JP3721981B2 - Manufacturing method of electronic component with cap and adhesive application device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an electronic component with a cap having a package structure having a substrate and a cap, such as a piezoelectric resonant component, and more particularly, an adhesion structure between a conductive cap and a substrate is improved. The present invention relates to a method of manufacturing an electronic component with a cap and an adhesive application device.
[0002]
[Prior art]
For example, in a piezoelectric oscillator, a piezoelectric filter, and the like, a package structure including a substrate and a cap is widely used. An example of this kind of electronic component with a cap is disclosed in Japanese Patent Laid-Open No. 9-307397.
[0003]
In the electronic component with a cap described in the above prior art, a plurality of external electrodes for electrical connection with the outside are formed on a substrate. In addition, a piezoelectric resonance element is mounted on the substrate, and a metal cap is joined to the substrate using an insulating adhesive so as to surround the piezoelectric resonance element. Further, in order to obtain an electromagnetic shielding effect, the metal cap is electrically connected to an external electrode formed on the substrate and connected to the ground potential.
[0004]
The metal cap bonding step in a manufacturing method according to the prior art will be described with reference to FIG.
First, as shown schematically in the upper of FIG. 7, for preparing a metal cap 101. The metal cap 101 has an opening that opens downward. On the other hand, the board | substrate 102 which comprises a package with the metal cap 101 is prepared. A plurality of external electrodes are formed on the upper surface of the substrate 102, although not particularly shown. In practice, a piezoelectric resonance element (not shown) or the like is mounted on the substrate 102.
[0005]
When the metal cap 101 is joined, the insulating adhesive 103 is applied to the opening end surface of the metal cap 101 and the outer side surface and the inner side surface connected to the opening end surface. Thereafter, the metal cap 101 is pressure-bonded to the upper surface of the substrate 102, and the metal cap 101 is bonded to the substrate 102 with the insulating adhesive 103.
[0006]
In this case, a conductive layer 104 is previously formed on the upper surface of the substrate 102 in order to achieve electrical connection between the metal cap 101 and an external electrode connected to the ground potential on the substrate 102. That is, the conductive layer 104 is provided on an external (not shown) electrode connected to the ground potential on the substrate 102. The conductive layer 104 is made of a conductive paste.
[0007]
When the conductive layer 104 is temporarily cured, the metal cap 101 is bonded to the substrate 102. Therefore, since the electrically hardened conductive layer 104 pushes away the insulating adhesive 103 and comes into contact with the lower opening end surface of the metal cap 101, the metal cap 101 and the conductive layer 104 are electrically connected. .
[0008]
[Problems to be solved by the invention]
In the prior art disclosed in Japanese Patent Laid-Open No. 9-307397, when the conductive layer 104 is formed and the metal cap 101 is joined, (1) the conductive layer 104 is formed by transferring the conductive paste onto the substrate. (2) a step of temporarily curing the conductive layer 104, (3) a step of applying the insulating adhesive 103 to the metal cap 101, and (4) a step of pressing the metal cap 101 onto the substrate 102. I had to. Therefore, since it takes time to temporarily cure the conductive layer 104, the productivity is low.
[0009]
In addition, the adhesive 103 may not always be pushed away by the conductive layer 104, and poor conduction between the cap 101 and the conductive layer 104 may occur.
Moreover, the incidence rate of the conduction failure varies depending on the viscosity of the insulating adhesive used. Therefore, when the adhesive is changed, the conduction failure occurrence rate changes. Therefore, the adhesive used is limited, and every time the adhesive is changed, strict production control must be performed.
[0010]
The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, excellent in productivity, hardly cause poor conduction between the conductive cap and the substrate, and have few restrictions on the type of adhesive for joining the conductive cap to the substrate. An object of the present invention is to provide a method of manufacturing an electronic component with a cap.
[0011]
Another object of the present invention is to provide an adhesive application device suitable for the above-described method for producing an electronic component with a cap.
[0012]
[Means for Solving the Problems]
1st invention of this application has the process of providing a conductive paste on a board | substrate, the process of mounting an electronic component element on the said board | substrate, and the opening opened below, It is formed by hardening of the said conductive paste. A step of preparing a conductive cap electrically connected to the electrode; and an adhesive stage on the upper surface of which an adhesive is applied to a predetermined thickness, and the adhesive stage in the region where the adhesive is applied At least one suction hole that is open on the upper surface and extends below the bonding stage is formed, and further includes suction means connected to the suction hole, and suctioning by the suction means allows the bonding stage to some of the applied adhesive to the top surface is configured to be removed, at the opening end surface of the conductive cap using an adhesive application device, in contact with the electrode on the substrate A step of applying an insulating adhesive except the portion to be removed, and a step of bonding a conductive cap to the substrate surface via the insulating adhesive before the conductive paste is cured, It is a manufacturing method of an electronic component with a cap.
