JP3440838B2 - Thermocompression bonding apparatus and thermocompression bonding method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding apparatus and a thermocompression bonding method for thermocompression bonding an electronic component to a work.

[0002]

2. Description of the Related Art As a method of mounting an electronic component on a work, a method by thermocompression bonding is known. According to this method, the electronic component is joined to the work by soldering or thermosetting adhesive by pressing the electronic component against the work while heating. In this thermocompression bonding process, since it is necessary to control the heating temperature, the thermocompression bonding head that heats and presses the electronic component has a heater as a heating means and a temperature such as a thermocouple for detecting the heating temperature. Detection means are provided.

[0003]

By the way, as a kind of thermocompression bonding apparatus, there is one having a rotary head. In order to speed up the operation of the thermocompression bonding apparatus and improve efficiency, this rotary head is equipped with a plurality of thermocompression bonding heads on a rotary table, and the plurality of thermocompression bonding heads sequentially perform electronic rotation while performing index rotation operation on the rotary table. The parts are thermocompression bonded. However, this rotary head system has problems peculiar to electric wiring for power supply and control to a movable part that performs a rotary operation.

That is, since the thermocompression bonding head sequentially moves by the index rotation operation, the fixed wiring is used when the electric wiring for connecting the heater, the thermocouple, etc. provided in the thermocompression bonding head to another fixed portion is performed. Can not be wiring. For this reason, connecting means is provided for electrically connecting the heater and the thermocouple to the fixing portion only when the thermocompression bonding head is in the position for performing the thermocompression bonding operation.

However, in this method, the heater is connected to the power source only when the thermocompression bonding head is in the thermocompression bonding position.
Also, since the thermocouple will be connected to the temperature control unit,
The heating control is temporarily interrupted while the thermocompression bonding head is rotationally moved, and the interrupted temperature control is newly started each time the thermocompression bonding head is moved to the thermocompression bonding position and newly connected.
As a result, there is a problem in that a predetermined time is required until the heating temperature of the thermocompression bonding head is controlled and the actual temperature is stabilized, and the tact time required for thermocompression bonding becomes long.

Therefore, an object of the present invention is to provide a thermocompression bonding apparatus and a thermocompression bonding method capable of efficiently controlling heating and shortening the tact time.

[0007]

A thermocompression bonding apparatus according to claim 1, wherein a thermocompression bonding head for thermocompression bonding an electronic component to a work,
A heating means for heating the electronic component, a temperature detecting means for detecting a heating temperature of the heating means, and a temperature control section for controlling the heating means based on a detection result of the temperature detecting means, which is provided in the thermocompression bonding head. And a circuit for electrically connecting the temperature control unit to the heating means and the temperature detecting means, and connecting and disconnecting these circuits, and the temperature detecting means when the connecting and disconnecting means is in the disconnected state. And a detection value holding input means for holding the temperature detection value immediately before the connection with the temperature control unit is cut off and inputting it to the temperature control unit.

According to a second aspect of the present invention, in the thermocompression bonding method, a thermocompression bonding head having a heating means and a temperature detecting means for detecting the heating temperature of the heating means presses the electronic component against the work while heating the electronic component. A thermocompression bonding method for controlling the heating means by a temperature control section based on the temperature detection result of the temperature detection means, and electrically connecting the temperature control section to the temperature detection means and the heating means. When the connecting / disconnecting means for connecting / disconnecting the circuit is in the disconnected state, the temperature control is performed by holding the temperature detection value immediately before the temperature detection means is disconnected from the temperature control unit and inputting it to the temperature control means. I tried to continue without interruption.

According to the invention described in each of the claims, when the temperature detecting means provided in the thermocompression bonding head is in an electrically disconnected state, the temperature detecting means immediately before the connection with the temperature control section is cut off. By holding the temperature detection value and inputting it to the temperature control unit, efficient heating control can be performed without interrupting the temperature control.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a thermocompression bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the thermocompression bonding apparatus, and FIG. 3 is a flow of a thermocompression bonding head moving process of the thermocompression bonding apparatus. FIG. 4 and FIG. 4 are graphs showing detected temperatures of the thermocompression bonding apparatus.

First, the structure of the thermocompression bonding apparatus will be described with reference to FIG. In FIG. 1, the one-turn table 1 includes a rotation driving means 1A. The rotary table 1 performs an index rotary operation by driving the rotary drive means 1A. A plurality of thermocompression bonding heads 2 are provided on the outer edge of the rotary table 1.
Are mounted symmetrically with respect to the axis of rotation. A thermocompression bonding tool 3 is attached to the lower end of the thermocompression bonding head 2,
The thermocompression bonding head 2 is provided with lifting means for lifting the thermocompression bonding tool 3. The thermocompression bonding tool 3 includes a heater 4 as a heating means and a thermocouple 5 as a temperature detecting means,
The heater 4 and the thermocouple 5 are connected to the terminals 6a and 6b of the fixed contact 6 fixed to the lower surface of the rotary table 1 by electric wiring.

Below the edge on one side of the rotary table 1, a supply part 10 for electronic components is arranged. The supply unit 10 includes a tray 12 provided on an XY table 11, and the tray 12 stores a large number of electronic components 13. The tray 12 is driven by driving the XY table 11.
The electronic components 13 inside move horizontally, and the thermocompression bonding tool 3
The electronic component 13 located immediately below is picked up by the thermocompression bonding tool 3 by driving the elevating means of the thermocompression bonding head 2. When the rotary table 1 is rotated by the rotary drive means, the thermocompression bonding head 2 picking up the electronic component 13 is rotationally moved to the opposite edge portion as the rotary table 1 is rotated.

Below the other edge of the rotary table 1,
A work positioning portion 14 is provided. The positioning unit 14 includes an XY table 15, and the XY table 1
A work 16 is placed on the workpiece 5. The electronic component 13 is thermocompression-bonded to the work 16 by lowering the thermocompression-bonding tool 3 holding the electronic component 13 with respect to the work 16 and heating and pressing according to a predetermined heating pattern.

When the fixed contact 6 of the rotary table 1 is located on the side of the positioning portion 14, the fixed contact 6 is located above the movable contact 7, and the movable contact 7 is raised by the cylinder 8 to move the movable contact 7. The terminals 7a and 7b of 7 come into contact with the terminals 6a and 6b of the fixed contact 6. This allows
The heater 4 and the thermocouple 5 are electrically connected to the control means 9. That is, the fixed contact 6, the movable contact 7, and the cylinder 8 form an intermittent means.

Next, the control means 9 will be described with reference to FIG. The control unit 9 has a function as a temperature control unit that controls the temperature of the thermocompression bonding tool 3, a rotation driving unit 3 of the rotary table 1, a lifting operation of the thermocompression bonding head 2, and an X of the supply unit 10.
The Y table 11, the XY table 15 of the positioning unit 14, and a function as a control unit that controls the operation of the cylinder 8 that moves up and down the movable contact 7 are provided. In FIG. 2, A
The / D converter 20 performs A / D conversion on the temperature signal sent from the thermocouple 5 via the fixed contact 6 and the movable contact 7. A /
The D-converted temperature data is input to the A side of the changeover switch 21, transmitted to the control unit 24, and further stored in the storage unit 23. The temperature data stored here is input to the B side of the changeover switch 21.

The changeover switch 21 switches the temperature data input to the temperature control unit 22 in accordance with a command from the control unit 24. That is, either the temperature data directly input from the thermocouple 5 or the temperature data stored in the storage unit 23 can be switched and input to the temperature control unit 22. That is, the control unit 24 and the changeover switch 1 are detection value holding input means. The temperature controller 22 is the controller 2
The electric power controlled based on the command temperature given from 4 and the detected temperature data is supplied to the heater 4.

The thermocompression bonding apparatus is constructed as described above, and its operation will be described below with reference to the drawings. First, in FIG. 1, the thermocompression bonding head 2 picking up the electronic component 13 from the supply unit 10 moves onto the work 16 by the index rotation operation of the rotary table 1. Next, the cylinder 8 is driven to raise the movable contact 7, and the terminals 6a,
6b is brought into contact with the terminals 7a and 7b, respectively, and the heater 4 and the thermocouple 5 are electrically connected to the temperature control unit 22. This allows
The heating of the thermocompression bonding tool 3 and the temperature control by the temperature control unit 22 are enabled. After that, the thermocompression bonding tool 3 descends to press the held electronic component 13 against the work 16 and heat it according to a predetermined heating pattern.

After a lapse of a predetermined time, the thermocompression bonding tool 3 is lifted to complete the thermocompression bonding of the electronic component 13. After that, the thermocompression bonding head 2 moves along with the index rotation operation of the rotary table 1. The process of changing the connection of the thermocouple 5 at this time will be described with reference to the flow of FIG. First, the thermocouple 5 reads the temperature detection value immediately before the thermocouple 5 is disconnected from the temperature control unit 22, and stores it in the storage unit 23 via the control unit 24 (ST1). Next, the changeover switch 21 is changed over to the B side in response to a command from the control section 24 (ST2).
As a result, the temperature of the thermocompression bonding tool 3 stored in the storage unit 23 is input to the temperature control unit 22 and held in this state.

Thereafter, the cylinder 8 is lowered to move the thermocompression bonding head 2 to separate the fixed contact 6 from the movable contact 7 (S
T3). As a result, the heater 4 and the thermocouple 5 are disconnected from the temperature control unit 22, but since the temperature of the thermocompression bonding tool 3 is continuously input to the temperature control unit 22,
The temperature control operation by the temperature control unit 22 is continued without interruption.

Thereafter, the rotary table 1 is index-rotated again to move the thermocompression bonding head 2 (ST4), and when the thermocompression bonding head 2 is stopped at the thermocompression bonding position, the movable contact 7 is raised and the fixed contact 6 is moved. (ST5). From this timing, the disconnection determination timer of the control unit 24 starts counting time (ST6), and the changeover switch is switched to the A side in response to a command from the control unit 24 (ST7).
As a result, the temperature detected by the thermocouple 5 is input to the temperature control unit 22, and the heating control of the thermocompression bonding tool 3 is performed.

FIG. 4 shows the temperature T of the thermocompression bonding tool 3 during this period.
It shows the change of. Timing t1 is S described above.
It is a timing at which the fixed contact 6 and the movable contact 7 are separated from each other at T3, and after this timing 1, the power supply to the heater 4 is stopped and the temperature gradually decreases from the set temperature [T].
When the fixed contact 6 and the movable contact 7 come into contact with each other again at the timing t2, the actually detected temperature of the thermocouple 5 is changed to the temperature control unit 2.
2 is input, and the above-mentioned temperature drop is detected. Then, the temperature control unit 22 controls the power supply to the heater 4 so as to recover the temperature decrease amount, and thereby the temperature of the thermocompression bonding tool 3 returns to the set temperature [T].

At this time, it is detected whether or not the contact between the fixed contact 6 and the movable contact 7 is detected during the time period from the start of the timer for judging the disconnection to the elapse of the predetermined time T1. That is, when the contact is separated at the timing t4 and the contact of the contact is not detected even at the timing t5 after the elapse of the predetermined time T1, disconnection determination processing is performed (ST8), and an alarm to that effect is issued.

As described above, even when the thermocouple 5 cannot be always connected to the temperature control unit 22 due to the movement of the thermocompression bonding head 2, the temperature detection value immediately before the disconnection is used as a dummy signal. By inputting, the temperature control operation can be maintained without interruption each time the thermocompression bonding head 2 moves. Therefore, after the reconnection, the temperature control function works immediately and the temperature can be quickly returned to the set temperature, and the takt time required for heating can be shortened.

[0024]

According to the present invention, when the temperature detecting means provided in the thermocompression bonding head is electrically disconnected,
By inputting the temperature detection value immediately before the disconnection as the dummy signal, the temperature control operation can be maintained without interruption each time the thermocompression bonding head moves. Therefore, after the reconnection, the temperature control function works immediately, the set temperature can be quickly restored, and the tact time can be shortened by performing efficient heating control.

[Brief description of drawings]

FIG. 1 is a side view of a thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the thermocompression bonding apparatus according to the embodiment of the present invention.

FIG. 3 is a flowchart of a thermocompression bonding head moving process of the thermocompression bonding apparatus according to the embodiment of the present invention.

FIG. 4 is a graph showing a temperature detected by the thermocompression bonding apparatus according to the embodiment of the present invention.

[Explanation of symbols]

1 rotary table 2 Thermocompression bonding head 4 heater 5 thermocouple 6 fixed contacts 7 movable contacts 8 cylinders 13 Electronic components 22 Temperature controller

Claims (2)

(57) [Claims] 1. A thermocompression bonding head for thermocompression bonding an electronic component to a work, a heating means provided in the thermocompression bonding head for heating an electronic component, a temperature detecting means for detecting a heating temperature of the heating means, It is provided in a temperature control unit that controls the heating unit based on the detection result of the temperature detection unit, and a circuit that electrically connects the temperature control unit to the heating unit and the temperature detection unit, and these circuits are intermittently connected. When the disconnecting means and the disconnecting means are in the disconnected state, the temperature detecting means holds the temperature detected value immediately before the temperature control section is disconnected from the temperature control section and inputs it to the temperature control section. And a thermocompression bonding device. 2. A thermocompression bonding method of pressing an electronic component against a work while heating it by a thermocompression bonding head having a heating means and a temperature detecting means for detecting a heating temperature of the heating means, Based on the temperature detection result of the temperature detection means, the intermittent control means for controlling the heating means by the temperature control section, and intermittently connecting and disconnecting the circuit electrically connecting the temperature control section to the temperature detection means and the heating means. When in the disconnection state, the temperature detection means holds the temperature detection value immediately before the connection with the temperature control section is cut off and inputs it to the temperature control means to continuously perform temperature control without interruption. A thermocompression bonding method characterized by the above.