JP3310896B2 - Flip chip mounting apparatus and bare chip mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed wiring board having a plurality of substrate electrodes disposed on a surface thereof, and a bare chip having a plurality of chip electrodes disposed on the surface to face the substrate electrodes. For example, the present invention relates to a flip-chip mounting apparatus used for flip-chip mounting connected via an adhesive made of an insulating material and a bare chip mounting method.

[0002]

[Prior art]

FIG. 13 shows a diagram of the prior art.
8A, the flip chip mounting apparatus 60 has a tool suction groove 69 and a tool suction hole 68 provided in the tool suction groove, and the tool suction groove 69 is passed through the tool suction hole 68 by a tool suction mechanism (not shown). The chip suction tool 81 is mounted by reducing the pressure.

Further, a chip suction hole 52 is formed in the chip suction tool 81 and the flip chip mounting device 60, and the pressure is reduced through the chip suction hole 52 by a chip suction mechanism (not shown) so that the bare chip 71 is placed on the chip suction surface 51. It is configured to adsorb.

[0005] Some flip chip mounting apparatuses form a bonding head in which a chip suction tool 81 is integrated.

The bare chip 71 is provided with chip electrodes 72 at predetermined intervals, and bumps 73 are formed on the chip electrodes 72.

On the other hand, substrate electrodes are formed on the surface of the printed wiring board 76 on which the bare chip 71 is mounted so as to correspond to the bumps 73. An adhesive 85 made of an insulating material is applied to a surface facing the bare chip 71. This adhesive 85 is for bonding and fixing the bare chip 71 by applying pressure and heating.

FIG. 16 shows a conventional bare chip mounting process. In the figure, after the bare chip 71 is set at a predetermined position on the chip suction surface 51, the chip suction tool 81 is lowered to start pressurization. The heating is started when the pressure reaches a predetermined mounting load, and after the predetermined mounting temperature is maintained for a certain time, the heating is ended.
When the heating is completed, the chip suction tool 81 is raised to start decompression, and the mounting is completed.

[0009] As shown in FIG.
In the initial stage of mounting 1, when the chip suction tool 81 that has sucked the bare chip 71 descends, the adhesive 85 spreads between the bare chip 71 and the printed wiring board 76 and further protrudes to the side surface of the bare chip 71.

FIG. 14 is an explanatory diagram (part 1) of the prior art. In FIG. 9A, the adhesive 85 protruding from the side surface of the bare chip 71 reaches the chip suction surface 51 of the chip suction tool 81 and the chip suction hole 52 is depressurized. Thus, the space between the surface of the bare chip 71 and the chip suction surface 51 is diffusely flowed and filled.

FIG. 1B shows a state in which the adhesive is sucked by the pressure reduction of the chip suction hole 52.

As described above, when the adhesive flows and fills between the surface of the bare chip 71 and the chip suction surface 51, the bare chip 71 and the chip suction surface 51 are fixed by bonding.

In order to prevent the bare chip 71 and the chip suction surface 51 from being fixed by bonding, the bare chip 7
A release agent may be applied to the surface 1 or the chip suction surface 51 in some cases.

FIG. 15 is an explanatory diagram (part 2) of the prior art. In the figure, the case where a release agent is applied to the surface of the bare chip 71 or the chip suction surface 51 will be described. Adhesive 8 sucked into chip suction hole 52 described above
5, the adhesive 85 is hardened in the chip suction hole 52 to close the chip suction hole 52. Further, the adhesive may flow into the inside of the flip chip mounting apparatus, which may cause a failure of the apparatus. In addition, adhesion occurs between the end surface of the bare chip and the inner wall of the chip suction hole 52.

As described above, the following phenomena occur in the conventional flip-chip mounting.

1) The adhesive having a relatively low viscosity enters between the bare chip and the bare chip suction surface due to a capillary phenomenon.

2) In order to obtain the bare chip suction force, the pressure of the bare chip and the bare chip suction surface is reduced, and the adhesive is sucked into the chip suction hole of the bare chip suction surface.

3) The above phenomenon is remarkable when the wettability of the adhesive to the printed wiring board is poor, when the viscosity of the adhesive is low, or when the amount of the adhesive is large.

[0019]

As described above, the flip chip mounting apparatus used for flip chip mounting according to the prior art and the chip suction tool mounted on the apparatus have the following problems.

1) The adhesive may enter the inside of the flip-chip mounting apparatus and cause a failure of the apparatus.

2) Even if a release agent is applied to the suction surface of the bare chip, if the adhesive is hardened in the chip suction hole, the bare chip and the flip chip mounting device or the bare chip and the chip suction tool are bonded. In some cases, bare chips cannot be mounted.

3) The chip suction hole is clogged with the adhesive, and a predetermined suction force cannot be obtained.

4) If the depressurizing operation is cut off before the adhesive rises to the flip chip mounting apparatus or the chip suction tool, the bare chip is released while a load is applied to the bare chip, and the mounting position of the bare chip is changed. It may cause misalignment.

[0024]

In order to solve the above problems, the present invention takes the following measures.

In the bare chip suction surface, there is provided means for preventing the flow of the adhesive between the end surface of the bare chip and the chip suction hole.

Further, there is provided means for varying the pressure reducing force on the chip suction surface between the end face of the bare chip and the chip suction hole.

By taking the above-described means, the following operation works.

The adhesive flows only to the point where the flow of the adhesive is stopped.

Further, if necessary, the attraction force of the bare chip is increased, and the flow of the adhesive is prevented.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention adopts the following embodiments.

As shown in FIGS. 1 and 2, in the flip chip mounting apparatus 10 used for flip chip mounting or the chip suction tool 31 mounted on the flip chip mounting apparatus, the chip is mounted on the chip suction surface 1 for sucking bare chips. A groove 3 surrounding the suction hole 2 is provided.

Further, as shown in FIGS. 1 to 3, the groove 3 is preferably provided with a ventilation hole 4 connected to the outside.

Further, as shown in FIGS. 7 and 8, it is desirable that the ventilation holes 4 are arranged substantially symmetrically with respect to the chip suction holes 2.

As shown in FIG.
Add outside air inside. Alternatively, as shown in FIG. 1, the air pressure controlled by the air pressure control unit 11 is applied to the groove 3 through the air hole 4.

Further, as shown in FIGS. 1 and 2, an air pressure control unit 11 for changing the air pressure in the groove 3 through the air hole 4 is provided.

Further, as shown in FIG. 1, in the air pressure control section 11 in the air hole, the chip suction hole 2
It is preferable to apply an air pressure to the groove 3 which is smaller than the suction force of the air and higher than the atmospheric pressure.

Further, as shown in FIG. 1, the pressure control unit 11 in the vent hole 11 controls the pressure to be equal to or lower than the atmospheric pressure in the initial stage of the bare chip mounting, and is smaller than the suction force of the chip suction hole 2 in the latter stage of the bare chip mounting. It is desirable to apply a higher air pressure or the same air pressure as the atmospheric pressure to the groove 3.

As shown in FIG. 1, in the method for mounting a bare chip, a groove 3 provided around a chip suction hole 2 formed in a chip suction surface 1 is provided with a ventilation hole 4 connected to the outside. In the initial stage of the bare chip mounting, the pressure is equal to or lower than the atmospheric pressure. In the latter stage of the bare chip mounting, the air pressure is lower than the suction force of the chip suction holes 2 and is equal to or higher than the atmospheric pressure.

Further, as shown in FIG. 9, the timing at which the air pressure is applied or made equal to the atmospheric pressure may be the time when the pressure of the bare chip 21 reaches a predetermined value.

Alternatively, as shown in FIG. 10, the timing of applying air pressure or making the same as atmospheric pressure is as follows.
It is good to start the heating of the bare chip.

Alternatively, as shown in FIG. 11, the timing of applying air pressure or making the same as atmospheric pressure is as follows.
The time may be a time when the viscosity of the adhesive drops to a predetermined value.

Alternatively, as shown in FIG. 12, the timing of applying air pressure or making the same as atmospheric pressure is as follows.
It may be performed immediately before or immediately after the adhesive reaches the chip suction tool or the bonding head.

By employing the above embodiment, the following operation works.

The grooves eliminate capillary action and prevent the adhesive from flowing in the direction of the chip suction holes.

Further, the depressurized state of the bare chip suction surface is as follows:
The pressure is reduced in the vicinity of the chip suction hole, and the pressure of the groove is reduced to the same level as the atmospheric pressure by the ventilation hole connected to the outside. Therefore, the adhesive is prevented from flowing in the direction of the chip suction hole.

Further, in the depressurized state of the bare chip suction surface, the pressure in the vicinity of the chip suction hole is reduced, and the pressure of the non-depressurized groove becomes uniform, thereby further preventing the flow of the adhesive. Accordingly, since the flow of the adhesive is made uniform, the reliability of bare chip mounting is high. This means is effective in the case where the distance between the groove and the end face of the chip cannot be increased, in the case of a small bare chip, or when the groove is narrow or shallow.

Further, in accordance with the situation of the flip chip mounting process, the increase of the attraction force of the bare chip and the prevention of the flow of the adhesive are performed in a timely manner.

Further, pressure is applied to the bare chip end face by applying air pressure to the groove. Therefore, the flow of the adhesive is further reduced. Also, the penetration of the adhesive into the groove is reduced. This is particularly effective when the distance between the groove and the end surface of the bare chip cannot be secured.

Furthermore, in the initial stage of bare chip mounting, which is deeply related to the displacement of the bare chip, mounting is performed with high precision by increasing the attraction force of the bare chip. At the later stage of the bare chip mounting such as during heating when the flow of the adhesive is a problem, air pressure is applied or the same as the atmospheric pressure to minimize the suction of the adhesive.

[0050]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A representative embodiment according to the present invention will be described with reference to FIGS. 1 to 1 below.
In FIG. 2, the same portions are denoted by the same reference numerals, and detailed description may be omitted.

FIG. 1 is a configuration diagram (part 1) of the present invention.

In the same figure, a flip chip mounting apparatus 1
0 is a tool suction controller 19 through a tool suction hole 18.
Then, the tool suction groove 20 is decompressed, and the chip suction tool 31 is detachably mounted. The bare chip 21 is suctioned to the chip suction surface 1 by depressurizing the chip suction hole 2 by the chip suction control unit 14. Further, the tip suction tool 31
A Z-axis position detecting mechanism and a Z-axis elevating mechanism 13 for elevating and lowering and moving the same, and a load detecting mechanism 15 for measuring the pressing force of the chip suction tool 31. Further, the Z-axis position detecting mechanism and the Z-axis elevating mechanism 13 are controlled by a Z-axis control unit 8 which detects the load or the position of the Z-axis to control the Z-axis. Further, the tool heating mechanism 17 is controlled by the tool heating control unit 7 to heat the chip suction tool 31 to obtain a predetermined mounting temperature.

Further, a groove 3 is formed on the chip suction surface 1 of the chip suction tool 31 around the chip suction hole 2 so as to surround the chip suction hole 2 within the range of the outline projected contour of the bare chip 21. The grooves 3 prevent the adhesive from flowing in the direction of the chip suction holes 2.

The groove 3 has an air hole 4, and the air pressure in the groove 3 can be changed as desired through the air hole 4 by the air pressure control unit 11.

Printed wiring board 2 previously coated with an adhesive
6 is fixed to the stage 28, and the chip suction tool 31 described above is lowered, and the bare chip 21 is
To join.

The image of the mounting surface of the printed wiring board 26 and the bare chip 2
An image of the first circuit surface is captured. The optical probe 16, the air pressure control unit 11, the chip suction control unit 14, the Z-axis position detection mechanism and the Z-axis elevation mechanism 13
The load detection mechanism 15 and the tool heating controller 7 are controlled by a controller that controls the entire flip chip mounting process (not shown).

FIG. 2 is a configuration diagram (part 2) of the present invention.

In the figure, the difference from FIG. 1 is that the bonding head 12 is provided in the flip chip mounting apparatus 10a instead of the chip suction tool 31. Further, the chip heating mechanism 22 is controlled by the chip heating control unit 9 to heat the bonding head 12 to obtain a predetermined mounting temperature.

The groove 3 is formed on the chip suction surface 1 of the bonding head 12 so as to surround the chip suction hole 2 within the range of the outline projection contour of the bare chip 21 in the same manner as described above.

The groove 3 has an air hole 4 communicating with the air pressure control section 11 in the air hole. And the air pressure control unit 11 in the vent hole
Thereby, the air pressure in the groove 3 can be changed as desired through the ventilation hole 4.

FIG. 3 is a configuration diagram (part 3) of the present invention.

In the figure, another example of the ventilation hole 4 is shown.
Bonding head 12 or chip suction tool 31
A groove 3 is formed around the chip suction hole 2 on the chip suction surface 1 for sucking the bare chip 21 as described above. The groove 3 has a ventilation hole 4 that communicates with outside air that does not communicate with the inside of the flip chip mounting devices 10 and 10a. Therefore, the pressure in the groove 3 is at the same level as the atmospheric pressure.

FIG. 4 is a diagram illustrating the operation of the present invention.

In the figure, the adhesive 35 which has protruded to the side surface of the bare chip 21 has a reduced pressure effect when the chip suction hole 2 is depressurized when it reaches the bonding head 12 or the chip suction surface 1 of the chip suction tool 31. The fluid flows between the surface of the bare chip 21 and the chip suction surface 1 due to the capillary phenomenon. However, the flow of the adhesive 35 is prevented by the groove 3, so that the adhesive 35 is not sucked into the chip suction hole 2.

FIG. 5 is an explanatory diagram of the present invention.

In the figure, the air pressure in the groove 3 is changed as required through the air holes 4 in the air pressure control section 11 in the air holes. The air pressure applied to the groove 3 is such that the chip suction holes 2
It is preferable to apply an air pressure that is smaller than the adsorption force of the air pressure and equal to or higher than the atmospheric pressure. The timing of the air pressure applied to the groove 3 will be described later.

The pressure of the chip suction surface 1 is reduced in the vicinity of the chip suction hole 2 by the air pressure, and the pressure of the groove 3 becomes equal to or higher than the atmospheric pressure by the ventilation hole 4 and is not reduced. Therefore, the adhesive is prevented from flowing in the direction of the chip suction hole 2 due to the decompression action and the capillary phenomenon.

In the initial stage of the bare chip mounting, the suction force of the bare chip is increased by reducing the pressure to the same or lower than the atmospheric pressure. Further, in the latter stage of the bare chip mounting, an air pressure smaller than the suction force of the chip suction hole 2 and higher than the atmospheric pressure can be applied, or the same air pressure as the atmospheric pressure can be applied to the groove 3.

FIG. 6 is a detailed view of the embodiment of the present invention (No. 1).
It is.

In the same drawing, a chip suction hole 2 is provided substantially at the center of the chip suction surface 1 of the bonding head 12 or the chip suction tool 31. The groove 3 is formed around the chip suction hole 2 so as to surround the chip suction hole 2. Preferably, the groove 3 is formed as a continuous square groove along the chip shape. The size of the groove 3 is
For example, when the bare chip size is 10 mm, the width of the groove 3 is 1 mm, the depth of the groove 3 is 1 mm, and the position of the groove is 1.5 mm from the end surface of the bare chip.

FIG. 7 is a detailed view of the embodiment of the present invention (part 2).
It is.

In FIG. 7B, when a plurality of ventilation holes 4 are provided, it is desirable to arrange the ventilation holes 4 symmetrically with respect to the chip suction holes 2. In this example, the ventilation holes 4 are provided at the upper, lower, left and right positions of the chip suction holes 2. The size of the vent hole 4 is the same as the width of the groove 3 and has the same diameter. However, the diameter of the ventilation hole 4 may be smaller than the width of the groove 3.

As shown in FIG. 7A, the air hole 4 may be formed at right angles to the chip suction surface 1 and the air pressure in the groove 3 may be controlled by the air hole pressure control unit 11 described above. .
Also, as shown in FIG. 3C, the inside of the groove 3 is made equal to the atmospheric pressure by taking outside air from the bonding head 12 or the chip suction tool 31 so as to be formed, for example, in parallel with the chip suction surface 1. You may.

When the chip suction surface 1 is depressurized, the pressure in the vicinity of the chip suction hole 2 is reduced, and the pressure of the groove 3 which is not depressurized is made uniform by the plurality of ventilation holes 4 to make the flow of the adhesive uniform. The reliability of mounting is increased.
This method is used when the groove cannot keep the distance from the chip end face,
This is particularly effective in the case of a small bare chip, or in the case where the groove is narrow or shallow.

FIG. 8 is a detailed view of the embodiment of the present invention (part 3).
It is.

FIG. 14 shows another embodiment of the groove 3. In FIG. The groove formed on the chip suction surface 1 does not necessarily need to have a shape following the shape of the bare chip. In this example, a circular groove 3 centering on the chip suction hole 2 can be formed. The ventilation hole 4 may be provided by dividing the groove 3 equally.

Now, the timing of the air pressure applied to the groove 3 will be described. In the following, the bare chip mounting step is the same as the conventional bare chip mounting step shown in FIG. 16, and a detailed description thereof will be omitted.

FIG. 9 is an explanatory view of the embodiment of the present invention (part 1).
It is.

In the figure, when the air pressure is applied or the same as the atmospheric pressure, the bonding head 12 or the chip suction tool 31 is lowered and the pressurization is started after the bare chip 21 is set at a predetermined position. When the pressure reaches a predetermined value before the pressure reaches a predetermined mount load, air pressure is applied to the groove 3 or equal to the atmospheric pressure. For example, if the mounting load is 100
In the case of 0 gf, the predetermined value of the pressing force is set to 600 gf.

FIG. 10 is an explanatory view (part 2) of the embodiment of the present invention.

In the figure, at the timing of applying air pressure or making the pressure equal to the atmospheric pressure, after the bare chip 21 is set at a predetermined position, the bonding head 12 or the chip suction tool 31 is lowered to start pressurizing. Heating is started when the pressurization reaches a predetermined mount load. At the same time as the pressurization starts, air pressure is applied to the groove 3 or the same as the atmospheric pressure.

FIG. 11 is an explanatory view (part 3) of the embodiment of the present invention.

In the figure, the timing of applying air pressure or making the pressure equal to the atmospheric pressure is such that the heating is started when the pressure reaches a predetermined mounting load, and the adhesive 35 is applied until the predetermined mounting temperature is reached. The viscosity decreases. When the viscosity of the adhesive 35 that has decreased is detected, air pressure is applied to the groove 3 when the viscosity reaches a predetermined value, or the pressure is made equal to the atmospheric pressure. The viscosity of the adhesive 35 can be detected by detecting the temperature of the chip suction surface 1.

FIG. 12 is an explanatory view (part 4) of the embodiment of the present invention.

In the figure, when the air pressure is applied or the same as the atmospheric pressure, the pressure is started by lowering the bonding head 12 or the chip suction tool 31 after the bare chip 21 is set at a predetermined position. While the pressure reaches a predetermined mounting load, the groove 3 is formed immediately before the adhesive 35 reaches the bonding head 12 or the chip suction tool 31 or immediately after the adhesive 35 reaches the bonding head 12 or the chip suction tool 31.
Apply air pressure to or equal to atmospheric pressure.

The timing at which the air pressure is applied or the timing at which the pressure is equal to the atmospheric pressure may be determined by the operator, or determined by an image processing technique for automatically recognizing the situation in which the adhesive reaches the bonding head 12 and the chip suction tool 81. It is also possible.

[0087]

As described above, according to the present invention, the following effects can be obtained.

In the flip chip mounting apparatus used for flip chip mounting, since the groove for surrounding the chip suction hole is provided on the chip suction surface for sucking the bare chip, the capillary phenomenon is eliminated by the groove, and the adhesive is applied in the direction of the chip suction hole. It can be prevented from flowing.

Further, since the groove is provided with a vent hole connected to the outside, the depressurized state of the bare chip suction surface is reduced in the vicinity of the chip suction hole, and the groove is at a level equivalent to the atmospheric pressure by the vent hole connected to the outside and is not depressurized. Therefore, no decompression occurs at the end face of the chip. Therefore, it is possible to prevent the adhesive from flowing in the direction of the chip suction hole.

Further, since the ventilation holes are arranged substantially symmetrically with respect to the chip suction holes, in the depressurized state of the bare chip suction surface, the pressure is reduced near the chip suction holes, and the air pressure in the grooves not depressurized becomes uniform. Further blocks the flow of the adhesive. Accordingly, since the flow of the adhesive is made uniform, the reliability of bare chip mounting can be improved. This means is particularly effective in the case where the distance between the groove and the chip end face cannot be kept, in the case of a small bare chip, or in the case where the groove is narrow or shallow.

Further, in a chip suction tool mounted on a flip chip mounting apparatus used for flip chip mounting, a groove surrounding a chip suction hole is provided on a chip suction surface for sucking a bare chip. The adhesive can be prevented from flowing in the direction of the chip suction hole.

Further, since the groove is provided with a vent hole connected to the outside, the depressurized state of the bare chip suction surface is reduced near the chip suction hole, and the groove is at a level equivalent to the atmospheric pressure by the vent hole connected to the outside and is not depressurized. Therefore, no decompression occurs at the end face of the chip. Therefore, it is possible to prevent the adhesive from flowing in the direction of the chip suction hole.

Further, since the ventilation holes are arranged substantially symmetrically with respect to the chip suction holes, when the bare chip suction surface is depressurized, the pressure in the vicinity of the chip suction holes is reduced, and the pressure in the grooves which are not reduced is uniform. Further blocks the flow of the adhesive. Accordingly, since the flow of the adhesive is made uniform, the reliability of bare chip mounting can be improved. This means is particularly effective in the case where the distance between the groove and the chip end face cannot be kept, in the case of a small bare chip, or in the case where the groove is narrow or shallow.

Further, since outside air is added to the inside of the groove through the ventilation hole, the depressurized state of the bare chip suction surface is reduced in pressure in the vicinity of the chip suction hole, and the groove becomes the same as the atmospheric pressure by the ventilation hole connected to the outside and is not depressurized. No decompression occurs at the chip end face. Therefore, it is easy and inexpensive to prevent the adhesive from flowing in the direction of the chip suction hole.

Further, since the air pressure in the groove is changed through the air hole by the air pressure control unit in the air hole, it is possible to increase the attraction force of the bare chip and prevent the flow of the adhesive in accordance with the situation of the flip chip mounting process. Can be done in a timely manner.

Further, an air pressure smaller than the suction force of the chip suction hole and higher than the atmospheric pressure is applied to the groove through the ventilation hole, so that the pressure is applied to the bare chip end face. Therefore, the flow of the adhesive can be further reduced. And it can reduce that an adhesive intrudes into a groove | channel.
This is particularly effective when the distance between the groove and the end face of the bare chip cannot be secured.

Further, in the initial stage of the bare chip mounting, the pressure is equal to or lower than the atmospheric pressure, and in the latter stage of the bare chip mounting, an air pressure smaller than the suction force of the chip suction holes and higher than the atmospheric pressure is applied to the groove or the same as the atmospheric pressure. In the initial stage of bare chip mounting, which is deeply related to the displacement of the bare chip, it is possible to mount the bare chip accurately by increasing the attraction force of the bare chip. Further, by applying air pressure or making the pressure equal to the atmospheric pressure at a later stage of the bare chip mounting at the time of overheating where the flow of the adhesive becomes a problem, the suction of the adhesive can be minimized.

In the method for mounting a bare chip, a groove around the chip suction hole formed in the chip suction surface is provided with a vent hole connected to the outside, and the pressure of the groove is the same as the outside pressure or the outside pressure in the initial stage of bare chip mounting. In the later stage of bare chip mounting, air pressure smaller than the suction force of the vacuum hole and higher than the outside air pressure is applied to the groove or the same as the atmospheric pressure. By increasing the height, mounting can be performed with high accuracy. Further, suction of the adhesive can be minimized by applying air pressure or making it the same as the atmospheric pressure in the later stage of the bare chip mounting such as during heating when the flow of the adhesive becomes a problem.

Further, the timing of applying the air pressure or making the pressure equal to the atmospheric pressure is performed when the pressure of the bare chip reaches a predetermined value. Alternatively, it is performed at the time of starting the overheating of the bare chip. Alternatively, it is performed when the viscosity of the adhesive drops to a predetermined value. Alternatively, since the bonding is performed immediately before or immediately after the adhesive reaches the chip suction tool or the bonding head, suction of the adhesive can be reduced by applying air pressure to the groove or making it equal to the atmospheric pressure. And it can reduce that an adhesive intrudes into a groove | channel.

[Brief description of the drawings]

FIG. 1 is a configuration diagram (part 1) of the present invention.

FIG. 2 is a configuration diagram (part 2) of the present invention.

FIG. 3 is a configuration diagram (part 3) of the present invention.

FIG. 4 is an operation explanatory view of the present invention.

FIG. 5 is an explanatory diagram of the present invention.

FIG. 6 is a detailed view (part 1) of the embodiment of the present invention.

FIG. 7 is a detailed view (part 2) of the embodiment of the present invention.

FIG. 8 is a detailed view (part 3) of the embodiment of the present invention.

FIG. 9 is an explanatory diagram (No. 1) of the embodiment of the present invention.

FIG. 10 is an explanatory diagram (part 2) of the embodiment of the present invention.

FIG. 11 is an explanatory diagram (No. 3) of the embodiment of the present invention.

FIG. 12 is an explanatory diagram (No. 4) of the embodiment of the present invention.

FIG. 13 is a diagram of the prior art.

FIG. 14 is an explanatory diagram (part 1) of a conventional technique.

FIG. 15 is an explanatory view (part 2) of a conventional technique.

FIG. 16 is an explanatory diagram of a conventional bare chip mounting process.

[Explanation of symbols]

 1: chip suction surface 2: chip suction hole 3: groove 4: air hole 11: air pressure control unit in air hole 12: bonding head 21: bare chip 31: chip suction tool 35: adhesive

Claims (7)

(57) [Claims] [Claim 1] have a chip suction tool or the bonding head is used to flip chip mounting, chip suction holes on the chip suction surface which adsorbs bare chip (1) (2)
(3) surrounding the groove, and ventilation that connects the groove (3) to the outside
The hole (4) and the air in the groove (3) through the ventilation hole (4).
An air pressure control unit (11) for changing air pressure
The flip chip mounting apparatus, wherein the air pressure control unit (11) in the air hole includes the air hole (4).
Absolute value is smaller than the negative pressure applied to the chip suction hole through
A flip chip mounting apparatus, wherein a positive pressure is applied to the groove (3) . 2. The air pressure control section (11) in the vent hole reduces the pressure to be equal to or lower than the atmospheric pressure in the initial stage of mounting the bare chip, and in the late stage of mounting the bare chip.
The flip-chip mounting device according to claim 1 , wherein a positive pressure having an absolute value smaller than a negative pressure applied to the groove or an air pressure equal to the atmospheric pressure is applied to the groove (3). 3. A method of mounting a bare chip, a chip suction hole formed in the chip suction surface (1) for adsorbing the bare chip (2), a groove (3) provided around the chip suction hole (2), the groove (3) Outside air or air pressure control inside the vent
A vent (4) for applying air pressure controlled by the part (11), and the pressure in the groove (3) is increased in the initial stage of bare chip mounting.
A positive pressure which is equal to or lower than the atmospheric pressure, and which has an absolute value smaller than the negative pressure applied to the chip suction holes in the groove (3) in the latter stage of the bare chip mounting.
A method for mounting a bare chip, the method being the same as a force or an atmospheric pressure . 4. The groove in a later stage of bare chip mounting.
Absolute pressure of (3) above negative pressure applied to chip suction hole
The method for mounting a bare chip according to claim 3 , wherein the timing at which the value is equal to the small positive pressure or the atmospheric pressure is when the pressure applied to the bare chip (21) reaches a predetermined value. 5. The groove in a later stage of bare chip mounting.
Absolute pressure of (3) above negative pressure applied to chip suction hole
The method for mounting a bare chip according to claim 3 , wherein the timing at which the value is equal to the small positive pressure or the atmospheric pressure is the time when the heating of the bare chip (21) is started. 6. The groove in a later stage of bare chip mounting.
Absolute pressure of (3) above negative pressure applied to chip suction hole
The method for mounting a bare chip according to claim 3 , wherein the timing when the value is equal to the small positive pressure or the atmospheric pressure is the time when the viscosity of the adhesive (35) decreases to a predetermined value. 7. The groove in a later stage of bare chip mounting.
Absolute pressure of (3) above negative pressure applied to chip suction hole
The timing at which the value is equal to the small positive pressure or the atmospheric pressure is performed immediately before or immediately after the adhesive (35) reaches the chip suction tool (31) or the bonding head (12). Item 4. A method for mounting a bare chip according to Item 3 .