JP2517469B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JP2517469B2 JP2517469B2 JP2274497A JP27449790A JP2517469B2 JP 2517469 B2 JP2517469 B2 JP 2517469B2 JP 2274497 A JP2274497 A JP 2274497A JP 27449790 A JP27449790 A JP 27449790A JP 2517469 B2 JP2517469 B2 JP 2517469B2
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- strip
- solder
- preventing
- droplet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 10
- 239000002184 metal Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 230000003405 preventing effect Effects 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000003779 heat-resistant material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
Description
【発明の詳細な説明】 （イ） 産業上の利用分野 本発明は、金属板と被付着体とを半田液により固定す
る半田付方法の改善に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an improvement in a soldering method for fixing a metal plate and an adherend with a solder liquid.
（ロ） 従来の技術 従来、噴流式半田付着を防止する技術として、例え
ば、特公昭63−15063号（B23K 1/08）に開示されている
ような技術がある。(B) Conventional Technology Conventionally, as a technology for preventing the jet-type solder adhesion, for example, there is a technology disclosed in Japanese Patent Publication No. 63-15063 (B23K 1/08).
また、例えば、第４図に於て、錫メッキ等を施した金
属板を方形に折曲げて形成した筒状体の金属フレーム
（１）の内側に、丁度挿入可能な形状となっているプリ
ント基板等の被付着体（２）が挿入されている。プリン
ト基板（２）の外周辺は半田レジストを塗布した銅箔が
存在するが、四隅および各辺の略中央部等、接合する部
分は半田レジストが塗布されておらず、銅箔が露出して
いる。金属フレーム（１）とプリント基板（２）を半田
付固定するには浸漬、噴流、噴霧等多くの方式が存在す
るが、ここでは噴流による一実施例について述べる。Further, for example, in FIG. 4, a print which is just insertable inside a metal frame (1) which is a tubular body formed by bending a tin-plated metal plate into a rectangular shape. An adherend (2) such as a substrate is inserted. There is a copper foil coated with solder resist on the outer periphery of the printed circuit board (2), but the solder resist is not coated on the joining portions such as the four corners and the substantially central portion of each side, and the copper foil is exposed. There is. There are many methods such as dipping, jetting, and spraying for fixing the metal frame (1) and the printed circuit board (2) by soldering. Here, an embodiment using jetting will be described.
第５図に於て噴流半田槽（３）は、半田液（４）が底
部に設けられたポンプの噴出等（図示略）により略一定
の高さに噴流され、噴流半田面（４′）を形成してい
る。プリント基板（２）を挿入した金属フレーム（１）
は、ガイドレール（５）上をローラー（６）（６′）に
よって移動するキャリア（７）内に位置決めガイド
（８）（８′）で固定されている。キャリア（７）内に
は半田の付着し難く且つ耐熱性素材であるテフロン等で
コーティングされたステンレス線（９）（９′）が固定
されており、噴流半田面（４′）に対して第６図（ａ）
に示す様に数mm程度浸漬させることで金属フレーム
（１）とプリント基板（２）の銅箔（10）を半田付固定
（11）する。噴流半田面（４′）より、キャリア（７）
内の金属フレーム（１）の下端縁（1b）が離れる際［第
６図（ｂ）参照］、余剰の半田液は金属フレーム（１）
の内側面（1a）および外側面（1c）を伝って流れ、表面
張力により金属フレーム（１）の下端縁（1b）に第４図
および第６図（ｃ）に示す様なツララ状滴状体（12）
（12′）（12″）が残留する。これにより、金属フレー
ム（１）の下端縁（1b）にシールドカバー等の金属板を
取付ける際、安定な電気的接触状態が得難く、後工程に
於て該滴状体（12）（12′）（12″）の除去が必要とな
り、生産性が疎外される欠点がある。In the jet solder bath (3) shown in FIG. 5, the solder liquid (4) is jetted to a substantially constant height by jetting of a pump (not shown) provided at the bottom, and the jet solder surface (4 '). Is formed. Metal frame (1) with printed circuit board (2) inserted
Are fixed by positioning guides (8) (8 ') in a carrier (7) which moves on guide rails (5) by rollers (6) (6'). Fixed in the carrier (7) are stainless wires (9) (9 ') coated with Teflon, which is a heat-resistant material that does not allow solder to adhere easily, and are fixed to the jet solder surface (4'). 6 (a)
As shown in FIG. 6, the metal frame (1) and the copper foil (10) of the printed circuit board (2) are fixed by soldering (11) by immersing them for several mm. From the jet solder surface (4 '), the carrier (7)
When the lower edge (1b) of the inner metal frame (1) separates [see FIG. 6 (b)], excess solder liquid is removed from the metal frame (1).
