JP3255142B2 - Pickup device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for picking up a chip-shaped object, and more particularly to a pick-up apparatus in a die bonding technique for mounting a semiconductor chip or the like on a lead frame or a substrate.

[0002]

2. Description of the Related Art A chip pick-up device in a die bonding technique is provided with a chip holding device such as a vacuum chuck for holding a chip. When joining the semiconductor chip together with a scrub operation (mechanical rubbing operation), a dedicated jig (hereinafter referred to as a collet) according to the size of the chip to be gripped is provided at the tip of the vacuum chuck. Each time the chip size was changed, the collet was replaced with a collet matching the size of the chip. Furthermore, mounting a chip on a lead frame requires positional accuracy. Therefore, every time the collet is replaced,
Since it is necessary to adjust the position of the chip pickup position, the labor and time required for collet replacement are burdensome.

As an example for solving such a problem, Japanese Patent Laid-Open Publication No. Hei 6-37124 discloses the following apparatus. This conventional example is shown in FIG. A fixed table 2 is provided at the tip of the vacuum chuck without using a replaceable collet as a chip holding device. At the center thereof, there are provided an opening 4 for adsorbing a chip, and chip position adjusting frames 3a to 3d for fixing four sides of a chip periphery whose position can be adjusted,
The chip position adjusting frames 3a to 3d are fixed at desired positions using the lever 6 and the nut 7 according to the chip size and the pickup position. When the chip is replaced, the chip position adjusting frames 3a to 3d are again positioned and adjusted according to the size of the replaced chip and the pickup position of the chip, and fixed.

[0004]

However, in the above-mentioned conventional apparatus, the trouble of exchanging the collet every time the chip size is different can be omitted. However, the position adjustment frames 3a to 3c are still used in accordance with the chip size and the chip pickup position. 3d must be adjusted, which requires time and effort. In addition, the chip gripping device is provided vertically below the pickup device, and it is difficult to visually confirm the chip position adjustment frame when performing position adjustment. It is difficult to perform the adjustment, and furthermore, the positioning adjustment requires time and effort.

Further, the position adjusting frames 3a to 3d
When the tip gripping device is heated and used, it is difficult to turn the bolts and nuts due to the galling between the metals due to the difference in the coefficient of thermal expansion between the metals when the chip gripping device is heated and used. In some cases, the adjustment frame cannot be adjusted, and the semiconductor chip cannot be replaced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pickup device capable of easily changing a collet and maintaining reproducibility of a collet position.

Another object of the present invention is to provide a pickup apparatus of a semiconductor chip enable easy replacement of the collet be heated using collet.

[0008]

A pickup device according to the present invention has at least a substantially columnar shape and a tip-shaped object at a tip.
And replaceable collet to pick up an object, the Kore
Configuration and a holding means for detachably holding the Tsu bets
It is, the holding means comprises a fixed plate having a predetermined thickness, which is fixed to the fixed plate, substantially equal and spacing of the contact walls
In There thickness, the side plan, cut-out said co collet axial section V-shaped in a direction perpendicular to the fixed plate surface
A positioning block formed as a positioning contact part for contacting with the contacting plane of Rett, the positioning
The position is opposite to the positioning contact portion of the block.
Is biased closing direction against the-decided Me contacting portion, the collet
When the mating surface abuts against the pressed surface of the collet,
Collet for securing the let to the positioning block
And preparative pressing, the positioning blocks the collet retainer
And switching means. Used to separate from the click, characterized in that it consists.

The positioning contact portion of the holding means and the collet
The Align surface, the two contacting plane and pressed flat surface of collet respectively corresponding fixed plate contact wall of the collet
By fitting and holding the end of the collet , the reproducibility of the alignment of the collet can be maintained even when the collet is replaced. In addition, no galling occurs even when the collet is heated.

Further, since the pressing member for pressing the collet can be opened and closed by the opening and closing means, the exchange of the collet becomes easy.

[0011] In further configurations and be Rukoto having a position adjusting means for positioning the holding means in a horizontal direction and a rotating direction, the pick-up position can be accurately adjusted. Once the positioning of the holding means is performed by the position adjusting means, the reproducibility of the alignment of the collet can be maintained even if the collet is replaced, so the time required for picking up semiconductor chips of different sizes is greatly increased. Can be shortened.

