droplets, causing deterioration of the image and lowering the yield. There is a problem in that a leak failure or the like occurs in the portion where the above occurs, which is one of the factors that reduce the yield of the assembly process.

In addition, since the resin described in Japanese Patent Application No. 60-131371 is a molded product that is generally molded with a mold, no matter how much the mold is cleanly cleaned, a large number of dust and air bubbles It was found to be mixed or adhered to the inside of the device, and it is suitable for use as a line sensor, but in order to improve the resolution, the yield is generally considerably low for use as an area sensor with high image density. .

In view of the above, the present invention not only hermetically seals a solid-state image sensor, but also causes water droplets to be generated on the inner surface of the transparent substrate due to the intrusion of water from the lead-resin interface or the like into the inside of the envelope, and the water droplets can improve the image quality. It is an object of the present invention to provide an area sensor which can be prevented from being lowered and which can be used as an area sensor with a considerably high yield.

[Structure of Invention]

(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention has an outer circumference in which an inner space is vertically divided by a lead frame having upper and lower surfaces opened and penetrating a side wall. And electrically connecting the electrodes of the solid-state imaging device mounted on the bed portion of the lead frame and the inner leads of the lead frame, and allowing the transparent resin in the internal space to flow in and be cured to thereby solid-state imaging device. A solid-state imaging device characterized by resin-sealing, and the inside and outside of an envelope in which an internal space is vertically divided by a lead frame having a frame shape whose upper and lower surfaces are opened and which penetrates a side wall, The solid-state imaging device is mounted on the bed portion of the lead frame, the electrodes of the solid-state imaging device and the lead frame are connected by bonding wires, and the solid-state imaging device mounted on the bed portion is mounted. The envelope is inverted so that the light-introducing side of the image element faces downward, and the flat plate-shaped surface is placed so that the upper surface of the envelope is in contact with the envelope. A method of manufacturing a solid-state imaging device is characterized in that a liquid transparent resin is caused to flow into the inside of the envelope from above the lower surface of the container and the transparent resin is cured.

(Function) Then, the solid-state image sensor is hermetically sealed by sealing the resin by injecting a liquid transparent resin and hardening the resin, and water penetrates into the transparent resin. By reliably preventing the occurrence of water droplets, it is possible to prevent generation of water droplets and obtain good image quality, eliminate the need for adhesives such as epoxy resin adhesives, and eliminate leak defects.
Further, it is possible to surely prevent a large number of dusts and bubbles from being mixed in or attached to the inside of the transparent resin, and to improve the yield when used as an area sensor.

(Embodiment) FIG. 1 shows a first embodiment of a solid-state image pickup device according to the present invention, which is a hollow thick-walled tubular body and the inside of an envelope 1 of an opaque plastic package formed of, for example, a thermoplastic resin. The lead 2a of the lead frame 2 is introduced from the side wall thereof to the lead frame 2 located at the center of the envelope 1.
The bed portion 2b at the center of is arranged.

A semiconductor chip (solid-state image sensor) 3 of a CCD image sensor is bonded to the center of the bed 2b via a conductive adhesive layer 4, and a plurality of semiconductor chips 3 are formed on the inner surface of the semiconductor chip 3. Electrode (not shown) and envelope 1
The inner leads at the ends of the leads 2a introduced from the side wall of the are respectively connected by bonding wires 5 made of aluminum, gold or the like.

The inside of the envelope 1 is filled with a transparent resin 8 such as an epoxy resin, which is injected in a liquid state and then cured.
As a result, the solid-state image sensor 3 and the inner leads at the base ends of the leads 2a are resin-sealed with the transparent resin 8, and the upper surface 8a of the transparent resin 8 and the surface 3a of the solid-state image sensor 3 are parallel to each other. Is configured.

FIG. 2 shows a second embodiment of the present invention, in which a step portion 1b is provided on the upper surface side of the envelope 1, that is, on the upper inner peripheral surface on the light introducing side, and the step portion 1b is provided with, for example, a glass plate. A light-shielding plate for accommodating the transparent substrate 6 such as a plastic plate or the like, adhering the transparent substrate 6 to the upper surface of the transparent resin 8 and closing the lower surface of the transparent resin 8 to the rear surface of the envelope 1 as necessary. 11 is attached to prevent light from entering from below.

