JP2803256B2 - Packaging method for electronic components - Google Patents
Packaging method for electronic componentsInfo
- Publication number
- JP2803256B2 JP2803256B2 JP31802589A JP31802589A JP2803256B2 JP 2803256 B2 JP2803256 B2 JP 2803256B2 JP 31802589 A JP31802589 A JP 31802589A JP 31802589 A JP31802589 A JP 31802589A JP 2803256 B2 JP2803256 B2 JP 2803256B2
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- lead wire
- electronic component
- slit
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000004806 packaging method and process Methods 0.000 title claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000003566 sealing material Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000007796 conventional method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は軸方向に引き出された二本のリード線を両端
に有する軸対称型の素体よりなる電子部品（以下、アキ
シャル型電子部品と呼ぶ）や、一方向に二本以上引き出
されたリード線を有する素体よりなる電子部品（以下、
ラジアル型電子部品と呼ぶ）の外装方法に関するもので
ある。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component (hereinafter, referred to as an axial electronic component) comprising an axially symmetric element having two axially drawn leads at both ends. Also, an electronic component consisting of a body having two or more lead wires drawn in one direction (hereinafter, referred to as
(Referred to as a radial electronic component).
従来の技術 従来、例えばアキシャル型電子部品の外装方法は、素
体表面に接着剤を用いて粉体状あるいは液状の封着用材
料を塗布し、バッジ炉内にて所要の高温雰囲気にさら
し、封着用材料を硬化せしめるものであった。特に、極
めて高温の雰囲気を必要とする封着材料については、リ
ード線部の酸化を避けるために炉内を還元性雰囲気とし
て封着材料の硬化を図るものである。第４図は従来の方
法を示しており、１は封着材料、２は素体、３はリード
線、４は搬送治具、５は炉を示す。2. Description of the Related Art Conventionally, for example, a packaging method for an axial type electronic component has been disclosed in which a powdery or liquid sealing material is applied to an element body surface using an adhesive, and the element is exposed to a required high-temperature atmosphere in a badge furnace. The material to be worn was cured. In particular, for a sealing material requiring an extremely high temperature atmosphere, the inside of the furnace is set to a reducing atmosphere to cure the sealing material in order to avoid oxidation of the lead wire portion. FIG. 4 shows a conventional method, wherein 1 is a sealing material, 2 is a body, 3 is a lead wire, 4 is a conveying jig, and 5 is a furnace.
発明が解決しようとする課題 このような従来の方法では、高温の雰囲気を要し、か
つ酸化雰囲気を要する封着材料を使用するアキシャル型
電子部品の外装に際して、リード線部の表面酸化が避け
られないという問題がある。そのため、封着作業終了後
に改めて酸化膜の除去を行う必要があり、除去作業に伴
う工数増加，設備保全費用の増加につながり、かつ若干
ながら残留した酸化膜が次工程の生産性を著しく低下さ
せるという問題があった。SUMMARY OF THE INVENTION In such a conventional method, a surface oxidation of a lead wire portion can be avoided when packaging an axial electronic component using a sealing material requiring a high-temperature atmosphere and requiring an oxidizing atmosphere. There is no problem. For this reason, it is necessary to remove the oxide film again after the sealing operation is completed, which leads to an increase in the number of steps involved in the removal operation and an increase in equipment maintenance costs, and the oxide film which remains slightly reduces the productivity of the next step remarkably. There was a problem.
したがって、本発明はこのような問題に鑑み、リード
線部の表面酸化が生じない電子部品の外装方法を提供す
ることを目的とするものである。Accordingly, an object of the present invention is to provide a method of packaging an electronic component in which surface oxidation of a lead wire portion does not occur in view of such a problem.
