JP3392052B2 - Epoxy resin composition and optical semiconductor device - Google Patents
Epoxy resin composition and optical semiconductor deviceInfo
- Publication number
- JP3392052B2 JP3392052B2 JP14485198A JP14485198A JP3392052B2 JP 3392052 B2 JP3392052 B2 JP 3392052B2 JP 14485198 A JP14485198 A JP 14485198A JP 14485198 A JP14485198 A JP 14485198A JP 3392052 B2 JP3392052 B2 JP 3392052B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- xylene
- curing
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 87
- 229920000647 polyepoxide Polymers 0.000 title claims description 87
- 239000000203 mixture Substances 0.000 title claims description 52
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 230000003287 optical effect Effects 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- 239000008096 xylene Substances 0.000 claims description 33
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 16
- -1 silanol compound Chemical class 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 11
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 9
- 230000003301 hydrolyzing effect Effects 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 150000003738 xylenes Chemical class 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 15
- 239000003566 sealing material Substances 0.000 description 15
- 230000035882 stress Effects 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 10
- 230000003139 buffering effect Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 238000001721 transfer moulding Methods 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- CERHRKAXIUREKC-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propylsulfanylsilane Chemical compound C(C1CO1)OCCCS[SiH3] CERHRKAXIUREKC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＬＥＤ、フォトト
ランジスター、フォトダイオード、ＣＣＤ等の光半導体
素子、そのなかでも特にＬＥＤを封止するために用いら
れるトランスファーモールド用のエポキシ樹脂組成物、
及びこのエポキシ樹脂組成物にて封止された光半導体装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element such as an LED, a phototransistor, a photodiode, and a CCD, and among them, an epoxy resin composition for transfer molding used for encapsulating an LED,
And an optical semiconductor device sealed with this epoxy resin composition.
【０００２】[0002]
【従来の技術】ＬＥＤ、受光素子等の光半導体の樹脂封
止を行って光半導体装置の製造を行う際の封止材料とし
ては、透明性、密着性、耐湿性、電気絶縁性、耐熱性等
に優れる点から、エポキシ樹脂組成物が主として用いら
れており、エポキシ樹脂組成物のトランスファーモール
ドにより成形した成形体を封止樹脂とし、この封止樹脂
により光半導体を封止する樹脂封止は、作業性及び量産
性の面で優れている。2. Description of the Related Art As a sealing material for manufacturing an optical semiconductor device by sealing an optical semiconductor such as an LED or a light receiving element with a resin, transparency, adhesion, moisture resistance, electrical insulation, heat resistance are used. Epoxy resin composition is mainly used because of its excellent properties, etc., and a molded body formed by transfer molding of an epoxy resin composition is used as a sealing resin, and the resin sealing for sealing an optical semiconductor with this sealing resin is It is excellent in workability and mass productivity.
【０００３】ここでＬＥＤ素子については非常に応力に
敏感であるため、従来のトランスファーモールド用の封
止材料では、成形応力、成形後の熱変化による封止材の
収縮応力、あるいは低温通電時における樹脂応力がＬＥ
Ｄ素子にかかった際に輝度劣化の問題が発生しやすい。
そこでその対策としてシリコンゲルに代表される柔らか
い透明な応力緩衝材をあらかじめＬＥＤ素子表面に塗布
した後硬化させ、その後エポキシ樹脂組成物のトランス
ファーモールドにより封止する必要があった。Here, since the LED element is very sensitive to stress, in the conventional sealing material for transfer molding, molding stress, shrinkage stress of the sealing material due to thermal change after molding, or low temperature energization. Resin stress is LE
When it is applied to the D element, the problem of luminance deterioration easily occurs.
Therefore, as a countermeasure against this, it is necessary to apply a soft transparent stress buffer material typified by silicon gel to the surface of the LED element in advance, cure the LED element surface, and then seal by transfer molding of an epoxy resin composition.
【０００４】[0004]
【発明が解決しようとする課題】しかしこの方法はあら
かじめシリコンゲル等の応力緩衝材をＬＥＤ素子表面に
塗布した後硬化させるための手間及び費用がかかると共
に、塗布状態のばらつきで輝度が安定しない等の問題が
生じることがあった。However, this method requires time and cost for applying a stress buffer material such as silicon gel to the surface of the LED element in advance and then curing it, and the brightness is not stable due to variations in the application state. The problem sometimes occurred.
【０００５】そのため、上述のような応力緩衝材を不要
なものとするために、硬化剤の当量比の調節を行った
り、各種の低分子エポキシ樹脂等を導入する等してエポ
キシ樹脂組成物に応力緩衝効果を付与するエポキシ樹脂
系がいくつか提案されているが、このようなエポキシ樹
脂組成物にて成形された成形体は、耐湿性や素子及びリ
ードフレームとの密着性が大幅に低下するという問題が
あった。Therefore, in order to make the above-mentioned stress buffering material unnecessary, the equivalent ratio of the curing agent is adjusted, various low molecular weight epoxy resins, etc. are introduced into the epoxy resin composition. Several epoxy resin systems that provide a stress buffering effect have been proposed, but a molded article molded from such an epoxy resin composition has significantly reduced moisture resistance and adhesion to the element and lead frame. There was a problem.
