JP3635835B2 - Component mounting apparatus and defective component collection method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus, a collection box, and a defective component collection method.
[0002]
[Prior art]
When an electronic component is automatically mounted on a substrate using a component mounting apparatus, a defective component having a problem such as deformation or chipping may be found in some cases. If such a defective part is mounted on a substrate as it is, the reliability of the circuit module constituted by the substrate is lowered. Further, if the defective part is held on the transfer head until it is manually removed, the mounting of other electronic parts is hindered, and the productivity is greatly reduced.
[0003]
Therefore, conventionally, when a defective part is found, it is immediately discarded or stored in a collection box. And this collection box is comprised from the cylindrical thing thrown in at random.
[0004]
[Problems to be solved by the invention]
However, this is not preferable because expensive electronic components that are desired to be reused are also thrown in together with other electronic components. In other words, considering the reuse of electronic components, it is desirable to collect electronic components in an orderly manner.
[0005]
Here, in order to collect defective parts in an orderly manner, it is also conceivable to use a collection tray provided with a grid-like partition as a collection box and store the defective parts in pockets partitioned by the partition.
[0006]
However, it is impossible to know in advance which kind of electronic component will be a defective component. The size of the electronic component ranges from a 1 mm square or less to a few cm square or more. Therefore, if the pockets are stored in the partitioned pockets, one size of the pockets must be set large so that even the largest electronic component can be stored.
[0007]
However, as is clear from the case where only the smallest electronic component is defective, there are many cases where one small defective component is stored in a large pocket. The efficiency per unit area of the collection box is very low.
[0008]
Therefore, an object of the present invention is to provide a component mounting apparatus, a recovery box, and a defective component recovery method that can efficiently and efficiently recover defective components.
[0009]
[Means for Solving the Problems]
The component mounting apparatus of the present invention is supported so as to be able to move up and down, a magazine for storing pallets in a plurality of upper and lower stages, a tray placed on the pallet and storing electronic components, placed on the pallet, and partitioned. A recovery box formed so that defective parts can be placed at any position on the bottom, a drawer that pulls out the pallet from the magazine, and a pallet that is pulled out by the drawer. A table, a positioning unit for positioning the substrate at a position away from the table, and picking up electronic components from a tray placed on the pallet on the table, transferring them to the substrate, and placing them on the pallet on the table A transfer head for placing defective parts in the collected collection box, and inspection means for detecting good / bad of electronic parts picked up by the transfer head; An unused area on the bottom surface of the collection box where no defective part is placed and a collection information storage unit for storing collection information regarding the used area other than the unused area are provided. The used area surrounds the defective part. This is a region in which the component rectangles that are set in accordance with the size of the defective component are arranged so as not to overlap the used region along the bottom side of the collection box.
[0010]
Further, the collection box of this component mounting apparatus is composed of a box body having a rectangular box shape with an open upper end, and a conductive material placed on the bottom surface of the box body, and the upper surface has a high coefficient of friction. And a sheet whose entire upper surface is exposed upward.
[0011]
Furthermore, the defective part collection method of the present invention includes a step of obtaining collection information about an unused area where a defective part is not yet placed on the bottom surface after detection of the defective part, and a defect held in the transfer head at the latest. A step of enclosing the defective part with respect to the part, obtaining information of a part rectangle that is set according to the size of the defective part, a step of determining whether the part rectangle can be accommodated in the current unused area, and a determination As a result, there is a step of placing the defective part in the unused area if it can be accommodated and changing the collection information so as to reduce the unused area by the part rectangle.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The component mounting apparatus according to claim 1 is supported so as to be movable up and down, a magazine for storing a plurality of upper and lower pallets, a tray mounted on the pallet and storing electronic components, mounted on the pallet, and There is no partition and a collection box formed so that defective parts can be placed at any position on the bottom, a pallet is pulled out from the magazine, the pallet is returned to the magazine, and the pallet pulled out by the drawer is lowered. Receiving table, positioning unit for positioning the substrate at a position away from the table, picking up electronic components from the tray placed on the pallet on the table, transferring them to the substrate, and placing them on the pallet on the table Transfer head for mounting defective parts in the mounted collection box, and inspection to detect good / bad of electronic components picked up by the transfer head And a recovery information storage unit for storing recovery information regarding an unused area other than the unused area and an unused area on the bottom surface of the recovery box, where the defective part is not yet placed. This is an area in which a part rectangle enclosing a part and set according to the size of the defective part is arranged so as not to overlap the used area along the bottom side of the collection box.
