JP2502792B2 - Vacuum deposition source and magnetic recording medium deposited using the vacuum deposition source - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum evaporation source that melts and evaporates an evaporation material to form a thin film on a substrate, and a magnetic recording medium evaporated using the vacuum evaporation source. Is.

Conventional technology For example, in order to form a thin film on a long film by vacuum deposition or the like and to manufacture a functional film, which is a material for capacitors, magnetic tables, etc., a large amount of vapor deposition material is required for a long time. It is necessary to generate steam. For that purpose, it becomes necessary to continuously supply the vapor deposition material at a heated position such as an evaporation crucible.

When the vapor deposition material is a single metal, the purpose can be achieved by replenishing the vapor deposition material so as to supplement the evaporated amount. However, when the vapor deposition material is composed of components having different evaporation rates, for example, Co--Cr alloy which is a magnetic film material, in order to keep the film thickness and composition ratio of the alloy thin film formed on the substrate constant, it will be described below. Material supply conditions must be met.

Since Cr has a three to four times higher evaporation rate than Co, the Cr content of the target thin film is M, and the Cr content of the molten metal of the thin film material when the thin film having the content M is obtained is Y, M> Y
And M = (3-4) × Y. Further, the Cr content of the vapor generated from the liquid surface of the molten metal is equal to M.

Therefore, if the material with the Cr content M is supplied by the amount of evaporation, the thin film material with the Cr content M can be continuously deposited while keeping the amount of the molten metal of the thin film material in the crucible constant.

The important point here is to replenish the material with more components having a high evaporation rate than the molten metal.

A problem in the case of depositing an alloy material composed of components having different evaporation rates in a conventional vapor deposition source will be described with reference to FIG. 21 using a Co—Cr alloy as an example.

In FIG. 21, reference numeral 1 is a vapor deposition material housed in the crucible 2. When the vapor deposition material 1 is a refractory metal such as a Co-Cr alloy, the crucible 2 is made of ceramics such as MgO as a heat resistant material. Reference numeral 40 denotes a hearth that holds the crucible 2 so that the high temperature solution of the vapor deposition material 1 does not flow out even if the ceramic crucible 2 is damaged by heat shock or the like, and is generally made of Cu. Reference numeral 41 is a flow path formed for circulating cooling water so that the hearth does not melt.
42 is a thin-walled case that is located between the crucible 2 and the hearth 40 and holds the crucible 2, and is generally made of Cu. 43 is a screw hole provided in a collar 44 formed on the case 42. A bolt (not shown) is screwed into the screw hole 43, and the bolt is held to hold the case 42 and the crucible 2 together.
Can be easily removed from.

The vapor deposition material 1 is heated and melted by the electron beam 7A which is scanned in the arrow E direction, for example. 3 is a rod-shaped long vapor deposition material for replenishment (hereinafter abbreviated as rod), 11, 12 and 13 are rotating rollers for guiding the rod 3, and 14 is a driving roller. The motor 20 is installed in a vacuum chamber (not shown) to directly drive the drive roller 14, or is installed externally to drive the drive roller 14 via a known rotation introducer. The drive roller 14 is driven in the counterclockwise direction by the motor 20 to sandwich the bar 3 between itself and the rotating roller 11 so that the bar 3 is melted at a constant speed in the direction of arrow A onto the liquid surface 4 of the vapor deposition material 1. Transfer to. Reference numerals 15 and 16 are covers that prevent the vapor of the vapor deposition material 1 from adhering to the rollers 11, 12, 13, and 14.

Reference numeral 8 denotes a substrate such as a film, which is supported above the crucible 2 by a known roller or the like (not shown) and runs in a direction perpendicular to the plane of the drawing.

With the above configuration, the bar material 3 is replenished so as to make up the amount of the vapor deposition material 1 in the crucible 2 reduced by evaporation in order to form the thin film 9 having a constant film thickness and a constant composition ratio on the substrate 8 for a long time. To be done.

