JPS6230385B2 - - Google Patents
Info
- Publication number
- JPS6230385B2 JPS6230385B2 JP54153014A JP15301479A JPS6230385B2 JP S6230385 B2 JPS6230385 B2 JP S6230385B2 JP 54153014 A JP54153014 A JP 54153014A JP 15301479 A JP15301479 A JP 15301479A JP S6230385 B2 JPS6230385 B2 JP S6230385B2
- Authority
- JP
- Japan
- Prior art keywords
- stylus
- composite board
- adjustment
- adjustment inspection
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 claims description 18
- 238000007689 inspection Methods 0.000 claims description 15
- 241001422033 Thestylus Species 0.000 claims description 14
- 239000000284 extract Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000003321 amplification Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
本発明は、複数の回路ユニツトが形成された複
合基板を触針治具によつて調整検査する方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adjusting and inspecting a composite board on which a plurality of circuit units are formed using a stylus jig.
触針治具を用いて調整検査する方法は、現在各
回路ユニツト単体について行なわれているが、こ
の方法では製品を構成する各ユニツト間のバラツ
キにより、製品化した段階で改めて調整検査する
必要がある。 The method of adjusting and inspecting using a stylus jig is currently carried out for each individual circuit unit, but with this method, due to variations among the units that make up the product, it is necessary to perform adjustment and inspection again at the stage of commercialization. be.
一方、現在では基板への部品装着の自動化が普
及してきており、その実効を上げるために基板一
枚当りの部品点数の増加、すなわち複合基板化が
行なわれる。また、基板の板取率向上の点からも
基板の集合化複合化が行なわれる。 On the other hand, automation of parts mounting on boards is now becoming widespread, and in order to increase its effectiveness, the number of parts per board is increased, ie, composite boards are used. In addition, from the viewpoint of improving the cutting rate of the board, boards are assembled and combined.
そこで、このような複合基板上に形成される複
数の回路ユニツトの全体の調整検査のために、半
田付け前に各回路ユニツト間にジヤンパ線をわた
す方法が採られる。しかし、この方法はあくまで
も複合基板全体の調整検査のためであり、このた
め各回路ユニツト単体での調整検査ができなくな
るために、そのような調整検査を必要とする部分
には使用することができず、主としてLED基
板、スイツチ基板等の簡単なユニツトの連結等に
使用される程度であつた。 Therefore, in order to check the overall adjustment of a plurality of circuit units formed on such a composite board, a method is adopted in which jumper wires are passed between each circuit unit before soldering. However, this method is only for checking the adjustment of the entire composite board, and therefore cannot be used for parts that require such adjustment checking, since it is not possible to check the adjustment of each circuit unit alone. Initially, it was mainly used for connecting simple units such as LED boards and switch boards.
本発明は斯る点に鑑みたもので、製品に対応し
た複数の回路ユニツトを有する複合基板の各回路
ユニツト単体の調整検査及び各回路ユニツト間の
バラツキの全体との関連での調整検査等ができる
ようにして、調整検査工数の低減を図らんとする
ものである。 The present invention has been developed in view of this point, and it is possible to perform adjustment inspection of each individual circuit unit of a composite board having a plurality of circuit units corresponding to a product, and adjustment inspection in relation to the overall variation among each circuit unit. The aim is to reduce the number of adjustment and inspection man-hours by making it possible.
以下、図を参照して本発明の一実施例を説明す
る。1は複合基板で、そこには製品の各種機能を
有する回路群に対応した複数の回路ユニツトA〜
Eがミシン目又はVカツト等の分割部1aによつ
て区画されている。製品が例えば受信機であれ
ば、回路ユニツトA〜Eはフロントエンド部、中
間周波増幅部、MPX部、トーンコントロール
部、オーデイオ増幅部等である。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings. 1 is a composite board, on which multiple circuit units A to A corresponding to circuit groups having various functions of the product are installed.
E is divided by a dividing portion 1a such as a perforation or a V-cut. For example, if the product is a receiver, the circuit units A to E are a front end section, an intermediate frequency amplification section, an MPX section, a tone control section, an audio amplification section, etc.
2は複合基板1と同一大きさ、同一形状の触針
台で、その片面には複合基板1の調整検査ポイン
トに対応した位置に触針3が植設されている。そ
してこの触針3からのリード線4はマイクロコン
ピユータやロジツク回路等で成るコントロール部
5に至つている。61〜6oは電源、周波数発振
器、歪率計、レベルメータ、その他の機器であ
る。 Reference numeral 2 denotes a stylus base having the same size and shape as the composite substrate 1, and a stylus 3 is implanted on one side of the stylus base at a position corresponding to an adjustment inspection point of the composite substrate 1. A lead wire 4 from this stylus 3 leads to a control section 5 consisting of a microcomputer, logic circuit, etc. 6 1 to 6 o are power supplies, frequency oscillators, distortion meters, level meters, and other equipment.
次に調整検査においては、触針台2を複合基板
1に位置決めして、その触針3を複合基板1の調
整検査ポイントに接触させる。そして、コントロ
ール部5を制御して機器61〜6oを各回路ユニ
ツトA〜E毎の触針3に対して接続して電気的入
力を与えると共に電気的出力を取り出して、回路
ユニツトA〜Eの各々単体についての特性を調べ
良否を確認し、更にその各回路ユニツトA〜E上
の可変抵抗、トリマ、コイル等を調整する。 Next, in the adjustment inspection, the stylus stand 2 is positioned on the composite substrate 1, and the stylus 3 is brought into contact with the adjustment inspection point on the composite substrate 1. Then, by controlling the control unit 5, the devices 61 to 6o are connected to the stylus 3 of each circuit unit A to E to give electrical input and take out an electrical output, so that the devices 61 to 6o The characteristics of each individual unit of E are checked to confirm its quality, and the variable resistors, trimmers, coils, etc. on each of the circuit units A to E are adjusted.
次に、コントロール部5によつて各回路ユニツ
トA〜Eの触針3の内の必要な触針を各回路ユニ
ツトA〜E間で電気的に接続して電気的入力を与
えると共に電気的出力を取り出し、その後コント
ロール部5によつて機器61〜6oを制御し、各
回路ユニツトA〜Eが電気的に連結された状態で
の複合基板1の全体的な特性を見、各回路ユニツ
トのバラツキを調整し、また可変抵抗、トリマ、
コイル等を最終的に調整する。その後触針台2を
複合基板1から離して調整検査を終る。 Next, the control unit 5 electrically connects the necessary stylus 3 of each circuit unit A to E to provide electrical input and electrical output. Then, the control section 5 controls the devices 61 to 6o to check the overall characteristics of the composite board 1 in a state where each circuit unit A to E is electrically connected. Variable resistance, trimmer,
Make final adjustments to the coils, etc. Thereafter, the stylus base 2 is separated from the composite substrate 1 to complete the adjustment inspection.
以上のように本発明によれば、回路ユニツトが
複数構成された複合基板の回路ユニツト単体での
調整検査及び複合基板全体の調整検査が行なわれ
るようになる。この結果、製品化後の段階での調
整検査のやり直しは必要なくなり、工数が大幅に
減少するようになる。本発明は、個々の回路部分
も特性のバラツキが全体を組み上げた状態で問題
となるような機器、例えば受信機等に好適であ
る。 As described above, according to the present invention, it is possible to perform an adjustment inspection of a single circuit unit of a composite board having a plurality of circuit units and an adjustment inspection of the entire composite board. As a result, there is no need to redo adjustment inspections at the stage after commercialization, resulting in a significant reduction in man-hours. The present invention is suitable for equipment in which variations in characteristics of individual circuit parts pose a problem when assembled as a whole, such as a receiver.
図は本発明の一実施例の説明図である。
1…複合基板、1a…分割部、2…触針台、3
…触針、4…リード線、5…コントロール部、6
1〜6o…機器。
The figure is an explanatory diagram of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Composite board, 1a...Divided part, 2...Stylus base, 3
...Stylus, 4...Lead wire, 5...Control section, 6
1 to 6 o ...Equipment.
Claims (1)
くとも1つを有する複数の回路ユニツトに分割可
能に集合した複合基板の各ユニツトに対応する基
板部分の調整検査ポイントに、その複合基板の調
整検査ポイントに対応した位置に触針を有する触
針台の触針を同時に接触させ、コントロール部に
よつて各回路ユニツト毎に触針から電気入力を与
えると共に触針から電気的出力を取り出して各回
路ユニツト毎の調整検査を行ない、次に異なる回
路ユニツトの調整検査ポイントに接触されている
触針のうちの所定の触針相互間をコントロール部
によつて相互接続して回路ユニツト相互の機能を
関連付け、この状態でコントロール部によつて触
針に電気的入力を与えると共に触針から電気的出
力を取り出して複合基板全体の調整検査を行なう
ようにした、複合基板の調整検査方法。1 Adjustment inspection points of the composite board are placed at the adjustment inspection points of the board portion corresponding to each unit of a composite board assembled into a plurality of circuit units, each of which has at least one of various mutually related functions of the product. The stylus of the stylus base having the stylus is brought into contact with the position corresponding to the stylus at the same time, and the control section applies electrical input from the stylus to each circuit unit and extracts electrical output from the stylus to each circuit unit. Then, predetermined styluses of the stylus contacts in contact with the adjustment inspection points of different circuit units are interconnected by the control unit to associate the functions of the circuit units. In this state, an electrical input is given to the stylus by a control unit, and an electrical output is taken out from the stylus to perform an adjustment inspection of the entire composite board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15301479A JPS5676064A (en) | 1979-11-28 | 1979-11-28 | Adjustment test method of compound substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15301479A JPS5676064A (en) | 1979-11-28 | 1979-11-28 | Adjustment test method of compound substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5676064A JPS5676064A (en) | 1981-06-23 |
| JPS6230385B2 true JPS6230385B2 (en) | 1987-07-02 |
Family
ID=15553064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15301479A Granted JPS5676064A (en) | 1979-11-28 | 1979-11-28 | Adjustment test method of compound substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5676064A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4780670A (en) * | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
-
1979
- 1979-11-28 JP JP15301479A patent/JPS5676064A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5676064A (en) | 1981-06-23 |
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