JP3398305B2 - Wiring board and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board used for a semiconductor element housing package for housing a semiconductor element, a hybrid integrated circuit board and the like.

[0002]

2. Description of the Related Art Conventionally, a wiring board, for example, a wiring board used for a semiconductor element housing package for housing a semiconductor element, is made of ceramics such as an aluminum oxide sintered body, and the semiconductor element is housed in the center of its upper surface. And a wiring conductor made of refractory metal powder such as tungsten and molybdenum, which is led out from the periphery of the recess of the insulating base to the lower surface,
The semiconductor element is adhered and fixed to the bottom surface of the recess of the insulating substrate with an adhesive such as glass, resin, or a brazing material, and each electrode of the semiconductor element is electrically connected to a wiring conductor through an electrical connecting means such as a bonding wire. After connecting, a lid made of metal, ceramics, or the like is bonded to the upper surface of the insulating base through a sealing material such as glass, resin, or brazing material so as to close the recess of the insulating base. A semiconductor device as a product is obtained by hermetically housing the semiconductor element in the recess. Then, the semiconductor element to be housed is electrically connected to the external electric circuit board by connecting the portion led out to the lower surface of the insulating substrate with the wire conductor to the wiring conductor of the external electric circuit board through an electrical connecting means such as solder. Will be connected.

This conventional wiring board is manufactured by a ceramic green sheet laminating method. Specifically, a suitable organic binder or solvent is added to ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide. A plurality of ceramic green sheets are obtained by mixing them into a sludge shape and adopting a conventionally known doctor blade method to form a sheet shape. Thereafter, while appropriately punching these ceramic green sheets, A metal paste to be a wiring conductor is printed and applied in a predetermined pattern, and finally these ceramic green sheets are laminated in a predetermined order on top and bottom to form a green ceramic compact, and this is fired in a reducing atmosphere at a high temperature of about 1600 ° C. It is produced by

However, in this conventional wiring board, since the ceramics such as the aluminum oxide sintered body forming the insulating substrate has a hard and brittle property, the wiring boards may not be connected to each other in a carrying process or an automatic line for manufacturing a semiconductor device. Or, if the wiring board and a part of the semiconductor device manufacturing automatic line collide violently, the insulating substrate may be chipped, cracked, or cracked. As a result, the semiconductor element cannot be housed in an airtight manner, and the semiconductor element is long. It has a drawback that it cannot operate normally and stably over a period of time.

Further, according to this conventional wiring board manufacturing method, when the green ceramic molded body is fired, uneven firing shrinkage occurs in the green ceramic molded body, and the resulting wiring board is deformed such as warped or the like. Variations in dimensions occur, and as a result,
It has a drawback that it is difficult to electrically and accurately connect the semiconductor element and the wiring conductor.

Therefore, the insulating substrate of the wiring board is formed by laminating an insulating substrate made of a material in which inorganic insulating powder is bonded by a thermosetting resin instead of the conventional ceramics, and the wiring conductor is formed by the conventional tungsten or tungsten. There has been proposed a wiring board formed of a material obtained by binding metal powder such as copper with a thermosetting resin instead of metallization of a high melting point metal such as molybdenum.

A wiring board composed of an insulating substrate formed by bonding the inorganic insulating powder with a thermosetting resin and a wiring conductor formed by bonding a metal powder with the thermosetting resin is a thermosetting resin precursor and an inorganic material. A semi-cured precursor sheet prepared by mixing insulating powder is prepared and subjected to appropriate punching, and then the precursor sheet is mixed with a thermosetting resin precursor and metal powder. The resulting metal paste is applied in a predetermined pattern by printing, and finally the precursor sheet on which the metal paste is applied by printing is laminated and hot pressed at a temperature of about 150 to 300 ° C. and a pressure of about 4 to 100 kgf / cm ^2. It is manufactured by thermosetting this.

[0008] According to this wiring board, an inorganic insulator powder serving as an insulating substrate and the wiring conductors become metal powder from that formed by combining with a thermosetting resin excellent in toughness, respectively, the wiring board or between the wiring board and the semiconductor Even if a part of the automatic equipment manufacturing line collides violently, there will be no chipping, cracking, or cracking in the insulating substrate.

Further, according to this method for manufacturing a wiring board, since it is manufactured by thermosetting the precursor of the thermosetting resin contained in the insulating substrate and the wiring conductor, uneven shrinkage due to firing is caused. There is no deformation or variation in dimensions.

