JPH084056B2 - Method for manufacturing laminated ceramic electronic component - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a laminated ceramic electronic component.

2. Description of the Related Art In recent years, with the development of ultra-small, thin, and lightweight electronic devices such as radios, microcassette recorders, electronic tuners, and video cameras, there has been a strong demand for miniaturization and integration of parts. In order to satisfy these requirements, a large number of laminated ceramic electronic components such as a laminated capacitor, a laminated varistor, a laminated piezoelectric body, a laminated chip coil and a laminated substrate are being actively developed. Here, a conventional technique will be described by taking a monolithic ceramic capacitor as a representative of monolithic ceramic electronic components.

As shown in FIG. 2, the monolithic ceramic capacitor has an internal electrode 1, a ceramic dielectric layer 2 and an external electrode 3, and has a structure in which a plurality of thin ceramic dielectric layers 2 are stacked via the internal electrode 1.

As is well known, the capacitance C (pF) of a capacitor composed of n layers of ceramic dielectrics and n pairs of electrodes is expressed by the following equation.

Where S is the electrode area (mm ² ), ε _r is the relative permittivity, t
Is the thickness (mm) of the dielectric and n is the number of layers. here,
n = 1 is a single plate capacitor, and n ≧ 2 is a monolithic ceramic capacitor. The thickness of one layer of the dielectric of the monolithic ceramic capacitor is designed to be about several tens of μm,
Compared with the thickness of several hundred μm of conventional single-plate capacitors
This corresponds to a thickness of 1/10 or less. As shown in the above equation, the capacitance is inversely proportional to the thickness, and is proportional to the total number of laminated dielectrics. Therefore, the thinner the thickness of one layer of the dielectric, the greater the capacitance. The number of dielectric layers can also be increased. Therefore, the monolithic ceramic capacitor can have a larger capacity in the same volume as compared with the single plate capacitor, and can be downsized in the same capacity.

FIG. 3 shows a general manufacturing process of a conventional monolithic ceramic capacitor. First, a dielectric layer 5 having a predetermined thickness is formed on an organic film 4 such as polyester by a doctor blade method using a slurry prepared by adding a binder, a plasticizer, an organic solvent and the like to a dielectric powder and mixing them.
A green sheet 6 on which is formed is produced. Next, the dielectric layer 5 is peeled from the organic film 4, punched out to a predetermined size, and then an electrode is applied in a predetermined pattern by a screen printing method and dried to form an internal electrode 7. Next, the dielectric layers 5 on which the internal electrodes 7 are formed are put into the metal die 8 by the number of laminated layers and laminated while applying heat and pressure. At this time, the upper and lower portions of the laminated body are overlaid with the dielectric layers 5a on which no electrodes are printed, and are designed to withstand warpage during sintering and stress during handling.
Then, after cutting into chips and firing, the external electrodes 9 are formed to manufacture capacitors ("Insulation / Dielectric Ceramics" published by CMC Co., Ltd. in 1985, edited by Tadashi Shiozaki, P. 211-227).

Although the monolithic ceramic capacitor has been described above, the monolithic varistor, the monolithic piezoelectric body and the like have the same structure and are manufactured by substantially the same manufacturing process.

Problems to be Solved by the Invention With the development of electronic circuits and electronic devices, it is strongly desired to reduce the size and increase the capacity of multilayer ceramic capacitors, for example. For that purpose, it is indispensable to further reduce the thickness of the dielectric layer, and specifically, it is necessary to reduce the current thickness of the dielectric layer of several tens of μm from several μm to several tens of μm. On the other hand, it is necessary to thin each ceramic powder layer in order to reduce the rising voltage in the laminated varistor and the driving voltage in the laminated piezoelectric body. When using such an ultra-thin sheet according to the manufacturing process shown in FIG. 3, the ceramic powder-to-layer sheet on which the electrode is printed and peeled from the organic film is uniformly formed into a metal die without wrinkles. Packing and crimping is an extremely difficult task. Furthermore, if wrinkles are generated, air will remain in the molded body, and after sintering, it may cause delamination between the ceramic powder layer and the electrode, so-called delamination, and in terms of workability and process yield. There are many problems.

In addition, Pd, P
Although noble metals such as t, Pd-Ag are used, thinning of the electrode layer is also strongly required for cost reduction and size reduction.

By the way, these ceramic powder green sheets are generally produced by the doctor blade method, but the surface of the sheet has large irregularities, and even if an electrode layer is thinned, the roughness of the sheet surface is smaller than the electrode thickness. If it is too large, cracks may occur on the surface of the electrode after printing the electrode, or air may easily remain between the electrode layer and the ceramic powder layer, which may reduce the effective area and cause delamination.

In view of the above-mentioned problems, the present invention is capable of laminating even an extremely thin ceramic powder sheet evenly and with good adhesiveness, and further forming an electrode layer on the sheet surface in which unevenness of the sheet surface is hardly recognized. It is intended to provide a method for manufacturing a ceramic electronic component.

Means for Solving the Problems In order to solve the above problems, the method for manufacturing a multilayer ceramic electronic component of the present invention is such that an electrode layer is formed on a surface of a ceramic powder layer on a green sheet having a predetermined shape, and a ceramic When heat and pressure are applied from the side of the base film surface of the green sheet consisting of the powder layer and the base film, another green sheet that can transfer the ceramic powder layer from the base film to the object is attached to each other. After overlapping so as to face each other, the ceramic powder layer of the latter sheet is transferred to the ceramic powder layer of the former sheet by thermocompression bonding from the base film surface side of the latter sheet, and then the base film of the latter sheet is peeled off. After forming electrodes on the peeled ceramic powder layer in a predetermined shape by screen printing, another latter film is formed on this sheet surface. The ceramic powder layer on which the above-mentioned electrode is formed by using a sheet, transfer by thermocompression bonding, peeling of the base film, and electrode formation by the screen printing method, and the ceramic powder layer and the electrode layer alternate. It is characterized by being laminated on.

Action The focus on the method for producing a monolithic ceramic electronic component according to the present invention is that a so-called hot-stamp type green sheet (hereinafter referred to as hot sheet) in which a ceramic powder layer is transferred to an object with good adhesion when heat and pressure are applied. Stamp sheet).

The slurry viscosity in the case of producing this hot stamp sheet can be designed to be extremely small as several tens of cps as compared with the slurry viscosity of several thousand cps when the conventional doctor blade method is used. Therefore, a hot stamp sheet can be easily manufactured by the reverse roll method or the like even with an ultrathin ceramic powder layer of up to several μm, which was impossible with the conventional method. In addition, when the ultra-thin ceramic powder layers of several μm to ten and several μm are stacked, they can be superposed integrally with the base film, so that the ceramic powder layers should be stacked evenly and without wrinkles. Is possible. Further, unlike the conventional example, in which many ceramic powder layers printed at the time of lamination are packed in a die and then pressed, unlike the conventional example, in the present invention, each hot stamp sheet is pressure-bonded by a heat roller or the like. Therefore, since the ceramic powders to be transferred and transferred or the binders contained in the electrodes are once softened to each other and then fixed to each other, the adhesiveness is remarkably improved as compared with the conventional case. Therefore, it is possible to obtain a laminated compact having good adhesion between the sheets even after omitting the step of heating and pressure-bonding again after laminating a desired number of ceramic powder layers. Further, when the roller is heated and pressure-bonded, the ceramic powder layer is brought into close contact with the air while being extruded, so that the air is unlikely to remain in the laminated molded body, and the occurrence rate of delamination can be significantly suppressed.

Further, in the case of the present invention, after transferring the ceramic powder layer, the electrode is formed on the surface from which the base film is peeled off, so the sheet surface is extremely smooth, and the sheet surface produced using the conventional doctor blade method The surface roughness is significantly smaller than that of Therefore, even if a thin electrode layer is formed by the screen printing method, cracking does not occur, and it is possible to form it extremely uniformly and with good adhesion, and it is possible to prevent the reduction of the effective area due to cracking and to prevent delamination. Can also be prevented.

Example A process for manufacturing a monolithic ceramic electronic component according to the present invention will be briefly described with reference to FIG.

First, using a slurry prepared by adding a binder, a plasticizer, a solvent and the like to ceramic powder and mixing them, an ultra-thin ceramic powder layer 10 having a thickness of several μm to several tens of μm is formed by a reverse roll method. The hot stamp sheet 12 is formed on the above. In this case, it is necessary to fully consider the type and amount of binder, etc., in accordance with the object so that the hot stamp system can be used. The hot stamp sheet 12 may be formed with a release layer on the base film 11 in advance and then the ceramic powder layer 10 may be formed in order to facilitate the release of the ceramic powder layer 10 during thermocompression bonding. . Next, in order to withstand warping during sintering and handling, the ceramic powder layer portion that is not directly related to the electrical characteristics is attached to the base film 11a.
After superposing the above-mentioned hot stamp sheet 12 on the green sheet 12a having the ceramic powder layer 10a produced by the doctor blade method, heat and pressure are simultaneously applied from the side of the base film 11 by a heat roller 13 or the like. By this, the ceramic powder layer of the hot stamp sheet 12
After transferring 10 to the ceramic powder layer 10a produced by the doctor blade method, the base film 11 of the hot stamp sheet 12 is peeled off to form a ceramic powder layer portion having a predetermined thickness that does not contribute to electrical characteristics. . in this case,
Only the above-mentioned hot stamp sheet 12 may be overlapped to form a ceramic powder layer portion that does not directly contribute to electrical characteristics. On the hot stamp sheet of the ceramic powder layer portion produced in this way, the internal electrode was formed into a predetermined shape.
Forming 14 Then another hot stamp sheet 12b
After the ceramic powder layer 10b and the ceramic powder layers of the above-mentioned hot stamp sheet are superposed so as to face each other, heat and pressure are simultaneously applied from the base film surface 11b side by the heat roller 13 or the like to obtain the hot stamp. The ceramic powder layer 10b of the sheet 12b is connected to the electrode 14 described above.
After being transferred to the formed ceramic powder layer, the base film 11b of the hot stamp sheet 12b is peeled off. Next, after forming internal electrodes by a screen printing method in a predetermined shape on this sheet surface, another hot stamp sheet is overlaid, transfer by thermocompression bonding, peeling of the base film, and electrode formation by a screen printing method. After repeatedly stacking the ceramic powder layer and the electrode layer on each other, a ceramic powder layer portion that does not directly relate to the electrical characteristics is formed on the uppermost layer as described above, and then cut and fired. After that, the external electrodes 15 are formed to produce a monolithic ceramic electronic component.

Next, specific examples of the present invention will be described in detail.

Of the dielectric powder 100 parts by weight of a main component <Example -1> BaTiO _3,
After blending 22 parts by weight of polyvinyl butyral resin and 2 parts by weight of dioctyl phthalate, they were kneaded in a ball mill using tetrahydrofuran as a solvent to prepare a slurry having a viscosity of 10 to 15 cps. After degassing this slurry, apply a thickness of 16 on the polyester film by the reverse roll method.
A hot stamp sheet was prepared by forming a μm dielectric layer.

Next, powder particles containing BaTiO ₃ as a main component prepared by the doctor blade method on a polyester film having a thickness of 50 μm, and a dielectric layer of a green sheet having a dielectric layer of 200 μm made of polyvinyl butyral resin, After stacking so that the dielectric layers of the hot stamp sheet face each other, a hot roller is applied from the hot stamp sheet base film surface side at a temperature of 130 ° C and a pressure of 500.
The dielectric layer of the hot stamp sheet was transferred by thermocompression bonding for 3 seconds under the condition of kg / cm ² . After that, the base film side of the hot stamp sheet is peeled off, and a commercially available Pd
An electrode having a shape of 3.5 × 1.0 mm was formed by a screen printing method using a paste (product name: ML-3724, manufactured by Shoei Chemical Co., Ltd.). Next, another hot stamp sheet is overlaid thereon, the hot stamp sheet is transferred by thermocompression bonding under the same conditions as above, the base film is peeled off, and the same electrode paste as above is used on that surface. Then, the electrodes were printed in a predetermined shape. The overlapping portion of the internal electrodes, that is, the electrode area effectively acting as a laminated capacitor was laminated and formed so as to be 1.4 × 1.0 mm. After repeating this step 10 times, the above-mentioned green sheets having a thickness of 200 μm and manufactured by the doctor blade method were stacked. Next, this laminated compact was further subjected to 500 k at 80 ° C using a die press.
It pressure-bonded under the condition of g / cm ² . In addition, in order to confirm the necessity of the die pressing, a laminated molded body not subjected to the die pressing treatment was also produced. After cutting the molded body into 2.4 × 1.6 mm chips, while dusting the chip molded body with ZrO ₂ powder
It was baked at 1300 ° C for 1 hr. The temperature rise and fall temperature is 200 ℃ / h
The temperature was set to r and was held at 380 ° C. for 10 hours to remove the binder on the way.

The capacitance of the capacitor thus produced was measured by a usual method, and the fine structure of the sintered body was observed by a scanning electron microscope to confirm the measurement of the dielectric layer thickness and the presence or absence of delamination. The number of measurement samples is
I made it 100. Table 1 below shows the average capacity of n = 100, the dielectric layer thickness of the sintered body, and the occurrence rate of delamination. For comparison, as a conventional method, a 40 μm-thick green sheet made of a dielectric powder containing BaTiO ₃ as the main component and having exactly the same composition as described above was prepared by using a doctor blade method, and such a sheet was prepared as shown in FIG. Table 1 also shows the capacitance, dielectric layer thickness, and delamination occurrence rate of the multilayer capacitor manufactured according to the manufacturing process of 1. Here, the type, shape, number of stacked layers, firing conditions, etc. of the electrodes were all the same as in Example-1.

Further, the surface of the sheet forming the electrode in the present invention, that is, the surface from which the base film of the hot stamp sheet is peeled off, and the surface roughness of the sheet surface prepared by the doctor blade method used in the conventional method are measured by a surface roughness meter. The measured values are also shown in Table 1.

From the results shown in Table 1, no significant change in characteristics was observed in the present invention with and without the die press. In the present invention, since each hot stamp sheet is thermocompression-bonded by a heat roller or the like in the present invention, even if the steps of heating and pressure-bonding again after the desired number of ceramic powder layers are laminated, the adhesion between the sheets can be eliminated. It shows that a laminated molded product having good properties is obtained.

As is clear from the above results, by using a hot stamp sheet, the laminated ceramic capacitor produced according to the present invention can be evenly laminated even with an extremely thin sheet with good adhesion. Furthermore, since the surface on which the electrodes are formed has a smaller surface roughness than the conventional example, it is possible to uniformly form a thin electrode layer by the screen printing method,
The occurrence of delamination can be suppressed. Further, since the dielectric layer of the sintered body is thin, the capacity is greatly improved and the size can be reduced as compared with the conventional method.

In the examples, the dielectric powder containing BaTiO ₃ as the main component was used, but any dielectric powder having any dielectric property such as SrTiO ₃ system or MgTiO ₃ —CaTiO ₃ system may be used.

<Example-2> 20 parts by weight of polyvinyl butyral resin and 2 parts of dibutyl phthalate per 100 parts by weight of varistor powder containing ZnO as a main component.
After blending parts by weight, the solvent is a mixed solvent of tetrahydrofuran and toluene (tetrahydrofuran / toluene = 80/2
(0 weight ratio), kneading with a ball mill to prepare a slurry with a viscosity of 20 cps, and after defoaming treatment, use a reverse roll coater to deposit a thickness of 25μ on the polyester film.
A hot stamp sheet was produced by forming a varistor powder layer of m.

Next, a varistor powder layer of a gree sheet having a varistor powder particle having a thickness of 200 μm made of a polyvinyl butyral resin, which is a varistor powder particle mainly composed of ZnO produced by a doctor blade method, and a varistor of the hot stamp sheet described above. After stacking so that the powder layers face each other, from the base film surface side of the hot stamp sheet, with a heat roller, under the conditions of temperature 130 ° C and pressure 500 kg / cm ²
After thermocompression bonding for 2 seconds, the varistor powder layer of the hot stamp sheet was transferred. Then, the base film surface of the hot stamp sheet was peeled off, and internal electrodes were formed on this peeled surface using the same electrode paste and screen plate as in Example-1.
Next, another hot stamp sheet is overlaid thereon, the hot stamp sheet by thermocompression bonding is transferred under exactly the same conditions as described above, the base film is peeled off, and the electrode printing of a predetermined shape is repeated 15 times, and then the above-mentioned thickness is obtained. Green sheets made by the 200 μm doctor blade method were stacked. The overlapping portion of the internal electrodes, that is, the electrode area that effectively works as the laminated varistor was the same as in Example-1.
Next, in the same manner as in Example 1, the laminated compact was further pressure-bonded using a die press at 80 ° C. under the condition of 500 kg / cm ² , and a die not subjected to die press treatment at all. Then, after cutting into a chip shape of 2.4 × 1.6 mm, the chip molded body was baked at 1250 ° C. for 1 hour. The temperature rising / falling rate, binder removal temperature, etc. were the same as in Example-1.

The non-linear index α and the varistor voltage Vth of the varistor thus produced are measured by a normal method, and the varistor layer thickness is measured and delaminated by observing the microstructure of the sintered body with a scanning electron microscope. The existence was confirmed. The varistor voltage (Vth) is V in this embodiment.
_The voltage applied to the device was measured when a current of 1 _mA , that is, 1 mA was applied to the device. The number of measurement samples was 100.
Table 2 shows the average varistor characteristics (α, Vth) when n = 100, the varistor layer thickness of the sintered body, and the delamination occurrence rate. As a conventional method for comparison, a 50 μm-thick green sheet made of varistor powder containing ZnO as the main component and having exactly the same composition as described above was prepared by using the doctor blade method, and the sheet shown in FIG. 3 was manufactured. Table 2 also shows the varistor characteristics, the varistor layer thickness, and the delamination occurrence rate of the laminated varistor manufactured according to the process. Here, the type, shape, number of stacked layers, firing conditions, etc. of the electrodes were all the same.

Further, the surface roughness of the sheet surface forming the electrode in the present invention, that is, the surface from which the base film of the hot stamp sheet is peeled off, and the surface roughness of the sheet surface prepared by the doctor blade method used in the conventional method are measured. Table 2 also shows the values measured by.

Similar to Example-1, after the laminated molded body was manufactured, it was not pressed with a mold, and no significant change was observed in the characteristics. In the present invention, since each hot stamp sheet is thermocompression-bonded by a heat roller or the like in the present invention, even if the step of heating and pressure-bonding again after the desired number of powder layers are laminated is omitted, the adhesion between the sheets can be eliminated. Indicates that a good laminated molded product is obtained.

As is clear from the above results, in the laminated ceramic varistor manufactured according to the present invention, by using a hot stamp sheet, even an extremely thin sheet can be uniformly laminated with good adhesion. Furthermore, since the surface on which the electrodes are formed has a remarkably small surface roughness as compared with the conventional one, it is possible to uniformly form a thin electrode layer by the screen printing method, and it is possible to suppress the occurrence of delamination. Also,
Since the varistor layer of the sintered body is thin, the varistor characteristics are significantly improved and the size can be reduced as compared with the conventional method.

<Example _{-3> PbZrO 3 -PbTiO 3 -Pb (} Mg, Nb) to the piezoelectric powder 100 parts by weight of the main component O _3, polyvinyl butyral resin 20
Parts by weight, and 3 parts by weight of dibutyl phthalate are mixed, and then tetrahydrofuran is used as a solvent, followed by kneading with a ball mill,
After making a slurry with a viscosity of 15 cps and defoaming,
By forming a 25 μm thick piezoelectric powder layer on a polyester film using a reverse roll coater,
A hot stamp sheet was prepared. Next, PbZrO was prepared by a doctor blade method _{3 -PbTiO 3 -Pb (Mg, Nb} ) O 3
After the piezoelectric powder layer of a 300 μm-thick piezoelectric green sheet made of polyvinyl butyral resin and the piezoelectric powder particles of which is the main component, and the piezoelectric powder layer of the hot stamp sheet described above are placed so as to face each other. From the base film surface side of the hot stamp sheet, thermocompression bonding was performed for 2 seconds under the conditions of a temperature of 150 ° C. and a pressure of 500 kg / cm ² by a heat roller to transfer the piezoelectric powder layer of the hot stamp sheet. Then, the base film surface of the hot stamp sheet was peeled off, and internal electrodes were formed on this peeled surface using the same electrode paste and screen plate as in Example-1. Next, another hot stamp sheet is superposed thereon, and the hot stamp sheet is transferred by thermocompression bonding under exactly the same conditions as described above, the base film is peeled off, and the electrode printing of a predetermined shape is repeated 100 times, and then the above-mentioned thickness is obtained. Green sheets made by the doctor blade method of 300 μm were stacked. In addition, the overlapping portion of the internal electrodes, that is, the electrode area effectively acting as the laminated piezoelectric material was the same as in the embodiment. Next, this laminated compact was subjected to 50 ° C. at 80 ° C. using a die press in the same manner as in Example-1.
One that was pressure-bonded under the condition of 0 kg / cm ² and one that was not subjected to any die pressing treatment were produced. Then, after cutting into a chip shape of 2.4 × 1.6 mm, the chip molded body was baked at 1280 ° C. for 1 hour. The temperature rising / falling rate, binder removal temperature, etc. were the same as in Example-1.

As a conventional method for comparison, a 100 μm-thick green sheet made of piezoelectric powder containing PbZrO ₃ —PbTiO ₃ —Pb (Mg, Nb) O ₃ as the main component and having the exact same composition as described above was used as a doctor blade method. And a laminated piezoelectric material was manufactured according to the manufacturing process of FIG. Here, the type, shape, number of stacked layers, firing conditions, etc. of the electrodes were all the same.

When a voltage was applied to the electrodes of each sample thus produced, the driving voltage required to make the strain rate of expansion and contraction per unit length the same was measured by a usual method, and the ratio was examined. As a result, it was confirmed that the laminated piezoelectric material according to the present invention was about 1/4 smaller than the conventional one.

Further, by observing the fine structure of the sintered body with a scanning electron microscope, the piezoelectric layer thickness was measured and the presence or absence of delamination was confirmed. The measurement sample amount was 50 pieces.
Table 3 shows the average piezoelectric layer thickness of the sintered body and the occurrence rate of delamination.

Further, in the present invention, the surface of the sheet forming the electrode,
That is, Table 3 also shows the surface of the hot stamp sheet from which the base film has been peeled off and the surface roughness of the surface of the sheet prepared by the doctor blade method used in the conventional method, measured by a surface roughness meter.

No significant change in properties was observed with or without die pressing. This is because the hot stamping sheets are thermocompression-bonded one by one with a heat roller, so the adhesiveness between the sheets is significantly improved. Therefore, after the desired number of powder layers are laminated, the step of heating and pressing again is omitted. It is possible to do.

As is clear from the above results, by using a hot stamp sheet, the laminated piezoelectric body manufactured according to the present invention enables even an extremely thin sheet to be uniformly laminated with good adhesion. Further, since the surface on which the electrodes are formed has a remarkably small surface roughness as compared with the conventional one, it is possible to uniformly form a thin electrode layer even by the screen printing method, and it is possible to suppress the occurrence of delamination. Further, since the piezoelectric powder layer of the sintered body is thin, the driving voltage can be greatly reduced and the size can be reduced as compared with the conventional method. In this embodiment, PbZrO ₃ -PbTiO ₃ -Pb (M
A ternary system of g, Nb) O ₃ was used, but any piezoelectric powder having any piezoelectric property such as Pb (Zr, Ti) O ₃ may be used.

In the above-mentioned examples, all described the functional laminated ceramics, but also for the production of laminated substrates such as Al ₂ O ₃ and AIN, the production method of the present invention provides a laminated substrate in which the occurrence of delamination is suppressed uniformly. It goes without saying that it becomes possible to fabricate.

Further, in the above-mentioned embodiment, the heat roller is used for transferring all the ceramic powder layers, but it goes without saying that the same effect can be obtained by moving the hot platen containing the heater up and down for thermocompression bonding. Is.

EFFECTS OF THE INVENTION As described above, the present invention provides a base sheet surface side of a green sheet composed of a ceramic powder layer and a base film on a green sheet in which an electrode layer is formed in a predetermined shape on the surface of the ceramic powder layer. When heat and pressure are applied from the base film, the green sheets that can transfer the ceramic powder layer from the base film to the copy are stacked so that the ceramic powder layers face each other, and then thermocompression bonded from both sides of the base film of the latter sheet. After transferring the ceramic powder layer of the latter sheet to the ceramic powder layer of the former sheet, the base film of the latter sheet is peeled off, and electrodes are formed on the peeled ceramic powder layer in a predetermined shape by screen printing. After formation, superposition on the ceramic powder layer on which the electrode is formed using another latter sheet on this sheet surface, Repeated transfer by thermocompression bonding, peeling of the base film, and electrode formation by screen printing,
By the manufacturing method of a laminated ceramic electronic component having a step of alternately laminating a ceramic powder layer and an electrode layer, it is possible to uniformly laminate even a green sheet composed of an extremely thin ceramic powder layer, which has been conventionally possible. From
The miniaturization of electronic components is achieved. Furthermore, since the surface on which the electrodes are formed has a significantly smaller surface roughness than before, it is possible to form a thin electrode layer even by the screen printing method, suppress delamination, and improve productivity. Its industrial value is extremely high, as can be achieved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a manufacturing process of a monolithic ceramic electronic component according to the present invention, FIG. 2 is a partially cutaway perspective view of a monolithic ceramic capacitor, and FIG. 3 is a diagram illustrating a manufacturing process of a monolithic ceramic electronic component according to a conventional method. It is a figure. 10,10a, 10b …… Ceramic powder layer, 11,11a, 11b …… Base film, 12,12b …… Hot stamp sheet, 12a…
… Green sheet, 13 …… Transfer roller, 14 …… Internal electrode, 15 …… External electrode.

Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location H01L 41/22 (72) Inventor Nobuo Otani 1006 Daiji Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hideyuki Okinaka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. When heat and pressure are applied from the base film surface side of a green sheet consisting of a ceramic powder layer and a base film onto a green sheet having an electrode layer formed in a predetermined shape on the surface of the ceramic powder layer. , After stacking another green sheet that can transfer the ceramic powder layer from the base film to the object so that the ceramic powder layers face each other, the latter sheet is heat-pressed from both sides of the base film. After transferring the ceramic powder layer to the ceramic powder layer of the former sheet, the base film of the latter sheet is peeled off, and an electrode is formed on the peeled ceramic powder layer by a screen printing method into a predetermined shape, By stacking on the ceramic powder layer on which the above electrodes are formed by using another latter sheet on this sheet surface and by thermocompression bonding Copy, peeling of the base film, repeats the electrode formation by screen printing, the method of production of a multilayer ceramic electronic component, wherein a ceramic powder layer and the electrode layers are alternately stacked.