JP2955472B2 - Method for forming suction surface on suction plate of vacuum chuck and cutting device for suction plate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a surface on a porous body, a method for forming a suction surface on a suction plate of a vacuum chuck, and a cutting device for the suction plate.

[0002]

2. Description of the Related Art Conventionally, as a suction plate of a vacuum chuck, a plate formed of a porous body having a large number of through holes communicating with both front and back surfaces is known. Then, by sucking air from one surface of the suction plate, an object to be sucked such as a silicon wafer is sucked to the other surface.
As a material of the porous body, for example, copper, aluminum, stainless steel, fluororesin, or the like is used. The suction plate compresses and forms fine particles of these materials.
It is formed from a porous body having a large number of through-holes formed therein by sintering under heat. Such a suction plate is used while being fixed to a disk-shaped chuck plate made of metal.

Further, a sintered porous body formed by compression molding and heat sintering of fine particles generally has poor shape accuracy. Therefore, the suction surface of the suction plate is formed by fixing the suction plate to the chuck plate and then cutting the suction surface side with a milling cutter or the like.

[0004] The step of cutting the suction plate is composed of three plane cutting steps of rough cutting, medium cutting and finish cutting. First, in rough cutting, each suction plate
Large irregularities are removed by repeatedly cutting several times with each cutting depth. Next, in middle cutting, plane cutting is performed several times while gradually reducing the cutting depth. Finally, the suction surface side is cut by 1 μm to form the suction surface by finish cutting.

[0005]

However, as shown in FIG. 4, when the suction plate 31 is cut in a plane to form the suction surface 32, the length of each through-hole 33 cut by the suction surface 32 is almost equal to that of the suction plate 32. Burrs 34 of 0.2 to 0.5 μm are generated. When the suction plate 31 having the burrs 34 inside the through holes 33 in the suction surface 32 is used for a vacuum chuck device, the burrs 34 move outside the through holes 33 due to the movement of air at the time of suction and desorption of the work. Or fall out of the through hole. When this suction plate 31 is used, for example, in a vacuum chuck device for fixing a silicon wafer for manufacturing a semiconductor integrated circuit device, burrs damage the wafer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a porous body capable of forming a surface by cutting a porous body without forming burrs on the cut surface. The object of the present invention is to provide a method for forming a surface in the above.

Further, in a suction plate formed of a porous body and having a suction surface formed by cutting, a method of forming a suction surface of a suction plate of a vacuum chuck capable of cutting and forming a suction surface without burrs. An object of the present invention is to provide an apparatus for cutting a suction plate used in this method.

[0008]

[0009]

Means for Solving the Problems To solve the above problems,
Because, a first aspect of the present invention, the suction surface for by cutting one surface of the formed suction plate of a porous material adsorbs adsorbate with multiple holes communicating with both sides In the method of forming the suction surface of the suction plate of the vacuum chuck, a fluid is supplied from the surface opposite to the suction surface side of the suction plate during cutting to form the suction surface, and the fluid is ejected to the suction surface side. While cutting.

[0010]

According to a second aspect of the present invention, there is provided a fixing and holding means for fixing and holding a suction plate formed of a porous body having a large number of through holes communicating with both front and back surfaces, and fixing to the fixing and holding means. A fluid supply means for supplying a fluid from the surface opposite to the suction surface of the suction plate to be held and ejecting the fluid from the through-hole of the surface serving as the suction surface; Cutting means for forming the suction plate by cutting the surface serving as the suction surface in a state where the fluid is supplied by the fluid supply means, the fixed holding means fixedly holding the suction plate, and the cutting means. Moving means for relatively moving the suction plate in parallel with a surface to be the suction surface.

[0012]

[0013]

Therefore, according to the invention described in claim 1, when cutting the suction surface to become the surface of the suction plate formed by a porous body having a large number of through holes therein, is cut at the cutting plane Burrs are formed in the through holes. The burrs are pushed out of the through holes by a fluid supplied from the side opposite to the surface serving as the suction surface. When cutting is performed in this state to form an adsorption surface,
Burrs are cut off.

