JP3146802B2 - Method of shutting down reflow device - Google Patents
Method of shutting down reflow deviceInfo
- Publication number
- JP3146802B2 JP3146802B2 JP27420293A JP27420293A JP3146802B2 JP 3146802 B2 JP3146802 B2 JP 3146802B2 JP 27420293 A JP27420293 A JP 27420293A JP 27420293 A JP27420293 A JP 27420293A JP 3146802 B2 JP3146802 B2 JP 3146802B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- furnace
- furnace body
- reflow device
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、運転により炉体内が高
温となったリフロー装置をできるだけ短時間で立下げ得
るようにしたリフロー装置の立下げ方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for shutting down a reflow device in which the temperature of a furnace inside becomes high due to operation, in a short time.
【0002】[0002]
【従来の技術】リフロー装置は、基板に表面実装された
電子部品を、基板の回路パターンに半田付けするために
広く用いられている。リフロー装置は、仕切壁によって
予熱ゾーン、均熱ゾーン、リフローゾーンなどに分割さ
れた炉体を有し、リフロー装置内をコンベアにより搬送
される基板は各ゾーン中にて所定温度プロファイルに従
って加熱される。ここで、リフロー装置の運転中、炉体
内の温度は最高約400℃程度に達している。2. Description of the Related Art Reflow devices are widely used for soldering electronic components surface-mounted on a substrate to circuit patterns on the substrate. The reflow device has a furnace body divided into a preheating zone, a soaking zone, a reflow zone, and the like by a partition wall, and the substrate conveyed by the conveyor in the reflow device is heated according to a predetermined temperature profile in each zone. . Here, during the operation of the reflow device, the temperature inside the furnace has reached a maximum of about 400 ° C.
【0003】ところが、炉体内においてコンベアから基
板が落下したときのように、炉体内でトラブルが発生
し、炉体内に作業者が手を入れる必要がある場合、リフ
ロー装置を立下げて、炉体内の温度を安全な温度まで下
げなければならない。[0003] However, when a trouble occurs in the furnace, such as when a substrate is dropped from a conveyor in the furnace, and an operator needs to reach into the furnace, the reflow device is lowered and the furnace is lowered. Temperature must be reduced to a safe temperature.
【0004】[0004]
【発明が解決しようとする課題】従来、このようにリフ
ロー装置を立下げるにあたっては、作業者が単にリフロ
ー装置内のヒータを切り、リフロー装置を放置して自然
に炉体内の温度が低下するまで待っていた。Conventionally, when the reflow device is lowered in this way, an operator simply turns off the heater in the reflow device and leaves the reflow device until the temperature inside the furnace naturally drops. have been waiting.
【0005】しかしながら、このようにすると、炉体内
の温度が安全な温度まで低下するまで丸一日程度の長い
時間を要し、この間運転を再開できず、リフロー装置の
稼働率が低下するという問題点があった。However, in this case, it takes a long time of about one full day until the temperature inside the furnace is lowered to a safe temperature, and during this time, the operation cannot be resumed, and the operation rate of the reflow device decreases. There was a point.
【0006】そこで本発明は、リフロー装置をできるだ
け短時間で立下げ得るリフロー装置の立下げ方法を提供
することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for lowering a reflow device, which can bring the reflow device down in as short a time as possible.
【0007】[0007]
【課題を解決するための手段】本発明は、下部炉体と、
この下部炉体に下部開閉自在に連結された上部炉体から
成る炉体を備えたリフロー装置において、炉体内の温度
を安全な温度まで下げるためのリフロー装置の立下げ方
法であって、高温状態の炉体内のヒータをOFFにする
ステップと、ファンの駆動により炉体内に外気を強制送
風することにより炉体内の温度を低下させるステップ
と、炉体内の温度が開放温度以下に低下したことを温度
センサが検知すると、上部炉体を開いて炉体を開放し、
炉体内の温度を立下げを完了してよい温度まで低下させ
るステップと、を含むものである。The present invention comprises a lower furnace body,
From the upper furnace body connected to the lower furnace body so that the lower part can be opened and closed
In a reflow device with a furnace body consisting of
The reflow device to lower the temperature to a safe temperature
Method, to turn off the heater in the furnace body in a hot state
External air is forcibly sent into the furnace by driving the step and fan
Step of lowering the temperature inside the furnace by blowing
That the temperature inside the furnace has dropped below the open temperature
When the sensor detects, open the upper furnace body and open the furnace body,
Reduce the temperature inside the furnace to a temperature at which the cooling can be completed.
And
【0008】[0008]
【作用】上記構成により、炉体内の温度よりもはるかに
低い外気が炉体内の気体と混じり合い、炉体内の温度を
急速に低下させることができる。According to the above construction, the outside air much lower than the temperature in the furnace mixes with the gas in the furnace, and the temperature in the furnace can be rapidly lowered.