[0013]
Therefore, usually, a pallet with a tray placed on a table is pulled out, and the transfer head picks up an electronic component from the tray and transfers the electronic component onto a substrate, thereby mounting.
[0014]
When a defective part is detected, the pallet on the table is replaced with a pallet on which a recovery box is placed, and the defective part is stored in the recovery box. Further, the pallet on the table is replaced with a pallet on which the tray is placed, and mounting is performed.
[0015]
Here, there is no partition in the collection box, and defective parts do not need to be placed in a predetermined area such as a large pocket. Then, the size of the component rectangle is set according to the size of the defective component. In other words, a minimal component rectangle is set for a minimal defective component. Then, referring to the collection information, the unused area is packed with a part rectangle so as not to overlap the used area, and the defective part is placed in the part rectangle.
[0016]
For this reason, defective parts are packed and placed on the bottom surface of the collection box without waste, and the collection box can be used efficiently.
[0017]
The recovery box according to claim 2 is composed of a box body having a rectangular box shape with an open upper end, a material placed on the bottom surface of the box body and having conductivity, and the upper surface has a high friction coefficient. And a sheet having the entire upper surface exposed upward.
[0018]
Therefore, the defective part can be held in a stable state even without a partition, and there is no fear that the defective part is damaged due to static electricity.
[0019]
According to a third aspect of the present invention, there is provided a method for collecting defective parts, the step of acquiring collection information about an unused area of the bottom surface where defective parts are not yet placed after the occurrence of defective parts at the latest, and being held by the transfer head. A step of enclosing the defective part for the defective part, obtaining information of a part rectangle that is set according to the size of the defective part, a step of determining whether the part rectangle can be accommodated in the current unused area, and As a result of the determination, there is a step of placing the defective part in the unused area if it can be accommodated and changing the collection information so as to reduce the unused area by the part rectangle equivalent.
[0020]
Therefore, the defective part can be rationally stored without waste on the bottom surface of the collection box without partition using the part rectangle that matches the size of the defective part.
[0021]
Next, embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a vertical feed screw 2 is rotatably supported in a case 1 having a hollow box shape with a hollow inside. The feed screw 2 is rotated by an elevating motor 3 provided on the upper portion of the case 1.
[0022]
A feed nut 4 attached to the lower part of the magazine 5 is screwed to the feed screw 2, and when the lifting motor 3 is driven, the entire magazine 5 can be lifted and lowered.
[0023]
A plurality of horizontal steps are formed in the magazine 5, and a pallet 6 is slidably accommodated in each step. In this embodiment, the tray 7 for storing the electronic components 16 in a matrix is placed on the uppermost pallet 6, but the lowermost pallet 6 has a collection box 8 described in detail later. It is placed.
[0024]
An entrance / exit 9 that is slightly larger than the pallet 6 is opened in the middle of the front surface of the case 1 so that the pallet 6 can be taken in and out, and a horizontal table 10 projects forward from the lower edge of the entrance / exit 9.
[0025]
The table 10 receives the pallet 6 drawn in the direction of the arrow N1 from the step at the same height as the doorway 9 in a horizontal and slidable manner. In addition, the drawer | drawing-out part 11 engages with the standing part 6a which stands up in the L-shape from the front edge of the pallet 6, hold | maintains the pallet 6, and moves to the arrow N1 or the reverse direction.
[0026]
The laser unit 12 is provided adjacent to the table 10 and irradiates measurement laser light toward a plurality of leads extending from the electronic component 16 passing over the laser unit 12 using laser light. Receives the reflected light and outputs an electrical signal. Then, the substrate 13 is positioned horizontally by the positioning unit 14 adjacent to the laser unit 12.
[0027]
Then, the transfer head 15 picks up the electronic component 16 from the tray 7 on the table 10 (arrow N1), horizontally transfers it (arrow N3), moves it onto the laser unit 12, and moves a plurality of leads of the electronic component 16 to each other. Then, the electronic component 16 is mounted on the substrate 13 as indicated by the broken line (arrow N4).
[0028]
Next, the collection box 8 will be described with reference to FIG.
As described above, in this embodiment, the collection box 8 is placed on the lowest pallet 6. This is because defective parts are not normally generated frequently, and the tray 7 is placed close to the inlet / outlet 9 so as to shorten the time required for raising and lowering the magazine 5 when the tray 7 is switched.
[0029]
The collection box 8 has a rectangular box-like box main body 17 (bottom surface 17a is horizontal) and a sheet placed on the bottom surface 17a and made of a conductive material with a large friction coefficient on the top surface. 18 and.
[0030]
When the sheet 18 is placed on the box body 17, the entire upper surface (the same shape as the bottom surface 17a) of the sheet 18 is exposed upward. Further, a grid-like partition or the like is not provided on the sheet 18. For this reason, a defective component can be placed at an arbitrary position on the entire upper surface (on the bottom surface 17a) of the sheet 18.
[0031]
And since the sheet | seat 18 has electroconductivity, static electricity does not generate | occur | produce in the defective component on the sheet | seat 18, and it can prevent component failure.
[0032]
Further, since the friction coefficient of the sheet 18 is high, defective parts on the sheet 18 do not cause lateral sliding even when the pallet 6 is put in and out, and can be held in a stable state. In order to increase the friction coefficient of the sheet 18, a sheet having a high friction coefficient may be used for the sheet 18 itself, or roughening or the like may be performed.
[0033]
Furthermore, it is desirable to use a soft material for the sheet 18. This is because expensive electronic components often have components that are easily deformed, such as ultra-thin leads, so as to weaken shocks during storage.
[0034]
Next, the control block of the component mounting apparatus will be described with reference to FIG.
The lifting motor 3, the transfer head 15, and the drawing unit 11 described above are driven by the lifting motor driving unit 19, the transfer head driving unit 20, and the drawing unit driving unit 21, respectively. The output of the laser unit 12 is input to the height measuring unit 22 and converted into height information.
[0035]
The ROM 23 stores the control program for controlling the height measuring unit 22 and the like from the lifting motor driving unit 19 and the lead height information obtained by the height measuring unit 22 in addition to the module according to the flowchart of FIG. Based on this, an inspection program for detecting whether there is a defect such as excessive bending of the lead of the electronic component is stored. The CPU 24 executes the program of the ROM 23, controls other components, and implements a defective part collection method along the flowchart of FIG.
[0036]
In this embodiment, the laser unit 12, the height measuring unit 22, and the CPU 24 constitute an electronic component inspection unit.
[0037]
In the layout data storage unit 25, information indicating which kind of electronic component 16 is present at which level of the magazine 5 is stored.
[0038]
In the component data storage unit 26, in addition to various electronic component 16 sizes, the number of leads, lead dimensions, and the like, component rectangles R, R, R, and R (FIG. 4B), which will be described later, have horizontal width CX and vertical width CY. Information is stored.
[0039]
In the collection information storage unit 27, the horizontal side length LX, the vertical side length LY (above are constant values), the coordinates (A, B) of the point of interest P, and the maximum vertical width M (above are variable values). Collection information consisting of (both described later) is stored.
[0040]
The layout data storage unit 25, the component data storage unit 26, and the collection information storage unit 27 are provided as one area such as a hard disk device or a RAM.
[0041]
Next, the main points of the defective part collection method will be generalized and described with reference to FIG.
As shown in FIG. 4A, the sheet 18 (the same applies to the bottom surface 17a) has a rectangular shape with a horizontal side length LX and a vertical side length LY. Then, the upper right corner point of the sheet 18 is set to the origin 0, and the X axis is taken to the left and the Y axis is taken to the lower side.
[0042]
On the other hand, as shown in FIG. 4B, a component rectangle R is considered. That is, since the characteristics of the shape such as the size can be known from the component data storage unit 26 for all types of electronic components 16, the minimum rectangle (or with some margin) surrounding the electronic components 16 is obtained. Can do. This rectangle is called a component rectangle R, and its upper right corner point is called a reference point Q. Once the horizontal width CX and vertical width CY of the component rectangle R are determined, they are stored in the component data storage unit 26 before mounting.
[0043]
Here, in this embodiment, the upper right corner point is used for both the origin 0 and the reference point Q. Therefore, as shown in FIG. 4A, basically, the reference point Q of the component rectangle R of each defective part is set from the origin 0 along the alignment line parallel to the X axis (side of the bottom surface 17a). The component rectangles R are arranged in series so as not to overlap, and when one line parallel to the X axis is formed, the largest vertical width CY among the vertical widths CY of defective parts arranged in this one line. A method is employed in which the alignment line AL is shifted to the Y axis by the same amount and aligned again in the same manner.
[0044]
In FIG. 4A, three component rectangles R6 to R8 formed by three defective electronic components in which the first row is formed by five component rectangles R1 to R5 formed by five defective electronic components. The next line is formed by
[0045]
Then, by using these eight component rectangles R1 to R8, a use area T (hatched portion) where a newly found defective component cannot be mounted and a newly found defective component which is not yet mounted. It can be divided into an unused area S that can be mounted. Here, Q1 to Q8 are reference points for the rectangles for each component, R1 to R8.
[0046]
In this embodiment, the attention point P and the maximum vertical width M are introduced as collection information for dividing the unused area S and the used area T. Of these, the attention point P is a point where the X coordinate A determined by the total dimension of the lateral width CX of the rectangular regions for parts arranged in the alignment line AL and the Y coordinate B through which the alignment line AL passes are set as the X and Y coordinates, respectively. The maximum vertical width M is the maximum value of the vertical width CY of the component rectangles R arranged on the alignment line AL.
[0047]
Here, if the XY coordinate of the attention point P and the maximum vertical width M are used, the unused area S and the used area T in any case can be uniquely determined as shown in FIG.
[0048]
Based on the above, a case where a defective part having the part rectangle R shown in FIG. 4B is generated at a certain point in time and is mounted on the sheet 18 in the state shown in FIG.
[0049]
In order to use the unused area S without waste, the electronic component 16 may be mounted so that the reference point Q coincides with the attention point P.
[0050]
Here, in order to make the reference point Q coincide with the attention point P, at least the rectangular area (horizontal side length LX-A, vertical side length LX-B) on the left side from the attention point P or the use area T The component rectangle R must be completely within the rectangular area below (horizontal side length LX, vertical side length LY-BM). However, in actuality, since the lateral width CX is not larger than the lateral side length LX, the comparison between the lateral side length LX and the lateral width CX is omitted.
[0051]
If it does not fit completely in this way, the unused area S is absolutely insufficient, and the collection box 8 itself must be replaced.
[0052]
On the other hand, if not, there are the following three cases.
(1) As indicated by the chain line in FIG. 4A, when the size of the component rectangle Ra is CX ≦ LX-A and CY ≦ M, in this case, the reference point of the component rectangle Ra is the point of interest P Need only be aligned with the attention point P. Further, the maximum vertical width M of the second used area U does not change. And if it arrange | positions, it should just move the attention point P to the point P2.
[0053]
(2) As shown by the chain line, when the size of the component rectangle Rb is CX ≦ LX-A and CY> M, in this case, the components can be arranged in the same manner as in (1), but the maximum vertical width M is newly set. This is the value of the vertical width CY of the arranged component rectangles Rb. And if it arranges, the attention point P will be moved to the point P3.
[0054]
(3) When the size of the component rectangle Rc is CX> LX-A In this case, the component rectangle Rc cannot be arranged at the attention point P. Therefore, the alignment line AL is shifted in the Y direction by the maximum vertical width M, and the component rectangle Rc is aligned with the reference point Q at the point of interest P3 at the intersection of the alignment line AL1 (two-dot chain) and the Y axis. And if it arranges, what is necessary is just to move the attention point P to the point P4.
[0055]
Then, the maximum vertical width M becomes the vertical width CY of the component rectangle Rc.
Next, the flow which actualized the above examination is demonstrated using FIG.
[0056]
First, when a new collection box 8 is set, the CPU 24 accesses the collection information storage unit 27, makes the attention point P coincide with the origin 0 (A = B = 0), and initializes the maximum vertical width M to 0. (Step 1). That is, at this time, the entire sheet 18 is an unused area S as shown in FIG.
[0057]
Next, the process waits until a defective part is generated and the collection of the defective part starts (step 2).
[0058]
When the inspection means detects a defective electronic component, the coordinates of the current attention point P and the maximum vertical width M are read from the collection information storage unit 27 (step 3). Further, the horizontal width CX and vertical width CY of the defective part type are read with reference to the component data storage unit 26 (step 4).
[0059]
Next, whether or not CY ≦ LY−B is checked is examined (step 5). If this is not the case, since the unused area S is absolutely insufficient as described above, it is instructed to replace the collection box 8 (step 6). Otherwise, go to step 7.
[0060]
In step 7, CX ≦ LX-A is considered. If yes, the component rectangles R can be arranged without moving the alignment line AL, and the process proceeds to seat mounting (step 10). If not, in order to move the alignment line AL, the X coordinate A of the target point P is first set to 0 and moved onto the Y axis, and the Y coordinate B is advanced by the maximum vertical width M (step 8). Then, the maximum vertical width M is returned to 0 (Step 9), and Step 5 is examined again.
[0061]
On the other hand, in step 10, it is examined whether the maximum vertical width M needs to be changed. If necessary, the vertical width CY of the current component rectangle R is substituted into the maximum vertical width M (step 11). Then, the process proceeds to step 12.
[0062]
In step 12, since the reference point Q of the current component rectangle R may be mounted on the current attention point P, the attention points P are mounted on the sheet 18 in such a manner and arranged by the amount of the component rectangles R arranged. The X coordinate A is advanced (step 13), and the process returns to a standby state for occurrence of recovery (step 2).
[0063]
The above processing is repeated until the unused area S is insufficient (route from step 5 to step 6).
[0064]
The determination of whether or not it can be accommodated in the unused area S according to claim 3 can be realized by simple numerical calculation and comparison by the combination of steps 5, 7, 8, 9, 10, and 11, and the determination time is almost the same. It does not take.
[0065]
When such a process is performed, the process generally proceeds from the state of FIG. 6A to FIG. 6D in order.
[0066]
In the state of FIG. 6B, the use area T is configured by the component rectangle R of three defective components.
[0067]
Further, in FIG. 6C, the use area T of one row is completed, and the point of interest P (alignment line AL) is shifted in the Y direction to arrange the next row. In FIG. 6D, the next line is being formed on the alignment line AL. However, if the defective part in this line is smaller than what is shown, the maximum height M of this line is also smaller than that shown in the figure. The unused area S can be used efficiently.
[0068]
【The invention's effect】
Since the present invention is configured as described above, defective parts can be efficiently and orderly collected. Moreover, according to the structure of Claim 2, a defective part can be collect | recovered stably and safely.
[Brief description of the drawings]
FIG. 1 is a side view of a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a collection box according to an embodiment of the present invention. FIG. 4A is an explanatory diagram of unused / used areas in one embodiment of the present invention. FIG. 4B is an explanatory diagram of a rectangle for parts in one embodiment of the present invention. FIG. 6 is a flowchart of a defective part collection method according to an embodiment of the present invention. FIG. 6A is a process explanatory diagram of the defective part collection method according to an embodiment of the present invention. (C) Process explanatory diagram of defective part collection method in one embodiment of the present invention (d) Process explanatory diagram of defective part recovery method in one embodiment of the present invention
5 Magazine 6 Pallet 7 Tray 8 Collection box 10 Table 11 Drawer 13 Substrate 14 Positioning unit 15 Transfer head 16 Electronic component S Unused area

Claims (4)

A magazine that is supported so as to be movable up and down, and stores a plurality of upper and lower pallets; a tray that is placed on the pallet and that stores electronic components; A collection box formed so that a defective part can be placed at a position; a drawer that pulls the pallet from the magazine; and a pallet that returns the pallet to the magazine; a table for receiving the pallet drawn by the drawer; A positioning unit that positions the substrate at a position away from the table, and an electronic component is picked up from the tray placed on the pallet on the table, transferred to the substrate, and placed on the pallet on the table. The transfer head for placing defective parts in the collected collection box and the electronic parts picked up by the transfer head are checked for good / bad. And a collection information storage unit for storing collection information regarding unused areas other than the unused areas and unused areas on the bottom surface of the collection box which are not yet mounted. The region is a region in which a component rectangle that surrounds the defective component and is set according to the size of the defective component is arranged so as not to overlap the used region along the side of the bottom surface of the collection box. Component mounting equipment. The collection box is composed of a box body having a rectangular box shape with an open upper end, a material placed on the bottom surface of the box body and having conductivity, and the upper surface has a high coefficient of friction, 2. The component mounting apparatus according to claim 1, further comprising a sheet whose upper surface is exposed upward. A defective part collecting method for collecting defective parts on a bottom surface of a collection box using a transfer head, wherein there is no partition on the bottom surface, and the collection box places defective parts at an arbitrary position on the bottom surface. It is formed so that it can
At the latest, after detecting a defective part, a step of acquiring collection information about an unused area of the bottom surface where the defective part is not yet placed, and surrounding the defective part with respect to the defective part held by the transfer head As a result of the determination, a step of obtaining information on a component rectangle that is set to be large or small according to the size of the defective component, a step of determining whether or not the component rectangle can be accommodated in a current unused area, A defective part collecting method comprising: placing a defective part in an unused area and changing the collection information so as to reduce the unused area by at least the part rectangle. 4. The defective part collection method according to claim 3, wherein the collection information includes coordinates of a defective part storage reference point.

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