According to the third aspect of the present invention, the burrs formed in the through-hole portion by cutting are formed in such a size as to be pushed out of the through-hole by the fluid. Then, when the fluid is supplied from the surface of the suction plate opposite to the surface serving as the suction surface, the burrs in the through holes are reliably pushed out of the through holes.

According to the second aspect of the present invention, when the fluid is supplied by the fluid supply means from the surface opposite to the suction surface of the suction plate fixed by the fixed holding means, Fluid spouts from the surface that becomes the suction surface. When the moving means moves the fixed holding means and the cutting means in parallel with the suction surface formed on the suction plate, a cutting surface parallel to the suction surface is formed. Burrs formed by cutting in the through-hole part cut on the cutting surface,
The fluid supplied by the fluid supply means is pushed out of the through hole. When the cutting surface is cut by the cutting means in this state, the suction surface from which burrs formed in the through holes cut by the cutting surface are removed is formed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flat cutting apparatus for forming a suction surface of a suction plate according to an embodiment of the present invention will now be described with reference to FIGS.
It will be described according to.

As shown in FIG. 2, a feeder 2 as a moving means mounted on the floor and extending in the left-right direction is provided below the plane cutting device 1. A work holding unit 3 is disposed on the feed unit 2 so as to be movable in the left-right direction along the feed unit 2. The holding unit 3 is reciprocated between a return position located on the leftmost side of the feed unit 2 and a turnback position located on the rightmost side. The feed unit 2 is controlled by a control panel (not shown).

The work holder 3 is up and down position adjusting portion 4 of the lower
And an upper work fixing portion 5. The vertical position adjusting unit 4 arranges the work fixing unit 5 at an arbitrary height set between a return position where the work fixing unit 5 is arranged at the lowest position and an upper limit position where the work fixing unit 5 is arranged at the highest position. Has become. The vertical position adjusting section 4 is controlled by the control panel.

The work fixing part 5 is provided with a vacuum chuck part 6. As shown in FIG. 3, the vacuum chuck section 6 includes a chuck body 7, a chuck plate 8, and a suction plate 9. The chuck body 7 is formed of a metal on a bottomed cylinder. The chuck plate 8 is formed in a disk shape having the same diameter as the chuck body 7 and has an annular groove 1 on its upper surface.
0 is formed. Each annular groove 10 has an annular groove 10
An air suction hole 11 that communicates with the lower surface of the chuck plate 8 is provided. A chamber 12 is formed by the chuck body 7 and the chuck plate 8. Therefore, the chamber 12 communicates with the annular groove 10 via the air suction hole 11. An air suction pipe 13 communicates with the bottom of the chuck body 7, and the chamber 12 is connected to a vacuum pump 14 provided outside the work holding unit 3 via the air suction pipe 13.

The suction plate 9 is formed in the same disk shape as the chuck plate 8 by a sintered plastic which is a porous body having a large number of through holes communicating with both front and back surfaces, and is adhered to the upper surface of the chuck plate 8. I have. Since this bonding is performed only on the outer peripheral portions of the chuck plate 8 and the suction plate 9, the lower surface side of the suction plate 9 and each of the annular grooves 10 communicate with each other, and air does not flow from the outer peripheral side. Has become. An air supply hole 15 communicating vertically is formed in a part of the suction plate 9. On the inner peripheral surface of the air supply hole 15, a non-breathable layer 16 for blocking the flow of air is formed. Further, a non-breathable layer 16 is also formed on the outer peripheral side of the suction plate 9. An air supply port 17 is formed at a position opposite to the air supply hole 15 of the chuck plate 8.
An air supply pipe 18 extending to the outside of the chuck body 7 through the chamber 12 is connected to the second side. The air supply pipe 18 is connected to an air compressor 19 provided outside the work holding unit 3. The air compressor 19 is connected to the air supply hole 15 through the air supply pipe 18 and the air supply port 17.
Supply air inside. In the present embodiment, a fixed holding unit is constituted by the vacuum chuck unit 6 and the vacuum pump 14,
Fluid supply means is constituted by the vacuum chuck section 6 and the air compressor 19.