Flowing along the inner side surface (1a) and outer side surface (1c) of the metal frame (1) due to surface tension, and the icy droplets are formed on the lower edge (1b) of the metal frame (1) as shown in FIGS. 4 and 6 (c). Body (12)
(12 ') and (12 ") remain, which makes it difficult to obtain a stable electrical contact state when attaching a metal plate such as a shield cover to the lower edge (1b) of the metal frame (1), making it difficult to use in the subsequent process. In this case, it is necessary to remove the droplets (12), (12 '), (12 "), and there is a drawback that productivity is reduced.
（ハ） 発明が解決しようとする課題 本発明は、上記欠点を改善するためになされたもの
で、金属板の端面にツララ状滴状体が形成されるものを
防止することを目的ものである。(C) Problems to be Solved by the Invention The present invention has been made in order to improve the above-mentioned drawbacks, and an object thereof is to prevent formation of icicle-shaped droplets on the end surface of a metal plate. .
（ニ） 課題を解決するための手段 本発明は、金属板の下端縁或は該下端縁に隣接する他
側面に、半田液のツララ状滴状体の形成を防止するため
の滴状体防止用細片を当接することを特徴とするもので
ある。(D) Means for Solving the Problems The present invention is directed to preventing droplet bodies for preventing the formation of icy droplets of a solder solution on the lower edge of a metal plate or on the other side surface adjacent to the lower edge. It is characterized by abutting a strip for use.
（ホ） 作用 本発明による半田付方法では、浸漬、噴流、噴霧等の
方法により半田付を行う際、余剰の半田液は金属板端面
に留まらず、当接した滴状体防止用細片の下面に滴状体
が形成され、金属板には滴状体が形成されないことにな
る。(E) Function In the soldering method according to the present invention, when soldering is performed by a method such as dipping, jetting or spraying, excess solder liquid does not remain on the end surface of the metal plate, The droplets are formed on the lower surface, and the droplets are not formed on the metal plate.
（ヘ） 実施例 以下、本発明の一実施例を図面に基づいて説明する。
第１図に於て、金属板を方形且つ筒状等に、加工した金
属フレーム（１）の内側に、丁度挿入可能な形状となっ
ているプリント基板等の被付着体（２）を挿入し、金属
フレーム（１）の下端縁（1b）全体に滴状体防止用細片
（13a）（13b）（13c）（13d）が第２図（ａ）の様に当
接されている。滴状体防止用細片（13a）（13b）（13
c）（13d）は第５図で示されるキャリア（７）内に固定
されたステンレス線（９）（９′）にバインド等（14）
（14′）によって固定されるている。(F) Example Hereinafter, one example of the present invention will be described with reference to the drawings.
In FIG. 1, a metal plate is formed into a square and cylindrical shape, and an adherend (2) such as a printed circuit board, which has a shape that can be inserted, is inserted inside a processed metal frame (1). As shown in FIG. 2 (a), strips (13a) (13b) (13c) (13d) for preventing droplets are in contact with the entire lower edge (1b) of the metal frame (1). Droplet prevention strips (13a) (13b) (13
c) (13d) binds to the stainless wire (9) (9 ') fixed in the carrier (7) shown in Fig. 5 (14)
It is fixed by (14 ').