[0013]
The second invention of the present application applies an adhesive to the conductive cap when the conductive cap is bonded to the substrate via an insulating adhesive so as to surround the electronic component element mounted on the substrate. An adhesive application device for providing an adhesive stage to which an adhesive is applied to a predetermined thickness on the upper surface, wherein the adhesive stage is open to the upper surface of the adhesive stage in a region where the adhesive is applied; and At least one suction hole extending below the bonding stage is formed, further comprising a suction means connected to the suction hole, and one of the adhesives applied to the upper surface of the stage by being sucked by the suction means. The configuration is such that the portion is removed.
[0014]
In a specific aspect of the second invention, a suction chamber that is communicated with the lower end of the suction hole and has a larger volume than the suction hole is further provided in the bonding stage, and the suction chamber is provided in the suction means. It is connected.
[0015]
In still another specific aspect of the second invention, a diaphragm made of an elastic film is divided in the suction chamber into a space on the suction hole side and a space on the opposite side of the suction hole. It is provided as follows.
[0016]
In another specific aspect of the second invention, a squeegee that is moved in parallel to the upper surface of the bonding stage is further provided in order to make the thickness of the adhesive applied on the bonding stage constant.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.
[0019]
1A and 1B are a plan view and a front view for explaining an electronic component with a cap obtained by a manufacturing method according to an embodiment of the present invention.
The electronic component 1 with a cap has a package structure including a substrate 2 and a conductive cap 3. The substrate 2 is made of an appropriate insulating material such as insulating ceramics or synthetic resin made of alumina.
[0020]
Although not particularly shown, a plurality of external electrodes are formed on the upper surface of the substrate 2. The plurality of external electrodes are electrically connected to an electronic component element housed in the package, for example, a piezoelectric resonance element.
[0021]
On the upper surface 2a of the substrate 2, an electrode 4 formed by solidifying the conductive paste is formed on the external electrode connected to the ground potential among the plurality of external electrodes.
[0022]
The conductive cap 3 is joined to the upper surface 2a of the substrate 2 via an insulating adhesive 6 so as to surround an electronic component element such as an internal piezoelectric resonant element. .
[0023]
The feature of this embodiment is that the insulating adhesive 6 is disposed between the opening end surface of the conductive cap 3 and the substrate 2 except for the portion where the electrode 4 is in contact with the opening end surface of the conductive cap 3. There is in being. Therefore, the electrode 4 ensures conduction between the conductive cap 3 and the external electrode connected to the ground potential formed on the upper surface of the substrate 2. In other words, the electrode 4 and the open end surface of the conductive cap 3 are reliably connected.
[0024]
Next, the manufacturing method of the electronic component 1 with a cap of a present Example is demonstrated.
First, the substrate 2 having a plurality of external electrodes (not shown) formed on the upper surface is prepared. Next, an electronic component element is mounted on the substrate 2. The mounting of the electronic component element is performed using a conductive adhesive, solder, or the like so that the electrode of the electronic component element and the external electrode on the substrate 2 are electrically connected.
[0025]
On the other hand, a conductive cap 3 having an opening opened downward is prepared. As the conductive cap 3, a metal cap made of an appropriate metal material such as Al or a cap formed by forming a conductive film on the surface of an insulating material can be used.
[0026]
Next, as schematically shown in FIG. 2, an insulating adhesive 6 is applied to the opening end surface 3 a of the conductive cap 3. In this case, the insulating adhesive 6 is applied except for the portion provided on the electrode 4 described above.
[0027]
Thereafter, a conductive paste is applied on the external electrode connected to the ground potential on the upper surface 2a of the substrate 2 in order to form the electrode 4 described above. Before the conductive paste is temporarily cured, the conductive cap 3 is bonded to the upper surface 2 a of the substrate 2, and the conductive cap 3 is bonded to the substrate 2 with the insulating adhesive 6.
[0028]
Thereafter, the capped electronic component 1 shown in FIG. 1 is obtained by curing the insulating adhesive 6 and the conductive paste.
In the manufacturing method of the present embodiment, an insulating adhesive is applied in advance on the opening end face of the conductive cap 3 excluding a portion in contact with the electrode 4, that is, selectively. Then, before the conductive paste applied to the upper surface of the substrate 2 is cured, the conductive paste 3 is pressure bonded to the upper surface 2a of the substrate 2 or bonded. Therefore, the electrode 4 formed by curing of the conductive paste and the opening end face of the conductive cap 3 are reliably in contact with each other, and there is almost no poor conduction between them. When the inventor of the present invention manufactured an electronic component with a cap by the manufacturing method of the present example, the conduction failure rate was improved from 3 to 5% to 0%.
[0029]
Further, since it is not necessary to temporarily cure the conductive paste, productivity can be improved as compared with the above-described prior art.
As described above, various methods can be used to selectively apply the adhesive on the opening end surface below the conductive cap 3, that is, not particularly limited. 3 and the adhesive application device shown in FIG. 4 can be suitably used.
