JP3094639B2 - Circuit board bonding method for liquid crystal display module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining circuit boards in a liquid crystal display module.

[0002]

2. Description of the Related Art As shown in FIG. 3, in a liquid crystal display module, three types of semiconductor units 2 to 4 are respectively joined to three sides of a liquid crystal display panel 1 and a circuit is provided for each of the semiconductor units 2 to 4. The substrates 5 to 7 are bonded to each other, and a drive signal is given to each of the semiconductor units 2 to 4 via each of the circuit boards 5 to 7 so that the liquid crystal display panel 1 operates and information such as an image corresponding to the drive signal. Is electro-optically displayed.

In this liquid crystal display panel 1, a large number of transparent electrodes in the form of stripes orthogonal to each other are formed on opposing surfaces of a pair of glass substrates 10 and 11, and these electrodes are composed of a first connection terminal 12 and a second connection Terminal 13 and third connection terminal 1
4 is derived. The semiconductor units 2 to 4 joined to the liquid crystal display panel 1 are each provided with a film substrate 15
The electrode of the semiconductor chip 17 is joined to the inner end of the lead 16 formed on the substrate, and the outer end of the lead 16 is
5 and is formed on the output terminal 18 and the input terminal 19. The output terminal 18 of the first semiconductor unit 2 is connected to the first connection terminal 1 of the liquid crystal display panel 1.
2, the output terminal 18 of the second semiconductor unit 3 is connected to the second connection terminal 13 of the liquid crystal display panel 1,
The output terminal 18 of the semiconductor unit 4 is joined to the third connection terminal 14 of the liquid crystal display panel 1. Also, the circuit boards 5 to 7
Are formed with a plurality of connection terminals 22 on each of the wiring leads 21 while forming the wiring leads 21 on the strip-shaped substrate 20.
Is formed. Then, the first circuit board 5
The input terminals 19 of a plurality of (six in the figure) first semiconductor units 2 are joined to the connection terminals 22 of the second circuit board 6.
The input terminals 19 of a plurality of (six in the figure) second semiconductor units 3 are joined to the connection terminals 22 of the third circuit board 7.
The input terminals 19 of a plurality (four in the figure) of the third semiconductor units 4 are joined to the connection terminals 22.

In such a liquid crystal display module,
When the circuit boards 5 to 7 are joined to the respective semiconductor units 2 to 4 of the liquid crystal display panel 1, they are joined as follows. For example, the first circuit board 5 joined to the plurality of first semiconductor units 2 joined to the first connection terminals 12 of the liquid crystal display panel 1 is manually placed on a bonding stage, and is placed on the bonding stage. The liquid crystal display panel 1 to which the semiconductor units 2 to 4 are joined is arranged. At this time, each input terminal 19 of the first semiconductor unit 2 joined to the first connection terminal 12 of the liquid crystal display panel 1 and the first terminal
Positioning is performed manually so that each connection terminal 22 of the circuit board 5 corresponds. In this state, the bonding stage is manually moved, and each input terminal 19 of the first semiconductor unit 2 and each connection terminal 22 of the first circuit board 5 are sequentially bonded by a bonding head. Thereafter, the liquid crystal display panel 1 to which the first circuit board 5 is bonded is removed from the bonding stage, and the second semiconductor unit 3 which is bonded to the second connection terminal 13 of the liquid crystal display panel 1 this time is removed. Positioning the circuit board 6 on the bonding stage,
The liquid crystal display panel 1 on which the first circuit board 5 is bonded is manually rotated on a horizontal plane and placed on the bonding stage, and the input terminals 19 of the second semiconductor unit 3 and the second circuit are connected in the same manner as described above. The connection terminals 22 of the substrate 6 are aligned with each other and are sequentially bonded by a bonding head. Further, when the third circuit board 7 is joined to the third semiconductor unit 4 joined to the third connection terminal 14 of the liquid crystal display panel 1, the first and second bonding stages are once performed on the bonding stage as described above. The liquid crystal display panel 1 to which the circuit boards 5 and 6 are bonded is removed, and the circuit board 7 is placed on the bonding stage.
After the positioning, the liquid crystal display panel 1 to which the first and second circuit boards 5 and 6 are joined is manually rotated and aligned again, and in this state, each input terminal 19 of each semiconductor unit 4 is connected to the circuit. Each connection terminal 22 of the substrate 7 is sequentially bonded by a bonding head.