FIG. 5 is an embodiment of a method for manufacturing a solid-state image pickup device according to the present invention, and shows the manufacture of the solid-state image pickup device shown in FIG.

That is, first, a predetermined portion of the lead frame 2 is molded and supported to form the envelope 1 that communicates with the top and bottom. Then, the solid-state imaging device 3 is mounted on the upper surface of the bed portion 2b of the lead frame 2, and the electrodes inside the solid-state imaging device 3 and the inner leads of the lead frame 2 are connected by the bonding wires 5. In this state, the surface 9a is flattened, and the surface of the plate member 9 that is made to be parallel is
In a state where the envelope 1 is upside down, the upper surface 1a, that is, the surface on the light introducing side is brought into contact with and placed, and then the syringe 10
As described above, the liquid transparent resin 8 is poured and filled into the envelope 1, and the plate body 9 is removed after the transparent resin 8 is cured to manufacture the solid-state imaging device.

In this way, by manufacturing the solid-state imaging device, air bubbles generated during the manufacturing, dust mixed in the inside, and the like are raised and collected on the back surface side where light is not introduced, and the front surface 8a of the transparent resin 8 and the solid-state imaging device. It is possible to prevent the presence of air bubbles, dust, and the like between the element 3 and the device 3 as much as possible, and to eliminate deterioration of the image due to the air bubbles, dust, etc., and obtain a good image.

In the manufacture of the solid-state imaging device shown in FIG. 2, the transparent substrate 6 and the upper surface 1a of the envelope 1 accommodating the transparent substrate 6 on the inner peripheral surface of the plate body 9 are almost the same as those shown in FIG. It is carried out by placing it on the surface 9a, pouring the liquid transparent resin 8 into the inside of the envelope 1 in this state, and hardening the transparent resin 8.

FIG. 3 shows a first reference example of the present invention, in which one side is used for injecting the transparent resin 8 and the other side is used for air discharge on the side wall of the bottomed cylindrical envelope 1 '. Two perforations 1'c,
1'c is drilled. Then, the leads 2a of the lead frame 2 are introduced into the inside, and the semiconductor chip 3 is mounted on the central bed portion 2b via the conductive adhesive 4, and a plurality of electrodes formed on the inner surface of the semiconductor chip 3 are mounted. And the tip of the lead 2a are connected by a bonding wire 5, and the inside of the opening of the envelope 1'is provided with the hole 1'c.
The liquid transparent resin 8 injected from is cured and resin-sealed.

By injecting the liquid transparent resin 8 in this way, the influence of air bubbles, dust, etc. is minimized, and the first
The miniaturization can be achieved by bringing the envelope 1'closer to the inner lead side than that shown in FIGS.

FIG. 4 shows a second reference example of the present invention. A step portion 1'b is provided on the upper inner peripheral surface of the envelope 1'shown in FIG. 3, and the transparent substrate 6 is provided on the step portion 1'b. And the transparent substrate 6 is attached to the upper surface of the transparent resin 8.

FIG. 6 is a third reference example of the present invention showing the manufacture of the solid-state imaging device shown in FIG.

That is, first, a predetermined portion of the lead frame 2 is molded and supported to form an envelope 1'opened upward. Then, the solid-state imaging device 3 is mounted on the upper surface of the bed portion 2b of the lead frame 2, and the electrodes inside the solid-state imaging device 3 and the inner leads of the lead frame 2 are connected by the bonding wires 5 and the adhesive tape 12 is attached. The transparent substrate 6 adhered closes the opening of the envelope 1 '. In this state, the perforation 1'c in which the envelope 1'is perforated on this side wall,
Stand up so that 1'c is on the upper side, and one hole 1'c
Then, the liquid transparent resin 8 is injected into the inside of the opening of the envelope 1'by the syringe 10 or the like, and at the same time, the air inside the liquid is evacuated from the other hole 1'c to cure the transparent resin 8. After that, the adhesive tape 12 is peeled off to manufacture the solid-state imaging device.