[0010]

However, a wiring board comprising an insulating substrate formed by bonding the inorganic insulating powder with a thermosetting resin and a wiring conductor formed by bonding a metal powder with the thermosetting resin is provided. For example, when the semi-cured precursor sheets are laminated by hot pressing, the curing reaction of the thermosetting resin precursor contained in the precursor sheets to be laminated on each other has already progressed before the lamination and thermosetting. Since the reactive groups in the thermosetting resin precursor are reduced, the curing reaction between the thermosetting resin precursors becomes weaker between the upper and lower precursor sheets. Therefore, the thermosetting resins are not tightly bonded to each other between the insulating substrates that form the insulating substrate, and the moisture resistance of this portion is slightly inferior. If such a wiring substrate is left in the external atmosphere for a long period of time, the insulation Moisture in the external atmosphere gradually infiltrates into the insulating substrate through the space between the substrates, causing corrosion of the wiring conductors, and as a result, the semiconductor elements housed inside can operate normally and stably for a long period of time. It has the drawback of disappearing.

The present invention has been devised in view of the above circumstances, and an object thereof is to bond an insulating substrate formed by bonding an inorganic insulating powder with a thermosetting resin and a metal powder with a thermosetting resin. Provided is a wiring board including a wiring conductor formed of the above-mentioned wiring conductor, in which moisture can be effectively prevented from entering between insulating boards, and a semiconductor element housed inside can be normally and stably operated for a long period of time. Especially.

Another object of the present invention is to provide a method of manufacturing a wiring board comprising an insulating substrate formed by bonding an inorganic insulating powder with a thermosetting resin and a wiring conductor formed by bonding a metal powder with a thermosetting resin. SUMMARY OF THE INVENTION It is an object of the present invention to provide a manufacturing method capable of obtaining a wiring board in which moisture can be effectively prevented from entering between insulating substrates, and a semiconductor element housed inside can be normally and stably operated for a long period of time. .

[0013]

The wiring board of the present invention is a hard board.
Epoxy resin that cures by reacting with an agent
Bismaleimide triazine resin mixed with edge powder
Heat curing by stacking multiple semi-cured precursor sheets consisting of
Was, the inorganic insulator powder by laminating a plurality of insulating substrates formed by combining with the bismaleimide triazine resin formed
The insulating substrates of the insulating base are
The semi-curing is induced by the curing agent interposed between the sheets.
The epoxy resin base agent exuded between the precursor sheets and the
It is characterized in that it is joined in multiple layers through an epoxy resin adhesive layer formed by reaction with a curing agent, and a wiring conductor is formed between the insulating substrates and / or on the exposed surface of the insulating substrate. .

[0014] The method of the wiring substrate manufacturing the present invention, a plurality prepare a precursor sheet was added to and mixed with the epoxy resin main component and the inorganic insulating powder is cured by reaction with hardening agent to the precursor of the bismaleimide triazine resin And the precursor
A step of semi-curing the body sheet, a step of depositing the semi-cured to at least one metal paste for forming the wiring conductor of metal foil or thermosetting of the wiring conductors of the precursor sheet in a predetermined pattern, the metal foil Or said metal pellet
The semi-cured precursor sheet to which the paste is applied, and a step of stacking the precursor sheet laminated in multiple layers with a curing agent that reacts with the epoxy resin main agent interposed therebetween, A plurality of insulating substrates are formed by binding the inorganic insulating powder with a heat-cured bismaleimide triazine resin, and wiring conductors are attached to the insulating substrates, and each insulating substrate is induced by the curing agent to be semi-cured. The precursor
It is characterized in that it comprises a step of joining by the cured epoxy resin adhesive layer is formed by reaction of the pre disappeared epoxy resin main agent and the curing agent exuded between the sheets.

According to the wiring board of the present invention, since a plurality of insulating boards formed by binding the inorganic insulating powder with the bismaleimide triazine resin are laminated in multiple layers via the epoxy resin adhesive layer, each insulating board is made of epoxy. Since it is firmly bonded via the resin adhesive layer, it is possible to improve the moisture resistance between the insulating substrates, and the epoxy resin adhesive layer can effectively prevent the infiltration of water through between the insulating substrates.
As a result, the wiring board is capable of normally and stably operating the semiconductor element housed therein for a long period of time.

According to the method for manufacturing a wiring board of the present invention, the epoxy resin main component inside the precursor sheet reacts with the curing agent interposed between the precursor sheets to cure the epoxy resin between the insulating substrates. Since the resin adhesive layer is formed, the cured epoxy resin adhesive layers firmly bond the insulating substrates to each other, so that the moisture resistance between the insulating substrates can be improved, and the epoxy resin adhesive layer can be used between the insulating substrates. It is possible to obtain a wiring board that can effectively prevent the entry of moisture from the inside.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wiring board and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment in which the wiring board of the present invention is applied to a semiconductor element housing package for housing a semiconductor element. In FIG.
Is an insulating substrate, and 2 is a wiring conductor.

The insulating substrate 1 is composed of three insulating substrates 1a, which are made of a material obtained by binding inorganic insulating powders such as silicon oxide, aluminum oxide, aluminum nitride, silicon carbide, barium titanate, and zeolite with a bismaleimide triazine resin. 1b and 1c, and has a recess A recessed stepwise in the center of the upper surface thereof, and the semiconductor element 3 is bonded and fixed to the bottom surface of the recess A via an adhesive such as resin.

The inorganic insulating powder contained in the insulating substrates 1a, 1b and 1c has a particle size of about 0.1 to 100 μm, and the thermal expansion coefficient of the insulating substrates 1a, 1b and 1c is equal to that of the semiconductor element 3. In addition to having a function close to the coefficient, it also has a function of imparting good thermal conductivity, water resistance, or a predetermined relative dielectric constant to the insulating substrates 1a, 1b, 1c. On the other hand,
The bismaleimide triazine resin contained in the insulating substrates 1a, 1b, 1c functions to bind the inorganic insulating powders to each other and hold the insulating substrate 1 in a predetermined shape.

Since the insulating substrates 1a, 1b, 1c are formed by binding the inorganic insulating powders with the bismaleimide triazine resin having excellent toughness, the insulating substrate 1 is chipped, cracked or cracked when the wiring substrates collide with each other. Etc. will not occur.

Further, in the insulating substrates 1a, 1b, 1c, when the content of the inorganic insulating powder contained therein is less than 60% by weight, the thermal expansion coefficient of the insulating substrate 1 is the thermal expansion coefficient of the semiconductor element 3. When the heat generated during the operation of the semiconductor element 3 is applied to the semiconductor element 3 and the insulating substrate 1, a large thermal stress is generated due to the difference in thermal expansion coefficient between the semiconductor element 3 and the semiconductor element 3. When the content of the inorganic insulating powder exceeds 95% by weight, the inorganic insulating powder is strongly bonded with the bismaleimide triazine resin when the element 3 tends to easily peel or crack from the insulating substrate 1. Tends to be difficult. Therefore, the insulating substrate 1a
The content of the inorganic insulating powder contained in b-1c is 60.
A range of up to 95% by weight is preferred.

The insulating substrate 1 is made up of the insulating substrates 1a and 1b.
1c is bonded in multiple layers via the cured epoxy resin adhesive layers 4a and 4b.

The epoxy resin adhesive layers 4a, 4b are made of a cured product of an epoxy resin such as bisphenol A type epoxy resin, novolac type epoxy resin, glycidyl ester type epoxy resin, etc., and firmly bond the insulating substrates 1a, 1b, 1c to each other. In addition, it has the function of preventing moisture from entering between the insulating substrates 1a, 1b and 1c.

The insulating substrate 1 is made up of the insulating substrates 1a, 1b, 1
Since c is joined in multiple layers via the epoxy resin adhesive layers 4a and 4b, the epoxy resin adhesive layers 4a and 4b
By this, the insulating substrates 1a, 1b, 1c are firmly joined together, and moisture is effectively prevented from entering between the insulating substrates 1a, 1b, 1c, and as a result, the semiconductor element 3 housed inside the recess A is formed. Can be operated normally and stably for a long period of time.

The epoxy resin adhesive layers 4a and 4b are
If the thickness is less than 0.5 μm, each insulating substrate 1a ・ 1b ・ 1
It tends to be difficult to firmly bond the c's together,
If the thickness exceeds 10 μm, there is a risk that the wiring conductor 2 to be described later may be electrically disconnected between the upper and lower insulating substrates. Therefore, the thickness of the epoxy resin adhesive layers 4a and 4b is preferably in the range of 0.5 to 10 μm.

Further, the insulating base 1 is led out from the upper surface of the insulating substrate 1b around the recess A through the insulating substrates 1b and 1c to the lower surface of the insulating substrate 1c, for example, copper, silver, gold, and the surface is coated with silver. A large number of wiring conductors 2 in which metal powder such as copper is bonded by a thermosetting resin such as an epoxy resin are provided.

The wiring conductor 2 serves to electrically connect the semiconductor element 3 housed inside to an external electric circuit, and each electrode of the semiconductor element 3 is provided with a bonding wire 5 at a portion around the recess A. Is electrically connected to the external electric circuit board.

The metal powder contained in the wiring conductor 2 acts to impart conductivity to the wiring conductor 2, and if the content in the wiring conductor 2 is less than 70% by weight, the conductivity of the wiring conductor 2 tends to deteriorate. And the content in the wiring conductor 2 is
If it exceeds 95% by weight, it tends to be difficult to firmly bond the metal powder with the thermosetting resin. Therefore, the content of the metal powder contained in the wiring conductor 2 in the wiring conductor 2 is preferably 70 to 95% by weight.

When the average particle diameter of the metal powder contained in the wiring conductor 2 is less than 0.5 μm, the contact resistance between the metal powder particles increases, and the electric resistance of the wiring conductor 2 tends to be high. Yes, on the other hand, if it exceeds 50 μm, the insulating substrate 1
50 to 20 which is generally required to have a wiring conductor 2 of a predetermined pattern
It tends to be difficult to form a line width of 0 μm. Therefore, the metal powder contained in the wiring conductor 2 preferably has an average particle size of 0.5 to 50 μm.

The thermosetting resin contained in the wiring conductor 2 is
The metal powders are bonded to each other in a state of being in contact with each other, and the wiring conductor 2 is adhered to the insulating substrate 1,
Epoxy resin such as bisphenol A type epoxy resin, novolac type epoxy resin and glycidyl ester type epoxy resin, and thermosetting resin such as phenol resin, polyimide resin, bismaleimide triazine resin and thermosetting polyphenylene ether resin.

If the content of the thermosetting resin in the wiring conductor 2 is less than 5% by weight, the metal powders cannot be firmly bonded to each other and the wiring conductor 2 is firmly covered on the insulating substrate 1. When the content of the wiring conductor 2 exceeds 30% by weight, it is difficult to bring the metal powders into sufficient contact with each other and the electrical resistance of the wiring conductor 2 tends to be large. It is in. Therefore, the thermosetting resin contained in the wiring conductor 2 is
The content in the wiring conductor 2 is preferably in the range of 5 to 30% by weight.

The exposed surface of the wiring conductor 2 is made of a metal, such as nickel or gold, which has a high corrosion resistance and a good bonding property with the bonding wire 5 or the like by a plating method.
When the wiring conductor 2 is adhered to a thickness of μm, the wiring conductor 2 can be effectively prevented from being oxidized and corroded, and the wiring conductor 2 and the bonding wire 5 and the wiring conductor of the external electric circuit board can be easily and firmly connected. Can be done.
Therefore, the wiring conductor 2 may be formed by depositing a metal such as nickel or gold, which has excellent corrosion resistance and connectivity with the bonding wire 5 or the like, to a thickness of 1 to 20 μm by plating. preferable.

Thus, according to the above-mentioned wiring board, the semiconductor element 3 is bonded and fixed to the bottom surface of the recess A of the insulating substrate 1, and each electrode of the semiconductor element 3 is electrically connected to the wiring conductor 2 via the bonding wire 5. Finally, the lid 6 is bonded to the upper surface of the insulating substrate 1 via a sealing material to form a semiconductor device as a product.

Next, a method for manufacturing the above-mentioned wiring board will be described with reference to the sectional views of each step shown in FIG.

First, as shown in FIG. 2 (a), three sheets obtained by adding and mixing an epoxy resin main component and an inorganic insulating powder which are cured by reacting with a curing agent by heating to a precursor of a bismaleimide triazine resin Precursor sheets 11a, 11b, 11
Prepare c.