The workpiece is adsorbed on the vacuum chuck 6. The workpiece K is composed of a chuck plate 20 and a suction plate 21 which are components of a vacuum chuck. The chuck plate 20 is formed in a disk shape from metal. The adsorbing plate 21 is formed of a sintered body of trifluoride resin, which is a porous body having a large number of through holes formed therein, and is formed in a disk shape having the same diameter as the adsorbing plate 9. The outer peripheral portion of the chuck plate 20 and the suction plate 21 are adhered, and the flow of air in the outer peripheral portion is blocked. A plurality of annular grooves 22 are formed on the upper surface of the suction plate 21. Each annular groove 22 is provided with an air suction hole 23 that communicates each annular groove 22 with the lower surface of the chuck plate 20. That is, the air suction hole 23 communicates with the lower surface of the suction plate 21 via the annular groove 22. Therefore, when using the chuck plate 20 and the suction plate 21 as a vacuum chuck, intake Chakumen 21a of the suction plate 21 through the air suction hole 23
By sucking the air from the, the object to be adsorbed is adsorbed on the adsorption surface 21a. When the chuck plate 20 and the suction plate 21 are sucked by the vacuum chuck portion 6 to form the suction surface 21a, the air suction holes 23 are formed in the suction plate 9.
Is adsorbed so as to communicate with the air supply hole 15. And
The air suction pipe 23 is used to separate the suction plate 2 from the air supply pipe 18.
1 is supplied with air.

A flat cutting portion 24 is provided at one end of the feeding portion 2. The plane cutting unit 24 includes a plane cutting unit 25 as cutting means and the plane cutting unit 25
And a supporting portion 26 that is held above. The rotating shaft 27 of the plane cutting unit 25 is arranged vertically, and the lower end of the rotating shaft 27 has a milling cutter 2 for plane cutting.
8 is attached. The milling cutter 28 is prepared for rough cutting, medium cutting and finish cutting, and the cutter 28 is replaced and mounted for each cutting process. In this embodiment, a cutting unit is constituted by the vertical position adjusting unit 4 and the plane cutting unit 25.

A switch for operating the feed unit 2 is provided on the control panel. The control panel is provided with a switch for operating the up / down adjustment unit 4. Further, the control panel includes the vacuum pump 14 and the air compressor 1.
A switch is provided for activating 9.

The operation of the flat cutting device 1 for the suction plate 21 configured as described above will be described. First, the suction plate 21
The chuck plate 20 to which is fixed is placed on the suction plate 9 of the vacuum chuck unit 6, and the vacuum pump 14 is operated to fix the suction plate. At this time, the air suction holes 23 of the chuck plate 20 are arranged so as to communicate with the air supply holes 15 of the suction plate 9. Further, the air compressor 19 is operated to supply air to the lower surface side of the suction plate 21 via the air supply pipe 18, the air supply hole 15, and the air suction hole 23. As a result, air is ejected from the upper surface side of the suction plate 21.

The plane cutting step includes the steps of rough cutting, medium cutting, finish cutting, and burr cutting. First, in rough cutting, a milling cutter 28 for rough cutting is mounted on the plane cutting unit 25, and the cutter 28 is rotated by operating the plane cutting unit 25. Then, the vertical position adjusting unit 4 is operated to raise the work fixing unit 5 from the return position, and the first cutting position of the suction plate 21 is arranged on the cutting surface of the cutter 28. Next, the feed unit 2 is operated to move the work holding unit 3 from its return position to the turnback position. Then, as the work holding unit 3 moves, the surface serving as the suction surface of the suction plate 21 is planarly cut by the cutter 28. As a result, the unevenness of the surface serving as the suction surface of the suction plate 21 is removed, and the suction plate 21 is cut and formed into a flat shape. When the work holding unit 3 is sent and the entire suction plate 21 passes through the cutter 28 and reaches the turnback position,
The vertical position adjusting unit 4 operates to lower the work fixing unit 5 slightly. Then, the work holding unit 3 is returned to the return position while the feed unit 2 is operated and the work fixing unit 5 is lowered. When the work holding unit 3 returns to the return position, the vertical position adjusting unit 4 operates to return the work fixing unit 5 to the initial cutting depth.

