JPH0832604B2 - Method for manufacturing ceramic molded body - Google Patents
Method for manufacturing ceramic molded bodyInfo
- Publication number
- JPH0832604B2 JPH0832604B2 JP63083042A JP8304288A JPH0832604B2 JP H0832604 B2 JPH0832604 B2 JP H0832604B2 JP 63083042 A JP63083042 A JP 63083042A JP 8304288 A JP8304288 A JP 8304288A JP H0832604 B2 JPH0832604 B2 JP H0832604B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- polymer compound
- ceramic
- containing polymer
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
- C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5053—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
- C04B41/5057—Carbides
- C04B41/5059—Silicon carbide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Inorganic Fibers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミックス成形体の製造方法に関する。更
に詳しくは、本発明は、セラミックスの成形体に、易加
工性で側鎖にシリル基を含有する特定の含ケイ素高分子
化合物を含浸させ、しかる後に焼成することを特徴とす
る高強度セラミックス成形体の製造方法に関する。The present invention relates to a method for producing a ceramic molded body. More specifically, the present invention is a high-strength ceramics molding characterized in that a ceramics compact is impregnated with a specific silicon-containing polymer compound which is easily processable and has a silyl group in the side chain, and is then fired. A method of manufacturing a body.
近年、含ケイ素セラミックスの技術開発状況は著しい
ものがあり、例えば炭化ケイ素(SiC)、窒化ケイ素(S
i3N4)、サイアロン、Si-Ti-C-O系セラミックス(チラ
ノ繊維、宇部興産)、SiC-B4C系セラミックス、Si3N4‐
SiC複合系セラミックスなどが所謂ファインセラミック
スとして注目されている。In recent years, the technological development of silicon-containing ceramics has been remarkable, and for example, silicon carbide (SiC), silicon nitride (S
i 3 N 4), SiAlON, Si-Ti-CO Ceramics (Tyranno fibers, from Ube Industries), SiC-B 4 C ceramic, Si 3 N 4 -
SiC composite ceramics are attracting attention as so-called fine ceramics.
これらの中にあって、特にSiCやSi3N4は需要量も多
く、また今後その伸展が期待されている。これらセラミ
ックスにおいては、一般に粉末を極めて高圧(例えば10
00気圧以上の高圧)で圧縮成形後、高温で焼結する成形
方法がとられているため、大型で高価な圧縮成形機を必
要とするかあるいは圧縮成形のため複雑な形状のものは
得られないなどの問題点があった。Among these, especially SiC and Si 3 N 4 are in great demand, and their growth is expected in the future. In these ceramics, powder is generally applied under extremely high pressure (for example, 10
Since the molding method involves compression molding under high pressure (00 atm or more) and then sintering at high temperature, a large and expensive compression molding machine is required, or a complicated shape can be obtained due to compression molding. There were problems such as not being.
これを解決する方法としてセラミックス粉末と易加工
性のポリスチレン、スチレンとブタジエンの共重合物、
ステアリン酸のような滑剤ともっとも分解揮発しやすい
ジエチルフタレートのような可塑剤とを適当な割合で配
合するもの、さらに前者に熱硬化性樹脂を添加したも
の、熱硬化性樹脂にワックスを混合したものなどの有機
化合物を添加剤として混合し、混合物を射出成形した
後、高温で焼結(脱添加剤もしくは予備焼結を含む)す
る方法が開発されてきた。As a method of solving this, ceramic powder and easily processable polystyrene, a copolymer of styrene and butadiene,
A mixture of a lubricant such as stearic acid and a plasticizer such as diethyl phthalate, which is most likely to decompose and volatilize, in an appropriate ratio, a thermosetting resin added to the former, and a wax mixed with the thermosetting resin. Methods have been developed in which organic compounds such as those are mixed as additives, the mixture is injection molded, and then sintered (including de-additives or pre-sintering) at high temperatures.
現状の射出成形法における最大の問題点は、脱添加剤
(樹脂)工程においてセラミックス中に気孔を生ずる等
のため、成形品の強度に限界があることである。The biggest problem in the current injection molding method is that the strength of the molded product is limited due to the generation of pores in the ceramics in the process of removing additives (resin).
さらに易加工性のセラミックス材料として、ケイ素を
含む高分子化合物を成形加工後、高温で焼成する方法の
開発が行われてきた。この高分子化合物の熱分解法にお
いても、高分子の一部が分解して揮散するため、上述し
たような微細な気孔を生ずることとなる。SiC繊維、Si3
N4繊維の製造がこの熱分解法の具体例としてあげられ
る。Further, as an easily workable ceramic material, a method of forming a polymer compound containing silicon and firing it at a high temperature has been developed. Also in the thermal decomposition method of this polymer compound, a part of the polymer is decomposed and volatilized, so that the fine pores as described above are generated. SiC fiber, Si 3
The production of N 4 fibers is a specific example of this pyrolysis method.
一方ケイ素を含む高分子化合物としては従来種々のも
のが知られているが、代表的なものとして以下の例があ
げられる。On the other hand, various types of polymer compounds containing silicon have been known in the past, but the following examples are representative ones.
(a)パーメチルポリシラン (b)ポリシラスチレン(ただしXは0.8〜1.3であり、
Φはフェニル基を示す。以下、同じ。) (c)ポリカルボシラン ポリカルボシランは、パーメチルポリシランや種々の
有機ケイ素化合物、例えばテトラメチルシラン、ジメチ
ルジクロロシラン、ドデカメチルシクロヘキサシランな
どの熱分解により得られるもので溶融性をもち、かつ、
ベンゼン等の有機溶媒に可溶である。現在この熱分解法
で工業的に製造されているものとして、SiC繊維(日本
カーボン社、商標“ニカロン”)がある。この繊維は、
直接法で得られるジメチルジクロロシランを出発原料に
用い、下記式(A)、(B)および(C)に従って製造
されているもので、耐熱性にすぐれた高強度繊維とし
て、樹脂、金属およびセラミックスの補強材料としての
今後の需要の伸びが期待されている(ケミストリー レ
ターズ(Chemistry Letters),551(1976),特公昭57-
26527,特公昭57-53892,特公昭57-38548)。(A) Permethyl polysilane (B) Polysilastyrene (where X is 0.8 to 1.3,
Φ represents a phenyl group. same as below. ) (C) Polycarbosilane Polycarbosilane is a permethylpolysilane or various organosilicon compounds, for example, tetramethylsilane, dimethyldichlorosilane, which is obtained by thermal decomposition of dodecamethylcyclohexasilane, and has meltability, and
It is soluble in organic solvents such as benzene. Currently, there is SiC fiber (Nippon Carbon Co., Ltd., trademark "Nicalon") that is industrially manufactured by this thermal decomposition method. This fiber is
A dimethyldichlorosilane obtained by the direct method is used as a starting material and is produced according to the following formulas (A), (B) and (C). It is expected that the demand for reinforced materials will increase in the future (Chemistry Letters, 551 (1976), Japanese Patent Publication No. 57-
26527, JP-B 57-53892, JP-B-57-38548).
この方法における問題点は、製造工程が複雑であるこ
と、特に(A)の工程においては溶媒中で金属ナトリウ
ムを使用するため未反応ナトリウムの除去が繁雑となる
こと、またポリマーの分別(低分子量ポリカルボシラン
の分離除去)が必要であること、(B)の工程の反応に
おいて高温高圧下(400℃、100気圧)で行なう必要があ
ること、加えて総収率が低く(特に、(B)および
(C)工程)、また最終製品中に相当量含まれている遊
離の炭素やシリカが、製品物性に悪影響を与えることで
ある。 The problem with this method is that the manufacturing process is complicated, especially in the step (A), the removal of unreacted sodium is complicated because metal sodium is used in the solvent, and the fractionation of the polymer (low molecular weight) It is necessary to separate and remove polycarbosilane), it is necessary to carry out the reaction in the step (B) under high temperature and high pressure (400 ° C., 100 atm), and in addition, the total yield is low (particularly, (B ) And (C) step), and free carbon and silica contained in a considerable amount in the final product adversely affect the physical properties of the product.
本発明の課題は、成形品の強度の大きいセラミックス
成形体を製造する方法を提供することにある。An object of the present invention is to provide a method for producing a ceramics molded body having high strength as a molded product.
本発明者らは、種々の方法で製造されたケイ素を含む
セラミックスの成形体の強度を向上する方法について鋭
意努力し、ある特定の含ケイ素高分子化合物の利用が有
効であることを見出し本発明を完成させるに至った。The present inventors have diligently made efforts to improve the strength of molded bodies of ceramics containing silicon produced by various methods, and have found that the use of a specific silicon-containing polymer compound is effective. Has been completed.
すなわち本発明は、ケイ素を含むセラミックス成形体
を、 (式中、mは0または1〜20の正の整数、nは1、2ま
たは3、R1は水素、アルキル基、アリール基またはハロ
ゲン、R2はアルキレン基またはフェニレン基であって、
R1およびR2はCOOH、NH2、Cl、OHなどの官能基を含んで
いても良い。)で表わされる繰返し構造単位を含有する
含ケイ素高分子化合物を含む溶液中に含浸させ、ついで
500〜2500℃の温度範囲で焼成することを特徴とするセ
ラミックス成形体の製造方法を提供するものである。That is, the present invention, a ceramic molded body containing silicon, (In the formula, m is 0 or a positive integer of 1 to 20, n is 1, 2 or 3, R 1 is hydrogen, an alkyl group, an aryl group or halogen, and R 2 is an alkylene group or a phenylene group,
R 1 and R 2 may contain a functional group such as COOH, NH 2 , Cl and OH. ) Is impregnated in a solution containing a silicon-containing polymer compound containing a repeating structural unit represented by
The present invention provides a method for producing a ceramic molded body, which comprises firing in a temperature range of 500 to 2500 ° C.