The precursor sheets 11a, 11b, and 11c are prepared by using a precursor of a bismaleimide triazine resin, an epoxy resin base such as a bisphenol A type epoxy resin, a novolac type epoxy resin, and a glycidyl ester type epoxy resin, and silicon oxide, aluminum oxide, and nitriding. A paste obtained by adding and mixing an inorganic insulating powder such as aluminum, silicon carbide, barium titanate, zeolite, etc. and a solvent such as methyl cellosolve is formed into a sheet by adopting the well-known doctor blade method. It is prepared by heating at a temperature of -100 ° C for 1-60 minutes to semi-cure the precursor of the bismaleimide triazine resin contained therein.

The epoxy resin base material contained in the precursor sheets 11a, 11b and 11c is the precursor sheet 11 as described later.
Insulating boards 1a, 1b, 1 by laminating a. 11b, 11c with a curing agent that reacts with the epoxy resin base material interposed and heating.
In the case of c, the insulating substrate 1 is leached between the precursor sheets 11a, 11b, and 11c and reacts with the curing agent to be cured.
Epoxy resin adhesive layer 4a ・ 4 for joining a ・ 1b ・ 1c
b is formed.

The epoxy resin base material contained in the precursor sheets 11a, 11b, 11c is less than 1% by weight based on the total amount of the precursor of the bismaleimide triazine resin and the epoxy resin base material. The semi-cured sheets 11a, 11b, and 11c are laminated on top of each other with a curing agent that reacts with the epoxy resin base material interposed therebetween, and this is heated to insulate the substrate 1.
The epoxy resin adhesive layers 4a, 4b for joining the insulating substrates 1a, 1b, 1c when forming a, 1b, 1c are not sufficiently formed, and the insulating substrates 1a, 1b, 1c are hardened by the epoxy resin adhesive layers 4a, 4b. It tends to be difficult to bond to. Further, if the content exceeds 10% by weight, the insulating substrate 1a ・ 1b ・ 1
A large amount of the uncured epoxy resin base material remains in c, and the strength of the insulating substrates 1a, 1b, 1c tends to be low. Therefore, the content of the epoxy resin base material contained in the precursor sheets 11a, 11b, and 11c is preferably in the range of 1 to 10% by weight based on the total amount of the precursor of the bismaleimide triazine resin and the epoxy resin base material.

Next, as shown in FIG. 2B, a precursor sheet
Two precursor sheets 11a, 11b of 11a, 11b, 11c
Two precursor sheets are provided with openings A1 and A2 to be concave portions A.
Through holes B1 and B2 are formed in 11b and 11c, respectively, which serve as wiring paths for routing the wiring conductor 2.

The openings A1 and A2 and the through holes B1 and B2 formed in the precursor sheets 11a, 11b, and 11c are formed by subjecting the precursor sheets 11a, 11b, and 11c to a conventionally known punching method. It is formed by punching holes of a predetermined shape in each of 11b and 11c.

Next, as shown in FIG. 2C, the upper surface of the precursor sheet 11b, the upper and lower surfaces of the precursor sheet 11c, and the through holes B1 and B2 formed in the precursor sheets 11b and 11c,
The metal paste 12 which is heat-cured to form the wiring conductor 2 is applied by printing and filling in a predetermined pattern by using the conventionally known screen printing method and filling method.

As the metal paste 12 to be the wiring conductor 2, for example, metal powder such as copper having a particle size of about 0.1 to 20 μm and epoxy such as bisphenol A type epoxy resin, novolac type epoxy resin, glycidyl ester type epoxy resin or the like. A paste is prepared by adding and mixing a resin and a curing agent such as an amine-based curing agent, an imidazole-based curing agent, and an acid anhydride-based curing agent to form a paste.

Next, as shown in FIG. 2 (d), a curing agent 13 that reacts with the epoxy resin base material by heating is applied to the lower surfaces of the precursor sheets 11a and 11b.

The curing agent 13 applied to the lower surface of the precursor sheets 11a and 11b is, as will be described later, the precursor sheets 11a and 11b.
Insulating boards 1a and 1b by stacking b and 11c and heating them
・ When forming 1c, the precursor sheet 11a is formed by inducing the epoxy resin main agent contained in the precursor sheets 11a, 11b, and 11c.
It has the function of leaching between 11b and 11c and reacting with this epoxy resin base material to form hardened epoxy resin adhesive layers 4a and 4b between insulating substrates 1a, 1b and 1c.

As the curing agent 13 applied to the lower surface of the precursor sheets 11a and 11b, curing agents such as amine-based curing agents, acid anhydride-based curing agents, and imidazole-based curing agents are used.
When the coating amount per 1 cm ^{2 of the} lower surface of 11a ・ 11b is less than 0.1 mg, the insulating sheets 1a ・ 1b ・ 1c are laminated and heated to form the insulating substrates 1a ・ 1b ・ 1c.
a sufficient amount of epoxy resin adhesive layer 4 between a, 1b and 1c
It tends to be difficult to form a.4b. If it exceeds 5 mg, the reliability of the electrical connection of the wiring conductor 2 between the upper and lower insulating substrates tends to be low. Therefore, the curing agent 13 applied to the lower surface of the precursor sheets 11a and 11b is 1 cm below the lower surface of the precursor sheets 11a and 11b.
The coating amount per ² is preferably 0.1 to 5 mg.

Further, when the curing agent 13 applied to the lower surface of the precursor sheets 11a and 11b is an amine-based curing agent, the amine-based curing agent removes the oxide film on the surface of the metal powder in the metal paste 12, As a result, the electric resistance of the wiring conductor 2 can be reduced. Therefore, the precursor 11a · 11
As the curing agent 13 applied to the lower surface of b, it is preferable to use an amine-based curing agent.

Finally, the precursor sheets 11a, 11b and 11c are laminated one above the other to obtain a temperature of about 150 to 300 ° C. and a temperature of about 4 to 100.
The precursor sheet 11a is hot-pressed at a pressure of kgf / cm ² and further heated at a temperature of 150 to 300 ° C. if necessary.
Insulating substrates 1a, 1b, 1c bonded with a thermally cured bismaleimide triazine resin by sufficiently curing the precursor of the bismaleimide triazine resin contained in 11b, 11c, and in the metal paste 12 The thermosetting resin of 1 is heat-cured to form a wiring conductor 2 formed by bonding metal powders with the thermosetting resin.
b ・ 1c, and each insulating substrate 1a ・ 1b ・ 1c
By bonding the two together with the cured epoxy resin adhesive layers 4a and 4b formed by the reaction of the epoxy resin base material and the curing agent 13 in the precursor sheets 11a, 11b and 11c, the present invention as shown in FIG. The wiring board is completed.

In this case, the epoxy resin base material contained in the precursor sheets 11a, 11b, 11c before hot pressing and the curing agent 13 applied to the lower surface of the precursor sheets 11a, 11b do not react with each other, and the reactive group Since it contains a large amount of
The epoxy resin base material contained in the precursor sheets 11a, 11b, 11c is induced by the curing agent 13 applied to the lower surface of the precursor sheets 11a, 11b to exude between the semi-cured sheets 11a, 11b, 11c and cure. Insulating layer 1a
Strong and densely hardened epoxy resin adhesive layers 4a and 4b are formed between 1b and 1c, and as a result, the respective insulating substrates 1a, 1b and 1c are firmly joined by the epoxy resin adhesive layers 4a and 4b. It is possible to provide a wiring board having excellent moisture resistance capable of effectively preventing the intrusion of water from between the insulating boards 1a, 1b, 1c.

In this case, the precursor sheets 11a, 11b,
The 11c and the metal paste 12 hardly shrink during thermosetting, and therefore the obtained wiring board is never deformed or the dimensions are varied, and the semiconductor element and the wiring conductor can be accurately connected. It will be possible.

It should be noted that the present invention is not limited to the examples of the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the wiring conductor 2 is formed of a material obtained by binding metal powder with a thermosetting resin, but the wiring conductor 2 is partially or entirely formed of a metal foil. May be. In this case, a metal foil such as a copper foil is attached to the surface of the precursor sheets 11a, 11b, 11c and is etched in a predetermined pattern, or the metal foil etched in a predetermined pattern is attached to the insulating substrate. 1a / 1
It is attached to b-1c.

In the above-mentioned embodiment, the case where the wiring board of the present invention is applied to a semiconductor element housing package for housing a semiconductor element has been described as an example.
The wiring substrate may be applied to a wiring board used for hybrid integrated circuit board or the like.

Further, in the above-described embodiment, the wiring board is formed by stacking three insulating boards, but the wiring board is formed by stacking two or four or more insulating boards. It may be formed by

[0054]

According to the wiring board of the present invention, a curing agent and
Epoxy resin base material and inorganic insulating powder that cure in response
Consisting of bismaleimide triazine resin mixed with
A plurality of semi-cured precursor sheets were laminated and heat-cured,
The inorganic insulator powder formed by laminating a plurality of insulating substrates formed by combining with bismaleimide triazine resin insulating substrate
Insulating substrates were interposed between semi-cured precursor sheets
Leaching between semi-cured precursor sheets induced by curing agent
Since the epoxy resin adhesive layer formed by the reaction of the epoxy resin main agent and the curing agent is used for bonding, each insulating substrate is firmly bonded via the epoxy resin adhesive layer and the epoxy resin adhesive layer is also bonded. The layers effectively prevent the infiltration of moisture from between the insulating substrates, and the semiconductor elements housed inside can be normally and stably operated for a long period of time.

[0055] The plurality of precursor sheet according to the manufacturing method of the wiring substrate, which was added a mixture of an epoxy resin main agent and an inorganic insulator powder is cured by reaction with hardening agent to the precursor of the bismaleimide triazine resin of the present invention In addition to the above, a wiring layer in which an insulating substrate in which a curing agent that reacts with an epoxy resin base material is interposed between the insulating substrate and the inorganic insulating powder is bonded by a thermosetting bismaleimide triazine resin is laminated by heating the wiring is laminated. from getting board was cured formed by reaction with <br/> precursor sheet inside the epoxy resin main agent and the curing agent exuded between induced by the precursor sheet to the curing agent between the insulating substrate It is possible to provide a wiring board having excellent moisture resistance, in which an epoxy resin adhesive layer is formed, and the insulating substrates are firmly bonded to each other via the epoxy resin adhesive layer.

As described above, according to the present invention, the infiltration of water from between insulating substrates is effectively prevented, and the semiconductor element housed inside can be normally and stably operated for a long period of time, and the wiring board. A manufacturing method could be provided.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a wiring board of the present invention.

2A to 2D are cross-sectional views for each step for explaining a method for manufacturing the wiring board shown in FIG.

[Explanation of symbols]

1 ... Insulating substrate 1a, 1b, 1c ... Insulating substrate 2 ... Wiring conductor 3 ・ ・ Semiconductor element 4a, 4b ... Epoxy resin adhesive layer 11a, 11b, 11c ... Precursor sheet 12 ... Metal paste 13- ・ Curing agent

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H05K 3/46 H01L 23/14 R 23/12 N (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 1 / 02 H05K 1/03 H05K 1/09 H05K 3/12 H05K 3/46 H01L 23/12-23/15 H01B 1/00-1/24

Claims (2)

(57) [Claims] 1. An epoxy resin which is cured by reacting with a curing agent.
Bismareimi mixed with main ingredient and inorganic insulating powder
Multiple semi-cured precursor sheets made of dotriazine resin
Single laminated to thermally cured, the insulating boards of the inorganic insulator powder formed by laminating a plurality of insulating substrates formed by combining with the bi <br/> scan maleimide triazine resin insulating substrate, half
Induced by a curing agent interposed between the precursor sheets for curing
And epoxies exuded between the semi-cured precursor sheets
While bonding in multiple layers via the epoxy resin adhesive layer formed by the reaction of the resin main agent and the curing agent, a wiring conductor is formed between the insulating substrates and / or on the exposed surface of the insulating substrate. A wiring board comprising: 2. A precursor of a bismaleimide triazine resin.
The epoxy resin main agent and an inorganic insulator powder is cured by reaction with hardening agent was added and mixed the steps of a plurality preparing the precursor sheet, a step of semi-curing the precursor sheet, said half
A step of depositing a metal foil to be a wiring conductor or a metal paste to be a wiring conductor by thermosetting on at least one of the cured precursor sheets in a predetermined pattern;
Alternatively, a step of laminating the semi-cured precursor sheet coated with the metal paste in multiple layers with a curing agent that reacts with the epoxy resin main agent interposed therebetween, and a precursor sheet laminated in the multilayer. By heating, the inorganic insulating powder is bonded with a thermosetting bismaleimide triazine resin to form a plurality of insulating substrates, and wiring conductors are adhered to the insulating substrates, and each insulating substrate is induced by the curing agent. Semi-hard
Manufacturing a wiring board characterized by comprising a step of joining an epoxy resin adhesive layer cured is formed by reaction between the precursor before exuded between the sheets disappeared epoxy resin main agent and the curing agent of Method.