【0009】[0009]
【実施例】次に図面を参照しながら、本発明の実施例を
説明する。図1は本発明の実施例に係るリフロー装置を
示す側面図であり、炉体Bのうち、1は台部Gに固定さ
れ、上方が開放された下部炉体、1aは下部炉体1の後
部に突設された突片、2はその後部に突設された突片2
aが突片1aとシャフト3により枢支されることによ
り、図1鎖線で示すように、下部開閉自在に連結される
上部炉体である。また突片2aの後部には長孔2bが開
設され、この長孔2bには、台部Gに固定された上向き
のシリンダ4のロッド4aの上端部が連結されている。
したがって、シリンダ4を駆動してロッド4aを突出さ
せると、図1実線で示すように、上部炉体2により下部
炉体1の上方を閉鎖することができる。逆にロッド4a
を没入させると、図1鎖線で示すように、シャフト3を
中心にして上部炉体2を上方へ回動させ、下部炉体1の
上方と上部炉体2の下方を開き、炉体Bを開放すること
ができる。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing a reflow apparatus according to an embodiment of the present invention. In the furnace body B, 1 is a lower furnace body fixed to a base G and an upper part is opened, and 1a is a lower furnace body 1. The protruding piece 2 protruding from the rear part is the protruding piece 2 protruding from the rear part.
The upper furnace body is pivotally supported by the protruding piece 1a and the shaft 3 so that the lower furnace part can be freely opened and closed as shown by the chain line in FIG. An elongated hole 2b is formed at the rear of the protruding piece 2a, and the upper end of the rod 4a of the upward cylinder 4 fixed to the base G is connected to the elongated hole 2b.
Accordingly, when the cylinder 4 is driven to project the rod 4a, the upper part of the lower furnace body 1 can be closed by the upper furnace body 2 as shown by the solid line in FIG. Conversely, rod 4a
1, the upper furnace body 2 is rotated upward about the shaft 3 as shown by the chain line in FIG. 1, the upper furnace body 2 and the lower furnace body 2 are opened, and the furnace body B is moved. Can be opened.
【0010】図2は同リフロー装置の縦断面図であり、
5は炉体B全体を横切って設けられ、電子部品6が搭載
された基板7を矢印N方向に搬送するコンベアである。
炉体B内には、互いに対向する仕切壁2c,1c、仕切
壁2d,1dが、上部炉体2、下部炉体1にそれぞれ設
けられ、炉体B内は、これらの仕切壁2c,1c,2
d,1dにより、矢印N方向に沿って、予熱ゾーンA
1、均熱ゾーンA2、リフローゾーンA3に分割されて
いる。H1,H2は予熱ゾーンA1内のコンベア5の上
下に配設されるヒータ、同様に、H3,H4と、H5,
H6は均熱ゾーンA2、リフローゾーンA3においてコ
ンベア5の上下に配設されるヒータである。また各ゾー
ンA1,A2,A3には、それぞれヒータH1,H3,
H5の熱を拡散するためのファン8,9,10及びこれ
らのファン8,9,10を回転させるモータM1,M
2,M3が設けられており、14は炉体B内の温度を検
出する温度センサである。11は炉体B内にN2 ガスを
供給するN2 ガス供給部、12は外気を炉体B内に送る
送風機などの空気供給部であり、これらN2 ガス供給部
11、空気供給部12の吐出側は、配管13を介して、
予熱ゾーンA1、均熱ゾーンA2、リフローゾーンA3
のそれぞれに連通している。また、V1は予熱ゾーンA
1へのN2 ガス又は空気の吐出を許否するバルブ、同様
にV2,V3は均熱ゾーンA2、リフローゾーンA3へ
の吐出をコントロールするためのバルブ、V4は空気供
給部12の吐出を許否するバルブ、V5はN2 ガス供給
部11の吐出を許否するバルブである。なお、これらの
バルブV1〜V5は電磁弁などからなる。FIG. 2 is a vertical sectional view of the reflow apparatus.
Reference numeral 5 denotes a conveyor provided across the entire furnace body B and transporting a substrate 7 on which electronic components 6 are mounted in the direction of arrow N.
In the furnace body B, opposing partition walls 2c, 1c, and partition walls 2d, 1d are provided in the upper furnace body 2 and the lower furnace body 1, respectively, and inside the furnace body B, these partition walls 2c, 1c are provided. , 2
d, 1d, along the arrow N direction, the preheating zone A
1, divided into a soaking zone A2 and a reflow zone A3. H1 and H2 are heaters disposed above and below the conveyor 5 in the preheating zone A1, similarly, H3, H4 and H5.
H6 is a heater disposed above and below the conveyor 5 in the soaking zone A2 and the reflow zone A3. The heaters H1, H3, H3 are provided in the respective zones A1, A2, A3.
Fans 8, 9, 10 for diffusing the heat of H5 and motors M1, M for rotating these fans 8, 9, 10
2 and M3 are provided, and 14 is a temperature sensor for detecting the temperature inside the furnace body B. 11 furnace N 2 gas supply unit for supplying a N 2 gas into B, 12 is the air supply, such as a blower sending the outside air into the furnace B, these N 2 gas supply unit 11, the air supply unit 12 The discharge side of
Preheating zone A1, soaking zone A2, reflow zone A3
In communication with each other. V1 is the preheating zone A
A valve for permitting or disallowing the discharge of N 2 gas or air to 1; similarly, V2 and V3 are valves for controlling the discharge to the soaking zone A2 and the reflow zone A3; A valve V5 is a valve for permitting or disallowing the discharge of the N 2 gas supply unit 11. Incidentally, these valves V1 to V5 are composed of solenoid valves and the like.
【0011】図3は同リフロー装置のブロック図であ
り、15は図4のフローチャートの処理を含む制御プロ
グラムを記憶するROM、ワークエリアが設けられたR
AM、入出力を司るインターフェース、これらを制御す
るCPUなどからなる制御部である。FIG. 3 is a block diagram of the reflow apparatus. Reference numeral 15 denotes a ROM for storing a control program including the processing of the flowchart of FIG. 4, and an R provided with a work area.
The control unit includes an AM, an interface that controls input / output, and a CPU that controls these.
【0012】図4は制御部15における処理の流れを示
すフローチャートであり、このフローチャートに沿って
本実施例のリフロー装置の立下げ方法を説明する。まず
炉体B内が高温である状態から、立下げの処理が開始さ
れると、まず各ゾーンA1,A2,A3のヒータH1〜
H6への通電がカットされる(ステップ1)。また制御
部15は、モータM1〜M3を駆動してファン8〜10
を回転させる(ステップ2)。そして空気供給部12を
駆動して外気を強制送風できるようにし(ステップ
3)、バルブV1,V2,V3,V4を全開として(ス
テップ4)、炉体B内に炉体B内の温度よりもはるかに
低い外気を強制送風する。これにより炉体B内の温度は
急激に低下し始める。そして制御部15は、温度センサ
14の出力を監視し、開放温度(約150℃程度)以下
になるまでこの状態を保持する(ステップ5)。ここ
で、各ゾーンA1,A2,A3に外気が強制送風される
が、このときファン8〜10が回転しているので、炉体
B内の高温の気体と外気とが十分に攪拌される。FIG. 4 is a flowchart showing the flow of processing in the control unit 15, and a method for shutting down the reflow apparatus of the present embodiment will be described with reference to this flowchart. First, when the process of shutting down is started from a state where the inside of the furnace body B is at a high temperature, the heaters H1 to H1 of the zones A1, A2, A3 are firstly set.
The energization to H6 is cut off (step 1). The control unit 15 drives the motors M1 to M3 to drive the fans 8 to 10
Is rotated (step 2). Then, the air supply unit 12 is driven so that the outside air can be forcibly blown (step 3), and the valves V1, V2, V3, and V4 are fully opened (step 4). Forcibly blow much lower outside air. As a result, the temperature inside the furnace body B starts to rapidly decrease. Then, the control unit 15 monitors the output of the temperature sensor 14 and holds this state until the temperature becomes equal to or lower than the open temperature (about 150 ° C.) (step 5). Here, outside air is forcibly blown to each of the zones A1, A2, and A3. At this time, since the fans 8 to 10 are rotating, the high-temperature gas in the furnace B and the outside air are sufficiently stirred.
【0013】そして温度センサ14が上記開放温度以下
になったことを検知すると、制御部15はシリンダ4を
駆動して、ロッド4aを突出させ、図1鎖線で示すよう
に、上部炉体2を開き、炉体Bを開放する(ステップ
6)。これにより、配管13だけでなく、リフロー装置
の周囲の外気が上部炉体2と下部炉体1との間から炉体
B内に進入する。もちろん、リフロー装置周囲の外気の
体積は、炉体B内の気体の体積よりもはるかに多いの
で、炉体B内はさらに急速に冷却される。そして制御部
15は、再度温度センサ14の出力を監視し、炉体B内
が立下げを完了してよい温度(約60℃程度)まで低下
したことを確認し(ステップ7)、空気供給部12を停
止し(ステップ8)、バルブV1〜V4を閉じ(ステッ
プ9)、モータM1〜M3を停止して(ステップ1
0)、立下げを完了する。When the temperature sensor 14 detects that the temperature is equal to or lower than the above-mentioned open temperature, the control unit 15 drives the cylinder 4 to project the rod 4a, and as shown by the chain line in FIG. Open and open the furnace body B (step 6). Accordingly, not only the pipe 13 but also the outside air around the reflow device enters the furnace body B from between the upper furnace body 2 and the lower furnace body 1. Of course, since the volume of the outside air around the reflow device is much larger than the volume of the gas in the furnace B, the inside of the furnace B is cooled more rapidly. Then, the control unit 15 monitors the output of the temperature sensor 14 again, confirms that the temperature inside the furnace body B has decreased to a temperature (about 60 ° C.) at which the shutdown can be completed (Step 7), 12 are stopped (step 8), the valves V1 to V4 are closed (step 9), and the motors M1 to M3 are stopped (step 1).
0), shutdown is completed.
【0014】[0014]
【発明の効果】以上説明したように本発明によれば、高
温状態の炉体内の気体に、炉体内よりもはるかに低温の
外気を強制的に混合して、急速に炉体内の温度を低下さ
せ、迅速な立下げ処理を行うことができる。このため、
立下げ処理により、リフロー装置の稼働率が大幅に低下
しないようにすることができる。As described above, according to the present invention, a high
The temperature inside the furnace can be rapidly lowered by forcibly mixing the outside air at a much lower temperature than the inside of the furnace with the gas in the furnace in the warm state, and a quick shutdown process can be performed. For this reason,
The shutdown processing can prevent the operation rate of the reflow device from being significantly reduced.
【図1】本発明の実施例に係るリフロー装置の側面図FIG. 1 is a side view of a reflow device according to an embodiment of the present invention.
【図2】本発明の実施例に係るリフロー装置の縦断面図FIG. 2 is a longitudinal sectional view of a reflow device according to an embodiment of the present invention.
【図3】本発明の実施例に係るリフロー装置のブロック
図FIG. 3 is a block diagram of a reflow device according to an embodiment of the present invention.
【図4】本発明の実施例に係るリフロー装置の立下げ方
法を示すフローチャートFIG. 4 is a flowchart illustrating a method for shutting down a reflow device according to an embodiment of the present invention.
1 下部炉体 2 上部炉体 4 シリンダ 12 空気供給部 14 温度センサ B 炉体 DESCRIPTION OF SYMBOLS 1 Lower furnace body 2 Upper furnace body 4 Cylinder 12 Air supply part 14 Temperature sensor B Furnace body
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 3/34 B23K 1/008 B23K 31/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/34 B23K 1/008 B23K 31/02
Claims (1)
に連結された上部炉体から成る炉体を備えたリフロー装
置において、炉体内の温度を安全な温度まで下げるため
のリフロー装置の立下げ方法であって、高温状態の炉体
内のヒータをOFFにするステップと、ファンの駆動に
より炉体内に外気を強制送風することにより炉体内の温
度を低下させるステップと、炉体内の温度が開放温度以
下に低下したことを温度センサが検知すると、上部炉体
を開いて炉体を開放し、炉体内の温度を立下げを完了し
てよい温度まで低下させるステップと、を含むことを特
徴とするリフロー装置の立下げ方法。1. A lower furnace body and a lower openable / closable lower body.
Reflow device with a furnace body consisting of an upper furnace body connected to
To reduce the temperature inside the furnace to a safe temperature
The method for shutting down a reflow device according to claim 1, wherein the furnace body is in a high temperature state.
To turn off the heater inside and to drive the fan
The temperature inside the furnace is increased by forcibly blowing outside air into the furnace.
The temperature in the furnace is below the opening temperature.
When the temperature sensor detects that the temperature has dropped below,
Open the furnace body to complete the temperature reduction in the furnace body
Lowering the temperature to an acceptable temperature .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27420293A JP3146802B2 (en) | 1993-11-02 | 1993-11-02 | Method of shutting down reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27420293A JP3146802B2 (en) | 1993-11-02 | 1993-11-02 | Method of shutting down reflow device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07131148A JPH07131148A (en) | 1995-05-19 |
| JP3146802B2 true JP3146802B2 (en) | 2001-03-19 |
Family
ID=17538462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27420293A Expired - Fee Related JP3146802B2 (en) | 1993-11-02 | 1993-11-02 | Method of shutting down reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3146802B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021129126B4 (en) * | 2021-11-09 | 2024-02-01 | Ersa Gmbh | Soldering system, in particular a reflow soldering system, with a cover and drive unit for opening and/or closing the cover |
| CN116921803A (en) * | 2023-07-31 | 2023-10-24 | 南京航空航天大学 | Multifunctional vacuumizing device for vacuum reflow oven |
-
1993
- 1993-11-02 JP JP27420293A patent/JP3146802B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07131148A (en) | 1995-05-19 |
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