As shown in FIG. 22, when the tip 5 of the rod 3 comes into contact with the liquid surface 4, the tip 5 absorbs heat from the liquid surface 4 and starts melting, and the solution 6
And dissolves in the solution of the vapor deposition material 1. At this time, a part 6A of the solution 6 flows into the evaporation region Ea where the liquid surface 4 is heated to a high temperature by the irradiation of the electron beam 7A. Since the solution 6 contains a large amount of a component (Cr) having a high evaporation rate, rapid evaporation occurs. The rapid evaporation induces the droplets to fly.

Droplet scattering also occurs due to the factors described below.

An oxide film is usually formed on the surface of the rod 3,
In addition, impurities such as oxides may be attached. In addition, the rod 3 may contain an oxide mixed therein during the manufacturing process. As shown in FIG. 23, when such a rod 3 is supplied to the liquid surface 4, the oxide has a high melting point and has a specific gravity smaller than that of the solution of the vapor deposition material 1, so that it floats above the liquid surface 4. It becomes a thing 3A and drifts. This suspended matter 3A is the evaporation area Ea.
When the electron beam 7A flows in and is irradiated with the electron beam 7A, it has a high melting point and thus is not easily evaporated and is heated to a very high temperature. Then, in the portion of the liquid surface 4 that comes into contact with the suspended matter 3A heated to this high temperature, abrupt evaporation occurs in the same manner as described above, causing the scattering of droplets.

The droplets are called splash, and adhere to the substrate to become protrusion foreign matter. When a magnetic film is formed on a substrate to create a magnetic recording medium, if a splash occurs and a protruding foreign substance occurs, the magnetic head rides on the protruding foreign substance during recording and reproduction, and the gap between the magnetic head and the magnetic recording medium increases. However, there was a serious problem that normal recording and playback could not be performed.

Therefore, the present inventor proposed in Japanese Patent Application No. 1-118975 and Japanese Patent Application No. 1-309681 a vapor deposition source that prevents the above-mentioned rapid evaporation and does not generate a splash.

As described in Japanese Patent Application No. 1-118975, as shown in FIG. 24, a supply region to which a supplementary vapor deposition material (bar material 3) is supplied.
A partition member 25 is fixedly provided to the crucible 2 between the Sa and the evaporation area Ea.

Incidentally, in FIG. 24, the same components as those in FIG. 21 are shown by the same numbers.

When the vapor deposition material 1 is a refractory metal such as a Co—Cr alloy, a ceramic such as MgO is used for the partition member 25 as in the crucible 2.

With the above configuration, the solution 6 of the rod 3 does not directly flow into the liquid surface 4 of the evaporation area Ea, but diffuses from the supply area Sa to the evaporation area Ea through the gap C between the partition member 25 and the bottom surface of the crucible 2.
After the concentration is diluted, it reaches the liquid surface 4 in the evaporation area Ea, so that the rapid evaporation as described above does not occur. Also,
Since the suspended matter 3A is blocked by the partition member 25 and does not flow into the evaporation region Ea, the rapid evaporation as described above does not occur. Therefore, the generation of splash can be prevented.

However, even in this prior art, improvement is desired in the following two points.

The first point is that when the ingot of vapor deposition material 1 (usually a columnar or rectangular parallelepiped) is put in a crucible and the ingot is irradiated with an electron beam to dissolve the ingot, the moment when the solution melted from the ingot comes into contact with the partition member. The ceramic partition member may be cracked by heat shock.

The second point is that when the vapor deposition is completed and the electron beam is turned off, the vapor deposition material begins to solidify, but the contracting force at the time of solidification may damage the partition member and prevent reuse.

The first point can be solved by incorporating a heater into the partitioning member to preheat the partitioning member although the structure becomes complicated, but regarding the second point, there is no effective improvement plan.

The one described in Japanese Patent Application No. 1-309681 was invented in order to solve the above-mentioned problems in the prior art, and the same constituent elements as those in FIG. 24 are shown in FIG. 25 with the same reference numerals.

In FIG. 25, like the partition member 25, 35 is a vapor deposition material introducing pipe (hereinafter abbreviated as introducing pipe) made of ceramics such as MgO. Reference numerals 31, 32, and 33 denote rotating rollers that guide the introducing pipe 35, and 34 denotes a driving roller. Drive roller 34
Is rotated by a motor 30 provided in the same manner as the motor 20, and the introduction pipe 35 is sandwiched between the rotation roller 31 and the arrow A.
Drive in the opposite direction or vice versa.