以下、本発明を詳細に説明する。 Hereinafter, the present invention will be described in detail.
本発明における含ケイ素高分子化合物とは、側鎖にシ
リル基類(SiH3、Si2H5、Si3H7基)を含む炭素系ポリマ
ーであって、一般式(I) で表わされる繰り返し構造単位を含有する含ケイ素高分
子化合物である。The silicon-containing polymer compound in the present invention is a carbon-based polymer containing a silyl group (SiH 3 , Si 2 H 5 , Si 3 H 7 group) in its side chain, and has a general formula (I) Is a silicon-containing polymer compound containing a repeating structural unit represented by:
また、mは0又は1〜20の正の整数であり、セラミッ
クス収率(焼成体中のSi重量/含ケイ素高分子化合物の
Si重量(%))の点からは小さい程好ましく、最も好ま
しくは0である。Further, m is 0 or a positive integer of 1 to 20, and the ceramic yield (Si weight in the fired body / silicon-containing polymer compound
From the viewpoint of Si weight (%), the smaller the value, the more preferable, and the most preferable value is 0.
R1は水素、アルキル基またはアリール基であって、例
えば‐H、‐CH3、‐C2H5、i-C3H7、‐Φ (‐Φはフェニル基を示す。以下同じ。)、‐Φ‐C
H3、‐CH2‐Φなどがあげられ、炭素数の少ないもの程
好ましく、水素が最も好ましい。R 1 is hydrogen, an alkyl group or an aryl group, and is, for example, —H, —CH 3 , —C 2 H 5 , iC 3 H 7 , —Φ (—Φ represents a phenyl group, the same applies hereinafter), — Φ‐C
H 3 and —CH 2 —Φ are listed, and those having a smaller number of carbon atoms are preferable, and hydrogen is most preferable.
R2はアルキレン基またはフェニレン基であって例え
ば、 ‐CH2‐、CH2 2、CH2 4、‐Φ (‐Φ‐はフェニレン基を示す。以下同じ。)、‐CH2
‐Φ‐などであるが、R1と同様炭素数が小さい程好まし
い。なお、上記R1、R2は‐COOH、‐NH2、‐OH、ハロゲ
ンなどの官能基を含んでいてもよい。R 2 is an alkylene group or a phenylene group and is, for example, —CH 2 —, CH 2 2 , CH 2 4 , —Φ (where —Φ— represents a phenylene group, the same applies hereinafter), —CH 2
-Φ-, etc., but the smaller the carbon number is, the more preferable it is as in R 1 . Note that R 1 and R 2 may include a functional group such as —COOH, —NH 2 , —OH, and halogen.
また、本発明における含ケイ素高分子化合物は、一般
式(I)で表される同種類の繰り返し構造単位のみから
なる重合物であってもよいし、同じく一般式(I)で表
される互いに異なる種類の繰り返し構造からなる重合物
であってもよい。勿論、これらのポリマーの立体規則性
に制限はなく、例えばアイソタクチック、シンジオクタ
クチック、アタクチック等のいかなる立体構造のもので
も良い。Further, the silicon-containing polymer compound in the present invention may be a polymer composed of only the same kind of repeating structural units represented by the general formula (I), or may be a polymer represented by the general formula (I). It may be a polymer having different types of repeating structures. Of course, the stereoregularity of these polymers is not limited, and may have any stereostructure such as isotactic, syndioctactic and atactic.
この分子量は特に制限はないが、通常100〜10,000,00
0、好ましくは200〜1,000,000程度のものが溶剤への溶
解度等の点で望ましい。This molecular weight is not particularly limited, but is usually 100 to 10,000,00.
0, preferably about 200 to 1,000,000, is desirable in terms of solubility in a solvent.
また、該繰り返し構造単位とケイ素を含まないその他
のビニル系ポリマー構造、例えば、エチレン、プロピレ
ン、スチレン、塩化ビニル、ブテン、イソブテン、MMA
等のビニル系由来の繰り返し構造単位とからなる共重合
物であっても良い。かかる共重合は、ランダム、交互、
ブロック若しくはグラフト等の何れであっても構わな
い。この場合、本発明の構造単位の部分は少なくとも0.
1重量%以上であることが望ましい。これらの共重合物
の分子量は特に制限はないが、通常、100〜10,000,00
0、好ましくは200〜1,000,000程度のものが溶剤への溶
解度等の点で望ましい。Also, other vinyl-based polymer structures containing no repeating structural units and silicon, for example, ethylene, propylene, styrene, vinyl chloride, butene, isobutene, MMA.
