JP2769517B2 - Manufacturing method of hybrid integrated circuit - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hybrid integrated circuit with trimming for adjusting the resistance value of a resistor.

[Prior Art] For example, as shown in FIG. 3, a circuit in which a circuit 12 and a circuit 13 are connected in series on an insulating substrate 11 is formed as a hybrid integrated circuit. The lead wire 15 connected to the input terminal pad 14 of the circuit 12 is connected to the wiring of the wiring board, and the output terminal pad 16 of the circuit 13 is mounted.
Are connected to the wiring of the wiring board and are actually used. Wiring capacitances 18, 19 of the wiring board are added to the lead wires 15, 16, respectively.

In manufacturing such a hybrid integrated circuit, the substrate 11 is placed on a stage (not shown) with the leads 15 and 17 not connected to the pads 14 and 16 respectively, as shown in FIG. , A probe card 21 is provided so that the substrate 11 is located in the opening 22 thereof, and the probe 2 attached to the probe card 21 is provided.
3, 24, 25 are brought into contact with the pads 14, 16 and the auxiliary pad 26.
The auxiliary pad 26 is formed on the substrate 11 by being connected to the connection point between the circuit 12 and the circuit 13 as shown in FIG. 5, and is used for trimming, and the lead wire is not connected. The following trimming was performed by connecting the connector section 27 of the probe card 21 to a measurement system (not shown).

(A) A signal is applied to the pad 14, the output of the auxiliary pad 26 is measured, and the DC input / output characteristic of the circuit 12 is measured. A resistor (not shown) in the circuit 12 is set so that the characteristic becomes a predetermined characteristic. Is adjusted by laser cutting or the like.

(B) A signal is applied to the auxiliary pad 26, the output of the pad 16 is measured, and the DC input / output characteristic of the circuit 13 is measured. A resistor (not shown) in the circuit 13 is set so that the characteristic becomes a predetermined characteristic. Trimming adjustment of the resistance value.

(C) A signal is applied to the pad 14, the output of the pad 16 is measured to measure the high-frequency characteristics of the circuits 12, 13 as a whole, and the resistance in the circuit 12 and / or 13 is adjusted so that the characteristics become predetermined. Trimming and adjusting body resistance.

[Problems to be Solved by the Invention] At the time of trimming shown in FIG. 4, capacitances 28, 29.31 generated in the wiring from the probe to the measurement system are present in the pads 14, 16, 26 as shown in FIG. Each is added. The input / output capacitances 28 and 29 are the capacitances 18 and 29 generated in the mounting state shown in FIG.
There is no problem corresponding to 19 respectively, but probe card 21
Since the respective trimmings (a) to (c) are performed in a state where is set, the capacity 31 which does not exist in the mounted state is added in the trimming of (c).
Correct trimming could not be performed. If the probe card is replaced at the time of trimming (c) so that only the pads 14 and 16 come into contact with the probe, the capacitance 31 is not affected, but it is necessary to prepare a plurality of probe cards. Further, there is a disadvantage that the replacement is troublesome.

[Means for Solving the Problems] A method of manufacturing a hybrid integrated circuit according to the present invention comprises forming at least a predetermined wiring pattern, a resistor, and a pad to which a lead wire is to be connected around an insulating substrate on an insulating substrate. A circuit is formed, and auxiliary pads to be contacted with the probe on the insulating substrate during trimming are formed at locations other than those where the lead wires are to be connected. The probe is contacted to perform trimming on the resistor, then the auxiliary pad is separated from the circuit, and the probe for measurement is brought into contact with a pad to which a lead wire is to be connected, to perform trimming on the resistor.

"Embodiment" FIG. 1 shows an example in which a device corresponding to the conventional device shown in FIG. 5 is produced by the method of the present invention. Although not shown in the figure, the pad 14 and the auxiliary pad are used in the state shown in FIG. 1A using a probe card as shown in FIG.
Measure the DC input / output characteristics of circuit 12 using
The resistor in the circuit 12 is trimmed, and then the DC input / output characteristics of the circuit 13 are measured using the space between the auxiliary pad 26 and the pad 16 to trim the resistor in the circuit 13. After the trimming using the auxiliary pad 26 is completed in this way, according to the present invention, as shown in FIG. 1B, the resistance line (pattern) 32 between the auxiliary pad 26 and the circuit is cut (33) and the auxiliary pad 26 is cut.
Disconnect from the circuit. This cutting may be performed using a laser used for trimming the resistor. Although not shown, the probe card keeps the probe in contact with the hybrid integrated circuit. Therefore, immediately after the separation of the auxiliary pad 26, the entire frequency characteristics can be measured by using the space between the pads 14 and 16, and the resistor in the circuit 12 and / or 13 can be trimmed. Since the auxiliary pad 26 is separated during the frequency characteristic measurement, the capacitance 31 added to the auxiliary pad 26 does not affect the measurement of the frequency characteristic, and the frequency characteristic in the almost same state as the mounted state is measured. It is possible,
Correct trimming can be performed.

In the above description, the present invention is applied to a case where function trimming is used, but the present invention can be applied to a case where other trimming is performed. For example, as shown in FIG. 2, distributed constant lines 34, 35 and 36 are formed on the insulating substrate 11, and these distributed constant lines
34, 35, 36 are connected to each other by resistors 37, 38, 39, and the auxiliary pad 41 is connected to the connection point.
The resistance value of each of the resistors 37, 38, and 39 is trimmed and adjusted using the 41, and then the auxiliary pad 41 is disconnected from the circuit at the connection section. Therefore, the auxiliary pad 41 does not affect the characteristics of the hybrid integrated circuit. Particularly in a high-frequency hybrid integrated circuit, if the auxiliary pad 41 is left, good high-frequency characteristics may not be obtained, but after trimming the auxiliary pad 41, a circuit having desired characteristics is obtained by separating the auxiliary pad 41. be able to.

Note that the trimming of the resistor is not necessarily performed after all the elements are formed and mounted on the substrate, and various elements may be formed or mounted after the trimming of the resistor.

[Effects of the Invention] As described above, according to the present invention, after trimming the resistor, the auxiliary pad used for the trimming is separated from the circuit. Trimming can be performed, or a hybrid integrated circuit having good high-frequency characteristics without being affected by the auxiliary pad can be obtained.

[Brief description of the drawings]

1 is a diagram schematically showing an embodiment of the present invention, FIG. 2 is a diagram showing another embodiment, FIG. 3 is a schematic diagram showing a hybrid integrated circuit in a mounted state, and FIG. FIG. 5 is a diagram showing the connection between the hybrid integrated circuit and the probe card for performing the operation, and FIG. 5 is a diagram showing the hybrid integrated circuit for explaining function trimming.

Claims (1)

(57) [Claims] 1. A circuit is formed by forming at least a predetermined wiring pattern, a resistor and a pad to which a lead wire is to be connected around the insulating substrate on an insulating substrate, and the lead wire is to be connected. An auxiliary pad with which a probe is to be contacted on the insulating substrate at the time of trimming is formed at a position other than the position, and the auxiliary probe and the pad to which the lead wire is to be connected are brought into contact with a measuring probe to trim the resistor. Performing a trimming process on the resistor by separating the auxiliary pad from the circuit, and bringing a measuring probe into contact with the pad to which the lead wire is to be connected.