浸漬、噴流、噴霧等の方法により、金属フレーム
（１）とプリント基板（２）の接触部を半田付固定（1
1）する際、余剰半田液は金属フレーム（１）の内側面
（1a）を流れ落ちるが、下端縁（1b）には留まらず、当
接した滴状体防止用細片（13a）（13b）（13c）（13d）
に沿って流れ、第３図（ａ）の様に細片（13a）の下端
に半田の滴状体（12）が形成され金属フレーム（１）に
は滴状体が形成されない。The contact part between the metal frame (1) and the printed circuit board (2) is fixed by soldering (1) by dipping, jetting, spraying, etc.
At the time of 1), the excess solder liquid flows down on the inner surface (1a) of the metal frame (1), but does not stay on the lower end edge (1b), and the abutting droplet-preventing strips (13a) (13b). (13c) (13d)
As shown in FIG. 3 (a), the droplets (12) of solder are formed on the lower end of the strip (13a) and the droplets are not formed on the metal frame (1).
滴状体防止用細片（13a）（13b）（13c）（13d）とし
ては半田の付着し難いテフロンやセラミック等の耐熱素
材を単体あるいはコーティング等を施して用いると、第
３図（ｂ）に示す様に細片（13a）自身にも滴状体（1
2）が付着することを防止できる。As the strips (13a), (13b), (13c), and (13d) for preventing droplets, a heat-resistant material such as Teflon or ceramic, which does not easily attach solder, is used alone or after being coated. As shown in, the strip (13a) itself also has droplets (1
2) can be prevented from adhering.
また、第２図（ａ）の様に金属フレーム（１）の下端
縁（1b）に滴状体防止用細片（13a）を当接するのに対
して第２図（ｂ）の様に金属フレーム（１）の外側面
（1c）に細片（13a）を当接した場合、余剰の半田液は
金属フレーム（１）より細片（13a）に移動して滴状体
を形成し、同様に金属フレーム（１）には滴状体が形成
されない。Further, as shown in FIG. 2 (a), the droplet-preventing strips (13a) are brought into contact with the lower end edge (1b) of the metal frame (1), while the metal as shown in FIG. 2 (b). When the strip (13a) is brought into contact with the outer surface (1c) of the frame (1), excess solder liquid moves from the metal frame (1) to the strip (13a) to form a droplet, and In addition, no droplets are formed on the metal frame (1).
滴状体防止用細片（13a）の形状は断面が円形の棒材
をスポット溶接して製作したものについて例示したが、
特に限定されるものではなく、他の形状とすることがで
きる。例えば第２図（ｃ）の様に方形の細片（13a）の
右隅に金属フレーム（１）の形状と丁度嵌合する形状の
切欠部（15）を設けておき、金属フレーム（１）の下端
縁（1b）と外側面（1c）の両方に当接させる方法やその
他平板をエッチング処理やレーザ加工等で製作したもの
を用いる方法等がある。The shape of the drip-preventing strip (13a) is exemplified by one manufactured by spot welding a rod having a circular cross section.
The shape is not particularly limited, and other shapes can be used. For example, as shown in FIG. 2 (c), a rectangular strip (13a) is provided at the right corner with a notch (15) having a shape that exactly fits the shape of the metal frame (1). There is a method of contacting both the lower end edge (1b) and the outer side surface (1c), and a method of using a flat plate manufactured by etching or laser processing.
なお第２図（ｂ）及び第２図（ｃ）の様に滴状体防止
用細片（13a）が金属フレーム（１）の外側面（1c）に
当接している場合は、金属フレーム（１）の位置決めも
同時に行うことができ、第５図の位置決めガイド（８）
（８′）を省略することができる。As shown in FIGS. 2 (b) and 2 (c), when the droplet preventing strip (13a) is in contact with the outer surface (1c) of the metal frame (1), the metal frame ( Positioning of 1) can be performed at the same time, and the positioning guide (8) of FIG.
(8 ') can be omitted.
（ト） 発明の効果 上記の様に本発明による半田付方法によれば、金属板
に余剰半田によるツララ状滴状体が形成されるのが防止
されるので、従来の如く後工程により滴状体の除去を行
う必要がなく、生産性が向上する効果がある。(G) Effect of the Invention As described above, according to the soldering method of the present invention, it is possible to prevent the formation of the icy droplets due to the excess solder on the metal plate. There is no need to remove the body, which has the effect of improving productivity.