It may be a copolymer composed of a repeating structural unit of vinyl origin such as Such copolymerization can be random, alternating,
It may be either a block or a graft. In this case, the structural unit part of the invention is at least 0.
It is preferably 1% by weight or more. The molecular weight of these copolymers is not particularly limited, but is usually 100 to 10,000,00.
0, preferably about 200 to 1,000,000, is desirable in terms of solubility in a solvent.
本発明で使用する上記含ケイ素高分子化合物は、本発
明の課題からセラミックス収率が高いことが特に望まし
いのは言うまでもないが、これらセラミックス収率、モ
ノマーの得られ易さ、およびポリマーの製造し易さ、溶
媒溶解性(加工性)から、特に好ましい具体例として
は、繰り返し構造単位として の一種類または二種類以上を含む含ケイ素高分子化合物
およびこれらの共重合物があげられる。It is needless to say that the above-mentioned silicon-containing polymer compound used in the present invention is particularly desirable to have a high ceramic yield in view of the subject of the present invention. However, these ceramic yield, the ease of obtaining a monomer, and the production of a polymer. From the viewpoint of easiness and solvent solubility (workability), a particularly preferable specific example is a repeating structural unit. Examples thereof include silicon-containing polymer compounds containing one kind or two or more kinds and copolymers thereof.
本発明で使用する含ケイ素高分子化合物としては、上
記したものが使用されるが、特にその製造方法もしくは
重合方法が規定されるものではなく、種々の方法により
製造したものを好適に用い得る。The above-mentioned compounds are used as the silicon-containing polymer compound used in the present invention, but the manufacturing method or polymerization method thereof is not particularly limited, and those manufactured by various methods can be preferably used.
例えば含ケイ素α−オレフィンの重合方法について
は、特に制限はなく、配位アニオン重合、ラジカル重
合、イオン重合などの種々の方法を採用できる。すなわ
ちチーグラー ナッタ(Ziegler-Natta)型触媒(ハロ
ゲン化チタン、アルコキシチタン、ハロゲン化バナジウ
ム、オキシハロゲン化マグネシウム、ハロゲン化ジルコ
ニウム等の遷移金属塩とアルキルアルミニウムからなる
触媒、これら遷移金属塩をハロゲン化マグネシウム、酸
化マグネシウム、オキハロゲン化マグネシウム、シリ
カ、アルミナなどを主成分とする担体上に担持させたも
のとアルキルアルミニウムからなる触媒)、SiO2‐Al2O
3にCrO3を担持させた触媒、γ‐Al2O3にMoO3を付着させ
LiAlH4、NaH、H2、CO等で還元処理した触媒、Cp2Zr(C
H3)2またはCp2TiCl2(ただしCpはシクロペンタジエニ
ル)とアルキルアルミノキサンからなる触媒(例えば特
開昭58-19309)を用いて重合する方法;金属酸化物(Cr
O3、SiO2、Al2O3等)、水素酸(H2SO4、H3PO4、HClO4、
HCl等)、ルイス酸(BF3、AlCl3、FeCl3、SnCl4等) 触媒によりカチオン重合させる方法;アルカリ金属(L
i、Na、K等)、アルキルアルカリ(C2H5Na、ナトリウ
ムナフタレン、(C2H5)3Al、C4H9Li、C6H5Li等)、水酸
化物(NaOH、KOH等)触媒によりアニオン重合させる方
法;熱、光、放射線、電気または過酸化水素、過硫酸ア
ンモン、過酸化ベンゾイル、クメンパーオキサイド、シ
クロヘキサンパーオキサイド、ジ−t−ブチルパーオキ
サイド、t−ブチルハイドロパーオキサイド、メチルエ
チルケトンパーオキサイド、アゾビスイソブチロニトリ
ルなどの触媒を用いてラジカル重合させる方法などがあ
げられる。For example, the method for polymerizing the silicon-containing α-olefin is not particularly limited, and various methods such as coordination anion polymerization, radical polymerization, and ionic polymerization can be adopted. That is, Ziegler-Natta type catalyst (titanium halide, alkoxy titanium, vanadium halide, magnesium oxyhalide, zirconium halide and other transition metal salts and alkylaluminum catalysts, these transition metal salts are magnesium halide , A catalyst composed of alkylaluminum supported on a carrier containing magnesium oxide, magnesium oxyhalide, silica, alumina, etc. as the main component), SiO 2 -Al 2 O
3 catalyst supported the CrO 3, to adhere the MoO 3 on gamma-Al 2 O 3
A catalyst reduced by LiAlH 4 , NaH, H 2 , CO, etc., Cp 2 Zr (C
H 3 ) 2 or Cp 2 TiCl 2 (where Cp is cyclopentadienyl) and a polymerization method using a catalyst composed of an alkylaluminoxane (for example, JP-A-58-19309); metal oxide (Cr
O 3, SiO 2, Al 2 O 3 , etc.), hydrochloric acid (H 2 SO 4, H 3 PO 4, HClO 4,
HCl, etc.), Lewis acid (BF 3 , AlCl 3 , FeCl 3 , SnCl 4, etc.) Cationic polymerization with a catalyst; alkali metal (L
i, Na, K, etc.), alkyl alkali (C 2 H 5 Na, sodium naphthalene, (C 2 H 5 ) 3 Al, C 4 H 9 Li, C 6 H 5 Li, etc.), hydroxide (NaOH, KOH Etc.) A method of anionic polymerization with a catalyst; heat, light, radiation, electricity or hydrogen peroxide, ammonium persulfate, benzoyl peroxide, cumene peroxide, cyclohexane peroxide, di-t-butyl peroxide, t-butyl hydroper. Examples include a method of radical polymerization using a catalyst such as oxide, methyl ethyl ketone peroxide, and azobisisobutyronitrile.
重合様式も特に制限はなく、気相、液相のいずれでも
良く、塊状重合、溶液重合、懸濁重合、乳化重合などの
方式を採用できる。反応温度、反応圧力は重合様式およ
び反応モノマーによって異なるが、反応温度は0〜400
℃、好ましくは20〜200℃、反応圧力は平衡上高圧であ
ることが望ましく、常圧〜1000気圧である。またベンゼ
ン、トルエン、キシレン、ペンタン、ジメチルホルムア
ミド、クロロホルム、水などの溶媒を用いて重合するこ
とも可能である。この他分子量調節剤などの種々の添加
剤を用いることもできる。又含ケイ素α−オレフィンと
α−オレフィンとの共重合の場合には特にモノマー組
成、重合様式に制限はなく、ランダム、交互、ブロッ
ク、グラフト等の種々の様式を採用できる。The mode of polymerization is not particularly limited and may be either gas phase or liquid phase, and bulk polymerization, solution polymerization, suspension polymerization, emulsion polymerization and the like can be adopted. The reaction temperature and the reaction pressure vary depending on the polymerization mode and the reaction monomer, but the reaction temperature is 0 to 400.
C., preferably 20 to 200.degree. C., and the reaction pressure is preferably high pressure in equilibrium, and is normal pressure to 1000 atmospheric pressure. It is also possible to carry out the polymerization using a solvent such as benzene, toluene, xylene, pentane, dimethylformamide, chloroform and water. In addition, various additives such as a molecular weight modifier may be used. Further, in the case of copolymerization of silicon-containing α-olefin and α-olefin, the monomer composition and the polymerization mode are not particularly limited, and various modes such as random, alternating, block and graft can be adopted.
重合用モノマーとなるシリル基を含有するα−オレフ
ィンは、種々の方法で製造することができ、本発明にお
いて特に制限するものではないが、例えば下式に示すよ
うな方法を採用できる。The silyl group-containing α-olefin serving as a polymerization monomer can be produced by various methods and is not particularly limited in the present invention. For example, the method represented by the following formula can be adopted.
これらのうち、、、はSiH4を原料に用いてお
り、特に、はVIII族金属を触媒に用いるヒドロシリ
ル化反応であり、容易に目的とするα−オレフィンを得
ることができる。Si2H6、Si3H6の場合も同様である。蓋
し、SiH4、Si2H6、Si3H8は近年、ポリシリコンやアモル
ファスシリコン用としての需要が拡大し、安価にかつ大
量に製造されるようになったもので、今後一層この傾向
が進むと予想される新しいケイ素原料である。従って本
発明におけるシリル基類を含有する含ケイ素高分子化合
物は、水素化ケイ素化合物とオレフィンから得られるモ
ノマーを重合させることにより容易に、かつ安価に製造
することが可能である点に大きな意義があるといえる。 Among these, SiH 4 is used as a raw material, and particularly, is a hydrosilylation reaction using a Group VIII metal as a catalyst, and the desired α-olefin can be easily obtained. The same applies to Si 2 H 6 and Si 3 H 6 . In recent years, the demand for SiH 4 , Si 2 H 6 , and Si 3 H 8 for polysilicon and amorphous silicon has expanded, and they have been manufactured at low cost in large quantities. Is a new silicon raw material that is expected to progress. Therefore, the silicon-containing polymer compound containing a silyl group in the present invention is of great significance in that it can be easily and inexpensively produced by polymerizing a monomer obtained from a silicon hydride compound and an olefin. It can be said that there is.
更に本発明にかかわる含ケイ素高分子化合物は、アル
キルクロロシランから誘導されるような下記のポリマー
とは異なり、 その製造は非クロル系で実施することができ、腐蝕の心
配もなくプロセスも極めて簡単なものとなる。以上のこ
とから本発明にかかわる含ケイ素高分子化合物は、将来
更に安価に製造することが可能になるものと思われる。Further, the silicon-containing polymer compound according to the present invention is different from the following polymers derived from alkylchlorosilane, The production can be carried out in a non-chlorine system, and the process is extremely simple without fear of corrosion. From the above, it is considered that the silicon-containing polymer compound according to the present invention can be manufactured more inexpensively in the future.
更に本発明に用いる含ケイ素高分子化合物は、重合が
容易であるばかりでなく、高分子化合物中に存在するシ
リル基類は極めて安定で、空気中においても室温では酸
化されることなく、150℃近辺の高温でようやく酸化さ
れるにすぎない。Further, the silicon-containing polymer compound used in the present invention is not only easy to polymerize, but the silyl groups present in the polymer compound are extremely stable and do not oxidize at room temperature even in the air at 150 ° C. It is only oxidized at high temperatures in the vicinity.
次に本発明におけるセラミックス成形体の製造方法に
ついて述べる。Next, a method for manufacturing a ceramic molded body according to the present invention will be described.
含ケイ素高分子化合物を含浸させるべき母体となるケ
イ素を含むセラミックス成形体とは、具体的には例えば
SiC、Si3N4、サイアロン、Si-Ti-C-O系セラミックス、S
iC-B4C系セラミックス、Si3N4‐SiC複合系セラミック
ス、SiO2を構成成分に含む混合酸化物系セラミックス、
更にはFRM(ファイバー セラミックス レインフォー
ストメタル(Fiber Ceramics Reinforced Metal))、F
RC(Fiber Ceramics Reinforced Ceramics)などの成形
体があげられ、これらの中ではSiC、Si3N4、SiC-Si3N4
複合系セラミックスが最も好適なものとしてあげられ
る。The ceramic molded body containing silicon, which is the base material to be impregnated with the silicon-containing polymer compound, is specifically, for example,
SiC, Si 3 N 4 , Sialon, Si-Ti-CO ceramics, S
iC-B 4 C ceramics, Si 3 N 4 -SiC composite ceramics, mixed oxide ceramics containing SiO 2 as a constituent component,
Furthermore, FRM (Fiber Ceramics Reinforced Metal), F
Examples include molded bodies such as RC (Fiber Ceramics Reinforced Ceramics), among which SiC, Si 3 N 4 , SiC-Si 3 N 4
Composite ceramics are the most suitable.
これらの成形体の製造方法には特に制限はなく、例え
ば前述のように通常のセラミックス粉を高圧で圧縮成形
したものでもよいが、特には含ケイ素高分子化合物を成
形加工後焼成したもの、または添加剤を加え、射出成形
法にて加工後焼成したものなどが好適で、本発明の効果
が大きい。また成形体の形状には特に制限はなく、繊維
や複雑に加工されたものが含まれる。The method for producing these molded bodies is not particularly limited, and may be, for example, those obtained by compression-molding ordinary ceramic powder under high pressure as described above, but particularly those obtained by firing a silicon-containing polymer compound after molding, or Those obtained by adding additives and firing after processing by an injection molding method are preferable, and the effect of the present invention is great. The shape of the molded body is not particularly limited, and includes a fiber and a complexly processed product.
本発明において、含ケイ素高分子化合物のセラミック
ス成形体への含浸方法としては、具体的には、例えば本
発明にかかわる含ケイ素高分子化合物を溶解させた溶液
中にセラミックス成形体を浸しておくなどの方法が最も
簡単な方法として採用できる。この場合含ケイ素高分子
化合物の溶媒としては、特に制限はなく、例えばヘプタ
ン、ヘキサン、テトラヒドロフラン、ジグライム、ジオ
キサン、ブチルエーテル、トルエン、ベンゼン、ヘキシ
ルアミンなどの種々のものを用い得る。勿論該含ケイ素
高分子化合物が液状の場合には必ずしも溶媒を必要とし
ない。含浸される時の温度、時間については特に制限は
ないが、好ましくはそれぞれ0〜200℃、1〜100時間の
範囲である。In the present invention, the method for impregnating the silicon-containing polymer compound into the ceramic compact is specifically, for example, immersing the ceramic compact in a solution in which the silicon-containing polymer compound according to the present invention is dissolved. The method of can be adopted as the simplest method. In this case, the solvent of the silicon-containing polymer compound is not particularly limited, and various solvents such as heptane, hexane, tetrahydrofuran, diglyme, dioxane, butyl ether, toluene, benzene and hexylamine can be used. Of course, when the silicon-containing polymer compound is liquid, a solvent is not always necessary. The temperature and time for impregnation are not particularly limited, but are preferably 0 to 200 ° C. and 1 to 100 hours, respectively.