【０００６】またエポキシ樹脂組成物にシリコンゲル等
の異種の高分子ゴム系や高分子ゲル系を添加する方法で
は、応力緩衝効果と密着性は確保できるが、耐湿性が低
下すると共に、成形後や吸湿後に成形体が白濁するとい
う問題があった。Further, in the method of adding a different type of polymer rubber type such as silicon gel or polymer gel type to the epoxy resin composition, the stress buffering effect and the adhesiveness can be secured, but the moisture resistance is lowered and after the molding. There is a problem that the molded body becomes cloudy after absorbing moisture.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、あらかじめシリコンゲル等の応力緩衝材をＬＥＤ
チップ表面に塗布した後硬化させなくとも、応力緩衝効
果が高く、しかも耐湿性や、素子及びリードフレームと
の密着性を充分確保することができ、かつ高い透明性を
有した、特に光半導体を封止するために用いることがで
きるエポキシ樹脂組成物、及びこのエポキシ樹脂組成物
にて封止されてなる光半導体装置を提供することを目的
とするものである。The present invention has been made in view of the above points, in which a stress buffering material such as silicon gel is previously attached to the LED.
Even if it is not cured after being applied to the surface of the chip, it has a high stress buffering effect, yet can secure sufficient moisture resistance and adhesiveness with the element and the lead frame, and has high transparency. It is an object of the present invention to provide an epoxy resin composition that can be used for encapsulation and an optical semiconductor device encapsulated with this epoxy resin composition.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に記載
のエポキシ樹脂は、エポキシ樹脂、硬化剤、硬化促進
剤、並びに下記化学式（１）及び下記一般式（２）で示
される化合物の少なくとも一方からなる数平均分子量２
００〜１０００のキシレン樹脂を含み、このキシレン樹
脂を、エポキシ樹脂、硬化剤、硬化促進剤、及びキシレ
ン樹脂の総量に対して３．０〜２５重量％含有し、硬化
剤として酸無水物を含有して成ることを特徴とするもの
である。The epoxy resin according to claim 1 of the present invention comprises an epoxy resin, a curing agent, a curing accelerator, and a compound represented by the following chemical formula (1) and general formula (2). Number average molecular weight 2 consisting of at least one
0 to 1000 xylene resin is contained, and the xylene resin is contained in an amount of 3.0 to 25% by weight with respect to the total amount of the epoxy resin, the curing agent, the curing accelerator, and the xylene resin, and the curing
It is characterized by containing an acid anhydride as an agent .
【０００９】[0009]
【化２】
また本発明の請求項２に記載のエポキシ樹脂組成物は、
請求項１の構成に加えて、メルカプト基含有シラン化合
物を加水分解してシラノール化された化合物を、上記の
エポキシ樹脂、硬化剤、硬化促進剤、及びキシレン樹脂
の総量に対して０．００１〜５重量％含有して成ること
を特徴とするものである。[Chemical 2] The epoxy resin composition according to claim 2 of the present invention is
In addition to the constitution of claim 1, the compound silanolized by hydrolyzing a mercapto group-containing silane compound is added in an amount of 0.001 to 1 with respect to the total amount of the epoxy resin, the curing agent, the curing accelerator, and the xylene resin. It is characterized by containing 5% by weight.
【００１０】また本発明の請求項３に記載の光半導体装
置は、請求項１又は２に記載のエポキシ樹脂組成物にて
封止されて成ることを特徴とするものである。An optical semiconductor device according to a third aspect of the present invention is characterized by being encapsulated with the epoxy resin composition according to the first or second aspect.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
【００１２】エポキシ樹脂としては、一分子中に二個以
上のエポキシ樹脂を有するものであれば特に限定するも
のではないが、本発明のエポキシ樹脂組成物を光半導体
の封止用に用いるためには比較的着色の少ないものが好
ましく、例えばビスフェノールＡ型エポキシ樹脂、ビス
フェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポ
キシ樹脂、オルトクレゾールノボラック型エポキシ樹
脂、脂環式エポキシ樹脂、トリグリシジルイソシアヌレ
ート、脂肪族系エポキシ樹脂等が挙げられる。これらの
エポキシ樹脂は、単独で、あるいは二種以上を適宜混合
して用いることができる。本発明のエポキシ樹脂組成物
を、固形のタブレット状に調製する場合は、エポキシ樹
脂として、固形状のエポキシ樹脂を含むもの用いるか、
あるいは固形状のエポキシ樹脂のみを単独で用いること
が好ましい。The epoxy resin is not particularly limited as long as it has two or more epoxy resins in one molecule, but the epoxy resin composition of the present invention is used for encapsulating an optical semiconductor. Is preferably relatively less colored, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, orthocresol novolac type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate, aliphatic series Epoxy resin etc. are mentioned. These epoxy resins can be used alone or in admixture of two or more kinds. When the epoxy resin composition of the present invention is prepared in the form of a solid tablet, as the epoxy resin, one containing a solid epoxy resin is used,
Alternatively, it is preferable to use only the solid epoxy resin alone.
【００１３】硬化剤としては、エポキシ樹脂と硬化反応
を起こすものであれば特に限定するものではないが、本
発明のエポキシ樹脂組成物を光半導体の封止用に用いる
ためには比較的着色の少ないものが好ましく、無水ヘキ
サヒドロフタル酸、無水メチルヘキサヒドロフタル酸、
無水テトラヒドロフタル酸等の酸無水物を挙げることが
できる。硬化剤は、単独で、あるいは二種以上を適宜組
み合わせて用いることができる。ここで硬化剤の配合割
合は、エポキシ樹脂に対する硬化剤の当量比が０．７〜
１．４となるようにするのが好ましい。The curing agent is not particularly limited as long as it causes a curing reaction with the epoxy resin, but is relatively colored in order to use the epoxy resin composition of the present invention for encapsulating an optical semiconductor. preferably it has a small, anhydrous hexahydrophthalic acid, methyl hexahydrophthalic anhydride,
It can be exemplified anhydride anhydride such as tetrahydrophthalic acid. Hardening agents may be used alone or in combination, or two or more thereof as appropriate. Here, the mixing ratio of the curing agent is such that the equivalent ratio of the curing agent to the epoxy resin is 0.7 to
It is preferably set to 1.4.