Next, the operation will be described. After the ingot is melted, the introduction pipe 35 is driven by the motor 30 in the direction of arrow A from above the liquid surface 4 while preheating the tip 36 of the introduction pipe 35 by the radiant heat from the liquid surface 4. Therefore, when the tip 36 of the introduction pipe 35 comes into contact with the liquid surface 4, the introduction pipe 35 is not damaged by heat shock. After the tip end 36 of the introduction pipe 35 is inserted from the liquid level 4 to the predetermined depth Pf in FIG. 25, the rod 3 is sent in the direction of arrow A by the motor 20 to set the inside of the introduction pipe 35 as the supply area Sa. The bar 3 is supplied to the liquid surface 4.

Before the vapor deposition is completed and the electron beam 4A is turned off to solidify the vapor deposition material 1, the rods 3 and the introduction tube 35 are driven by the motors 20 and 30 in the direction opposite to the arrow A, and the respective tips 5 and
Pull up to a position where 36 comes off the liquid surface 4. Therefore, the introduction pipe 35 is not damaged when the vapor deposition material 1 is solidified.

By doing so, the introducing pipe 35 will play the role of the partition member 25 in Japanese Patent Application No. 1-118975.
The dissolved solution does not flow directly into the liquid surface 4 of the evaporation region Ea, and the suspended matter does not flow into the evaporation region Ea.

Therefore, it is possible to prevent the occurrence of splash without damaging the introduction pipe 35.

Problems to be Solved by the Invention However, the latter prior art also has the following problems to be improved.

The vapor generated from the liquid surface in the introduction pipe 35 adheres to the surface of the rod 3 and the inner wall of the introduction pipe 35, and the gap between the rod 3 and the introduction pipe 35 gradually becomes smaller until finally the rod 3 and the introduction pipe 35. Since 35 adheres, there is a problem that the material cannot be supplied for a long time.

Therefore, the present invention does not generate a splash or damage the member partitioning the evaporation region and the supply region,
We provide a vacuum evaporation source that can reinforce materials for a long time,
Another object of the present invention is to provide an inexpensive magnetic recording medium which has few protrusion foreign matter defects deposited with high productivity by using this vacuum deposition source.

Means for Solving the Problems And, in order to solve the above problems, the invention according to claim 1 is a crucible for containing a vapor deposition material, an electron gun for heating, melting and evaporating a vapor deposition material in a crucible, and the molten vapor deposition. A means for supplying a replenishment evaporation material to the liquid surface of the material solution, an evaporation region of the crucible irradiated with an electron beam by the electron gun, and a liquid surface between the supply region to which the replenishment evaporation material is supplied. A partition member supported by a support member so that it can be inserted and removed,
The partition member, which is inserted into and removed from the liquid surface via a support member, is driven so that the upper surface of the partition member inserted into the liquid surface projects at least from the liquid surface, and the lower surface supplies the evaporation region between the bottom surface and the crucible bottom surface. It is a vacuum evaporation source provided with a gap through which the solution in the region flows.

A ninth aspect of the present invention is a magnetic recording medium obtained by vapor-depositing a magnetic film containing Co and Cr as main components on a substrate by the vacuum vapor deposition source according to the first aspect.

According to the invention described in claim 1, with the above-described structure, the occurrence of splash and the damage of the partition member are prevented, and furthermore, the partition member and the vapor deposition material for reinforcement are sufficiently separated from each other to prevent them from sticking to each other. It is possible to supply the material over time. Therefore, it is possible to vapor-deposit a thin film having no projection foreign matter due to splash with high productivity.

As described above, the invention according to claim 9 can realize an inexpensive magnetic recording medium free from projection foreign matter due to splash and high in productivity.

Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings. The same components as those of the conventional example are indicated by the same numbers as those of the conventional example. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is a sectional view taken along the line K-Ka in FIG.

In FIG. 1, 70 is an electron gun equipped with a known deflecting means for generating an electron beam 7A and scanning the electron beam 7A as required.

