JP3149038B2 - Liquid crystal display module semiconductor unit bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for joining semiconductor units of a liquid crystal display module.

[0002]

2. Description of the Related Art In a liquid crystal display module, as shown in FIG. 5, three types of semiconductor units 2 to 4 are respectively joined to three sides of a liquid crystal display panel 1, and each of the semiconductor units 2 to 4 is connected to a circuit board. When the liquid crystal display panel 1 is connected to each of the semiconductor units 2 to 4 via the respective circuit boards 5 to 7 and a drive signal is applied thereto, the liquid crystal display panel 1 operates to transfer information such as an image corresponding to the drive signal to the electro-optical device. It has a structure to display the information.

In this liquid crystal display panel 1, a large number of stripe-shaped transparent electrodes which are orthogonal to each other are formed on opposing surfaces of a pair of glass substrates 10 and 11, and drive signals are applied to these electrodes, for example, as shown in FIG. As described above, two opposite left and right sides of the lower glass substrate 10 protrude from each side of the upper glass substrate 11, and the first connection terminals 12, 13 are formed on the upper surfaces of the two protruding sides, respectively. One side behind the upper glass substrate 11 is one side behind the lower glass substrate 10.
The third connection terminal 14 protrudes from the side, and is formed on the lower surface of the protruded side.

In the semiconductor units 2 to 4 joined to the liquid crystal display panel 1, the electrodes of the semiconductor chip 22 are joined to the inner ends of the leads 21 formed on the film substrate 20, respectively. Are projected from the film substrate 20 to form a panel connection electrode 23 and a substrate connection electrode 24. The semiconductor unit 2 has a panel connection electrode 23 whose liquid crystal display panel 1
The semiconductor unit 3 has its panel connection electrode 23 bonded to the second connection terminal 13 of the liquid crystal display panel 1, and the semiconductor unit 4 has its panel connection electrode 23 connected to the first connection terminal 12 of the liquid crystal display panel 1. Three connection terminals 14 are joined.

Each of the circuit boards 5 to 7 has a structure in which a wiring lead 26 is formed on a strip-shaped substrate 25 and a connection terminal 27 is formed on each wiring lead 26. The plurality of (six in the figure) substrate connection electrodes 24 of the semiconductor unit 2 are joined to the connection terminals 27 of the circuit board 5, and the plurality (six in the figure) of connection terminals 27 of the circuit board 6 are connected to the connection terminals 27 of the circuit board 6. The substrate connection electrode 24 of the semiconductor unit 3 is joined, and a plurality of connection terminals 27 (4 in FIG.
) Of the semiconductor units 4 are joined.

In such a liquid crystal display module,
When the semiconductor units 2 to 4 are joined to the liquid crystal display panel 1, the liquid crystal display panel 1 is placed on a bonding stage movable in the X and Y directions, and the first side of one side of the liquid crystal display panel 1 Each panel connection electrode 23 of the semiconductor unit 2 is positioned on the connection terminal 12 and bonded by a bonding head. By repeating this several times, a plurality of (six in the figure) semiconductor units 2 are joined to the first connection terminals 12 of the liquid crystal display panel 1. Thereafter, when the semiconductor unit 3 is joined to the second connection terminal 13 on the other side of the liquid crystal display panel 1, the liquid crystal display panel 1 is manually connected.
Are rotated and positioned on a bonding stage, and in this state, a plurality of semiconductor units 3 are sequentially bonded in the same manner as described above. The third connection terminal 1 of the liquid crystal display panel 1
When the semiconductor unit 4 is bonded to the semiconductor device 4, the liquid crystal display panel 1 is manually turned upside down and positioned on the bonding stage, and in this state, the plurality of semiconductor units 3 are sequentially bonded as described above.

[0007]

However, in such a method of joining the semiconductor units 2 to 4 to the liquid crystal display panel 1, the semiconductor unit 2 is joined to one side of the liquid crystal display panel 1, for example, the first connection terminal 12 sequentially. After that, when the semiconductor units 3 and 4 are joined to the second connection terminal 13 or the third connection terminal 14 on the other side, respectively, the liquid crystal display panel 1 is manually rotated or turned upside down. There is a problem that a product of poor and stable quality cannot be obtained.

The present invention has been made in view of the above circumstances, and an object of the present invention is to achieve automation from supply of components to joining of a semiconductor unit to at least two sides of a liquid crystal display panel, thereby improving productivity. Another object of the present invention is to provide a bonding apparatus for a semiconductor unit of a liquid crystal display module, which can obtain a product of stable quality.

[0009]

In order to achieve the above object, the present invention provides a method for connecting a plurality of semiconductor units each having a semiconductor chip bonded to a film substrate to connection terminals exposed on at least two sides of a liquid crystal display panel. a bonding apparatus for a semiconductor unit of a liquid crystal display module for sequentially joining the terminals, X, and bonding stage provided to be movable and rotate in the Y direction, reversing of the liquid crystal display panel
And a panel turning stage for, as well as equipped with the liquid crystal display panel on the bonding stage, bonderizing
Transfer from loading stage to panel reversal stage for mounting
A panel mounting means for the unit mounting means for mounting the connection terminals of the semiconductor units on the connection terminals of the liquid crystal display panel mounted on the bonding stage, the connection terminals of the semiconductor unit is connected to a connection terminal of the liquid crystal display panel on the bonding stage And a bonding head for joining the two.

[0010]

According to the present invention, the liquid crystal display panel is mounted on the bonding stage by the panel mounting means and positioned, and the connection terminal of the semiconductor unit is positioned on the connection terminal on one side of the liquid crystal display panel by the unit mounting means. In this state, the connection terminal of the liquid crystal display panel and the connection terminal of the semiconductor unit are joined by a bonding head, and this operation is repeated a plurality of times to connect a plurality of semiconductor units to the connection terminal on one side of the liquid crystal display panel. Then, the bonding stage is rotated, the connection terminals on the other side of the liquid crystal display panel are positioned on the bonding head side, and the connection terminals of the semiconductor unit are placed on the connection terminals on the other side of the liquid crystal display panel. In the same manner as described above, the components are positioned by unit mounting means and sequentially bonded by a bonding head, thereby It is possible to automate the feed to the joining of the semiconductor unit to at least 2 sides of the liquid crystal display panel.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same parts as those in FIG. 4 are denoted by the same reference numerals, and description thereof will be omitted. FIG. 1 is a plan view showing the entire configuration of the joining apparatus of the present invention, and FIG. 2 is a left side view thereof. In these figures, 30 is a machine base. In FIG. 1, a liquid crystal display panel 1 and a panel stocker 31 for accommodating a liquid crystal display module, which is a finished product described later, are arranged above the machine base 30. The liquid crystal display panel 1 is sucked onto the panel stocker 31 and transported to a predetermined position on the machine base 30, and the liquid crystal display module arranged at a predetermined position on the machine base 30 is sucked and transported to the panel stocker 31. A panel transfer robot 32 is provided. A unit stocker 33 that accommodates three types of semiconductor units 2 to 4 is disposed on the left side of the machine base 30 in FIG. On the unit stocker 33, there is provided a unit transfer robot 34 for selecting any one of the semiconductor units 2 to 4 as needed, adsorbing it, and transferring it to a predetermined position on the machine base 30.

A bonding stage 35 is provided at a lower intermediate portion on the machine base 30 in FIG. The bonding stage 35 has a liquid crystal display panel 1 on its upper surface.
Is mounted, and in this state, it is movable in the X and Y directions and is rotatable in a horizontal plane.

A panel positioning table 36 for placing and positioning the liquid crystal display panel 1 transported by the panel transport robot 32 is disposed on the machine base 30 above the bonding stage 35 in FIG. The liquid crystal display panel 1 on the panel positioning table 36 is sucked onto the machine base 30 above the panel positioning table 36, transported to and mounted on a bonding stage 35. A panel mounting robot 38 is provided to be transported to and mounted on the reversing stage 37.

A unit positioning table 39 for mounting and positioning any of the semiconductor units 2 to 4 transferred by the unit transfer robot 34 is provided on the machine base 30 on the left side of the bonding stage 35 in FIG. The semiconductor units 2 to 4 on the unit positioning table 39 are transported to and mounted on the liquid crystal display panel 1 on the bonding stage 35 at a position near the bonding stage 35 from above the unit positioning table 39. A unit mounted robot 40 is provided. The unit positioning table 39
A bonding pedestal 41 is provided between the first and second bonding stages 35, and a bonding head 42 is disposed above the bonding pedestal 41 so as to be vertically movable.

Further, the bonding stage 3 shown in FIG.
On the machine base 30 on the right side of 5, a panel reversing stage 37 is provided. This panel reversing stage 37
As shown in FIGS. 2 and 3, a table 44 is provided with a notch 43 extending from the lower side to the vicinity of the center, and the liquid crystal display panel 1 is disposed on the upper surface. A suction head 45 for sucking the lower surface of the liquid crystal display panel 1 through the unit 43 and a holding column 46 for holding the suction head 45 are provided. Suction head 45
The rotary cylinder 48 provided with the suction part 47 at the top of the tip is held by the holding column 46 in a horizontal state. That is, the right end of the rotary cylinder 48 is provided with the holding column 46 so that the rotary cylinder 48 can move up and down through the notch 43 of the table 44 and can rotate at its upper and lower positions.
Is held in.

Next, a case where the semiconductor units 2 to 4 are joined to the liquid crystal display panel 1 by such a joining apparatus will be described.

First, the liquid crystal display panel 1 accommodated in the panel stocker 31 is sucked by the panel transfer robot 32 and mounted on a panel positioning table 36, and the liquid crystal display panel 1 is mounted on the panel positioning table 36 by a television camera (not shown). Positioning is performed based on image processing using an image (not shown). Then, the liquid crystal display panel 1 is suctioned by the panel mounting robot 38 and mounted on the bonding stage 35. At this time, the first connection terminal 1 of the liquid crystal display panel 1
2 is arranged below the bonding head 42.

Thereafter, among the semiconductor units 2 to 4 housed in the unit stocker 33, the semiconductor unit 2 to be joined to the first connection terminal 12 of the liquid crystal display panel 1 is selected and sucked by the unit transport robot 34, The semiconductor unit 2 is mounted on a unit positioning table 39,
Positioning is performed on the unit positioning table 39 based on image processing using a television camera (not shown). The panel connection electrode 23 of the semiconductor unit 2 is provided with an anisotropic conductive adhesive 50 in advance. The anisotropic conductive adhesive 50 referred to herein is a mixture of conductive particles or conductive particles having an insulating film formed on the surface of the conductive particles mixed in the insulating adhesive, and exhibits insulating properties in the plane direction. Has conductivity in the thickness direction.

Then, the semiconductor unit 2 is sucked by the unit mounting robot 40 and the bonding stage 35
It is conveyed to the liquid crystal display panel 1 mounted thereon, and the panel connection electrode 23 of the semiconductor unit 2 is placed on the first connection terminal 12 of the liquid crystal display panel 1 via the anisotropic conductive adhesive 50 as shown in FIG. To place.

In this state, the bonding head 42 is lowered to press the panel connection electrodes 23 of the semiconductor unit 2 and the first connection terminals 12 of the liquid crystal display panel 1 onto the bonding pedestal 41 for bonding. After the bonding, the bonding head 42 is raised, the bonding stage 35 is moved at a predetermined pitch, and the bonding operation of the next semiconductor unit 2 is started. By repeating the above operation several times, a plurality (6 in FIG. 5) is connected to the first connection terminal 12 of the liquid crystal display panel 1.
Semiconductor units 2 are sequentially joined.

Thus, the first liquid crystal display panel 1
After the plurality of semiconductor units 2 are joined to the connection terminals 12, the bonding stage 35 is rotated by 180 degrees, and the second connection terminals 13 of the liquid crystal display panel 1 are arranged below the bonding head 42. Then, in the same manner as described above, the unit stocker 33 outputs the second
The semiconductor unit 3 joined to the connection terminal 13 is transferred to the liquid crystal display panel 1 by the unit transfer robot 40 and the unit mounting robot 40, and the panel connection electrode 23 of the semiconductor unit 3 is connected to the second connection terminal 13 of the liquid crystal display panel 1.
Place on top. In this state, the panel connection electrode 23 of the semiconductor unit 3 and the second connection terminal 13 of the liquid crystal display panel 1 are joined by the bonding head 42. After the bonding, the bonding head 42 is raised, and the bonding stage 35 is moved at a predetermined pitch.
The joining operation starts. By repeating the above operation several times, a plurality of (six in FIG. 5) semiconductor units 3 are sequentially joined to the second connection terminals 13 of the liquid crystal display panel 1.

Further, the liquid crystal display panel 1
After a plurality of semiconductor units 2 and 3 are respectively joined to the first connection terminal 12 and the second connection terminal 13 on the two sides, the liquid crystal display panel 1 is sucked by the panel mounting robot 38 and transferred to the panel reversing stage 37. And mount it. At this time, as shown in FIG. 3, the suction head 45 is positioned below the panel reversing stage 44 in advance, and
The suction head 45 below the table 44 sucks the lower surface of the liquid crystal display panel 1 through the notch 43, and in this state, the suction head 45
4 and reaches the upper limit position.
The liquid crystal display panel 1 is turned 180 degrees to turn the liquid crystal display panel 1 upside down. After that, the suction head 45 descends and the liquid crystal display panel 1 turned upside down is placed on the table 44. The inverted liquid crystal display panel 1 is again transported and mounted on the bonding stage 35 by the panel mounting robot 38, rotated by 90 degrees by the bonding stage 35, and the third connection terminal 14 of the liquid crystal display panel 1 is set to the bonding head. Positioned below 42.

Thereafter, the semiconductor unit 4 to be joined to the third connection terminal 14 of the liquid crystal display panel 1 from the unit stocker 33 is transferred to the liquid crystal display panel 1 by the unit transfer robot 34 and the unit mounting robot 40 in the same manner as described above. Then, the panel connection electrodes 23 of the semiconductor unit 4 and the third connection terminals 14 of the liquid crystal display panel 1 are positioned and bonded by the bonding head 42. After the joining, the bonding head 42 is raised, the bonding stage 35 is moved at a predetermined pitch, and the joining operation of the next semiconductor unit 4 is started. By repeating the above operation several times, a plurality of terminals (4 in FIG. 5) are connected to the third connection terminals 14 of the liquid crystal display panel 1.
Semiconductor units 4 are sequentially joined. As a result, a liquid crystal display module is formed. The liquid crystal display module is transferred to the panel positioning table 36 by the panel mounting robot 38, and then the panel transfer robot 3
In step 2, the sheet is conveyed to and stored in the panel stocker 31.

As described above, in this joining apparatus, the semiconductor units 2 to 3 are respectively provided on the three sides of the liquid crystal display panel 1 from the supply of the components of the liquid crystal display panel 1 and the semiconductor units 2 to 4.
4 can be automated until the four are sequentially joined, whereby productivity can be improved and a product of stable quality can be obtained. In particular, the positioning of the liquid crystal display panel 1 and the semiconductor units 2 to 4
The relative positional deviation is calculated by performing image processing on the video taken by the television camera, and the panel positioning table 36 and the unit positioning table 39 automatically correct the positional deviation according to the calculation results. , High-precision positioning can be performed, and a product with extremely high precision can be obtained.

The panel connection electrodes 23 of the semiconductor units 2 to 4 and the connection terminals 12 to 14 of the liquid crystal display panel 1 are connected.
It is not always necessary to perform the bonding with the anisotropic conductive adhesive 50, and each panel connection electrode 23 and each connection terminal 12 to 14 are connected.
May be preliminarily subjected to solder plating, and the solder plating may be melted to join the two.

[0026]

As described above, according to the present invention, the liquid crystal display panel is mounted on the bonding stage by the panel mounting means, and the connection terminals of the semiconductor unit are mounted on the connection terminals on one side of the liquid crystal display panel. In this state, the connection terminals of the liquid crystal display panel and the connection terminals of the semiconductor unit are joined by a bonding head, and this operation is repeated a plurality of times. Units are joined sequentially,
Thereafter, the bonding stage is rotated to arrange the connection terminals on the other side of the liquid crystal display panel on the bonding head side, and the connection terminals of the semiconductor unit are placed on the connection terminals on the other side of the liquid crystal display panel in the same manner as described above. , By means of unit mounting means and sequential bonding by means of a bonding head, from the supply of parts to at least 2
It is possible to automate the process of joining the semiconductor unit to the side, thereby improving the productivity and obtaining a product of stable quality.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing the overall configuration of a bonding apparatus according to the present invention.

FIG. 2 is a left side view of FIG.

FIG. 3 is a perspective view showing a main part of a panel reversing stage.

FIG. 4 is an essential part cross-sectional view showing a state where the semiconductor unit is joined to the liquid crystal display panel.

FIG. 5 is an exploded perspective view of the liquid crystal display module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2-4 Semiconductor unit 12 1st connection terminal 13 2nd connection terminal 14 3rd connection terminal 23 Panel connection electrode 35 Bonding stage 37 Panel inversion stage 38 Panel mounting robot 40 Unit mounting robot 42 Bonding head

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1345 H01R 43/00

Claims (1)

(57) [Claims] 1. A bonding apparatus for a semiconductor unit of a liquid crystal display module, wherein connection terminals of a plurality of semiconductor units each having a semiconductor chip bonded to a film substrate are sequentially bonded to connection terminals exposed on at least two sides of a liquid crystal display panel. A bonding stage provided so as to be movable and rotatable in the X and Y directions, and the liquid crystal display panel is turned upside down.
And a panel turning stage for, as well as mounting the liquid crystal display panel on the bonding stage, before
From the bonding stage to the panel reversal stage
A panel mounting means for mounting and transport, the unit mounting means for mounting the connection terminals of the semiconductor units on the connection terminals of the liquid crystal display panel mounted on the bonding stage, the liquid crystal display panel on the bonding stage A bonding head for bonding the connection terminal of the semiconductor unit to the connection terminal of (b).