[0005]

However, the semiconductor units 2 to 2 joined to the liquid crystal display panel 1 as described above.
In the method of joining the circuit boards 5 to 7 to the first circuit board 5, a plurality of first semiconductor units 2 joined to one side of the liquid crystal display panel 1, for example, the first connection terminal 12, and the first circuit board 5 are sequentially joined. The second and third semiconductor units 3 joined to the second connection terminal 13 or the third connection terminal 14 on the other side,
When joining the second and third circuit boards 6 and 7 to
Each time, the liquid crystal display panel 1 is temporarily removed from the bonding stage, and in this state, the second and third circuit boards 6, 7 are positioned on the bonding stage.
Since the removed liquid crystal display panel 1 is manually rotated and aligned in a horizontal plane, the manufacturing process becomes complicated, and not only takes a long time, but also all the processes are manual work, resulting in poor productivity. There is a problem that a product of stable quality cannot be obtained.

The present invention has been made in view of the above circumstances, and has as its object to simplify the manufacturing process.
An object of the present invention is to provide a method of joining circuit boards of a liquid crystal display module, which can automate a process from supply of components to joining, thereby improving productivity and obtaining a product of stable quality.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides one of at least two circuit boards.
A board mounting process in which one circuit board is mounted on the bonding stage by the board mounting means and positioned, and then the bonding stage is rotated by a predetermined angle, and in this state another circuit board is mounted on the bonding stage by the board mounting means and positioned. And a liquid crystal display panel on which the output terminals of a plurality of semiconductor units are joined by a panel mounting means on a bonding stage on which two circuit boards are positioned, and each input terminal of the plurality of semiconductor units is mounted. A panel mounting step of arranging the connection terminals on each circuit board, each input terminal of a plurality of semiconductor units in which each output terminal is joined to one side of the liquid crystal display panel, and each connection terminal of the corresponding circuit board After bonding with the bonding head in order,
The bonding stage is rotated by a predetermined angle, and each input terminal of a plurality of semiconductor units, each output terminal of which is bonded to the other side of the liquid crystal display panel, and each corresponding connection terminal of another circuit board are bonded with a bonding head. And a joining step of sequentially joining.

[0008]

According to the present invention, at least two circuit boards are sequentially mounted on the bonding stage by the substrate mounting means and positioned in the substrate mounting step, and then each output terminal is joined to the liquid crystal display panel in the panel mounting step. The semiconductor unit is mounted on the bonding stage by the panel mounting means, and each input terminal of each semiconductor unit and each connection terminal of each circuit board are aligned at once, and thereafter, the bonding stage is appropriately moved in a horizontal plane in a bonding process. And by rotating, each input terminal of each semiconductor unit in which each output terminal is bonded to at least two sides of the liquid crystal display panel and each connection terminal of each circuit board are sequentially bonded.
The manufacturing process can be simplified, and the process from component supply to joining can be automated.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic plan view showing the entire configuration of a joining apparatus used in the joining method of the present invention. With reference to this figure, the joining device will be described first.

In FIG. 1, reference numeral 30 denotes a machine base. On the left side of the machine base 30, a board stocker 31 accommodating three types of circuit boards 5 to 7 is arranged. On the substrate stocker 31, there is provided a substrate transfer robot 32 for selecting any one of the circuit boards 5 to 7 as required, adsorbing it, and transferring it to a predetermined position on the machine base 30. Further, on the right side of the machine base 30, a liquid crystal display panel 1 in which a plurality of semiconductor units 2 to 4 are respectively joined to three sides and a panel stocker 33 for accommodating a liquid crystal display module which is a finished product described later are arranged. ing. This panel stocker 33
On the upper side, the liquid crystal display panel 1 is sucked and conveyed to a predetermined position on the machine base 30, and the liquid crystal display module arranged at a predetermined position on the machine base 30 is sucked and the panel stocker 3 is sucked.
3 is provided with a panel-mounted robot 34 for transporting the panel.