In FIG. 1 and FIG. 2, 50 is a partition member made of ceramics such as MgO similar to the above, and both ends 5 thereof.
1, 52 are inserted into and supported by the square holes 53H, 54H at the tips of the levers 53, 54. Both ends 51, 52 can be easily bent into the square holes 53H, 5 by bending the levers 53, 54 in the directions of arrows B and Ba.
Can be inserted in 4H. 55 and 56 are shafts, which are erected on the hearth 40 and rotatably support the levers 53 and 54. 57 is a T-shaped lever, and a screw 58 is further fixed to the levers 53 and 54. Reference numeral 59 is a motor, which is attached to a racket 61 fixed to the hearth 40 with screws 60. A pinion 62 is fixed to the shaft 63 of the motor 59 and meshes with the rack 64.
Reference numeral 65 is a backup roller, which is rotatably supported by a shaft 66 erected on the placket 61 and abuts against the rack 64 so that the rack
The engagement between 64 and the pinion 62 is maintained. 67 is a shaft, which is erected on the rack 64 and is rotatably engaged with the T-shaped lever 57.

 Next, the operation will be described.

FIG. 3 is a view showing the initial state of the vacuum vapor deposition source of the above embodiment. In the initial state, the rack 64 is located below the position shown in FIG. Therefore, the lever 57 is located in a position rotated counterclockwise about the shafts 55 and 56 from FIG. 2, and the partition member 50 is located above that in FIG.
At this time, the angle α formed by the line connecting the shafts 63 and 66 and the axis of the rack 64 deviates from 90 °, and the rack 64 acts to widen the gap between the shafts 63 and 66. Δ
Since G is extremely small, if the interval between the shafts 63 and 66 is set to be wide by ΔG in advance, it is possible to operate the elements satisfactorily without generating a large force.

At this time, the tip 5 of the bar 3 is also in a position retracted upward from FIG.

Reference numeral 21 is a known shutter provided between the crucible 2 and the substrate 8.

When the partition member 50 and the bar 3 are in the state shown in FIG. 3, the electron beam 7A is applied to the ingot-shaped vapor deposition material 1A housed in the crucible 2 and melted as shown in FIG. The electron beam 7A is not emitted to the ingot-shaped vapor deposition material 1B, but the solution 1C dissolved from the ingot-shaped vapor deposition material 1A
It is melted by heat transfer from. Then, the ingot-shaped vapor deposition materials 1A and 1B are melted together to form a solution of the vapor deposition material 1 shown in FIG.

In this melting process, since the partition member 50 is located above the liquid surface 4, the ingot-shaped vapor deposition materials 1A, 1
The solution 1C dissolved from B does not contact the partition member 50 and damage the partition member 50 due to heat shock. Further, since the substrate 8 is shielded from the crucible 2 by the shutter 21, the vapor evaporated from the vapor deposition material 1 does not adhere to the substrate 8 to form an unnecessary film during the melting process.

Next, the motor 59 is driven to rotate the pinion 62 counterclockwise to move the partition member 50 through the rack 64 and the lever 57.
To the liquid surface 4 of the vapor deposition material 1. The descending speed is set to a speed at which the partition member 50 is sufficiently preheated by the radiant heat from the liquid surface 4 (this speed is V1). Therefore, when the partition member 50 comes into contact with the liquid surface 4, the partition member 50 is heat-shocked. It will not be damaged. After the partition member 50 contacts the liquid surface 4, the motor 59 is further moved to a predetermined depth shown in FIG.
Drive to lower. After the partition member 50 comes into contact with the liquid surface 4, there is no support even if the partition member 50 is lowered at a speed higher than V1, and by doing so, time can be saved.

Next, the rod material 3 is driven by the motor 20 in the direction of arrow A to replenish the vapor deposition material, the shutter 21 is opened, and vapor deposition is performed on the substrate 8.

Similar to the partition member 25 of FIG. 24, the partition member 50 prevents the solution 6 of the rod 3 from directly flowing into the evaporation area Ea and the suspended matter 3A from flowing into the evaporation area Ea, so that a splash is generated. Can be prevented.

After the vapor deposition is completed, the motor 59 is driven to rotate the pinion 62 in the clockwise direction to drive the partition member 50 upward via the rack 64 and the lever 57, and as shown in FIG. The partition member 50 is separated from the liquid surface 4.