Next, the vertical position adjusting section 4 is operated again to raise the workpiece fixing section 5 by the cutting amount for the next rough cutting. In this embodiment, the depth of cut in the rough cutting is 10 μm.
Is set to Then, rough cutting is performed in the same manner as the first rough cutting. Hereinafter, several times of rough cutting are performed in the same manner at a cutting depth of 10 μm. As a result, the unevenness of the surface serving as the suction surface of the suction plate 21 is completely removed, and the suction plate 21 is formed into a flat shape. In addition, burrs are formed by cutting in the through-hole portions appearing on the cutting surface obtained by cutting the suction plate 21. The size of the burr is a size substantially correlated with the size of the cutting depth of the cutting.

Next, medium cutting is performed. For medium cutting, a milling cutter 28 for medium cutting is mounted on the plane cutting unit 25, and cutting is performed several times with the cutter 28 while the cutting depth is gradually reduced from 10 μm. The size of the burrs formed in the through-hole portion on the cutting surface of the suction plate 21 is reduced by the medium cutting.

Next, finish cutting is performed. For the finish cutting, a milling cutter 28 for finish cutting is attached to the plane cutting unit 25, and the cutter 28 performs one cutting.
In this embodiment, the depth of cut in the finish cutting is 1 μm
Is set to As a result, the suction surface 21a is formed on the suction plate 21 by the finish cutting. At this time, as indicated by a two-dot chain line in FIG.
About 0.5 μm. Further, since the thickness of the burr 30 is reduced, as shown by the solid line in FIG.
The burr 30 is held in a state of being pushed out of the through hole 29 by the air ejected from the suction surface 21a through the suction hole 21a. In addition, in the rough cutting and the medium cutting, air is ejected from the suction surface side of the suction plate 21. However, since the amount of cut is large, the size of the burr formed in the through hole portion by the rough cutting and the medium cutting is large. The burrs are not pushed out of the through-holes by the jetting air.

Next, burr cutting is performed. Burr cutting is performed once using a cutter 28 for finish cutting. In this embodiment,
The cutting depth of the burr cutting is set to zero. The burr 3 pushed out of the through hole 29 by this burr cutting
0 is cut off. As a result, the suction surface 21a without the burr 30 is formed.

As described in detail above, according to the method for forming the suction surface of the suction plate of the vacuum chuck of the present embodiment, the surface serving as the suction surface of the suction plate 21 is finish-cut with a cutting amount of 1 μm. The size of the burr formed in the portion of the through-hole 29 cut by the cutting surface was set to a size that could be pushed out of the through-hole 29 by air blown from the suction surface side of the suction plate 21. Then, air was blown out from the surface of the suction plate 21 serving as the suction surface, so that the burrs at the portion of the through hole 29 were pushed out of the through hole 29 to perform a burr cutting with a cut amount of 0. As a result, the suction surface 21
The burr formed in the through-hole 29 of a was able to be removed. Accordingly, it is possible to form the suction surface 21a on the suction plate 21 without burrs.

Further, according to this embodiment, since air is used as the fluid supplied to the suction plate 21, equipment for handling the fluid in the manufacturing process is simplified. Further, according to the present embodiment, since the burr cutting for removing the burr 30 is performed at the cutting depth of 0, only the burr is cut.

The present invention is not limited to the above embodiment, but may be configured as follows. (1) In the above embodiment, the suction surface 21a is formed by cutting the suction plate 21 of the vacuum chuck as a porous body. However, other various kinds of porous bodies are cut to remove burrs. It may be carried out when forming.

(2) In the above embodiment, the burr cutting was performed with the cut amount set to 0 after the finish cutting. However, this cut amount was set to a cut amount larger than 0 as long as the burr could be removed without making a new burr. Is also good.