[0012]

FIG. 1 is a perspective view showing a schematic structure of a die bonding facility incorporating an embodiment of a pickup device according to the present invention. Pickup device 1 of the present embodiment provided in die bonding equipment
01 consists collet holding portion 102 and the positioning adjustment unit 103, collet holder 102 holds the collet 105 for adsorbing the semiconductor chip 104, positioning adjustment section 103 of the collet 105 in accordance with the pick-up position of the chip The position can be adjusted. The pickup device 101 is movable in the direction of arrow D110 (vertical direction) and the direction of arrow D111 (horizontal direction) by the transport mechanism 106, and the semiconductor chip 1
04 can be picked up and mounted on a lead frame (or substrate) 109 on a conveyor 108.

FIG. 2 is an exploded perspective view showing the configuration of the position adjustment unit in the pickup device of the present embodiment. The positioning adjustment unit 103 includes the pickup device 101
A block 201 for fixing to the transport mechanism 106,
It has an upper connection plate 202 and a lower connection plate 203 which are relatively movable with respect to the block 201. The plate-like portion of the block 201 extending in the horizontal direction has a thickness
Oval whose cross-section is long in the direction of arrow D213
Three through holes 201B form are provided, the through holes 201
B in are passed through the threaded portion of the fixing screw 201A may be fixed at a desired position of the upper connecting plate 202 in a screwed allowed through hole 201B to. Further, in block 201,
Three relatively large through holes 201C are formed so that the lower connection plate 203 can rotate.

The upper connection plate 202 has three through holes 2
02A is provided, and a fixing screw 202 is provided in each through hole 202A.
B can be penetrated and the lower connection plate 203 can be fixed at a desired position in the through hole 202A. Each fixing screw 20
The head of 2B is accommodated in a corresponding through-hole 201C provided in the block 201.

Further, the upper connection plate 202 has an arrow D
A groove 206 extending in the direction of arrow D213 orthogonal to both 110 and D111 is formed on one side end upper surface ,
The block 201 can be translated along the groove 206. Block 2 of upper connection plate 202
The position in the direction of arrow D213 with respect to 01 can be adjusted by the horizontal position adjustment screw 207. Specifically, the adjustment plate 207A is fixed to the upper connection plate 202,
The horizontal position adjustment screw 20 is inserted into the screw hole of the adjustment plate 207A.
7, the tip of the horizontal position adjustment screw 207 is in contact with the front surface 207B of the block 201. As shown in the drawing, the horizontal position of the upper connection plate 202 is changed by the arrow D21 by changing the position of the tip by turning the horizontal position adjustment screw 207.
It can be adjusted in three directions .

Further, a pin 208 is fixed to the center of the upper connection plate 202, and a lower portion of the pin 208 is fitted in the center of the lower connection plate 203, whereby the lower connection plate 203 is fixed to the upper connection plate 202. 3 can be rotated about the pin 208 (arrow D2 in FIG. 3).
14 directions) .

The position of the lower connection plate 203 with respect to the upper connection plate 202 in the direction of the arrow D214 can be adjusted by a rotation position adjustment screw 209. More specifically, the rotation position adjustment unit 209A is fixed to one end of the lower connection plate 203, and the rotation position adjustment screw 209 has a screw hole through which the rotation position adjustment unit 209A passes. The tip of the rotation position adjusting screw 209 is connected to the groove 20 of the upper connection plate 202.
6 abuts against the abutting portion 209B fixed on the opposite side,
The rotational position of the lower connection plate 203 with respect to the upper connection plate 202 is determined. Therefore, by turning the rotation position adjusting screw 209 to change the tip position, the lower connection plate 203 is rotated.
Of the upper connection plate 202 can be adjusted.

As will be described later, since the collet holding portion 102 is fixed below the lower connection plate 203, the collet holding portion 102 is adjusted by the horizontal position adjusting screw 207 in the horizontal direction D213 to adjust the horizontal position. The set horizontal position is fixed by the fixing screw 201A. continue,
The rotational position in the direction of arrow D214 is adjusted by the rotational position adjusting screw 209, and the adjusted rotational position is
02B.

FIG. 3 is an exploded perspective view showing the structure of the collet holding portion in the pickup device of the present embodiment. The collet holding portion 102 includes a positioning block 210 for fixing the collet 105 at a predetermined position between the head cover 204 and the fixing plate 205, a collet retainer 211 for holding the collet 105 from falling off, and a collet 105. Lever 21 for removal
2 are provided. The upper surface of the head cover 204
The lower connection plate 203 of the positioning adjustment unit 103 described above.
Fixed to

When the lever 212 is turned in the direction of arrow D215, the collet press 211 rotates and a gap is formed between the collet press 211 and the positioning block 210. by this,
The collet 105 can be easily attached and detached. to this
The details will be described later.

FIG. 4 shows the positioning adjustment unit 103 shown in FIG.
FIG. 4 is a cross-sectional view illustrating an overall configuration of a pickup device in which the collet holding unit 102 illustrated in FIG. As described above, the collet 105 can be easily attached and detached by turning the lever 212. The horizontal direction D2 of the collet 105 is adjusted by the horizontal position adjustment screw 207 of the position adjustment unit 103.
13, the horizontal position is fixed by the fixing screw 201A. Then, the rotation position adjusting screw 209
Thus, the rotational position of the collet 105 is adjusted, and the adjusted rotational position is fixed by the fixing screw 202B. Therefore, it is important for the alignment process that the collet 105 is held by the collet holding portion 102 such that the center axis of the pin 208, which is the center of the rotational position adjustment, always coincides with the center axis of the collet 105 of the collet holding portion 102. Becomes

[0022] Hereinafter, collet that such collet positioning can be maintained during their collet exchange with reference to FIGS. 5 to 8
Main part of the preparative holding portion 102 further on (collet holding mechanism)
This will be described in detail.

[0023] Figure 5 is a plan view showing the configuration of the collet retaining mechanism in this embodiment, FIG. 6 is a sectional view along line A-A in FIG. 5, FIG. 7 is sectional view taken along line B-B in FIG. 6, and 8 FIG. 3 is an exploded perspective view of a positioning block 210 and a lever 212 portion. Positioning block 210 is fixed plate 2
05. One end of the collet retainer 211 is connected to a positioning block 210 through a shaft 301 and is rotatable about the shaft 301. A torsion spring 302 is provided around the shaft 301 for urging the collet press 211 with a sufficiently strong force in a direction to close the gap between the collet press 211 and the positioning block 210. As will be described later, the collet holding force of the torsion spring 302 is preferably 700 g or more in order to allow the semiconductor chip to be attracted by mounting the collet 105.

As shown in FIG. 8, the end of the lever 212 opposite to the handle is rotatably connected to a positioning plate 210 through a shaft 303, and the position of the lever closer to the handle than the shaft 303 is shifted through a shaft 306 to the intermediate plate 304. It is rotatably connected to one end. The other end of the intermediate plate 304 is rotatably connected via a shaft 305 to an end of the collet retainer 211 opposite to the shaft 301 (see FIG. 5). Accordingly, when the lever 212 is pushed in the direction of arrow D215, the collet presser 211 rotates around the shaft 301 in the direction of arrow D216 against the urging force of the torsion spring 302. Therefore, the collet 105 is opened, and attachment / detachment becomes easy.

Conversely, when the lever 212 is left unattended,
Collet mating surface 310 of the collet retainer 211 by the biasing force of the torsion spring 302 is pressed and fixed chamfer of the collet 105 and (pressed flat) 401 to contact with the positioning block 210 side. Since the lever 212 and the collet presser 211 are connected by the link mechanism in this manner, the lever 212 can be opened and closed with a small force, and the collet 105 can be easily attached and detached.

As shown in FIG. 8, the positioning block 210 contacts a contact portion of the collet 105 , which will be described later, and
V-shaped positioning for positioning Rett horizontally
A contact portion 308 is formed, and an intake hole 309 for sucking the semiconductor chip is provided at the center thereof. The upper and lower surfaces of the positioning contact portion 308 are used to position the collet 105 in the vertical direction, as described below.

FIG. 9 is a perspective view showing an example of the collet used in the present embodiment. The collet 105 in the present embodiment has one of the side tops of the substantially quadrangular prism-shaped body.
Has a substantially pentagonal prism shaped body as you listen chamfered, the pentagonal columnar body side surface of the collet 105, the positioning block 2
A protrusion is formed that matches the ten V-shaped positioning contacts 308 . That is, V-shaped parallel to the collet axis
Sides of adjacent collet 105 Jo to intersect each other, the contact
Formed as two contact planes as projections
I have. An upper flange 40 is provided in front of the upper surface of the collet body.
2. A lower flange 403 is provided at a position separated from the upper flange 402 by a predetermined distance downward.
As a result, a predetermined distance in the collet axial direction is
The collet axis is perpendicular to the collet axis and is outside the collet axis.
Flange 402 and lower flange 40 extending to
A contact wall is formed as the opposing surface of No. 3. In addition,
The contact wall at the top of the protrusion (intersection of the contact plane)
An exhaust hole 405 is provided at a substantially central portion between them. Body
Collet suction at the lower end to hold the semiconductor chip
A unit 404 is provided. The space from the exhaust hole 405 to the collet suction portion 404 is hollow. The contact plane
The intersection (the chamfer) on the opposite side of the collet axis is
Functions as a pressed plane 401 parallel to the cut axis,
The pressing member 211 is in contact with the pressing member 211 and is pressed. Also collet
It is also used to determine the orientation when the 105 is mounted. this
As shown in the figure, the collet is
It has a chamfer as the pressing plane 401. This pushed
When the pressure plane 401 is pressed by the collet retainer 211 with a force of 700 g or more, the protrusion having the exhaust hole 405 comes into contact with the V-shaped positioning contact portion 308 of the positioning block 210 to enable the semiconductor chip to be attracted. I do.

Such a V-shaped positioning contact portion 308
If the collet has the suction flange 404 of any size as long as the collet has the upper flange 402 and the lower flange 403 in common, the collet holding unit 1
02 can be mounted while maintaining position reproducibility.

FIG. 10 is a side sectional view of the collet holding mechanism holding the collet 105 shown in FIG. As shown in the figure, the collet 105 can be easily positioned vertically by sandwiching the positioning block 210 between the upper flange 402 and the lower flange 403. The upper flange 402 and the lower flange 403 are connected to the intake hole 309 on the positioning block 210 side and the exhaust hole 4 of the collet 105.
05 are formed so as to coincide with each other.

As described above, the lever 212 is moved by the arrow D2.
The collet can be easily exchanged for another one by pushing in the 15 direction to move the collet retainer 211 backward. At this time, the upper flange 402 of the collet 105
Between the positioning flange 210 and the lower flange 403
The collet 105 can be positioned in the horizontal direction and the vertical direction only by abutting the projection of the collet 105 against the positioning contact portion 308 so as to sandwich the collet 105. Thereafter, the release lever 212, the collet retainer 21 presses the pressed flat 4 01 of the collet 105, collet 105
Can be fixed in a positioned state. Therefore, reproducibility of positioning can be maintained even when the collet is replaced.

Further, even in a pickup device in which the heater is heated directly above the collet 105, the collet 105 is similarly heated because no galling occurs between the collet 105 and the collet retainer 211 or the positioning block 210 due to heating. Easy attachment and detachment.

As described above, the collet holding portion 102 of the present embodiment can not only easily replace the collet, but also can maintain the reproducibility of positioning even when the collet is replaced. Such a collet holding portion 102 is fixed to a lower connection plate 203 of the positioning adjustment portion 103 as shown in FIG. Therefore, as described above,
The horizontal position adjustment screw 207 of the positioning adjustment unit 103 adjusts the position of the collet 105 in the horizontal direction D213, and the horizontal position is fixed by the fixing screw 201A. Subsequently, the rotational position of the collet 105 is adjusted by the rotational position adjusting screw 209, and the adjusted rotational position is fixed by the fixing screw 202B. Finally, arrow D
Positioning in the 111 direction can be performed by the transport mechanism 106. That is, the positioning in the direction of arrow D111 is performed by controlling the drive motor in the transport mechanism 106.

In this manner, the collet 105 is positioned three-dimensionally (arrow D110, arrow D110, and arrow D21).
In addition to 3), the rotation position setting (arrow D214) can be easily realized. This alignment only needs to be performed once at the beginning. This is because the reproducibility of the position due to the collet exchange is maintained by the collet holding unit 102 of the present embodiment.

In the above embodiment, the collet press 211
Is applied by the torsion spring 302, but a similar effect can be produced by providing a tension spring between the intermediate plate 304 and the lever 212. At this time, the shape of the head cover 204 may be changed to secure a space for installing the extension spring.

[0035]

As described in detail above, according to the present invention, the positioning contact portion and the positioning surface of the holding means are colleted.
A predetermined contact portion and a predetermined surface of the kit ( pickup means ) are held in correspondence with each other. For this reason, even if the collet is replaced, the reproducibility of the alignment of the collet can be maintained, and even if the collet is heated, galling between the metals does not occur.

Furthermore, in order by the opening and closing means to open and close the collet retainer for pressing the collet, replacement of the collet is facilitated.

By further providing a position adjusting means for adjusting the position of the holding means in the horizontal and rotational directions, the pickup position can be adjusted with high precision. Furthermore, once the positioning of the holding means is performed by the position adjusting means, the reproducibility of the alignment of the collet can be maintained even if the collet is replaced, so that the time required for the step of picking up semiconductor chips of different sizes is required. Can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a die bonding facility incorporating one embodiment of a pickup device according to the present invention.

FIG. 2 is an exploded perspective view showing a configuration of a positioning adjustment unit in the pickup device of the embodiment.

FIG. 3 is an exploded perspective view illustrating a configuration of a collet holding unit in the pickup device of the embodiment.

4 is a cross-sectional view showing an overall configuration of a pickup device in which a positioning adjustment unit 103 shown in FIG. 2 and a collet holding unit 102 shown in FIG. 3 are connected.

FIG. 5 is a plan view illustrating a configuration of a collet holding mechanism according to the embodiment.

6 is a sectional view of the collet holding mechanism shown in FIG. 5 taken along line AA.

FIG. 7 is a sectional view taken along line BB of the collet holding mechanism shown in FIG. 5;

FIG. 8 is an exploded perspective view of a positioning block 210 and a lever 212 portion.

FIG. 9 is a perspective view showing an example of a collet used in the present embodiment.

10 is a side sectional view of a collet holding mechanism holding the collet 105 shown in FIG.

FIG. 11 is a plan view (A) and a side cross-sectional view (B) showing the configuration of a conventional chip positioning device.

DESCRIPTION OF SYMBOLS 101 Pickup device 102 Collet holding unit 103 Position adjustment unit 104 Chip 105 Collet 107 Chip supply unit 108 Conveyor 109 Lead frame 201 Block 202 Upper connection plate 203 Lower connection plate 204 Head cover 205 Fixed plate 206 Groove 207 Horizontal position Adjusting screw 208 Pin 209 Rotational position adjusting screw 210 Positioning block 211 Collet presser 212 Lever 301 Shaft 302 Torsion spring 303 Shaft 304 Intermediate plate 305 Shaft 306 Shaft 308 Positioning contact portion 309 Inlet hole 310 Collet mating surface 401 Pressed flat surface ( chamfered portion ) 402 Upper flange 403 Lower flange 404 Chip suction section 405 Intake hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/52 H05K 13/04

Claims (5)

(57) [Claims] 1. A meet pickup apparatus for picking up a chip-shaped object, at least, pick tip-like object with the tip at a substantially prism shape
And interchangeable collet to be up, detaching the collet
Holding means for holding the sheet so as to be capable of being held, and a side face of the collet is flat on a collet shaft as a contact portion.
Two contact planes that cross each other in a V-shape
On the collet axis on the opposite side of the intersection line of the contact plane to the collet axis
A parallel pressed plane is formed, and furthermore,
Is on the collet shaft at a predetermined distance in the collet axial direction.
A contact wall is formed that extends perpendicular to the outside of the collet axis.
Cage, said retaining means includes a fixed plate having a predetermined thickness, wherein fixed to the fixed plate, the distance between the contact walls
With a substantially equal thickness, a notch having a V-shaped cross section in the collet axial direction in a direction perpendicular to the surface of the fixed plate is provided on the side plane as a positioning contact portion for contacting the contact plane of the collet. and formed positioning block, arranged opposite to the positioning contact portion of the positioning block
Is biased closing direction against the positioning contact part is, those collet mating surface is the pressed plane of the collet
A collet retainer for securing said collet to said positioning block in contact, away said collet retainer to said positioning block
Pickup apparatus characterized by comprising a because of opening and closing means is between. 2. The opening / closing means includes: a lever rotatable around a fulcrum fixed to the fixed plate; and a rotation of the lever is transmitted to the collet holder , and the lever is rotated in a predetermined direction. 2. The pickup device according to claim 1, further comprising: a mechanical link mechanism that sometimes moves the collet presser in a direction to separate the collet presser from the positioning block . 3. A pickup device according to claim 1 or 2, characterized by further comprising a position adjusting means for adjusting the position of said holding means. 4. A position adjusting device comprising: a first position adjusting device for adjusting a horizontal position of the holding device; a second position adjusting device for adjusting a rotating position of the holding device. 4. The pickup device according to claim 3, comprising: 5. An exhaust hole is provided at the predetermined contact portion of the collet , and an intake hole is provided at a position corresponding to the exhaust hole at the positioning contact portion of the positioning block. pickup device according to any one of claims 1 to 4.