At this time, as shown in FIG. 5, between the inner surface 2A above the liquid surface 4 of the crucible 2 and the fitting surface 50A of the partition member 50 loosely fitted to the inner surface 2A, the vapor evaporated from the liquid surface 4 is generated. Adhere to. If the attached vapor is liquefied, the partition member 50 can be driven upward without any problem. However, the inner surface 2A of the crucible 2
When the temperature is low, the vapor is solidified and the partition member 50 is fixed to the inner surface 2A of the crucible, so that the partition member 50 cannot be driven upward.

In such a case, the motor 59 applies an upward driving force to the partition member 50, and the electron beam 7A is scanned along the partition member 50 in the direction of arrow F as shown in FIG. The partition surface 50 is driven upward by irradiating the liquid surface 4A near the fitting surface 50A with the electron beam 7A, heating the liquid surface 4A to a high temperature, and melting the vapor 1D which is solidified by heat conduction from the liquid surface 4A. You will be able to do things.

If the electron beam 7A is turned off after the partition member 50 is driven upward to separate it from the liquid surface 4, the partition member 50 will not be damaged when the vapor deposition material 1 is solidified.
50 can be reused.

Next, a method of setting the clearance C between the partition member 50 and the crucible 2 in FIG. 2 will be described. If the gap C is too small, heat is less likely to be transferred from the evaporation region Ea to the supply region Sa through the gap C, so that the temperature of the supply region Sa decreases and the rod 3 does not melt well, and the tip 5 of the rod 3 is The partition member 50 will be damaged by hitting the partition member 50. Conversely, the gap C
When is too large, the Cr concentration of the solution 6 of the rod 3 flows into the evaporation region Ea before being sufficiently diluted, so that the splash preventing effect becomes small. To prevent splash,
When the height of the liquid surface 4 is H, C / H is preferably at least 9/10 or less, and if possible, 4/5 or less.

When C / H is set to a desired value, the temperature of the supply area Sa becomes low, and if the bar 3 does not melt well, the hearth 40
The cooling water passage 41A formed in the vicinity of the supply area Sa is eliminated, and the outer surface of the crucible 2 near the supply area Sa is insulated more than that of the evaporation area Ea.
41A should be thin.

Alternatively, although not shown, a heat insulating material may be provided between the case 42 and the outer surface of the crucible 2 near the supply area Sa.

When the melting point of the bar 3 is low, the heat of fusion is small, and the like, the tip 5 of the bar 3 melts at a speed faster than the supply speed in the direction of arrow A, contrary to the above. The behavior of the tip 5 of the bar 3 in this case will be described with reference to FIGS. 7, 8 and 9 and 10.

FIG. 7 is a view at the moment when the tip 5 of the bar 3 comes into contact with the liquid surface 4, and this moment is referred to as a state a. In this state a, the tip 5 absorbs heat from the liquid surface 4 and starts melting, and becomes a solution 6, which melts into the solution of the vapor deposition material 1 as indicated by the arrow R in the state b shown in FIG. At this time, heat is transferred to the tip 5 in the direction opposite to the arrow R and the melting of the tip 5 proceeds. As the melting progresses, the distance g between the liquid surface 4 and the tip 5 of the bar 3 becomes longer, so that the heat from the liquid surface 4 is less likely to be transferred to the tip 5, and the amount of melting of the tip 5 as in state c in FIG. The amount of the solution 6 decreases and the amount of the solution 6 decreases. Then, the tip 5 becomes more difficult to melt and finally
Melting stops as in state d in FIG.

During this time, the bar 3 is continuously fed in the direction of the arrow A, but the melting speed of the tip 5 from the state a to the state d is faster than the speed thereof, so that a gap D occurs as in the state d. . Since the bar 3 is continuously fed, the clearance D becomes smaller as time passes and finally the state becomes the state a, and the above cycle is repeated. That is, even if the bar 3 is continuously fed, the bar 3 is supplied to the liquid surface 4 intermittently.