(3) The cut amount in the finish cutting is not limited to 1 μm, but the cut amount in a range where a burr 30 large enough to be pushed out of the through hole 29 by air ejected from the suction surface side of the suction plate 21 can be formed. Any quantity is sufficient.

(4) The porous body forming the adsorbing plate 21 is made of a material other than the sintered trifluoride resin, for example, a sintered tetrafluoride resin.
It may be a synthetic resin material such as sintered nylon resin or sintered polyacetal resin, or a metal material such as sintered aluminum, sintered copper, or sintered stainless steel.

(5) The fluid ejected from the suction surface 21a of the suction plate 21 is not limited to air, but may be another gas such as carbon dioxide or a liquid such as water. Hereinafter, in addition to the technical idea described in the claims, the technical idea grasped in the above-described embodiment will be described together with its effects.

(1) The method for forming a suction surface on a suction plate of a vacuum chuck according to claim 1,
A method for forming a suction surface of a suction plate of a vacuum chuck, wherein a fluid supplied to the vacuum chuck is air.

According to such a configuration, equipment for handling the fluid is simplified. (2) The method of forming a suction surface on a suction plate of a vacuum chuck according to claim 2, wherein the cut amount is zero.

According to such a configuration, only burrs can be removed. In this specification, the means relating to the configuration of the invention shall be defined as follows.

(1) The through-hole means a space formed in the material forming the suction plate and allowing air to flow between the front and back surfaces of the suction plate by connecting these spaces to each other. (2) Fluid refers to a fluid that can be introduced from the surface opposite to the adsorption surface of the adsorption plate, passed through the through hole inside the adsorption plate, and ejected to the adsorption surface side. It shall include not only gas but also liquid such as water.

[0041]

[0042]

As described in detail above , according to the first or second aspect of the present invention, the suction member is formed by a porous body having a large number of through-holes, and is formed by cutting. In the suction plate, a suction surface without burrs can be cut and formed.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a cross-sectional view of an attraction plate according to one embodiment of the present invention.

FIG. 2 is a schematic front view of a flat cutting device for a suction plate.

FIG. 3 is a cross-sectional view showing a suction plate sucked by a vacuum chuck unit.

FIG. 4 is a schematic view showing a cross-sectional view of a conventional suction plate.

[Explanation of symbols]

Feeder as 2 ... mobile unit, 4 ... Up Down position adjusting unit, 6
... Vacuum chuck as fixed holding means and fluid supply means, 14 ... Vacuum pump as fixed holding means, 19 ... Air compressor as fluid supply means, 21 ... Suction plate, 21a
... Suction surface as surface, 25 plane cutting unit as cutting means, 29 through hole, 30 burr.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B23C 3/13 B26D 7/00

Claims (2)

(57) [Claims] 1. A large number of through holes (29) communicating with both front and back surfaces
An adsorbing surface (21) for adsorbing an object to be adsorbed by cutting one surface of an adsorbing plate (21) formed of a porous body having
a) forming a suction surface of a suction plate of a vacuum chuck forming the suction surface;
Forming a suction surface in a suction plate of a vacuum chuck, wherein cutting is performed while supplying a fluid from a surface opposite to the suction surface (21a) side and ejecting the fluid to the suction surface (21a) side. 2. A large number of through holes (29) communicating with both front and back surfaces.
Fixing and holding means (6, 14) for fixing and holding the suction plate (21) formed of a porous body having: and suction of the suction plate (21) fixed and held by the fixing and holding means (6, 14). Fluid supply means (6, 19) for supplying a fluid from the surface opposite to the surface serving as the surface (21a) and ejecting the fluid from the through hole (29) of the surface serving as the adsorption surface (21a);
The suction plate (21) fixed by the fixing and holding means (6, 14) is turned into the suction surface (21a) when the fluid is supplied by the fluid supply means (6, 19). Cutting means (25) for cutting and forming, and the fixed holding means (6) fixedly holding the suction plate (21).
And a moving means (2) for relatively moving the cutting means (25) in parallel with a surface to be the suction surface (21a) of the suction plate (21).