課題を解決するための手段 この課題を解決するために本発明は、内壁に断熱材を
貼りつけるとともに外壁面に冷却板を取りつけ、前記冷
却板が設けられた外壁とその内壁を含む壁部の少なくと
も１ヶ所にスリットを形成した炉を設け、素体の外周に
封着用材料を塗布してなる電子部品のリード線を、前記
スリットから炉の外部へ引き出し、前記素体近傍のみを
連続的に炉内で加熱し前記封着用材料を硬化することを
特徴とする電子部品の外装方法。Means for Solving the Problems In order to solve this problem, the present invention provides a method of attaching a heat insulating material to an inner wall and attaching a cooling plate to an outer wall surface, the outer wall provided with the cooling plate and a wall portion including the inner wall thereof. A furnace having a slit formed in at least one place is provided, and a lead wire of an electronic component formed by applying a sealing material to the outer periphery of the element body is drawn out of the slit from the slit to the outside of the furnace. A method for packaging an electronic component, comprising heating in a furnace to cure the sealing material.
作用 この方法により、素体部分は高温酸化雰囲気に連続的
にさらされ、リード線部分は炉外大気中にさらされる。
そしてスリット部より炉外へ拡散しようとする炉内高温
雰囲気がもたらすリード線部近傍の雰囲気温度の上昇に
ついては、炉壁外面に貼りつけた冷却板がリード線近傍
の雰囲気を冷却することで温度上昇を緩和し、リード線
表面の酸化開始温度以下に維持する。したがって、より
高温な酸化雰囲気を封着に要する封着材料についても、
冷却板の冷却能力を向上させることで、リード線近傍雰
囲気の冷却及び温度調節を可能とする。また、炉内雰囲
気についても炉壁内面の断熱材に蓄えられた炉内熱量を
スリット部より炉外へ拡散する炉内雰囲気が抜熱してい
くことで、スリット部炉内近傍雰囲気の著しい温度低下
を防ぐことが可能となり、かつスリット部のクリアラン
スを調整することで炉内雰囲気のリーク量を容量に調整
することが可能となる。したがって、封着材料の硬化に
ついては炉内温度の安定制御が行えるため、従来の方法
と同程度の品質を得ることができる。According to this method, the element body portion is continuously exposed to the high-temperature oxidizing atmosphere, and the lead wire portion is exposed to the atmosphere outside the furnace.
Regarding the rise in the ambient temperature near the lead wire caused by the high-temperature atmosphere inside the furnace, which tends to diffuse out of the furnace from the slit, the cooling plate attached to the outer surface of the furnace wall cools the atmosphere near the lead wire. The rise is moderated, and the temperature is kept below the oxidation start temperature of the lead wire surface. Therefore, for sealing materials that require a higher temperature oxidizing atmosphere for sealing,
By improving the cooling capacity of the cooling plate, it is possible to cool the atmosphere near the lead wire and adjust the temperature. In addition, the furnace atmosphere, which diffuses the amount of heat stored in the heat insulating material on the inner surface of the furnace wall to the outside of the furnace from the slit, is relieved, and the temperature inside the furnace near the slit decreases significantly. Can be prevented, and the amount of leakage in the furnace atmosphere can be adjusted to a capacity by adjusting the clearance of the slit portion. Therefore, the curing temperature of the sealing material can be controlled stably in the furnace, so that the same quality as that of the conventional method can be obtained.