While the tip 5 is melting in the liquid surface, heat is taken from the liquid surface 4, so that the temperature of the liquid surface 4 in the supply area Sa decreases. The temperature decrease is transmitted to the evaporation area Ea through the gap C, and the evaporation area Ea
And lowers the temperature of the liquid surface 4.

Then, the evaporation rate decreases, and the evaporation rate changes from the state a to the state d with the lapse of time as shown in FIG.
It will fluctuate with the change of. The distance D in the state d increases as the rod 3 becomes thicker. The reason is that when the solution 6 is formed into a substantially cylindrical shape, the thicker the cylindrical shape, the smaller the ratio of the surface area / cylinder volume of the cylindrical shape becomes. Therefore, the amount of heat transferred from the liquid surface 4 to the tip 5 through the solution 6 from the cylindrical surface This is because the proportion of the amount of heat that escapes due to radiation decreases and the material melts longer. Therefore, as the bar becomes thicker, both the period T _L and the fluctuation range H _{L of the} evaporation rate in FIG. 11 increase.

At this time, the bar material 3 having a Cr concentration higher than that of the vapor deposition material 1
Becomes a solution 6 and intermittently dissolves in the liquid surface 4 of the supply area Sa. Intermittent changes in the Cr concentration in the supply area Sa are transmitted to the evaporation area Ea through the gap C, and the Cr content of the vapor evaporated from the evaporation area Ea is increased.
The concentration changes periodically like the evaporation rate shown in FIG.

When the evaporation rate and the Cr concentration in the vapor fluctuate, the film thickness and the composition ratio in the passage direction are set when vapor deposition is performed while moving the substrate 8 of the film or the like above the crucible 2 in the direction perpendicular to the drawing. Fluctuates.

If intermittent melting as described above occurs, use the above C /
If H is decreased and the temperature of the supply area Sa is lowered to an appropriate temperature, the speed at which the bar 3 is supplied becomes substantially equal to the speed at which the bar 3 comes into contact with the liquid surface 4 and melts. It is possible to realize continuous supply while maintaining the state in which the tip 5 and the liquid surface 4 are connected by the solution 6, that is, the state between the state b and the state c.

Next, regarding the value of the protrusion height Hg from the liquid surface 4 of the partition member 50 in FIG. 5, FIG. 12, FIG. 13, FIG. 14, FIG.
This will be described with reference to FIG.

In FIG. 12, 1E is vapor deposited from the liquid surface 4 and attached to the inner surface 2A of the crucible 2 and the side surface 50A of the partition member 50. If the temperature of the surface to which this steam 1E adheres is high, steam
1E becomes a droplet and becomes solid when the temperature is low. As shown in FIG. 13, the amount of the attached vapor 1E increases with the passage of time, and when it is a droplet, when it reaches the limit, it falls on the liquid surface 4 due to gravity. If it is a solid, contact surface 1Ec with liquid level 4 if it reaches the limit as shown in Fig. 14
Is melted and melted by heat conduction from the liquid surface 4 in the same manner as in the case where the bar 3 comes into contact with the liquid surface 4 and melts in the order shown in FIGS. 15 and 16, and most of the attached vapor 1E is on the liquid surface. Melt to 4.

When the above phenomenon occurs, the attached vapor IE contains more Cr than the vapor deposition material 1, so the Cr content of the liquid level 4 increases, and the Cr content of the vapor generated from the liquid level 4 increases accordingly. Therefore, the Cr content of the film 9 also increases, and the composition ratio of the film 9 changes. In order to reduce this fluctuation, the height Hc from the liquid surface 4 to the upper end surface 2B of the crucible 2 and the protruding height Hg of the partition member 50 from the liquid surface 4 shown in FIGS. Therefore, the amount of the attached vapor 1E may be reduced. Therefore
If Hc is lowered to the limit at which the vapor deposition material 1 does not spill out of the crucible 2 and Hg is made to be substantially the same as Hc, the fluctuation of the composition ratio due to the above phenomenon can be minimized. In the vicinity of the inner surface 2A of the crucible of the partition member 50, it is unavoidable that Hg becomes high due to the structure, but since the length Wg is smaller than the total length Wa, the influence on the composition ratio fluctuation is small.

By configuring the vapor deposition source as described above, it is possible to prevent the occurrence of splash and damage to the partition member, and also to prevent the partition member and the replenishment vapor deposition material from being sufficiently separated from each other to prevent them from sticking to each other for a long time. It is possible to supply materials throughout. Therefore, it is possible to vapor-deposit a thin film having no projection foreign matter due to splash with high productivity.

Further, by using the vapor deposition source having the above structure, a magnetic film can be vapor-deposited with high productivity without protrusions due to splash, and thus an inexpensive vapor recording medium can be realized.

 Next, a second embodiment of the present invention will be described.

17 and 18 are views showing a second embodiment of the present invention,
The same components as those in FIGS. 1 and 2 are designated by the same reference numerals.

The feature of this configuration is that the central portion of the partition member 50 is an annular member 50.
It is in C. In this configuration, the supply area Sa
Is an area inside the annular member 50C, so that FIG.
It is not necessary to form the supply area Sa by closing the liquid surface 4 with the partition member 50 and the crucible 2 as in the configuration of FIG. Therefore, since it is not necessary to loosely fit the partition member 50 and the crucible 2 to each other, it is possible to prevent the steam from adhering to the loose fitting portion and being fixed to the partition member 50 or the crucible 2 as described above. It can be driven upward and separated from the liquid surface 4.

Also in this configuration, if the temperature of the supply area Sa becomes low and the bar 3 does not melt well, the outer surface of the crucible 2 near the supply area Sa is insulated from the outer surface of the evaporation area Ea in the same manner as described above. It should be in a state where it has been.

FIG. 19 is a diagram showing a third embodiment of the present invention, in which the same components as those in FIGS. 1 and 2 are designated by the same reference numerals.

Since the liquid surface 4 of the supply area Sa is not directly irradiated with the electron beam 7A, the temperature of the liquid surface 4 is low. Therefore, the liquid level 4
From the supply area Sa
Since the Cr concentration is high, the Cr concentration on the right side of the film 9 formed on the substrate 8 in FIG. 19 tends to be high. If this becomes a problem, a shielding plate 80 is provided between the supply area Sa and the substrate 8 as shown in FIG.
It should be made difficult to adhere to.

FIG. 20 is a diagram showing a fourth embodiment of the present invention, in which the same components as in FIG. 19 are designated by the same reference numerals.

In the configuration of FIGS. 1 and 2, the liquid level 4 in the supply area Sa
If the temperature of 3 does not become too high with respect to the melting point of the bar 3, as described above, the bar 3 will not melt well, and the tip 5 of the bar 3 will hit the partition member 50 and damage the partition member 50. Become. One method for preventing this is shown in FIG. In FIG. 20, 7B is an electron beam, which irradiates the tip 5 of the bar 3 to melt the tip 5 into a solution 6 which is dropped as a droplet 6B onto the liquid surface 4 of the supply area Sa. is there. In this way, the vapor deposition material can be easily replenished even under the above-mentioned conditions, which is an effective method in the case of a high melting point material.

Although the vapor deposition material for reinforcement has been described as a bar material in all of the above,
The material is not limited to the rod material, and may have other shapes such as a wire shape and a granular shape.

EFFECTS OF THE INVENTION As described above, according to the present invention, it is possible to realize a vacuum vapor deposition source that can reinforce materials for a long time without causing a splash or damaging a member that separates an evaporation region and a supply region. By using a vacuum evaporation source, it is possible to provide an inexpensive magnetic recording medium with few protrusion foreign matter defects with high productivity, which has a great industrial effect.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic structure of a vacuum vapor deposition source in a first embodiment of the present invention, FIG. 2 is a vertical sectional view taken along the line K-Ka in FIG. 1, and FIG. 3 is a line taken along the line K-Ka in FIG. Operation explanatory drawing shown using a longitudinal sectional view, FIG. 4 is an explanatory drawing of the initial state of ingot melting in the K-Ka longitudinal section of FIG. 1, and FIG. 5 is an L-La longitudinal sectional view of FIG. The figure is a motion explanatory view shown in a perspective view, FIG. 7, FIG. 8, FIG. 9 and FIG.
FIG. 11 is an evaporation rate fluctuation diagram, FIG. 12, FIG. 13, FIG.
FIGS. 15 and 16 are enlarged views of the main parts of FIG. 2, FIG. 17 is a perspective view showing a second embodiment of the present invention, and FIG. FIG. 19 is a vertical sectional view showing a third embodiment of the present invention, FIG. 20 is a vertical sectional view showing a fourth embodiment of the present invention, FIG. 21 is a vertical sectional view of a conventional vapor deposition source, and FIG. FIG. 23 is an enlarged view of an essential part of FIG. 21, and FIGS. 24 and 25 are vertical sectional views showing prior art by the applicant. 1 ... Evaporation material, 2 ... Crucible, 3 ... Rod, 4 ... Liquid level, 7A ... Electron beam, 8 ... Substrate, 9 ... Thin film, 14 ...
… Drive roller, 20, 59 …… Motor, 50 …… Partition member, 5
3, 54 …… Lever, 55, 56, 67 …… Shaft, 57 …… T-shaped lever, 62 …… Pinion, 65 …… Backup roller, 70
…… Electron gun, Ea …… Evaporation area, Sa …… Supply area, C ……
A gap between the partition member 50 and the bottom of the crucible 2.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kayoko Kodama 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 57-169088 (JP, A) JP 60- 116769 (JP, A) JP 64-21072 (JP, A) JP 2-23525 (JP, A)

Claims (9)

(57) [Claims] 1. A crucible for containing a vapor deposition material, an electron gun for melting and vaporizing the vapor deposition material in the crucible, a means for supplying a replenishment vapor deposition material to a liquid surface of a solution of the melted vapor deposition material, and the electron. A partition member supported by a support member so that it can be inserted into and removed from a liquid surface between an evaporation region of the crucible irradiated with an electron beam by a gun and a supply region to which a replenishment vapor deposition material is supplied, and the support member. Drive means for inserting / removing the partition member to / from the liquid surface via the upper surface of the partition member inserted in the liquid surface at least protruding from the liquid surface, and the lower surface between the bottom surface of the crucible and the evaporation area. And a vacuum evaporation source provided with a gap through which the melt of the supply region flows. 2. The vacuum vapor deposition source according to claim 1, wherein the supply region is a region surrounded by the partition member and the inner surface of the crucible. 3. The vacuum vapor deposition source according to claim 1, wherein the supply region is a region surrounded by the inner surface of the annular partition member. 4. The vacuum vapor deposition according to claim 1, 2 or 3, wherein the height of protrusion of the partition member from the liquid surface is substantially the same as the height from the liquid surface to the upper end surface of the crucible except for the vicinity of the inner surface of the crucible. source. 5. The partition member is brought to a temperature at which the partition member is not thermally damaged even when the partition member is immersed in the solution while the partition member is lowered from above the solution surface in the crucible toward the liquid surface. The vacuum deposition source according to claim 1, 2 or 3, wherein the partition member is driven by the driving means at a descending speed such that the member is preheated by the heat of the solution. 6. A speed for supplying a replenishment vapor deposition material to a liquid surface,
The clearance between the lower surface of the partition member inserted in the liquid surface and the bottom of the crucible is set so that the speed at which the replenishment vapor deposition material comes into contact with the liquid surface and melts is substantially equal.
The vacuum vapor deposition source according to 2 or 3. 7. The driving means is a driving means having a means for applying an upward driving force to the partition member after vapor deposition, and the liquid near the fitting surface of the partition member loosely fitted to the inner surface of the crucible. An electron gun having a deflecting means for irradiating the surface with an electron beam, and by irradiating the electron beam from the electron gun, an individualized product of the vapor deposition material for fixing the partition member and the inner surface of the crucible in the vicinity of the loose fitting portion. The vacuum vapor deposition source according to claim 1 or 2, which is formed by melting and driving the partition member by the upward driving force of the driving means and pulling it up to a position where it is separated from the liquid surface. 8. The vacuum vapor deposition source according to claim 2, wherein an outer surface of the crucible near the supply region is a crucible that is more thermally insulated than that near the evaporation region. 9. A magnetic recording medium obtained by vapor-depositing a magnetic film containing Co and Cr as main components on a substrate by the vacuum vapor deposition source according to claim 1.