The machine base 30 near the substrate stocker 31
On the top, the circuit boards 5 conveyed from the board stocker 31
7 are placed, and in this state, the connection terminals 2 of the circuit boards 5 to 7 are mounted.
Flux application table 35 for applying flux to 2
Is provided. This is because the solder plating is applied to the connection terminals 22 of the circuit boards 5 to 7 in advance. The machine base 30 on the right side of the flux application table 35
A board positioning table 36 for mounting and positioning the circuit boards 5 to 7 to which the flux has been applied is provided above. The liquid crystal display panel 1 conveyed from the panel stocker 33 and the panel temporary stage 37 on which the completed liquid crystal display module is temporarily mounted are provided on the machine base 30 on the right side of the substrate positioning table 36. As shown in FIG. 2, a liquid crystal display panel having circuit boards 5 to 7 and semiconductor units 2 to 4 bonded to three sides is provided on the machine base 30 on the near side (lower side) of the panel temporary placement stage 37. 1 is provided with a bonding stage 38. Bonding stage 38
Has a structure in which the circuit boards 5 to 7 and the liquid crystal display panel 1 are mounted and is movable in the X and Y directions and rotatable in a horizontal plane. A board mounting robot 39 that mounts the circuit boards 5 to 7 on the panel temporary placement stage 37 on the bonding stage 38 is provided on the machine base 30 in front of the panel temporary placement stage 37 and on the left side of the bonding stage 38. Is provided. further,
A bonding support table 40 is disposed on the machine base 30 on the front side of the bonding stage 38, and two types of bonding heads 41 and 42 are provided on the bonding support table 40 so as to be vertically movable. The two types of bonding heads 41 and 42 are used when the bonding conditions between the circuit boards 5 to 7 and the semiconductor units 2 to 4 of the liquid crystal display panel 1 change. For example,
In this embodiment, the bonding head 41 joins the first and second circuit boards 5 and 6 and the semiconductor units 2 and 3, and the bonding head 42 joins the third circuit board 7 and the semiconductor unit 4. Is configured.

Next, the circuit units 5 to 7 are attached to the semiconductor units 2 to 4 of the liquid crystal display panel 1 by using such a bonding apparatus.
Will be described.

First, of the three types of circuit boards 5 to 7 accommodated in the board stocker 31, for example, the liquid crystal display panel 1
The first circuit board 5 bonded to the first semiconductor unit 2 is sucked by the board transfer robot 32 and transferred to the flux application table 35, and the connection terminals 22 of the first circuit board 5 are connected to the flux application table 35 on the flux application table 35. Apply flux. Thereafter, the first circuit board 5 to which the flux has been applied is again sucked by the board transfer robot 32 and transferred to the board positioning table 36, and the first circuit board 5 is transferred to the TV camera (not shown) by the board positioning table 36. Positioning is performed based on image processing using. Then, the first circuit board 5 is attracted by the board mounting robot 39 and is positioned and mounted at a predetermined position on the bonding stage 38. In this state, the bonding stage 38 is rotated by a predetermined angle so that the next circuit board can be mounted.

Thereafter, the second circuit board 6 to be joined to the second semiconductor unit 3 of the liquid crystal display panel 1 is again sucked from the board stocker 31 by the board transfer robot 32 and transferred to the flux application table 35 again. As in the case of the first circuit board 5 described above, each connection terminal 2 of the first circuit board 6
After the flux is applied to the substrate 2, the substrate is transferred to the substrate positioning table 36 by the substrate transfer robot 32, and the position is adjusted based on image processing using a television camera (not shown). The robot 39 is positioned at a predetermined position on the bonding stage 38 and mounted. Also in this case, the bonding stage 38 is rotated by a predetermined angle so that the next circuit board can be mounted.