In this case, it is possible to raise bubbles generated during the manufacturing process or dust mixed therein and concentrate them on the side wall portion where the perforations 1'c are formed, thereby eliminating image deterioration due to dust or bubbles. Not only can a good image be obtained, but the envelope 1'can be brought closer to the inner lead side to achieve the miniaturization.

〔The invention's effect〕

In the present invention, since the solid-state image sensor is resin-sealed by curing the liquid transparent resin as described above, there is no leak defect occurring in the envelope in the structure in which the conventional transparent substrate is bonded to the envelope, The yield of assembly can be improved.

Furthermore, since the solid-state image sensor is hermetically sealed and water is surely prevented from entering the inside of the transparent resin, water droplets do not adhere to the upper surface of the solid-state image sensor, and accordingly, water droplets are not adhered. It is possible to reliably prevent deterioration of image quality due to adhesion.

In addition, since a large amount of dust and air bubbles do not mix or adhere to the inside of this transparent resin, a high yield can be realized even when used as an area sensor.

Further, according to the method of the present invention, it is possible not only to manufacture the solid-state imaging device without using a mold, and thus inexpensively and promptly, and without difficulty of deflashing, It is possible to prevent bubbles, dust, etc. mixed in the product that are produced during this manufacturing from existing between the surface of the transparent resin and the solid-state image sensor as much as possible, and to eliminate image deterioration due to bubbles or dust. There is an effect that it is possible to obtain various images.

[Brief description of drawings]

1 to 4 are vertical cross-sectional views showing different embodiments of the solid-state imaging device of the present invention, FIG. 5 is a vertical cross-sectional view showing a manufacturing example of the solid-state imaging device shown in FIG. 1, and FIG. FIG. 3 is a vertical cross-sectional view showing a manufacturing example of the solid-state imaging device shown in FIG. 3 in the order of steps, and FIG. 1, 1 '... Enclosure, 2 ... Lead frame, 2a ... Lead, 2b ... Bed part, 3 ... Solid-state image sensor (semiconductor chip), 3a ... Same surface, 4 ... Conductivity Adhesive layer, 5 ...
... Bonding wire, 6 ... Transparent substrate, 7 ... Epoxy adhesive, 8 ... Transparent resin, 8a ... Top surface, 9 ... Plate body, 11 ... Shading plate.

Claims (5)

[Claims] 1. A solid body mounted on a bed portion of the lead frame, wherein an envelope having a frame shape having an open upper and lower surfaces and having an inner space defined vertically by a lead frame penetrating a side wall is provided. A solid-state image pickup device, characterized in that an electrode of an image pickup element and an inner lead of the lead frame are electrically connected, and a transparent resin is allowed to flow into the internal space and cured to seal the solid-state image pickup element with resin. 2. The solid-state imaging device according to claim 1, wherein a transparent substrate is attached to the upper surface of the transparent resin. 3. The solid-state image pickup device according to claim 1, wherein a light shielding plate is attached to the lower surface of the transparent resin. 4. A solid-state image sensor on a bed portion of the lead frame inside an envelope in which an inner space is divided into upper and lower parts by a lead frame which has a frame shape whose upper and lower surfaces are open and which penetrates a side wall. Mounting, the electrodes of the solid-state imaging device and the inner leads of the lead frame are connected by bonding wires, and the envelope of the solid-state imaging device mounted on the bed is oriented so that the light-introducing side faces downward. Upside down, placing the upper surface of the envelope in contact with the upper surface of the flat plate body, and liquid transparent inside the envelope from above the lower surface of the envelope. A method for manufacturing a solid-state imaging device, which comprises injecting a resin to cure the transparent resin. 5. A transparent substrate is mounted on the frame-shaped inner peripheral surface of the envelope, and the transparent substrate is placed in contact with the surface of the plate body. 4. The method for manufacturing the solid-state imaging device according to item 4.