含ケイ素高分子化合物を含浸させた成形体は、必要に
よって過剰の表面高分子化合物を溶媒等によって洗浄、
乾燥され、しかる後に高温、好ましくは500〜2500℃の
温度範囲で焼成される。以上の含浸、焼成の操作は必要
に応じ多数回行なうことができる。The molded product impregnated with the silicon-containing polymer compound may be washed with a solvent or the like to remove excess surface polymer compound, if necessary.
It is dried and then calcined at an elevated temperature, preferably in the temperature range of 500-2500 ° C. The above-mentioned impregnation and firing operations can be carried out as many times as necessary.
本発明によれば、予めセラミックス成形体中に存在し
ていた気孔または表面が、含ケイ素高分子化合物の焼成
によって生じたSiCによって占められることになり、ま
たこのSiCがさらに成形体中のセラミックス粉末と結合
を作るため、成形体のかさ密度が増加し、さらには成形
体の機械的強度および時には耐熱性が向上するものと思
われる。According to the present invention, the pores or surfaces that were previously present in the ceramic molded body will be occupied by the SiC generated by the firing of the silicon-containing polymer compound, and this SiC is further the ceramic powder in the molded body. It is considered that the bulk density of the molded body is increased due to the formation of a bond with, and further the mechanical strength and sometimes the heat resistance of the molded body are improved.
以下、本発明を実施例によって説明する。 Hereinafter, the present invention will be described with reference to examples.
実施例1 ビニルシラン100g、AlBN(アゾビスイソブチロニトリ
ル)1gをオートクレーブに入れ、70℃にて8時間重合さ
せ、オイル状の平均分子量約2000の含ケイ素高分子化合
物を約90g得た。Example 1 100 g of vinylsilane and 1 g of AlBN (azobisisobutyronitrile) were placed in an autoclave and polymerized at 70 ° C. for 8 hours to obtain about 90 g of an oily silicon-containing polymer compound having an average molecular weight of about 2000.
市販の平均約300メッシュのSiC粉末40gと、上記含ケ
イ素高分子化合物5gとを混練後、ルツボ状に加圧成形し
た。次に加圧成形物を真空中にて室温から1500℃まで徐
々に昇温させながら加熱し、更に1800℃で4時間焼成し
た。得られたルツボのかさ比重は3.12であった。40 g of a commercially available SiC powder having an average of about 300 mesh and 5 g of the above-mentioned silicon-containing polymer compound were kneaded, and then pressure-molded in a crucible shape. Next, the pressure-formed product was heated in a vacuum while gradually raising the temperature from room temperature to 1500 ° C., and further baked at 1800 ° C. for 4 hours. The bulk specific gravity of the obtained crucible was 3.12.
更にこのルツボを、オイル状のポリビニルシランを50
wt%の濃度で含むベンゼン溶液に室温下にて2日間浸漬
させ、しかる後ベンゼンを除去、更にその後該ルツボを
真空中にて室温から1500℃まで徐々に昇温させながら加
熱し、更に1800℃で4時間焼成した。この操作を3回繰
り返し得られたルツボのかさ密度は3.15であった。この
ルツボの機械的強度は、処理前に得られたルツボの約2
倍で、又多結晶シリコンの溶融に用いたところ寿命も大
幅に向上した。Furthermore, this crucible was filled with 50% oily polyvinylsilane.
Immerse in a benzene solution containing wt% concentration for 2 days at room temperature, then remove benzene, and then heat the crucible in vacuum while gradually increasing the temperature from room temperature to 1500 ° C, and then 1800 ° C. It was baked for 4 hours. The bulk density of the crucible obtained by repeating this operation three times was 3.15. The mechanical strength of this crucible is about 2 times that of the crucible obtained before treatment.
Also, when it was used for melting polycrystalline silicon, the life was greatly improved.
実施例2 実施例1において、ポリビニルシランのかわりにポリ
アリルシランを用いた以外は実施例1と同様に実験を行
なった。Example 2 An experiment was performed in the same manner as in Example 1 except that polyallylsilane was used instead of polyvinylsilane.
この時ルツボの機械的強度は、処理前に得られたルツ
ボの約1.5倍で、又多結晶シリコンの溶融に用いたとこ
ろ寿命も大幅に向上した。At this time, the mechanical strength of the crucible was about 1.5 times that of the crucible obtained before the treatment, and when it was used for melting polycrystalline silicon, the life was greatly improved.