Similarly, the third circuit board 7 bonded to the third semiconductor unit 4 of the liquid crystal display panel 1 is transferred from the substrate stocker 31 to the flux application table 35 by the substrate transfer robot 32 to apply the flux. It is transported to the substrate positioning table 36 and a television camera (not shown)
The first circuit board 6 is positioned at a predetermined position on the bonding stage 38 by the board mounting robot 39 and mounted.

Thus, the bonding stage 3
After positioning and mounting the three types of circuit boards 5 to 7 on 8, the liquid crystal display panel 1 accommodated in the panel stocker 33 is sucked by the panel mounting robot 34 and transported onto the panel temporary placement stage 37. After the liquid crystal display panel 1 is mounted on the panel temporary placement stage 37 and positioned based on image processing using a television camera (not shown), the liquid crystal display panel 1 is sucked again by the panel mounting robot 34. It is transported and mounted on the bonding stage 38. At this time, the connection terminals 22 of the three types of circuit boards 5 to 7 mounted on the bonding stage 38 correspond to the input terminals 19 of the three types of semiconductor units 2 to 4 bonded to the liquid crystal display panel 1. As shown in FIG. 2, they are positioned and mounted so as to overlap each other.

Thus, the three types of circuit boards 5 to 7
After the connection terminals 22 and the input terminals 19 of the three types of semiconductor units 2 to 4 of the liquid crystal display panel 1 are aligned, the bonding stage 38 is moved to move the circuit boards 5 to 7 and the semiconductor units 2 to 4. 4 is disposed below the bonding heads 41 and 42. At this time,
For example, a portion where the connection terminal 22 of the first circuit board 5 and each input terminal 19 of the first semiconductor unit 2 of the liquid crystal display panel 1 overlap is arranged below the bonding head 41, and the bonding head 41 is lowered in this state. Then, they are joined by thermocompression bonding. At this time, each input terminal 19 of the first semiconductor unit 2 is bridged by an opening (not shown) provided in the film substrate 15, and the opening is arranged on the first circuit board 5. At, the connection terminal 22 of the first circuit board 5 and the input terminal 19 of the first semiconductor unit 2 are joined. Thereafter, the bonding stage 38 is rotated by a predetermined angle (180 degrees), and the connection terminals 2 of the second circuit board 6 are rotated.
A portion where 2 and each input terminal 19 of the second semiconductor unit 3 of the liquid crystal display panel 1 overlap is arranged below the bonding head 41, and the bonding head 41 is lowered and bonded by thermocompression as described above. At this time, each input terminal 19 of the second semiconductor unit 3 is bridged by an opening (not shown) provided in the film substrate 15, and the opening is arranged on the second circuit board 6. At the second
The connection terminal 22 of the circuit board 6 and the input terminal 19 of the second semiconductor unit 3 are joined. Thereafter, the bonding stage 38 is rotated again by a predetermined angle (90 degrees),
A portion where the connection terminal 22 of the third circuit board 7 overlaps with each input terminal 19 of the third semiconductor unit 4 of the liquid crystal display panel 1 is disposed below the bonding head 42, and the bonding head 42 is moved in the same manner as described above. Lower and join by thermocompression bonding. At this time, each input terminal 19 of the third semiconductor unit 4 is bridged by an opening (not shown) provided in the film substrate 15, and the opening is arranged on the third circuit board 7. At, the connection terminal 22 of the third circuit board 7 and the input terminal 19 of the third semiconductor unit 4 are joined.

As a result, a liquid crystal display module in which the first, second, and third circuit boards 5 to 7 are joined to the respective semiconductor units 2 to 4 joined to the three sides of the liquid crystal display panel 1 is formed. become. The liquid crystal display module thus formed is once transported and mounted on the panel temporary placement stage 37 by the panel mounting robot 34, then sucked again by the panel mounting robot 34, transported to the panel stocker 33 and stored therein. Is done.

As described above, in this bonding method, the three types of circuit boards 5 to 7 are sequentially mounted from the substrate stocker 31 at predetermined positions on the bonding stage 38 by the substrate transfer robot 32 and the substrate mounting robot 39. Thereafter, the panel stocker 33 is placed on the bonding stage 38.
The liquid crystal display panel 1 to which three types of semiconductor units 2 to 4 are joined is transported by the panel mounting robot 34, and each input terminal 19 of each semiconductor unit 2 to 4 and each connection of each circuit board 5 to 7 at a time. Align the terminal 22 and then
Since the aligned portions are sequentially joined by the bonding heads 41 and 42, the manufacturing process can be simplified,
The entire process from the supply of parts to the joining can be automated, thereby improving the productivity and obtaining a product of stable quality. In particular, the alignment between the input terminals 19 of the semiconductor units 2 to 4 bonded to the liquid crystal display panel 1 and the connection terminals 22 of the circuit boards 5 to 7 is performed by image processing of a video taken by a television camera. Since the relative displacement is calculated and the displacement is automatically corrected according to the calculation result, highly accurate positioning can be performed.

[0020]

As described above, according to the present invention, at least two circuit boards are mounted on the bonding stage by the substrate mounting means and positioned in the substrate mounting step, and then each is mounted on the liquid crystal display panel in the panel mounting step. Each semiconductor unit to which the output terminal has been bonded is mounted on a bonding stage by a panel mounting means, and at a time, each input terminal of the semiconductor unit is aligned with each connection terminal of each circuit board. The stage is appropriately moved and rotated in the horizontal plane, and each input terminal of each semiconductor unit in which each output terminal is bonded to at least two sides of the liquid crystal display panel and each connection terminal of each circuit board are sequentially bonded. The manufacturing process can be simplified, and the entire process from component supply to joining can be automated. It is possible to improve the productivity, it is possible to obtain a stable quality products.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing the overall configuration of a joining apparatus suitable for the joining method of the present invention.

FIG. 2 is a cross-sectional view showing a state where a liquid crystal display panel in which a semiconductor unit is bonded on a bonding stage and respective circuit boards are positioned and mounted.

FIG. 3 is an exploded perspective view of the liquid crystal display module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2-4 Semiconductor unit 5-7 Circuit board 19 Input terminal 22 Connection terminal 34 Panel mounting robot 38 Bonding stage 39 Board mounting robot 41, 42 Bonding stage

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1345 G02F 1/13 101 G02F 1/1333 H01R 43/00

Claims (1)

(57) [Claims] 1. An input terminal of a semiconductor unit in which a plurality of output terminals are respectively joined to at least two sides of a liquid crystal display panel, and connection terminals of at least two wiring boards corresponding to two sides of the liquid crystal display panel. A bonding method of a circuit board in a liquid crystal display module, wherein one of the two circuit boards is mounted on a bonding stage by a board mounting means and positioned, and then the bonding stage is rotated by a predetermined angle. A board mounting step of mounting another circuit board on the bonding stage by the board mounting means in this state, and positioning the two circuit boards on the bonding stage. The liquid crystal display panel to which each output terminal is joined is mounted by panel mounting means, and the plurality of A panel mounting step of arranging each input terminal of the conductor unit on the connection terminal of each circuit board; and each input terminal of the plurality of semiconductor units having each output terminal joined to one side of the liquid crystal display panel. After sequentially connecting the corresponding connection terminals of the circuit board with a corresponding bonding head by a bonding head, the bonding stage is rotated by a predetermined angle, and the plurality of output terminals bonded to the other sides of the liquid crystal display panel are connected. A bonding step of sequentially bonding each input terminal of the semiconductor unit and each corresponding connection terminal of the other circuit board by the bonding head, the method comprising: bonding a circuit board in a liquid crystal display module.