【００１４】硬化促進剤としては上記のようなエポキシ
樹脂と硬化剤との反応を促進する作用を有するものであ
れば特に限定するものではないが、本発明のエポキシ樹
脂組成物を光半導体の封止用に用いるためには比較的着
色の少ないものが好ましく、例えばトリフェニルホスフ
ィン、ジフェニルホスフィン等の有機ホスフィン系硬化
促進剤、２−メチルイミダゾール、２−フェニル−４−
メチルイミダゾール、２−フェニルイミダゾール等のイ
ミダゾール系硬化促進剤、１，８−ジアザビシクロ
（５，４，０）ウンデセン−７、トリエタノールアミ
ン、ベンジルメチルアミン等の三級アミン系硬化促進
剤、テトラフェニルホスホニウム・テトラフェニルボレ
ート等のテトラフェニルボレート系硬化促進剤等を挙げ
ることができる。これらの硬化促進剤は、単独で、ある
いは二種以上を適宜組み合わせて用いることができる。
ここで硬化促進剤の配合割合は、エポキシ樹脂組成物全
量に対して０．０５〜５重量％とすることが好ましい。The curing accelerator is not particularly limited as long as it has the action of promoting the reaction between the epoxy resin and the curing agent as described above, but the epoxy resin composition of the present invention is used to seal an optical semiconductor. For use as a fixing agent, those having relatively little coloration are preferable, for example, organic phosphine-based curing accelerators such as triphenylphosphine and diphenylphosphine, 2-methylimidazole, 2-phenyl-4-.
Imidazole curing accelerators such as methylimidazole and 2-phenylimidazole, tertiary amine curing accelerators such as 1,8-diazabicyclo (5,4,0) undecene-7, triethanolamine and benzylmethylamine, tetraphenyl Examples thereof include tetraphenylborate-based curing accelerators such as phosphonium and tetraphenylborate. These curing accelerators can be used alone or in combination of two or more kinds.
Here, the mixing ratio of the curing accelerator is preferably 0.05 to 5% by weight with respect to the total amount of the epoxy resin composition.
【００１５】また下記化学式（１）及び下記一般式
（２）に示す化合物のうち少なくとも一方のものからな
り、数平均分子量が２００〜１０００のキシレン樹脂を
用いるものである。A xylene resin having at least one of the compounds represented by the following chemical formula (1) and general formula (2) and having a number average molecular weight of 200 to 1000 is used.
【００１６】[0016]
【化３】
このようなキシレン樹脂を配合すると、本発明のエポキ
シ樹脂組成物を硬化成形して得られる成形体に優れた応
力緩衝効果を付与することができ、この成形体をＬＥＤ
等の光半導体素子の封止材として用いる場合、通電によ
る発熱によって封止材が加熱した際に封止材の熱応力が
ＬＥＤ等にかかることによる輝度の劣化を抑制すること
ができる。またこの成形体を半導体装置の封止材として
用いる場合の耐湿性、リードフレームや素子との密着
性、及び透明性を良好なものとすることができる。ここ
でこのキシレン樹脂の配合量は、エポキシ樹脂組成物中
のエポキシ樹脂、硬化剤、硬化促進剤、及び上記のキシ
レン樹脂の総量に対して３〜２５重量％とするものであ
り、２５重量％を超えると吸湿性が上昇し、成形体を半
導体装置の封止材として用いる場合の耐湿性が低下する
おそれがあり、３重量％に満たないと成形体に充分な応
力緩衝効果を付与する効果が低下するおそれがある。ま
たこのキシレン樹脂の数平均分子量が２００に満たない
と成形体に充分な応力緩衝効果を付与することができな
くなり、１０００を超えるとキシレン樹脂とエポキシ樹
脂との相溶性が低下してキシレン樹脂がエポキシ樹脂中
に十分に溶解することができなくなり、成形体に白濁が
生じたり、成形体を半導体装置の封止材として用いた場
合の耐湿性が低下するおそれがある。[Chemical 3] When such a xylene resin is blended, an excellent stress buffering effect can be imparted to a molded product obtained by curing and molding the epoxy resin composition of the present invention.
When used as a sealing material for an optical semiconductor element such as, the deterioration of the brightness due to the thermal stress of the sealing material applied to the LED or the like when the sealing material is heated by the heat generated by energization can be suppressed. Further, when this molded product is used as a sealing material for a semiconductor device, it is possible to improve moisture resistance, adhesion to a lead frame or an element, and transparency. Here, the compounding amount of the xylene resin is 3 to 25% by weight with respect to the total amount of the epoxy resin, the curing agent, the curing accelerator, and the xylene resin in the epoxy resin composition, and 25% by weight. When the content exceeds 3%, the hygroscopicity increases, and the moisture resistance when the molded product is used as an encapsulant for a semiconductor device may decrease. If it is less than 3% by weight, a sufficient stress buffering effect is imparted to the molded product. May decrease. If the number average molecular weight of this xylene resin is less than 200, a sufficient stress buffering effect cannot be imparted to the molded product, and if it exceeds 1000, the compatibility between the xylene resin and the epoxy resin decreases and the xylene resin becomes It may not be sufficiently dissolved in the epoxy resin, white turbidity may occur in the molded product, or the moisture resistance may decrease when the molded product is used as a sealing material for a semiconductor device.
【００１７】本発明のエポキシ樹脂組成物には、メルカ
プト基含有シラン化合物を、あらかじめ加水分解させて
生成させた化合物を、エポキシ樹脂組成物中のエポキシ
樹脂、硬化剤、硬化促進剤、及び上記のキシレン樹脂の
総量に対して０．００１〜５重量％の割合で配合するこ
ともできるものであり、このようにすると、成形体を半
導体装置の封止材として用いた場合、成形体とリードフ
レームや素子との密着性を更に向上することができるも
のである。ここでこのメルカプト基含有シラン化合物を
あらかじめ加水分解させて生成させた化合物のエポキシ
樹脂組成物中のエポキシ樹脂、硬化剤、硬化促進剤、及
び上記のキシレン樹脂の総量に対する割合が０．００１
重量％に満たないと、密着性の向上の効果を十分に発揮
させることができず、また５重量％を超えると吸湿性が
上昇して好ましくない。また密着性の向上の効果は、メ
ルカプト基含有シラン化合物をあらかじめ加水分解させ
て生成させた化合物を、エポキシ樹脂組成物中のエポキ
シ樹脂、硬化剤、硬化促進剤、及び上記のキシレン樹脂
の総量に対して０．０１〜３重量％の割合で配合させた
際に最も顕著に発揮させることができる。In the epoxy resin composition of the present invention, a compound produced by previously hydrolyzing a mercapto group-containing silane compound is used to prepare an epoxy resin, a curing agent, a curing accelerator, and the above-mentioned compound in the epoxy resin composition. It is also possible to mix in a proportion of 0.001 to 5% by weight with respect to the total amount of xylene resin, and in this case, when the molded body is used as a sealing material for a semiconductor device, the molded body and the lead frame. It is possible to further improve the adhesion with the element. Here, the ratio of the compound formed by previously hydrolyzing the mercapto group-containing silane compound to the total amount of the epoxy resin, the curing agent, the curing accelerator, and the xylene resin in the epoxy resin composition is 0.001.
If it is less than 5% by weight, the effect of improving the adhesiveness cannot be sufficiently exerted, and if it exceeds 5% by weight, the hygroscopicity is increased, which is not preferable. Further, the effect of improving the adhesiveness is a compound produced by previously hydrolyzing the mercapto group-containing silane compound, in the total amount of the epoxy resin in the epoxy resin composition, the curing agent, the curing accelerator, and the xylene resin. On the other hand, it can be most remarkably exhibited when blended in a proportion of 0.01 to 3% by weight.
【００１８】ここでメルカプト基含有シラン化合物とし
ては、例えばγ−メルカプトプロピルトリメトキシシラ
ン等のメルカプト基含有シランカップリング剤を挙げる
ことができ、このようなメルカプト基含有シランカップ
リング剤を、あらかじめメルカプト基含有シランカップ
リング剤と同量又はそれ以下の蒸留水及びアルコールと
混合し、加水分解してシラノール化することによって得
られる化合物を用いるものである。Examples of the mercapto group-containing silane compound include a mercapto group-containing silane coupling agent such as γ-mercaptopropyltrimethoxysilane. A compound obtained by mixing the same amount or less of distilled water and alcohol as the group-containing silane coupling agent, and hydrolyzing the mixture to silanol is used.
【００１９】本発明のエポキシ樹脂組成物には、上記の
各成分のほかに、必要に応じて変色防止剤、老化防止
材、染料、シリカ等の無機充填材、変成剤、可塑剤、希
釈剤等を配合することが可能である。In the epoxy resin composition of the present invention, in addition to the above-mentioned components, if necessary, a discoloration inhibitor, an antioxidant, a dye, an inorganic filler such as silica, a modifier, a plasticizer, a diluent. It is possible to mix these.
【００２０】本発明のエポキシ樹脂組成物を調製するに
あたっては、調製されるエポキシ樹脂組成物の性状が液
体状である場合は上記の各成分を所望の割合で配合した
ものを溶解混合し、又は溶融混合した後３本ロール等で
溶融混練して液体状のエポキシ樹脂組成物を得ることが
できる。また調製されるエポキシ樹脂組成物の性状が固
体状である場合は上記の各成分を所望の割合で配合した
ものを溶解混合し、又は溶融混合した後３本ロール等で
溶融混練したものを冷却固化した後粉砕して粉末状の樹
脂組成物を得るものであり、また更に必要に応じて粉末
状の樹脂組成物をタブレット状に打錠することもでき
る。In preparing the epoxy resin composition of the present invention, when the prepared epoxy resin composition is in a liquid state, a mixture of the above components in a desired ratio is dissolved and mixed, or After being melt-mixed, the liquid epoxy resin composition can be obtained by melt-kneading with a three-roll or the like. When the epoxy resin composition to be prepared has a solid state, the above components are mixed in a desired ratio by melt-mixing, or the mixture is melt-mixed and then melt-kneaded with a three-roll mill or the like to cool it. The resin composition is solidified and then pulverized to obtain a powdery resin composition. Further, the powdery resin composition can be tabletted into a tablet if necessary.
【００２１】このようにして得られたエポキシ樹脂組成
物を用いて光半導体装置の製造を行う際には、先ず金属
のリードフレーム上に、ＬＥＤ、フォトトランジスタ
ー、フォトダイオード、ＣＣＤ、ＥＰＲＯＭ等の光半導
体素子をダイボンディングする。次にＡｕ等の細線ワイ
ヤを用いたワイヤボンディング法等でリードフレームと
光半導体素子を結線する。次に上記のエポキシ樹脂組成
物を用いて光半導体装置とワイヤーを樹脂封止する。こ
のように形成される光半導体装置は、チップ、ワイヤ、
及びその接合部が封止樹脂により電気的、機械的に外部
環境から保護される共に、ユーザーが使い易いようにす
るものである。ここで樹脂封止を行うにあたっては、エ
ポキシ樹脂組成物が固体状である場合には粉末状又はタ
ブレット状のエポキシ樹脂組成物をトランスファー成形
することにより封止樹脂を成形して樹脂封止を行うもの
であり、エポキシ樹脂組成物が液体状である場合にはキ
ャスティング等の方法により注型、固化することにより
封止樹脂を成形して樹脂封止を行うものである。When manufacturing an optical semiconductor device using the epoxy resin composition thus obtained, first, a light such as an LED, a phototransistor, a photodiode, a CCD, an EPROM is provided on a metal lead frame. Die bonding the semiconductor element. Next, the lead frame and the optical semiconductor element are connected by a wire bonding method using a fine wire such as Au. Next, the optical semiconductor device and the wire are resin-sealed by using the above epoxy resin composition. The optical semiconductor device thus formed includes a chip, a wire,
In addition, the joint portion is electrically and mechanically protected from the external environment by the sealing resin, and is easy for the user to use. Here, when performing resin encapsulation, when the epoxy resin composition is in a solid state, the encapsulating resin is molded by transfer molding the powdery or tablet-like epoxy resin composition to perform resin encapsulation. When the epoxy resin composition is in a liquid state, it is cast and solidified by a method such as casting to mold a sealing resin to perform resin sealing.
【００２２】[0022]
【実施例】以下、本発明を実施例によって詳述する。
（実施例１乃至１１）表１に示す各成分を、各実施例及
び比較例について表１に示す割合で配合し、ホモミキサ
ー攪拌装置を備えたステンレス容器に入れて、５５℃で
約１０分間溶融混練した後冷却固化したものを粉砕して
粉末状の半導体封止用エポキシ樹脂組成物を得た。この
粉末状の半導体封止用エポキシ樹脂組成物をタブレット
状に打錠した。EXAMPLES The present invention will be described in detail below with reference to examples. (Examples 1 to 11) The components shown in Table 1 were blended in the proportions shown in Table 1 for each Example and Comparative Example, placed in a stainless steel container equipped with a homomixer stirrer, and kept at 55 ° C for about 10 minutes. What was melt-kneaded and then cooled and solidified was crushed to obtain a powdery epoxy resin composition for semiconductor encapsulation. The powdery epoxy resin composition for semiconductor encapsulation was tabletted.
【００２３】ここで表中のビスフェノールＡ型エポキシ
樹脂＊１は、エポキシ当量１８５の液体状のビスフェノ
ールＡ型エポキシ樹脂（油化シェルエポキシ（株）製、
商品名「エピコート８２７」）、ビスフェノールＡ型エ
ポキシ樹脂＊２は、エポキシ当量４９０の固形状のビス
フェノールＡ型エポキシ樹脂（油化シェルエポキシ
（株）製、品番「エピコート１００１」）、キシレン樹
脂＊３は、上記化学式（１）及び上記一般式（２）で示
される化合物からなる数平均分子量３８０のキシレン樹
脂（三菱ガス化学（株）製、「ニカノールＹ５００
１」）、キシレン樹脂＊４は、上記化学式（１）及び上
記一般式（２）で示される化合物からなる数平均分子量
３００のキシレン樹脂（三菱ガス化学（株）製、「ニカ
ノールＹ１０１」）、キシレン樹脂＊５は上記化学式
（１）及び上記一般式（２）で示される化合物からなる
数平均分子量２６０のキシレン樹脂（三菱ガス化学
（株）製、「ニカノールＹ５１」）、キシレン樹脂＊６
は上記化学式（１）で示される化合物のみからなる数平
均分子量２３０のキシレン樹脂である。また、メルカプ
トシランカップリング剤の加水分解品＊７は、γ−グリ
シドキシプロピルメルカプトシラン１０重量部に対して
メタノール２重量部、水０．５重量部を添加し、室温で
５分間攪拌し、更に４０℃で１時間放置して加水分解し
たものである。The bisphenol A type epoxy resin * 1 in the table is a liquid bisphenol A type epoxy resin (produced by Yuka Shell Epoxy Co., Ltd.) having an epoxy equivalent of 185.
Product name "Epicoat 827"), bisphenol A type epoxy resin * 2 is a solid bisphenol A type epoxy resin with an epoxy equivalent of 490 (Yukaka Shell Epoxy Co., Ltd., product number "Epicoat 1001"), xylene resin * 3 Is a xylene resin having a number average molecular weight of 380, which is composed of a compound represented by the above chemical formula (1) and the above general formula (2) (manufactured by Mitsubishi Gas Chemical Co., Inc., “Nicanol Y500”).
1 "), a xylene resin * 4 is a xylene resin having a number average molecular weight of 300 composed of a compound represented by the chemical formula (1) and the general formula (2) (manufactured by Mitsubishi Gas Chemical Co., Inc.," Nikanol Y101 "), The xylene resin * 5 is a xylene resin having a number average molecular weight of 260 (“Nicanol Y51” manufactured by Mitsubishi Gas Chemical Co., Inc.), which is a compound represented by the chemical formula (1) and the general formula (2), and a xylene resin * 6.
Is a xylene resin having a number average molecular weight of 230 and consisting only of the compound represented by the chemical formula (1). Further, the hydrolyzate * 7 of the mercaptosilane coupling agent was added with 2 parts by weight of methanol and 0.5 parts by weight of water to 10 parts by weight of γ-glycidoxypropylmercaptosilane and stirred at room temperature for 5 minutes. Further, it was hydrolyzed by further standing at 40 ° C. for 1 hour.
【００２４】上記のようにして得られた各実施例及び各
比較例のエポキシ樹脂組成物について、以下に示すよう
な評価試験を行い、その結果を表１に示す。
（光透過性評価）各実施例及び比較例にて得られたタブ
レット状のエポキシ樹脂組成物を用いて、注入時間２０
秒、注入圧力８０ｋｇｆ／ｃｍ2、キュアタイム９０
秒、型温１６５℃の条件でトランスファー成形を行い、
厚み１ｍｍのテストピースを作製した。このテストピー
スに光線を入射すると共に透過光を分光光度計（（株）
日立製作所製、「Ｕ−３４００」）にて検出し、波長９
６０ｎｍ及び波長４００ｎｍの光線の透過率を測定し
た。
（白濁性評価）各実施例及び比較例にて得られたタブレ
ット状のエポキシ樹脂組成物を用いて、上記の光透過性
評価の場合と同一の条件にてテストピースを厚み１〜８
ｍｍの範囲で作製した。一方白色紙に硬度Ｂの鉛筆にて
線を描き、その上にテストピースを載せ、テストピース
を介して線を目視で観察した。そして白濁性の評価を下
記の評価基準にて行った。The epoxy resin compositions of Examples and Comparative Examples obtained as described above were subjected to the following evaluation tests, and the results are shown in Table 1. (Evaluation of Light Transmittance) Using the tablet-shaped epoxy resin compositions obtained in the respective examples and comparative examples, an injection time of 20
Second, injection pressure 80 kgf / cm 2 , cure time 90
Second, transfer molding is performed under the condition that the mold temperature is 165 ° C.
A test piece having a thickness of 1 mm was produced. A light beam is incident on this test piece and the transmitted light is measured by a spectrophotometer (Co., Ltd.).
"U-3400" manufactured by Hitachi, Ltd., and the wavelength of 9
The transmittance of light having a wavelength of 60 nm and a wavelength of 400 nm was measured. (Evaluation of white turbidity) Using the tablet-shaped epoxy resin compositions obtained in the respective examples and comparative examples, test pieces having a thickness of 1 to 8 were formed under the same conditions as in the case of the above-mentioned evaluation of light transmittance.
It was produced in the range of mm. On the other hand, a line was drawn on a white paper with a pencil of hardness B, a test piece was placed on the line, and the line was visually observed through the test piece. The white turbidity was evaluated according to the following evaluation criteria.
【００２５】○：厚み１〜８ｍｍの全てのテストピース
において、白色紙上の線を観察できる。◯: Lines on white paper can be observed in all test pieces having a thickness of 1 to 8 mm.
【００２６】×：厚み８ｍｍ以下のテストピースにおい
て、白色紙上の線を観察できなくなる。（耐湿信頼性評
価）部分銀めっきを施した４２アロイ製リードフレーム
上に、窒化ケイ素膜に配線幅５μｍのＡｌパターンを形
成したチップサイズ４×５ｍｍのＡｌパターンチップを
ダイボンディングした後、直径２５μｍのＡｕの細線ワ
イヤを用いたワイヤボンディング法で結線して、各実施
例及び各比較例のエポキシ樹脂組成物を用いて上記の光
透過性評価の場合と同一の条件でトランスファー成形に
て樹脂封止して、１６ＤＩＰ封止成形品を作製した。X: In the test piece having a thickness of 8 mm or less, the line on the white paper cannot be observed. (Moisture resistance reliability evaluation) After a die-bonding of an Al pattern chip with a chip size of 4 × 5 mm in which an Al pattern with a wiring width of 5 μm is formed on a silicon nitride film on a lead frame made of 42 alloy which is partially silver-plated, the diameter is 25 μm. The wire bonding method using the Au thin wire is used, and the epoxy resin composition of each example and each comparative example is used to perform resin molding by transfer molding under the same conditions as in the case of the above light transmittance evaluation. Then, a 16DIP sealing molded product was produced.
【００２７】この１６ＤＩＰ封止成形品２０個について
１２５℃で１２時間アフターキュアー処理を行ったもの
を６０℃、ＲＨ９５％の高温高湿下に最大１０００時間
曝露し、２５０時間ごとにオープン不良の有無を確認し
て、累積不良が１０％に達するまで（２０個のサンプル
のうち２個のサンプルについて不良が発生するまで）の
時間を測定した。
（密着性評価）耐湿信頼性評価の際と同一の条件で５０
０時間高温高湿下に曝露した１６ＤＩＰ封止成形品につ
いて、封止樹脂とＡｌパターンチップとの密着性を超音
波密着探傷試験機（（株）キャノン製、「Ｃ−７０
０」）にて測定して下記評価基準にて評価を行った。20 pieces of the 16 DIP encapsulation molded products which were subjected to after-curing treatment at 125 ° C. for 12 hours were exposed to high temperature and high humidity of 60 ° C. and RH of 95% for a maximum of 1000 hours, and there was an open defect every 250 hours. Was confirmed, and the time until the cumulative defect reached 10% (until a defect occurred in two samples out of 20 samples) was measured. (Adhesion evaluation) 50 under the same conditions as in the moisture resistance reliability evaluation.
Regarding the 16DIP encapsulation molded product exposed to high temperature and high humidity for 0 hours, the adhesion between the encapsulation resin and the Al pattern chip was measured by an ultrasonic adhesion flaw detection tester (manufactured by Canon Inc., "C-70").
0 ") and evaluated according to the following evaluation criteria.
【００２８】○：封止樹脂とＡｌパターンチップとの接
合面のうち２０％以下の面積の部分にて剥離が発生。◯: Peeling occurred in the area of 20% or less of the joint surface between the sealing resin and the Al pattern chip.
【００２９】△：封止樹脂とＡｌパターンチップとの接
合面のうち２０％超、５０％以下の面積の部分にて剥離
が発生。Δ: Peeling occurred in a portion having an area of more than 20% and less than 50% of the joint surface between the sealing resin and the Al pattern chip.
【００３０】×：封止樹脂とＡｌパターンチップとの接
合面のうち５０％超の面積の部分にて剥離が発生。
（ＬＥＤ封止低温通電評価）部分銀めっきを施した４２
アロイ製リードフレーム上に、ＬＥＤ（Ｃｏｎａｒｙ社
製、品番「ＵＥＤ−７１２ＳＹ−Ｖ）をダイボンディン
グした後、直径２５μｍのＡｕの細線ワイヤを用いたワ
イヤボンディング法で結線して、各実施例及び各比較例
のエポキシ樹脂組成物を用いて上記の光透過性評価の場
合と同一の条件でトランスファー成形にて樹脂封止し
て、封止成形品を作製した。X: Peeling occurred in the area of more than 50% of the joint surface between the sealing resin and the Al pattern chip. (LED encapsulation low-temperature energization evaluation) 42 with partial silver plating
An LED (manufactured by Conary, product number “UED-712SY-V”) was die-bonded on an alloy lead frame and then connected by a wire bonding method using a fine wire of Au having a diameter of 25 μm, and each Example and each Using the epoxy resin composition of Comparative Example, resin molding was performed by transfer molding under the same conditions as in the case of the above-mentioned evaluation of light transmittance, and a molded molded article was produced.
【００３１】この封止成形品に−２０℃の条件下で３．
５Ｖの定格電圧を印加して通電すると共に、このとき封
止樹脂を介してＬＥＤから発せられる光の輝度を分光光
度計（（株）日立製作所製、品番「Ｕ−３４００」）を
用いて測定し、輝度が通電初期と比較して１０％低下し
た時間を計測した。This sealing molded product was subjected to the conditions of -20 ° C and 3.
While applying a rated voltage of 5V and energizing, measure the brightness of the light emitted from the LED through the sealing resin at this time using a spectrophotometer (manufactured by Hitachi, Ltd., product number "U-3400") Then, the time when the brightness was reduced by 10% compared to the initial stage of energization was measured.
【００３２】[0032]
【表１】
表１から判るように、式（１）、（２）で示される数平
均分子量２００〜１０００のキシレン樹脂が配合されて
いない比較例１、６や、配合量がエポキシ樹脂、硬化
剤、硬化促進剤、及びキシレン樹脂の総量に対して３．
０〜２５重量％の範囲にはない比較例２乃至５では、非
通電時の光透過性及び密着性については良好な結果が得
られたが、白濁性、耐湿信頼性、及びＬＥＤ封止低温通
電評価について同時に良好な結果を得ることはできなか
った。それに対して実施例１乃至６では、非通電時の光
透過性及び密着性が良好であり、かつ白濁性、耐湿信頼
性、及びＬＥＤ封止低温通電評価のいずれにおいても良
好な結果が得られた。特にメルカプト基含有シラン化合
物をあらかじめ加水分解してなる化合物を、上記のエポ
キシ樹脂、硬化剤、硬化促進剤、及びキシレン樹脂の総
量に対して０．００１〜５重量％の範囲で含有する実施
例６では、密着性について特に良好な結果が得られた。[Table 1] As can be seen from Table 1, Comparative Examples 1 and 6 in which the xylene resin having the number average molecular weight of 200 to 1000 represented by the formulas (1) and (2) is not blended, and the blending amount is an epoxy resin, a curing agent, and a curing accelerator. 2. Based on the total amount of agent and xylene resin.
In Comparative Examples 2 to 5, which were not in the range of 0 to 25% by weight, good results were obtained with respect to the light transmittance and the adhesiveness at the time of non-energization, but the white turbidity, the humidity resistance reliability, and the LED sealing low temperature were obtained. It was not possible to obtain good results at the same time for the evaluation of energization. On the other hand, in Examples 1 to 6, the light transmittance and the adhesiveness when not energized were good, and good results were obtained in all of the white turbidity, the humidity resistance reliability, and the LED encapsulation low-temperature energization evaluation. It was In particular, an example containing a compound obtained by previously hydrolyzing a mercapto group-containing silane compound in a range of 0.001 to 5% by weight with respect to the total amount of the above epoxy resin, curing agent, curing accelerator, and xylene resin. In No. 6, particularly good results were obtained regarding the adhesion.
【００３３】[0033]
【発明の効果】上記のように本発明の請求項１に記載の
エポキシ樹脂組成物は、エポキシ樹脂、硬化剤、硬化促
進剤、並びに上記化学式（１）及び上記一般式（２）で
示される化合物の少なくとも一方からなる数平均分子量
２００〜１０００のキシレン樹脂を含み、このキシレン
樹脂を、エポキシ樹脂、硬化剤、硬化促進剤、及びキシ
レン樹脂の総量に対して３．０〜２５重量％含有し、硬
化剤として酸無水物を含有するため、本発明のエポキシ
樹脂組成物を硬化成形して得られる成形体に優れた応力
緩衝効果を付与することができ、この成形体をＬＥＤ等
の光半導体素子の封止材として用いる場合、通電による
発熱によって封止材が加熱した際に封止材の熱応力がＬ
ＥＤ等にかかることによる輝度の劣化を抑制することが
できるものである。またこの成形体を半導体装置の封止
材として用いる場合の耐湿性、リードフレームや素子と
の密着性、及び透明性を良好なものとすることができる
ものである。As described above, the epoxy resin composition according to claim 1 of the present invention is represented by the epoxy resin, the curing agent, the curing accelerator, and the chemical formula (1) and the general formula (2). It contains a xylene resin having a number average molecular weight of 200 to 1000 consisting of at least one of the compounds, and the xylene resin is contained in an amount of 3.0 to 25% by weight based on the total amount of the epoxy resin, the curing agent, the curing accelerator, and the xylene resin. , Hard
Since an acid anhydride is contained as an agent , an excellent stress buffering effect can be imparted to a molded product obtained by curing and molding the epoxy resin composition of the present invention, and this molded product is used as an optical semiconductor element such as an LED. When used as a sealing material for the sealing material, the thermal stress of the sealing material is L when the sealing material is heated by heat generated by energization.
It is possible to suppress the deterioration of the brightness due to the ED or the like. Further, when this molded product is used as a sealing material for a semiconductor device, it is possible to improve moisture resistance, adhesion to lead frames and elements, and transparency.
【００３４】また本発明の請求項２に記載のエポキシ樹
脂組成物は、メルカプト基含有シラン化合物を加水分解
してシラノール化された化合物を、上記のエポキシ樹
脂、硬化剤、硬化促進剤、及びキシレン樹脂の総量に対
して０．００１〜５重量％含有して成るため、本発明の
エポキシ樹脂組成物を硬化成形して得られる成形体を半
導体装置の封止材として用いた場合、成形体とリードフ
レームや素子との密着性を更に向上することができるも
のである。The epoxy resin composition according to claim 2 of the present invention comprises a compound obtained by hydrolyzing a mercapto group-containing silane compound to silanolize the epoxy resin, the curing agent, the curing accelerator, and the xylene. Since the content of the resin is 0.001 to 5% by weight based on the total amount of the resin, when the molded product obtained by curing and molding the epoxy resin composition of the present invention is used as a sealing material for a semiconductor device, It is possible to further improve the adhesion to the lead frame and the element.
フロントページの続き (56)参考文献 特開 昭60−65020（ＪＰ，Ａ) 特開 平10−60228（ＪＰ，Ａ) 特開 平11−209579（ＪＰ，Ａ) 特開 昭64−65120（ＪＰ，Ａ) 特開 昭60−110747（ＪＰ，Ａ) 特開 平７−11106（ＪＰ，Ａ) 特開 平１−203456（ＪＰ，Ａ) 特開 昭62−192469（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 63/00 - 63/10 C08K 5/548 C08L 61/18 H01L 23/29 Continuation of front page (56) Reference JP-A-60-65020 (JP, A) JP-A-10-60228 (JP, A) JP-A-11-209579 (JP, A) JP-A-64-65120 (JP , A) JP 60-110747 (JP, A) JP 7-11106 (JP, A) JP 1-203456 (JP, A) JP 62-192469 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C08L 63/00-63/10 C08K 5/548 C08L 61/18 H01L 23/29
Claims (3)
びに下記化学式（１）及び下記一般式（２）で示される
化合物の少なくとも一方からなる数平均分子量２００〜
１０００のキシレン樹脂を含み、このキシレン樹脂を、
エポキシ樹脂、硬化剤、硬化促進剤、及びキシレン樹脂
の総量に対して３．０〜２５重量％含有し、硬化剤とし
て酸無水物を含有して成ることを特徴とするエポキシ樹
脂組成物。 【化１】 1. A number average molecular weight of from 200 to 200 comprising an epoxy resin, a curing agent, a curing accelerator, and at least one of compounds represented by the following chemical formula (1) and general formula (2).
Including 1000 xylene resin, this xylene resin,
The epoxy resin, the curing agent, the curing accelerator and the xylene resin are contained in an amount of 3.0 to 25% by weight based on the total amount of the curing agent.
An epoxy resin composition comprising an acid anhydride . [Chemical 1]
解してシラノール化された化合物を、上記のエポキシ樹
脂、硬化剤、硬化促進剤、及びキシレン樹脂の総量に対
して０．００１〜５重量％含有して成ることを特徴とす
る請求項１に記載のエポキシ樹脂組成物。2. A silanol compound obtained by hydrolyzing a mercapto group-containing silane compound is contained in an amount of 0.001 to 5% by weight based on the total amount of the epoxy resin, curing agent, curing accelerator and xylene resin. The epoxy resin composition according to claim 1, wherein the epoxy resin composition comprises:
成物にて封止されて成ることを特徴とする光半導体装
置。3. An optical semiconductor device, which is encapsulated with the epoxy resin composition according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14485198A JP3392052B2 (en) | 1998-05-26 | 1998-05-26 | Epoxy resin composition and optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14485198A JP3392052B2 (en) | 1998-05-26 | 1998-05-26 | Epoxy resin composition and optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11335530A JPH11335530A (en) | 1999-12-07 |
| JP3392052B2 true JP3392052B2 (en) | 2003-03-31 |
Family
ID=15371903
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14485198A Expired - Lifetime JP3392052B2 (en) | 1998-05-26 | 1998-05-26 | Epoxy resin composition and optical semiconductor device |
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| Country | Link |
|---|---|
| JP (1) | JP3392052B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5329054B2 (en) * | 2007-06-13 | 2013-10-30 | 日東電工株式会社 | Epoxy resin composition for optical semiconductor element sealing and optical semiconductor device using the same |
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1998
- 1998-05-26 JP JP14485198A patent/JP3392052B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11335530A (en) | 1999-12-07 |
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