実施例3 パーメチルポリシラン(新日曹化工社製、平均分子量
約2000)をオートクレーブ中400℃、100気圧にて15時間
加熱焼成して得られた含ケイ素高分子化合物を溶融紡糸
法にて紡糸し、直径10μmの含ケイ素高分子化合物の繊
維を得た。この繊維を真空中(1×10-3mmHg)、1000℃
まで10時間かけて昇温予備加熱し、更にアルゴンガス雰
囲気中で、1200℃まで昇温し、該温度で2時間高温焼成
しSiC繊維を得た。Example 3 A silicon-containing polymer compound obtained by firing permethylpolysilane (manufactured by Shin Nisso Kako Co., Ltd., average molecular weight of about 2000) in an autoclave at 400 ° C. and 100 atm for 15 hours was spun by a melt spinning method. Then, a silicon-containing polymer compound fiber having a diameter of 10 μm was obtained. This fiber in vacuum (1 × 10 -3 mmHg) at 1000 ℃
Up to 1200 ° C. in an argon gas atmosphere, and then fired at that temperature for 2 hours to obtain SiC fibers.
この繊維を、オイル状のポリビニルシランを50wt%の
濃度で含むベンゼン溶液に室温下にて2日間浸漬させ、
しかる後ベンゼンを除去、更にその後真空中にて1800℃
まで徐々に昇温させながら加熱し、更に1800℃で4時間
焼成した。この操作を2回繰り返した。The fiber is immersed in a benzene solution containing oily polyvinylsilane at a concentration of 50 wt% for 2 days at room temperature,
After that, benzene was removed, and then 1800 ° C in vacuum.
The temperature was gradually raised to 1,800 ° C., and further calcined at 1800 ° C. for 4 hours. This operation was repeated twice.
処理前1200℃での引張強度が1.5GPaであった繊維の強
度は、処理後2.6GPaに向上した。The strength of the fiber, which had a tensile strength of 1.5 GPa at 1200 ° C before the treatment, improved to 2.6 GPa after the treatment.
本発明は、セラミックス成形体の強度を増加させる方
法を提供するものであり、用いる含ケイ素高分子化合物
に特徴を有する。該含ケイ素高分子化合物は入手が容易
であり、本発明によれば、強度の優れたSiCおよびSi3N4
を初め種々の含ケイ素セラミックス成形体を製造するこ
とが可能である。得られた成形体のかさ密度、強度は大
きく、特に高温での耐酸化性、強度に優れている。The present invention provides a method for increasing the strength of a ceramic molded body, and is characterized by the silicon-containing polymer compound used. The silicon-containing polymer compound is easily available, and according to the present invention, SiC and Si 3 N 4 having excellent strength can be obtained.
It is possible to manufacture various silicon-containing ceramic compacts including the above. The obtained molded product has a large bulk density and strength, and is particularly excellent in oxidation resistance and strength at high temperatures.
Claims (2)
たは3、R1は水素、アルキル基、アリール基またはハロ
ゲン、R2はアルキレン基またはフェニレン基であって、
R1およびR2はCOOH、NH2、Cl、OHなどの官能基を含んで
いても良い。)で表される繰り返し構造単位を含有する
含ケイ素高分子化合物を含む溶液中に含浸させ、ついで
500〜2500℃の温度範囲で焼成することを特徴とするセ
ラミックス成形体の製造方法。1. A ceramic compact containing silicon, (In the formula, m is 0 or a positive integer of 1 to 20, n is 1, 2 or 3, R 1 is hydrogen, an alkyl group, an aryl group or halogen, and R 2 is an alkylene group or a phenylene group,
R 1 and R 2 may contain a functional group such as COOH, NH 2 , Cl and OH. ) Impregnated in a solution containing a silicon-containing polymer compound containing a repeating structural unit represented by
A method for producing a ceramic molded body, which comprises firing in a temperature range of 500 to 2500 ° C.
たはこれらの混合物からなる請求項1に記載の方法。2. The method according to claim 1, wherein the ceramic containing silicon comprises SiC, Si 3 N 4 or a mixture thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083042A JPH0832604B2 (en) | 1988-04-06 | 1988-04-06 | Method for manufacturing ceramic molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083042A JPH0832604B2 (en) | 1988-04-06 | 1988-04-06 | Method for manufacturing ceramic molded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01257177A JPH01257177A (en) | 1989-10-13 |
| JPH0832604B2 true JPH0832604B2 (en) | 1996-03-29 |
Family
ID=13791151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63083042A Expired - Lifetime JPH0832604B2 (en) | 1988-04-06 | 1988-04-06 | Method for manufacturing ceramic molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0832604B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2665778C1 (en) * | 2017-09-25 | 2018-09-04 | Акционерное общество "Обнинское научно-производственное предприятие "Технология" им. А.Г. Ромашина" | Method of producing composite material |
| JP7181435B1 (en) | 2022-07-01 | 2022-11-30 | 株式会社クレハ | Method for producing polycarbosilane for producing silicon carbide fiber and method for producing silicon carbide fiber |
-
1988
- 1988-04-06 JP JP63083042A patent/JPH0832604B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01257177A (en) | 1989-10-13 |
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