実施例 第１図，第２図は本発明にかかる電子部品の外装方法
をサーミスタ製品で実施した装置の一実施例を示す断面
図及び要部拡大斜視図である。同図において、封着材料
１〜搬送治具４は従来例と同じである。また、６はトン
ネル状の連続した炉を示しており、その内壁面に極めて
薄い断熱材７を、両側面の外壁面に冷却板８を固定して
おり、かつその両側面にリード線３との間がクリアラン
ス３〜10mm程度のスリット９を炉６の長手方向に有して
いる。そして、このスリット９部に両端のリード線３が
はまるようにアキシャル型電子部品の素体２をチェーン
コンベアなどの搬送治具４により炉６内へ連続搬入する
構成としている。Embodiments FIGS. 1 and 2 are a cross-sectional view and an enlarged perspective view of a main part showing an embodiment of an apparatus in which a method for packaging an electronic component according to the present invention is implemented using a thermistor product. In the drawing, sealing materials 1 to transport jigs 4 are the same as in the conventional example. Reference numeral 6 denotes a tunnel-shaped continuous furnace, in which an extremely thin heat insulating material 7 is fixed on the inner wall surface, and a cooling plate 8 is fixed on the outer wall surface on both side surfaces. A slit 9 having a clearance of about 3 to 10 mm is provided in the furnace 6 in the longitudinal direction. Then, the axial electronic component body 2 is continuously loaded into the furnace 6 by a transport jig 4 such as a chain conveyor so that the lead wires 3 at both ends are fitted into the slits 9.
本実施例によれば。炉内最高温度;500℃、スリット部
の冷却板近傍雰囲気温度;150℃、炉内通過時間;20分、
封着材料；ガラスフリット、リード線材質；ステンレス
の条件の下で素体封着を行ったところ、リード線部は素
体近傍のみを除き酸化膜の発生は認められず、また封着
についても従来の方法と同程度の品質を得ることができ
た。According to the present embodiment. Maximum temperature in the furnace: 500 ° C, ambient temperature near the cooling plate at the slit part; 150 ° C, passage time in the furnace: 20 minutes,
When the body was sealed under the conditions of sealing material; glass frit, lead wire material: stainless steel, no oxide film was observed on the lead wire portion except in the vicinity of the body, and the sealing was not performed. The same quality as the conventional method could be obtained.
第３図は本発明方法をラジアル型電子部品の外装に用
いた場合の実施例を示す断面図である。この実施例に示
すように、一方向（本図においては素体2aの鉛直下方）
に二本以上上引き出されたリード線3aを有するラジアル
型電子部品は、量産工程において、一番にリード線端部
をフィルム上にテーピング固定する形態をとる。FIG. 3 is a cross-sectional view showing an embodiment in which the method of the present invention is used for an outer casing of a radial electronic component. As shown in this embodiment, one direction (in this figure, vertically below the element body 2a)
In a mass production process, a radial electronic component having two or more lead wires 3a drawn out above takes the form in which the lead wire ends are first taped and fixed on a film.
本例において、6aはトンネル状の連続した炉、7aは炉
壁内面に貼りつけられた極めて薄い断熱材、8aは冷却板
を示し、炉6aはその下面にクリアランス３〜10mm程度の
スリット9aを炉6aの長手方向に有している。また、1aは
封着材料であり、リード線3aはフィルム10上に粘着テー
プ11により固定されている。そして、炉壁スリット部か
らリード線3a及びフィルム10が炉外に放置されるように
設定し、炉内への連続搬入を行う構成としている。In this example, 6a is a tunnel-shaped continuous furnace, 7a is an extremely thin heat insulating material attached to the inner wall of the furnace wall, 8a is a cooling plate, and the furnace 6a has a slit 9a with a clearance of about 3 to 10 mm on its lower surface. It is provided in the longitudinal direction of the furnace 6a. 1a is a sealing material, and the lead wire 3a is fixed on the film 10 by an adhesive tape 11. The lead wire 3a and the film 10 are set so as to be left outside the furnace from the furnace wall slit portion, and are continuously loaded into the furnace.
本実施例によれば、炉内最高温度;500℃、スリット部
の冷却板近傍付近温度;120℃、炉内通過時間;20分、封
着材料；ガラスフリット、リード線材質；ステンレスの
条件の下で素体封着を行ったところ、リード線部は炉内
放置側を除き酸化膜の発生は認められず、封着について
も従来の方法と同程度の品質を得ることができた。According to the present embodiment, the maximum temperature in the furnace: 500 ° C., the temperature near the cooling plate in the slit portion; the temperature in the furnace: 120 ° C., the passage time in the furnace; 20 minutes, the sealing material: glass frit, the material of the lead wire; When the element body was sealed below, no oxide film was observed on the lead wire portion except for the side left in the furnace, and the same quality as the conventional method could be obtained for the sealing.
