JPH0834229B2 - Bonding device - Google Patents

Description

The present invention relates to a semiconductor integrated circuit (IC) and a large-scale integrated circuit (LS).
The present invention relates to a semiconductor device bonding apparatus of I), and more particularly to a bonding apparatus improved in bonding with the increase in size of electronic devices.

BACKGROUND ART Conventionally, this type of bonding apparatus is as shown in FIGS. 3 and 4. The apparatus shown in FIG. 3 is of a constant heat type, and the tool holder 6 supports and fixes the bonding tool 5 and is provided with an inclination adjusting mechanism so that the bonding tool 5 can be adjusted in the X direction and the Y direction. This tilt adjustment is for obtaining parallelism between the work as a bonding object and the bonding tool, and is adjusted before bonding. This adjustment is necessary even in the pulse heating method. The tool holder 6 is held by a vertical drive unit 7 and driven vertically.
The vertical drive unit 7 is placed on an XY table, which is driven in the X and Y directions to position the bonding tool 5 on the IC chip 8 and the leads 9 arranged on the substrate 10. Bond.

The structure of the bonding tool 5 is shown in FIG.
The pressing surface of the work pressing portion 1 shown in FIG. 4 is formed in a size capable of thermocompression bonding the IC chip 8 (device) which is a bonding object at one time. The same applies to the pulse heat method. The work pressing portion 1 is placed and fixed on a shank material 2, and a cartridge heater 3 and a thermocouple 4 are provided on the side surface of the shank material 2.

[Problems to be Solved by the Invention] However, the conventional bonding apparatus has the following drawbacks.

That is, in the conventional apparatus, since the work pressing portion is formed in the size of the device, a uniform bonding load is required for all the bonding portions, and the “parallelism between the work and the bonding tool” is strict in two directions. Settings are required.

In the conventional apparatus, if the height of the bonding surface of the work to be bonded varies, it is not possible to supply a uniform bonding load to all the bonded parts.

Further, as the size of the device becomes larger, a bonding load corresponding to it is required, and the capacity of the bonding apparatus itself must be improved.

As the device becomes larger, the heat capacity of the bonding tool corresponding to it becomes necessary.

Although it is necessary to increase the size of the bonding tool due to the increase in the size of the device, it becomes difficult to manufacture the tool and it becomes difficult to maintain the processing accuracy in terms of accuracy.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide a bonding apparatus that can achieve various effects such as bonding even if the electronic device becomes large. is there.

[Means for Solving the Problem] The present invention is a bonding apparatus for bonding components to be bonded arranged in a linear shape or a strip shape having a constant width, and an XY driving means for driving in the X and Y directions. An up-down drive means mounted on the XY drive means, a holding means driven up and down by the up-down drive means, and a bonding tool which is held by the holding means and presses a bonding surface of a component to be bonded for bonding. The bonding tool comprises a bonding tool fixing portion and a bonding tool movable portion that rotates about a rotation shaft supported by the fixing portion.

EXAMPLES Next, the present invention will be described in detail with reference to FIG. 1 and FIG.

In FIG. 1, the tool holder 23 supports and fixes the bonding tool and is provided with an inclination adjusting mechanism so that the bonding tool can be adjusted in the X direction and the Y direction. This tilt adjustment is for obtaining parallelism between the work as a bonding object and the bonding tool, and is adjusted before bonding. Tool holder 23
Is driven up and down by the vertical drive unit, and this vertical drive unit
The present embodiment is similar to the conventional device in that it is placed on a table and driven and positioned in the X and Y directions.

The structure of each part of the bonding tool in FIG. 1 will be described. A cartridge heater 21 and a thermocouple 22 are embedded in the side surface of the bonding tool movable part 19, and the bonding tool movable part 19 has a substantially U shape. It is supported rotatably around a rotary shaft 25 supported by the fixed portion 20. The work contact portion 24, which is convex around the rotary shaft 25 of the bonding tool movable portion 19 and has a bonding surface formed in an arc shape, is arranged on the center of the bonding tool fixing portion 20. This is to prevent the generation of a moment against the load from the tool holder 23 side. Further, the bonding tool holding portion of the present embodiment has the same structure as the conventional device, and therefore is configured to be compatible.

FIG. 2 (a) shows the principle of the outer lead bonding of the inner lead 16 and outer lead 17 on the IC chip 8 positioned on the substrate 18 shown in FIG. 2 (b) according to this embodiment. It is a figure.

In FIG. 2A, when the center of the rotary shaft 25 is moved from 0 (tool fulcrum reference position 14) to 0 '(tool position movement position 15), the bonding tool reference position 12 is changed to the bonding tool movement position 13 indicated by a chain double-dashed line. However, the tool moves, but a uniform peak load corresponding to the bonding portion-bonding portion from A to A'is applied regardless of the variation in the height of the bonding surface. That is, the center of the rotary shaft 25 is 0,0 ′
From the workpiece contact part 24 to the arcuate surfaces A, A ′ is R =
Since it is R ', if the height of the bonding surface between A-A' is the same, the rotation center moves from 0 to 0'in parallel. In this type of bonding, leads and bumps arranged in a square shape as shown in FIG. 2B are targeted.
Therefore, in the bonding according to the present embodiment, one of the four sides of FIG. 2 (b) is continuously bonded to two sides after bonding, and the tool and the tool holder are rotated by 90 degrees, or the bonding tool is separately arranged. The remaining two sides are bonded by the bonding station. As described above, in the present embodiment, at the time of bonding, the rotating shaft 25 is moved in parallel with the work under a constant load, but since the load shaft of the vertical drive unit 7 is provided in the vertical direction, the position corresponding to the height of the bonding portion is provided. Always follow and move with. Therefore, thermocompression bonding can be performed by moving the heated bonding tool as described above.

[Effects of the Invention] As described above, according to the present invention, the following effects are obtained.

Since the present invention has a degree of freedom in one rotation direction about the rotation axis, the tilt adjustment of the bonding tool is conventionally only two directions, but only one direction.

According to the present invention, even if there is a variation in the height of the bonding surface of the object to be bonded, it is possible to perform bonding with a uniform bonding load according to the height of the bonding portion.

According to the present invention, even if the device is upsized, a large load is not required because the contact portion between the work as the bonding object and the bonding tool is a part.

According to the present invention, since the contact portion between the work and the bonding tool is a part, the heat capacity is smaller than that of the conventional device.

According to the present invention, it is easy to obtain the processing accuracy of the work contact portion (bonding surface).

[Brief description of drawings]

FIG. 1 is a diagram showing the configuration of the present invention, FIG. 2 is a diagram showing the principle of outer lead bonding using the bonding tool of FIG. 1, and FIGS. 3 and 4 are diagrams showing conventional examples. Is. 1 ... Work pressing part, 2 ... Shank material, 3 ... Cartridge heater, 4 ... Thermocouple, 5 ... Bonding tool, 6 ... Tool holder, 7 ... Vertical drive part, 8 ... IC
Chip, 9 ... Lead, 10 ... Board, 12 ... Bonding tool reference position, 13 ... Bonding tool movement position, 14 ... Tool fulcrum reference position, 15 ... Tool position movement position, 16 ... Inner lead, 17 ...... Outerlead, 18
...... Substrate, 19 ...... Bonding tool moving part, 20 …… Bonding tool fixed part, 21 …… Cartridge heater,
22 …… Thermocouple, 23 …… Tool holder, 24 …… Work contact part.

Claims (2)

[Claims] 1. A bonding apparatus for bonding components to be bonded arranged in a linear shape or a strip shape having a constant width, the XY driving means being driven in the X direction and the Y direction, and being mounted on the XY driving means. Vertical drive means, holding means that is vertically driven by the vertical drive means, and a bonding tool that presses the bonding surface of the component to be bonded and that is held by the holding means, and the bonding tool is the bonding tool. It is composed of a fixed portion and a bonding tool movable portion which rotates around a rotation shaft supported by the fixed portion, a bonding surface at the tip of the bonding tool movable portion is formed in an arc shape, and the rotation axis is the center of curvature. A bonding apparatus having a radius of curvature of 2. The bonding apparatus according to claim 1, wherein the tip of the movable portion of the bonding tool is formed in a convex shape and the bonding surface is formed in an arc shape.