第１図は本発明の一実施例を示す斜視図、第２図（ａ）
は第１図の（Ａ−Ａ′）から見た要部断面図、第２図
（ｂ）および（ｃ）はそれぞれ滴状体防止用細片の位置
および形状を変えた実施例を示す要部一部断面図、第３
図は滴状体防止用細片による滴状体付着防止作用を示す
断面図、第４図、第５図および第６図は従来の技術に於
ける半田液の滴状体の発生状態を示す斜視図及び断面図
である。 １……金属フレーム、1a……金属フレーム内面、1b……
金属フレーム下端縁、1c……金属フレーム外面、２……
プリント基板、３……噴流半田槽、４……半田液、４′
……噴流半田面、５……ガイドレール、6,6′……ロー
ラー、７……キャリア、8,8′……位置決めガイド、9,
9′……ステンレス線、10……銅箔パターン、11……半
田付固定、12……ツララ状滴状体半田、13a,13b,13c,13
d……滴状体防止用細片、14……バインド、15……細片
切欠部。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 (a).
Is a cross-sectional view of the main part as seen from (A-A ') in FIG. 1, and FIGS. 2 (b) and 2 (c) are views showing an embodiment in which the position and shape of the droplet-preventing strip are changed. Partial sectional view, part 3
FIG. 4 is a cross-sectional view showing the drop-like body adhesion preventing action of the drop-like body preventing strip, and FIGS. 4, 5, and 6 show the generation state of the drop-like bodies of the solder liquid in the prior art. It is a perspective view and a sectional view. 1 …… Metal frame, 1a …… Metal frame inner surface, 1b ……
Metal frame bottom edge, 1c …… Metal frame outer surface, 2 ……
Printed circuit board, 3 ... jet solder bath, 4 ... solder liquid, 4 '
...... Jet solder surface, 5 ...... guide rails, 6,6 '…… rollers, 7 …… carriers, 8,8' …… positioning guides, 9,
9 '... Stainless wire, 10 ... Copper foil pattern, 11 ... Fixed by soldering, 12 ... Soldering drop solder, 13a, 13b, 13c, 13
d …… Droplet-preventing strip, 14 …… bind, 15 …… strip cutout.
Claims (1)
ムに収納されて金属フレームの内側の一側面と半田付さ
れる被付着体とを備え、半田の付着し難い耐熱材料から
構成されると共に前記金属フレームの下端縁或は該下端
縁に隣接する側面に半田液のツララ状滴状体の形成を防
止するための滴状体防止用細片を当接した後、前記滴状
体防止用細片を当接した側より半田液に浸して前記金属
フレームと被付着体とを半田付することを特徴とする半
田付方法。1. A substantially frame-shaped metal frame, and an adherend to be soldered to one side surface of the metal frame that is housed in the metal frame and is made of a heat-resistant material that does not easily adhere to solder. At the same time, after contacting the lower end edge of the metal frame or the side surface adjacent to the lower end edge with a droplet-preventing strip for preventing the formation of the droplet-like droplets of the solder solution, the droplet-preventing droplet is prevented. A soldering method, characterized in that the metal strip and the adherend are soldered by immersing the strip in contact with a solder solution from the side where the strip is abutted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2274497A JP2517469B2 (en) | 1990-10-12 | 1990-10-12 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2274497A JP2517469B2 (en) | 1990-10-12 | 1990-10-12 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04157064A JPH04157064A (en) | 1992-05-29 |
| JP2517469B2 true JP2517469B2 (en) | 1996-07-24 |
Family
ID=17542513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2274497A Expired - Lifetime JP2517469B2 (en) | 1990-10-12 | 1990-10-12 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2517469B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49140430U (en) * | 1973-04-07 | 1974-12-03 | ||
| JPS6297763A (en) * | 1985-10-25 | 1987-05-07 | Senjiyu Kinzoku Kogyo Kk | Soldering method and device |
-
1990
- 1990-10-12 JP JP2274497A patent/JP2517469B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04157064A (en) | 1992-05-29 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |