JP5374358B2 - Electronic circuit component mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of streamlining work for recovering electronic components disposed in a component disposal box by using an existing facility, in an electronic circuit component mounter having a component disposal box. <P>SOLUTION: By a board transport device 4 included in this electronic circuit component mounter 1, a board 14 for component discharge or a board 18 for component disposal box transport is carried in. After the carrying in, an electronic component 16 disposed into a component disposal box 10 is discharged by an ascending mechanism or a tilting mechanism. Alternatively, the component disposal box 10 is moved by an XY movement device 5 and a component mounting head 7, and thereafter the component is discharged by opening the door of the component disposal box 10. Alternatively, a similar effect is exerted by replacing the component disposal box 10. Thereafter, the board 14 for component discharge or the board 18 for component disposal box transport is carried out by the board transport device 4 to complete the recovery. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic circuit component mounting machine equipped with a component disposal system.

  In the electronic circuit component mounting machine, as described in Patent Document 1 below, a component disposal system is provided, and a component disposal box for discarding electronic components that are not suitable for mounting, as determined by the component imaging system, is provided. It is prepared.

  Further, as described in Patent Document 2 below, the bottom of the component disposal box is penetrated to fix one end of the component suction hose here, and the other end of the hose is used as a suction duct of the waste member collecting device. There has already been disclosed a technique of positively sucking and collecting a discarded electronic component, which has only been discarded until now.

JP-A-11-145698 JP2004-296882

  However, in the conventional parts disposal system, the parts disposal box is installed in the machine at the time of collection. Therefore, you must open the front door, put your hands in the machine, and take out the parts disposal box once. I must. Furthermore, if a plurality of machines are lined up, it is necessary to repeat the work of collecting and collecting hands by that number. In recent years, electronic circuit component mounting machines have been downsized, and it has become difficult for workers to access the inside, and it has become increasingly troublesome to collect components.

  If the technique described in Patent Document 2 is used, an operator can be released from the above-described work. However, the technology of collecting parts by arranging a hose and sucking it by vacuum is not efficient from an economical point of view, and conflicts with the recent demand for miniaturization required for electronic circuit component mounting machines. To do.

  Means for solving the problems will be described below. (1) is [Claim 1], (2) is [Claim 2], (3) is [Claim 3], (4) is [Claim 5], (5) is [Claim] This corresponds to item 4] and [claim 6].

  (1) The above-described problems are a board transfer device that transfers a circuit board, a component mounting head that sucks an electronic component from a component supply unit and mounts the electronic component on the circuit board, and whether the electronic component can be mounted. A component imaging unit for determining whether or not the electronic component determined to be unmountable is disposed, and a substrate for discharging a component is carried in by the substrate transport device and is disposed in the component disposal box. A system for recovering the discarded electronic component by discharging the electronic component to the component discharging substrate, and after the discharging is completed, is carried out by the substrate transfer device. This can be solved by providing the component mounting machine.

  (2) The component disposal box is raised by a component disposal box raising mechanism provided in the electronic circuit component mounting machine, and tilted by a component disposal box tilting mechanism provided in the electronic circuit component mounting machine. The discharging may be performed. (3) The component disposal box may be ejected by being moved onto the component ejection board by an XY moving device provided in the electronic circuit component mounting machine and the component mounting head. Good.

  In this way, the electronic component discarded in the component disposal box can be collected without an operator accessing the electronic circuit component mounting machine.

  (4) In addition, the above-described problems are the board transport device that transports the circuit board, the component mounting head that sucks the electronic component from the component supply unit and mounts the electronic component on the circuit board, and the electronic component. The component imaging means for determining whether or not the electronic component can be mounted, and the component disposal box for discarding the electronic component that is determined not to be mountable, the substrate transporting device carrying in the component disposal box transporting substrate. The component disposal box provided in the electronic component placement machine is exchanged with the component disposal box on the component disposal box transport board by the XY moving device and the component mounting head provided in the electronic circuit component placement machine. This can be solved by providing the electronic circuit component mounting machine with a system that performs this.

  Even in this case, the electronic component discarded in the component disposal box can be collected without an operator accessing the electronic circuit component mounting machine.

  (5) The identification means attached to the component discharge board or the component disposal box transport board is read by the identification means recognition device provided in the electronic circuit component mounting machine, so that the component discharge The electronic circuit component mounting machine may include information processing means for recognizing that the substrate or the component disposal box carrying substrate has been carried in.

  According to this configuration, the component discharge board or the component disposal box transport substrate is mounted on the electronic circuit component mounting without an operator giving any instruction to the information processing means provided in the electronic circuit component mounting machine. The information processing means can recognize that it has been carried into the machine.

  Most of these devices are devices included in an existing electronic circuit component mounting machine, which can be implemented without significant changes in the devices, and are also effective from an economical viewpoint.

  By implementing the above-described invention, it is possible to easily collect the discarded electronic components in the line constituted by the electronic circuit component mounting machine.

It is a top view which shows the electronic circuit component mounting machine of one Embodiment concerning this invention. It is the schematic which shows the state which reads the identification means attached | subjected to the circuit board by the identification means recognition apparatus. It is the schematic which shows the state which reads the identification means attached | subjected to the components discharge | emission board | substrate by the identification means recognition apparatus. It is a side view which shows the positional relationship of the components disposal box and component discharge board | substrate described in Example 1. FIG. It is a side view which shows the state which the component disposal box described in Example 1 raised. It is a side view which shows the state which discharges | emits an electronic component from the component disposal box described in Example 1 to the board | substrate for component discharge | emission. It is a side view which shows the positional relationship of the component disposal box described in Example 2, a component discharge board | substrate, and a component mounting head, and the state which the component mounting head moves a component disposal box. It is a side view which shows the state which the component mounting head described in Example 2 moves a component disposal box, and discharges an electronic component from a components disposal box to the component discharge | emission board | substrate. It is a top view which shows the positional relationship of the components disposal box and board | substrate for components disposal box conveyance described in Example 3. FIG.

  Several embodiments of the claimable invention will be described below with reference to the drawings. In addition to the following embodiment, the claimable invention can be implemented in variously modified forms based on the knowledge of those skilled in the art.

  First, the configuration of the electronic circuit component mounting machine 1 will be described with reference to FIG. The electronic circuit component mounting machine 1 includes an XY moving device 5, and the XY moving device 5 can move the component mounting head 7 in the XY direction. Further, the electronic circuit component mounting machine 1 is provided with a board transfer device 4 so that the circuit board can be transferred in the X direction. The component disposal box 10 is provided next to the component imaging unit 6 between the transport device 4 and the component supply unit 2. The electronic circuit component mounting machine 1 is also provided with information processing means 22.

  Next, the structure of the board | substrate conveyance apparatus 4 and the identification means recognition apparatus 9 is demonstrated based on FIG. The circuit board 3 carried in from the previous process is fixed on the substrate transfer device 4 by a substrate clamp mechanism (not shown) provided in the substrate transfer device 4. Fixing the circuit board 3 is optional, and fixing is not an essential condition. Identification means 8 is attached to the circuit board 3. The identification means 8 can be recognized by an identification means recognition device 9 provided in the XY moving device 5. The identification means recognition device 9 may be integrated with the component mounting head 7 or may be provided separately. FIG. 3 shows a mode in which a component discharge board 4 is fixed instead of the circuit board 3.

  Next, the configuration of the discarded electronic component collection system 19 will be described with reference to FIG. The cylinder 11 is installed so that the component disposal box 10 can be raised. The cylinder 11 is provided with a rotating cylinder 15 so that the component disposal box 10 can be tilted. The cylinder 11 and the rotating cylinder 15 are installed so that the electronic component 3 can be discharged from the component disposal box 10 to the component discharge board 14 by raising and tilting the component disposal box 10.

  The operation of the electronic circuit component mounting machine 1 and the discarded electronic component collection system 19 configured as described above will be described. The electronic component 16 is mounted on the board according to the production plan by the XY moving device 5 and the component mounting head 7. The electronic component 16 is picked up by the component imaging device 6, and if it is determined that the electronic component can be mounted as a result of the imaging, the electronic component 16 is mounted on the circuit board 3. If the electronic component cannot be mounted, the component is discarded. Discarded in box 10.

  When the production plan is finished and the next production plan is started, the board discharging device 14 is carried into the electronic circuit component mounting machine 1 by the board transfer device 4. Next, the identification means 8 attached to the component discharge board 14 is read by the identification means recognition device 9. By reading the identification means 8, the information processing means 22 provided in the electronic circuit component mounting machine 1 recognizes that the component discharge board 14 has been carried in. If necessary, the component discharge board 14 is fixed by a board clamping mechanism (not shown). It may not be fixed unless necessary.

  As shown in FIG. 4, after the component discharge board 14 stops at a predetermined position, the state of the XY moving device 5 is confirmed, and the component mounting head 7 is raised by the cylinder 11 so as not to interfere with the component disposal box. (FIG. 5). The driving by the cylinder 11 is not limited to the cylinder, and may be a method driven by a motor.

  After the component disposal box 10 is raised, the component disposal box 10 is tilted toward the component discharge board 14 by the rotating cylinder 15. The electronic component 16 discarded in the component disposal box 10 is discharged from the component disposal box 10 to the component discharge board 14 by the tilting operation (FIG. 6). The rotating cylinder 15 may be driven by a motor. The time for determining the completion of discharge may be determined by adjustment, or may be determined by a sensor.

  After the electronic component 16 is completely discharged, the component disposal box 10 is returned to the original upright state by the rotating cylinder 15. Thereafter, the cylinder 11 is lowered.

  The component discharge board 14 collects the discarded electronic component 16 and then carries it out according to the function of the board transfer device 4. When the electronic circuit component mounting machine 1 forms a line, the above operation is repeated, and the discarded electronic components 16 can be collected from the component disposal boxes 10 arranged in all the electronic circuit component mounting machines 1. .

  Next, the configuration of the discarded electronic component collection system 20 will be described with reference to FIG. The component mounting head 7 is detachably installed with a component disposal box gripping means 17 that can grip the component disposal box 10. The component disposal box 10 is installed in a place where the component disposal box gripping means 17 can grip it.

  Based on FIG. 7, the operation of the waste electronic component recovery system 20, which is another embodiment of the claimable invention, will be described. After the component discharge board 14 is stopped at a predetermined position by the substrate transfer device 4, the component mounting head 7 is moved above the component disposal box 10 in order to hold the component disposal box 10. After the component mounting head 7 stops, the component disposal box gripping means 17 is moved downward by the vertical drive means of the component disposal box gripping means 17 provided in the component mounting head 7. The component disposal box gripping means 17 is stopped at a position where the component disposal box 10 can be gripped. Thereafter, the component disposal box 10 is gripped by the component disposal box gripping means 17. Whether or not it can be gripped may be determined by a sensor.

  The gripped component disposal box 10 is moved onto the component discharge board 14 by the component mounting head 7 and the XY moving device 5. The component disposal box 10 is configured such that a gripping force by the component disposal box gripping means 17 is further increased to open a door (not shown) below the component disposal box 10. When the door is opened, the discarded electronic component 16 is discharged from the component disposal box 10 and collected on the component discharge board 14 (FIG. 8). When the collection of the electronic component 16 is completed, the door is closed and the component disposal box 10 is returned to a predetermined position.

  The component discharge board 14 collects the discarded electronic component 16 and then carries it out according to the function of the board transfer device 4. When the electronic circuit component mounting machine 1 forms a line, the above operation is repeated, and the discarded electronic components 16 can be collected from the component disposal boxes 10 arranged in all the electronic component assembly machines 1.

  Based on FIG. 9, the structure of the waste electronic component collection system 21, which is another embodiment of the claimable invention, will be described. The component disposal box carrying substrate 18 is fixed to the substrate carrying device 4. It is optional that the component disposal box carrying substrate 18 is fixed, and fixing is not an essential condition. The component disposal box 10 placed on the component disposal box transport substrate 18 does not contain the electronic component 16. This parts disposal box 10 is for preparing for the next production.

  Next, the operation of the waste electronic component collection system 21 will be described. In the first and second embodiments, the component discharge board 14 is described for the purpose of collecting the discarded electronic components 16. However, the component disposal box 10 is transported by the component disposal box transport substrate 18. It may be. That is, the component disposal box carrying substrate 18 on which the empty component disposal box 10 is placed is conveyed instead of the component discharging substrate 14 (FIG. 9). Then, the electronic component 16 can be recovered by replacing the empty component disposal box 10 and the component disposal box 10 in which the electronic component 3 is disposed with the component disposal box gripping means 17, the component mounting head 7, and the XY moving device 5. It can be done.

  It is also possible to selectively transport the component discharge board 14 and the component disposal box board 18 in response to a request signal from the electronic circuit component mounting machine during production.

  DESCRIPTION OF SYMBOLS 1 ... Electronic circuit component mounting machine, 2 ... Component supply means, 3 ... Circuit board, 4 ... Board conveyance apparatus, 5 ... XY movement apparatus, 6 ... Component imaging means, 7 ... Component mounting head, 8 ... Identification means, 9 DESCRIPTION OF SYMBOLS IDENTIFICATION DEVICE RECOGNITION DEVICE, 10 ... COMPONENT DISPOSAL BOX, 11 ... BAR, 12 ... HINGE, 13 ... BOARD HOLDER, 14 ... COMPONENT DISCHARGE BOARD, 15 ... ROTARY CYLINDER, 16 ... ELECTRONIC COMPONENT, 17 ... COMPONENT DISPOSAL BOX GRIPS , 18... Substrate disposal box transport substrate, 19... Discarded electronic component collection system, 20... Discarded electronic component collection system, 21.

Claims (6)

  A board conveying device for conveying a circuit board; a component mounting head for sucking an electronic component from a component supply means and mounting the electronic component on the circuit board; and a component imaging means for determining whether or not the electronic component can be mounted. A component disposal box for discarding an electronic component determined to be unmountable, a component discharge substrate is carried in by the substrate transfer device, and the electronic component discarded in the component disposal box is transferred to the component discharge substrate The electronic circuit component mounting machine comprising: a system for recovering the discarded electronic component by discharging the component discharging substrate by the substrate transfer device after the discharging is completed.   The component disposal box is raised by a component disposal box raising mechanism provided in the electronic circuit component placement machine, and the discharge is performed by being tilted by a component disposal box tilting mechanism provided in the electronic circuit component placement machine. The electronic circuit component mounting machine according to claim 1.   The component disposal box is held by an XY moving device provided in the electronic circuit component mounting machine and the component mounting head, and is ejected by being moved onto the component ejection board. The electronic circuit component mounting machine described in 1.   The identification means attached to the component discharge board is read by the identification means recognition device provided in the electronic circuit component placement machine, so that the component discharge board is carried into the electronic circuit component placement machine. The electronic circuit component mounting machine according to claim 1, further comprising an information processing unit for recognizing the electronic circuit component.   Determining whether the electronic component can be mounted, the substrate conveying device for conveying the circuit board, the component mounting head for adsorbing the electronic component from the component supply means and mounting the electronic component on the circuit substrate The component image pickup means and the component disposal box for discarding the electronic component determined to be unmountable, and the substrate transport device carries a component disposal box transport board into the electronic circuit component mounting machine. And a system for exchanging the component disposal box on the component disposal box transport board and the component disposal box provided in the electronic component mounting machine by using the XY moving device and the component mounting head. The electronic circuit component mounting machine   The identification means attached to the component disposal box transport substrate is read by the identification means recognition device provided in the electronic circuit component mounting machine, so that the component disposal box transporter is transported into the electronic circuit component mounting machine. The electronic circuit component mounting machine according to claim 5, further comprising the information processing means for recognizing that the board has been carried in.

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