発明の効果 以上のように本発明によれば、上記内容の炉を用いる
ことで、電子部品の素体部近傍及びリード線部近傍の雰
囲気温度を各々任意に調節かつ維持することが可能とな
り、高温酸化雰囲気を硬化に必要とする封着材料を使用
する電子部品の外装に際して、リード線部の酸化防止が
果たせることとなる。また、酸化膜除去作業の省略可能
により、工数削減，設備保全費用の削減，残留酸化膜に
よる次工程の生産性低下の回避という効果が得られこと
となる。Effects of the Invention As described above, according to the present invention, by using the furnace described above, it is possible to arbitrarily adjust and maintain the ambient temperature in the vicinity of the element body portion and the lead wire portion of the electronic component, When packaging an electronic component using a sealing material that requires a high-temperature oxidizing atmosphere for curing, it is possible to prevent oxidation of the lead wire portion. Further, since the oxide film removing operation can be omitted, the effects of reducing man-hours, reducing facility maintenance costs, and avoiding a decrease in productivity in the next process due to a residual oxide film can be obtained.
第１図，第２図は本発明方法を実施する装置の一実施例
を示す断面図及び要部拡大斜視図、第３図は本発明方法
を実施する装置の他の実施例を示す断面図、第４図は従
来の外装方法を示す断面図である。 1,1a……封着材料、2,2a……素体、3,3a……リード線、
４……搬送治具、6,6a……炉、7,7a……断熱材、8,8a…
…冷却板、9,9a……スリット。1 and 2 are a sectional view and an enlarged perspective view showing an embodiment of an apparatus for carrying out the method of the present invention, and FIG. 3 is a sectional view showing another embodiment of an apparatus for carrying out the method of the present invention. FIG. 4 is a sectional view showing a conventional packaging method. 1,1a …… Seal material, 2,2a …… Element body, 3,3a …… Lead wire,
4… Transfer jig, 6,6a… Furnace, 7,7a …… Insulation material, 8,8a…
… Cooling plate, 9,9a …… slit.
Claims (1)
面に冷却板を取りつけ、前記冷却板が設けられた外壁と
その内壁を含む壁部の少なくとも１ヶ所にスリットを形
成した炉を設け、素体の外周に封着用材料を塗布してな
る電子部品のリード線を、前記スリットから炉の外部へ
引き出し、連続的に前記素体近傍のみを炉内で加熱し、
前記封着用材料を硬化することを特徴とする電子部品の
外装方法。1. A furnace in which a heat insulating material is attached to an inner wall surface, a cooling plate is attached to an outer wall surface, and a slit is formed in at least one portion of an outer wall provided with the cooling plate and a wall portion including the inner wall, A lead wire of an electronic component obtained by applying a sealing material to the outer periphery of the body is drawn out of the furnace from the slit, and only the vicinity of the body is continuously heated in the furnace,
A method for packaging an electronic component, comprising curing the sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31802589A JP2803256B2 (en) | 1989-12-07 | 1989-12-07 | Packaging method for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31802589A JP2803256B2 (en) | 1989-12-07 | 1989-12-07 | Packaging method for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03179707A JPH03179707A (en) | 1991-08-05 |
| JP2803256B2 true JP2803256B2 (en) | 1998-09-24 |
Family
ID=18094658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31802589A Expired - Fee Related JP2803256B2 (en) | 1989-12-07 | 1989-12-07 | Packaging method for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2803256B2 (en) |
-
1989
- 1989-12-07 JP JP31802589A patent/JP2803256B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03179707A (en) | 1991-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |