JPH0831674B2 - Flexible circuit board manufacturing method - Google Patents
Flexible circuit board manufacturing methodInfo
- Publication number
- JPH0831674B2 JPH0831674B2 JP61108982A JP10898286A JPH0831674B2 JP H0831674 B2 JPH0831674 B2 JP H0831674B2 JP 61108982 A JP61108982 A JP 61108982A JP 10898286 A JP10898286 A JP 10898286A JP H0831674 B2 JPH0831674 B2 JP H0831674B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protective film
- resin composition
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、フレキシブル回路基板の製造方法に関
し、詳しくは改良した絶縁性保護膜を有するフレキシブ
ル回路基板の製造方法に係わるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible circuit board, and more particularly to a method for manufacturing a flexible circuit board having an improved insulating protective film.
（従来の技術） 従来、リジッドな回路基板におけるジャンパの形成
は、基板に設けた、例えば銅箔回路パターンのクロス部
分に絶縁性保護膜となる樹脂組成物を印刷塗布し、熱硬
化させ、形成した絶縁性保護膜上に導電性インクを印刷
塗布して設けられる。(Prior Art) Conventionally, a jumper on a rigid circuit board is formed by printing a resin composition, which serves as an insulating protective film, on a cross portion of a copper foil circuit pattern provided on the board and thermally curing the resin composition. The conductive ink is printed and applied on the insulating protective film.
そして、絶縁性保護膜は絶縁を確実にするため、多層
印刷するのが一般である。多層印刷の熱硬化の条件は、
例えば３層印刷の場合において、第１の樹脂組成物の層
が120℃15分、第２の樹脂組成物の層が120℃10分、第３
の樹脂組成物の層が120℃10分の各処理がされる。この
ように、多層印刷よりなる絶縁性保護の熱硬化処理は各
層毎に充分にフルキュアされ、これが順次行なわれるこ
とによりなされている。The insulating protective film is generally printed in multiple layers to ensure insulation. The conditions for thermosetting in multi-layer printing are
For example, in the case of three-layer printing, the first resin composition layer is 120 ° C. for 15 minutes, the second resin composition layer is 120 ° C. for 10 minutes, and the third resin composition layer is
Each layer of the resin composition is treated at 120 ° C. for 10 minutes. As described above, the thermosetting treatment for insulating protection by multi-layer printing is performed by fully curing each layer and sequentially performing this.
（発明が解決しようとする問題点） しかしながら、前記の如く形成された絶縁性保護膜は
樹脂組成物の溶剤がほとんど除去（例えば99.9％除去）
された、いわゆるフルキュアの状態であるため、形成さ
れる絶縁性保護膜がリジットなものとなり、これをフレ
キシブル回路基板に適用した際にはフィルム基材のフレ
キシビリティを阻害する不都合な問題があった。また、
最上層の熱硬化処理時には、それより下層は必要以上に
熱硬化処理を受ける結果となり、従って、下層にいく程
もろくなってしまう欠点を有していた。(Problems to be solved by the invention) However, in the insulating protective film formed as described above, most of the solvent of the resin composition is removed (for example, 99.9% is removed).
Since it is in the so-called full-cured state, the formed insulating protective film becomes rigid, and when this is applied to a flexible circuit board, there was an inconvenient problem of impeding the flexibility of the film base material. . Also,
At the time of heat-curing the uppermost layer, the lower layer is subjected to heat-curing more than necessary, so that the lower layer is fragile.
そこで、この発明の課題は多層印刷する絶縁性樹脂組
成物の熱硬化処理を工夫することにより、密着性良好
で、かつフレキシブルな絶縁性保護膜を形成したフレキ
シブル回路基板の製造方法を提供することにある。Therefore, an object of the present invention is to provide a method for manufacturing a flexible circuit board having a good adhesion and a flexible insulating protective film by devising a thermosetting treatment of an insulating resin composition for multi-layer printing. It is in.
（問題点を解決するための手段） 上記問題点を解決するために、この発明の手段は 所定の回路パターンを設けた絶縁フィルム基材の前記
回路パターン形成面に絶縁性保護膜を被覆してフレキシ
ブル回路基板を得る方法であって、 前記絶縁性保護膜は樹脂組成物を多層に塗布するとと
もに、第２層以上の各層は、各下層が樹脂組成物の層中
に溶剤を数％残存する状態に加熱し、下層に重畳して形
成することを特徴ととする。(Means for Solving the Problems) In order to solve the above problems, the means of the present invention is to cover the circuit pattern forming surface of an insulating film substrate provided with a predetermined circuit pattern with an insulating protective film. A method for obtaining a flexible circuit board, wherein the insulating protective film is formed by applying a resin composition in multiple layers, and each of the second and higher layers has a lower layer in which several percent of the solvent remains in the resin composition layer. It is characterized in that it is heated to a state and is formed so as to be superimposed on the lower layer.
（作 用） フレキシブル回路基板の回路パターンを覆う絶縁性保
護膜は樹脂組成物を多層に塗布して形成される。各層の
樹脂組成物は不完全の硬化において順次樹脂組成物が重
畳塗布される。各層の樹脂組成物は溶剤を数％存在した
状態、すなわち、半硬化状態で上層が重畳されて処理さ
れることにより、フレキュアされない。かくして、得ら
れた絶縁性保護膜はフレキシビリティを有する。(Operation) The insulating protective film that covers the circuit pattern of the flexible circuit board is formed by applying the resin composition in multiple layers. The resin composition of each layer is sequentially applied in a superimposed manner in the case of incomplete curing. The resin composition of each layer is not cured because the upper layer is superposed and treated in the state where a few percent of the solvent is present, that is, in a semi-cured state. Thus, the obtained insulating protective film has flexibility.
（実施例） 次に、本発明の一実施例を図面に基づいて説明する。(Embodiment) Next, an embodiment of the present invention will be described with reference to the drawings.
ポリエチレンテレフタレートなどの絶縁フィルム基材
１上には、接着層1Aを介してラミネートした銅箔などの
エッチング処理により所定の回路パターン２が形成され
ている。回路パターン２の所定のクロス部分には絶縁性
保護膜６が被覆されている。絶縁性保護膜６は、例えば
エポキシ樹脂と溶剤とよりなる絶縁性の樹脂組成物を印
刷塗布し熱硬化させる処理を複数回行なって、多層に形
成されている。A predetermined circuit pattern 2 is formed on an insulating film substrate 1 such as polyethylene terephthalate by etching a copper foil laminated via an adhesive layer 1A. A predetermined cross portion of the circuit pattern 2 is covered with an insulating protective film 6. The insulating protective film 6 is formed in multiple layers by performing a process of printing and coating an insulating resin composition made of, for example, an epoxy resin and a solvent and thermally curing the resin composition a plurality of times.
本例では第１回目の樹脂組成物の印刷塗布後に100〜1
10℃５分間の熱硬化の処理をして層厚20〜25μｍの第１
樹脂層３となし、次いで第１樹脂層３上に樹脂組成物を
印刷により重畳塗布し、100℃〜110℃５分間の熱硬化の
処理をして層厚15〜20μｍの第２樹脂層４となし、さら
に第２樹脂層４上に樹脂組成物を印刷により重畳塗布
し、120〜130℃10分間熱処理して層厚10〜15μｍの第３
樹脂層５を形成した。In this example, 100 to 1 after the first resin composition is applied by printing.
The first layer with a layer thickness of 20-25 μm after heat treatment at 10 ℃ for 5 minutes
The second resin layer 4 having a layer thickness of 15 to 20 μm is formed into the resin layer 3, and then the resin composition is superposed on the first resin layer 3 by printing and heat-cured at 100 ° C. to 110 ° C. for 5 minutes. In addition, the resin composition is superposed on the second resin layer 4 by printing and heat-treated at 120 to 130 ° C. for 10 minutes to form a third layer having a layer thickness of 10 to 15 μm.
The resin layer 5 was formed.
本例の第１樹脂層3,第２樹脂層４および第３樹脂層５
の前記した各熱硬化の条件は、いずれも溶剤が完全に除
去されかつ樹脂組成物がフルキュアされる程苛酷な条件
ではなく、本例では約２％の溶剤が残存され樹脂組成物
がフルキュアされない状態で処理されている。First resin layer 3, second resin layer 4 and third resin layer 5 of this example
Each of the above-mentioned heat curing conditions is not so severe that the solvent is completely removed and the resin composition is fully cured. In this example, about 2% of the solvent remains and the resin composition is not fully cured. Is being processed in a state.
第１樹脂層３は接着層1A面および回路パターン２に接
着性良好であり、かつ第１樹脂層3,第２樹脂層４および
第３樹脂層５の各相互の接着性も良好であり、第１樹脂
層3,第２樹脂層４および第３樹脂層５よりなる絶縁性保
護膜６はフレキシブルなものである。The first resin layer 3 has good adhesion to the surface of the adhesive layer 1A and the circuit pattern 2, and also has good mutual adhesion of the first resin layer 3, the second resin layer 4 and the third resin layer 5, The insulating protective film 6 including the first resin layer 3, the second resin layer 4 and the third resin layer 5 is flexible.
絶縁性保護膜６上およびその近傍の接着層1A面上の部
位には、導電性インクが印刷塗布され乾燥されて所定の
ジャンパ７が形成される。Conductive ink is printed and applied on the insulating protective film 6 and its vicinity on the surface of the adhesive layer 1A to form a predetermined jumper 7.
しかして、本例のフレキシブル回路基板８は、絶縁性
保護膜６を形成する各樹脂層3,4,5をフルキュアの熱硬
化させてないことによりフレキシブルであり、フレキシ
ブル回路基板８のフレキシビリティは良好であった。The flexible circuit board 8 of this example is flexible because the resin layers 3, 4 and 5 forming the insulating protective film 6 are not cured by full cure, and the flexibility of the flexible circuit board 8 is high. It was good.
（発明の効果） 本発明は、絶縁フィルム基材面に多層形成する絶縁性
保護膜を、各下層が層中に数％の溶剤を残存させて硬化
させるようにしたことにより、形成された絶縁性保護膜
の充分なる硬化を防止しかつフレキシビリティを有する
ものとすることができる。また、本発明における絶縁性
保護膜は各層の密着性良好であり、本来の絶縁性には何
ら支障がないものである。(Effects of the Invention) The present invention provides an insulating protective film formed in multiple layers on the surface of an insulating film substrate, in which each lower layer is cured by leaving several% of the solvent in the layer to be cured. It is possible to prevent the hardening of the property protection film and to have flexibility. In addition, the insulating protective film of the present invention has good adhesion between the layers and does not hinder the original insulating property.
図は本発明の一実施例を示すものであり、第１図はフレ
キシブル回路基板の要部拡大断面図、第２図および第３
図は絶縁性保護膜形成過程の要部を示す説明図である。 １……絶縁フィルム基材 ２……回路パターン ３……第１樹脂層 ４……第２樹脂層 ５……第３樹脂層 ６……絶縁性保護膜 ８……フレキシブル回路基板FIG. 1 shows an embodiment of the present invention, and FIG. 1 is an enlarged sectional view of an essential part of a flexible circuit board, FIG. 2 and FIG.
The figure is an explanatory view showing the main part of the process of forming the insulating protective film. 1 ... Insulating film substrate 2 ... Circuit pattern 3 ... First resin layer 4 ... Second resin layer 5 ... Third resin layer 6 ... Insulating protective film 8 ... Flexible circuit board
Claims (1)
基材の前記回路パターン形成面に絶縁性保護膜を被覆し
てフレキシブル回路基板を得る方法であって、 前記絶縁性保護膜は樹脂組成物を多層に塗布するととも
に、第２層以上の各層は、各下層が樹脂組成物の層中に
溶剤を数％残存する状態に加熱し、下層に重畳して形成
することを特徴としたフレキシブル回路基板の製造方
法。1. A method for obtaining a flexible circuit board by coating an insulating protective film on a surface of an insulating film substrate having a predetermined circuit pattern formed thereon, wherein the insulating protective film is a resin composition. A flexible circuit in which each of the second and higher layers is formed by heating the lower layers so that the solvent remains in the layers of the resin composition by several%, and superimposing the layers on the lower layers. Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61108982A JPH0831674B2 (en) | 1986-05-13 | 1986-05-13 | Flexible circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61108982A JPH0831674B2 (en) | 1986-05-13 | 1986-05-13 | Flexible circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62264692A JPS62264692A (en) | 1987-11-17 |
| JPH0831674B2 true JPH0831674B2 (en) | 1996-03-27 |
Family
ID=14498581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61108982A Expired - Fee Related JPH0831674B2 (en) | 1986-05-13 | 1986-05-13 | Flexible circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831674B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59106185A (en) * | 1982-12-09 | 1984-06-19 | 松下電器産業株式会社 | How to cover electronic circuits |
-
1986
- 1986-05-13 JP JP61108982A patent/JPH0831674B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62264692A (en) | 1987-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |