JP3189607B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus that automatically mounts electronic components on a substrate, an operation of mounting the electronic components on a substrate is performed after checking the displacement of the electronic components by an observation unit such as a camera. Here, when the image of the electronic component is captured by the observation unit, a reflective background plate is arranged behind the nozzle that sucks the electronic component, and the background behind the electronic component is brightened, so that a clear silhouette of the electronic component is obtained. There is something devised to obtain.

However, recently, large electronic components such as connectors have been automatically mounted by an electronic component mounting apparatus. However, in the conventional electronic component mounting apparatus, QFP
A background plate of just a good size is used as a background for a medium-sized electronic component such as the one described above, and as it is, it cannot be used for a large-sized electronic component such as a connector.

[0004]

Here, it is conceivable that the field of view of the observation section is simply enlarged in accordance with a large electronic component, and the background plate behind the nozzle is also enlarged accordingly. However, the background plate moves at high speed through each stage of the electronic component mounting apparatus integrally with the nozzle. When the size of the background plate is increased, interference with other members of the electronic component mounting apparatus is likely to occur. Improper. Further, simply enlarging the field of view of the observation unit has a problem that the actual resolution is reduced and the accuracy of position recognition becomes insufficient.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus capable of responding to electronic components of various sizes, without increasing the overall size of the background plate.

[0006]

According to the electronic component mounting apparatus of the present invention, a background plate for reflecting light is provided in a small portion behind a nozzle, and a light source for a light source is directed toward these background plates.
A moving unit for irradiating light and moving each background plate toward and away from the nozzle, and a control unit for controlling the moving unit according to the size of the electronic component currently being sucked by the nozzle are provided.

[0007]

With the above arrangement, the plurality of background plates are separated from the nozzle only when observing the large electronic component, and the background plate is moved behind the characteristic portion of the large electronic component. Observation can be performed with a high resolution, and in other cases, interference with other members can be avoided by bringing a plurality of background plates close to each other.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a base, 2 is a frame erected on the base 1, 3 is an X table mounted on the frame 2, 4 is a Y table connected to the lower part of the X table 3, HB Is a head box provided on the Y table 4 for accommodating the transfer head 5 (see FIG. 2), and 6 is a nozzle elevating unit U built in the transfer head 5 (see FIG. 3).
Is a nozzle that moves up and down. A is a supply unit provided on the base 1, of which 7 is a tray for supplying a large electronic component PL, and 8 is a small electronic component PS (QFP for convenience).
This is a tape feeder that supplies small electronic components including medium-sized electronic components. Further, at a central portion of the base 1, as a positioning portion B, a pair of transport rails 9 are provided along the X direction to transport and position the substrate 10,
Between the supply section A and the substrate 10 (during the movement of the transfer head 5)
1 including a camera CA and a light source LG (see FIG. 4)
1 is provided.

FIG. 2 is a front view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention. 12 is a guide rail fixed horizontally on the front surface of the head box HB along the X direction, and 13 and 14 are sliders 15 and 1 slidably engaged with the guide rail 12 at intervals.
6 and is movable in the direction of arrow N1. The upper ends of the arms 13 and 14 are connected symmetrically with respect to the nozzle 6 to a timing belt 19 tuned to pulleys 17 and 18 rotatably supported on the left and right sides of the head box HB. The pulley 17 is driven by an opening / closing motor M to open and close. Further, a left background plate 20 and a right background plate 21 facing the nozzle 6 side are fixed horizontally to lower ends of the arms 13 and 14, respectively. Here, the left background plate 20 and the right background plate 21 have a characteristic of diffusing light, and a conventional background plate (size for the background of a component such as QFP) is placed on the left and right sides of the nozzle 6 around the nozzle 6. It is divided. Therefore, when the opening / closing motor M is driven, the left background plate 20 and the right background plate 21 can be moved symmetrically (approach / separation) about the nozzle 6 by rotating the pulleys 17 and 18. Thus, the back of the nozzle 6 can be opened and closed. In this embodiment, the opening / closing motor M, pulleys 17 and 18,
The timing belt 19 constitutes moving means for moving the background plates 20 and 21.

FIG. 3 is a block diagram of an electronic component mounting apparatus according to one embodiment of the present invention. In FIG. 3, reference numeral 30 denotes a CPU as a control unit for controlling the whole, and 31 stores a control program executed by the CPU 30 in addition to a size of each electronic component (including a size of an electronic component currently sucked by the nozzle 6). 32, a drive circuit for driving the opening / closing motor M; 33, an axis controller for driving the X table 3 and the Y table 4; 34, recognition for performing pin position detection and the like on an image obtained by the camera CA. Circuit.

The electronic component mounting apparatus of this embodiment has the above-described configuration. Next, the operation of the camera CA when capturing an image will be described with reference to FIGS. First, as shown in FIG. 4, when the nozzle 6 is sucking the large electronic component PL, the CPU 30 controls the opening / closing motor M to open the left background plate 20 and the right background plate 21. Then, the image of the large electronic component PL is divided into two regions so that a sufficiently high resolution can be obtained. Specifically, as shown in FIG. 4, light from the light source LG is first applied to the left background plate 20 among the opened background plates, and the camera CA captures an image. Then, an image of the left end portion of the large electronic component PL is obtained in the visual field V1 as shown on the left side of FIG. Then, light is applied to the right background plate 21 to obtain an image of the right end of the large electronic component PL in the visual field V2 as shown on the right side of FIG. Here, the movement state of the nozzle 6, that is, the movement state of the transfer head 5, is always grasped by the CPU 30 that controls the axis control unit 33. It is possible to know the displacement amount of the entire electronic component PL.

On the other hand, as for the small electronic component PS, as shown in FIG. 6, the left background plate 20 and the right background plate 21 are closed with the nozzle 6 as the center, and the left background plate 20 and the right background plate 21 are separated from the light source LG.
, And images are taken in one visual field V3 at a time as shown in FIG.

[0014]

According to the electronic component mounting apparatus of the present invention, a background plate for reflecting light is provided in a small portion behind the nozzle, and light from a light source is directed toward these background plates.
To, also the closing means to approach / separate from each background plate to the nozzle, the size of the electronic components that are adsorbed to the current nozzle
Since a control unit for controlling the opening / closing means is provided according to the size, it is necessary to open / close the background plate as necessary to accommodate electronic components of various sizes, without increasing the substantial size of the entire background plate. Can be.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a diagram illustrating an observation operation of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is an explanatory view of an observation operation of the electronic component mounting apparatus in one embodiment of the present invention.

FIG. 6 is a diagram illustrating an observation operation of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 7 is an explanatory view of an observation operation of the electronic component mounting apparatus in one embodiment of the present invention.

[Explanation of symbols]

 6 Nozzle 20 Left background plate 21 Right background plate M Opening / closing motor

Claims (2)

(57) [Claims] 1. A positioning unit for positioning a substrate, a supply unit for supplying electronic components of various sizes, and a nozzle for sucking electronic components from the supply unit and mounting the electronic components on the substrate positioned on the positioning unit. A transfer head, a camera and a light source for observing electronic components adsorbed on the nozzles
An observing unit including: a light-reflecting background plate provided in a plurality of subdivided portions behind the nozzle, and the light source directed toward these background plates;
And a control unit for controlling the moving unit in accordance with the size of an electronic component currently being sucked by the nozzle. An electronic component mounting apparatus comprising: 2. The apparatus according to claim 1, wherein the background plate is provided at right and left sides with respect to the nozzle.
2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is divided into two parts.