[0030]
3 to 5 are a front sectional view, a plan view, and a perspective view for explaining an embodiment of the adhesive application device of the present invention.
The adhesive applicator 11 is provided with a disk-shaped adhesive stage 12. On the upper surface 12 a of the bonding stage 12, an adhesive is applied to the annular region between the alternate long and short dash lines A and B in FIG. 4. The application of the adhesive is performed by dropping the adhesive into the annular region and moving the squeegee 13 disposed on the stage 12a in the circumferential direction to make the thickness of the adhesive constant.
[0031]
In this embodiment, the bonding stage 12 is configured to be rotated by a rotation drive source such as a motor (not shown), while the squeegee 13 is fixed. The lower end surface 13 b of the squeegee 13 is parallel to the upper surface 12 a of the bonding stage 12 and extends in the radial direction of the stage 12. Moreover, the distance between the lower end surface 13a and the upper surface 12a of the stage 12 is determined according to the target application thickness of the adhesive.
[0032]
In this embodiment, the squeegee 13 is fixed. However, the bonding stage 12 may be fixed, and the squeegee 13 may be rotated around the annular region of the bonding stage 12.
[0033]
On the other hand, the bonding stage 12 is provided with a plurality of suction holes 12b that open to the upper surface 12a and extend downward. The suction hole 12b is provided to suck and remove a part of the applied adhesive. That is, as shown in FIG. 4, the plurality of conductive caps 3 described above are placed on the upper surface 12 a of the bonding stage 12 as indicated by an imaginary line C, and thereby the lower end surface of the conductive cap 3. The adhesive is transferred to the surface.
[0034]
Specifically, the conductive cap 3 is held by a holding means such as a suction chuck and placed on the adhesive applied on the upper surface 12 a of the bonding stage 12. In this case, the conductive cap 3 is placed so that the suction hole 12 b overlaps a part of the opening end surface below the conductive cap 3. As shown in FIG. 4, in this embodiment, the conductive caps 3 are arranged so that the suction holes 12b are located in the opposing long side portions of one conductive cap opening end surface. .
[0035]
As shown in FIG. 3, a suction chamber 14 is provided below the suction hole 12b. In this embodiment, the bonding stage 12 includes a stage main body 12A and a base member 15 bonded to the lower surface of the stage main body 12A. A suction chamber 14 is formed in the bonding stage 12 by a recess 15a provided on the upper surface of the base member 15 and a recess 12c provided on the lower surface of the stage main body 12A. The recesses 12c and 15a are shaped to overlap each other. Further, the recesses 12c and 15a are extended in the circumferential direction of the bonding stage 12 in this embodiment. That is, the recesses 12c and 15a have an annular shape. However, the recesses 12c and 15a do not necessarily have an annular shape, and a plurality of recesses 12c and 15a may be formed in the circumferential direction.
[0036]
A diaphragm 16 made of an elastic film such as silicon rubber is disposed in the suction chamber 14. The diaphragm 16 is provided so as to partition the suction chamber 14 into a space on the suction hole 12b side and a space on the opposite side to the suction hole 12b side. A pressing plate 17 that holds the diaphragm is attached to the lower surface of the diaphragm 16.
[0037]
A suction path 18 is connected to the lower side of the diaphragm 16 in the suction chamber 14. The suction path 18 is formed in the base 15 and extends toward the center of the bonding stage 12.
[0038]
On the other hand, a spindle 20 having a suction path 19 inside is connected to the center of the bonding stage 12. A joint 21 is connected to the upper end of the spindle 20, and the joint 21 is connected to a rotational drive source such as a motor (not shown). The bonding stage 12 is fixed to the spindle 20 so as to be able to rotate together with the spindle 20.
[0039]
Although not particularly shown, suction means (not shown) such as a vacuum pump is connected to the suction path 19.
The process of apply | coating an adhesive agent to the electroconductive cap 3 using the adhesive agent coating apparatus 11 of a present Example is demonstrated.
[0040]
First, an adhesive is dropped on the upper surface 12 a of the bonding stage 12, the bonding stage 12 is rotated, and the thickness of the adhesive applied by the squeegee 13 is made constant. In this state, a suction means (not shown) is driven to suck the adhesive from the suction hole 12b. As a result, the adhesive at the portion located on the suction hole 12b is removed. Thereafter, the conductive cap 3 is placed on the upper surface 12a of the bonding stage 12 by a holding means such as a suction chuck so that a part of the opening end surface thereof overlaps the suction hole 12c. Next, in a state where the conductive cap 3 is held by the holding means, it is pressure-bonded onto the substrate 2 shown in FIG.
[0041]
Thus, if the adhesive application device 11 of the present embodiment is used, the adhesive can be reliably removed at the upper portion of the suction hole 12b. Therefore, the adhesive can be selectively applied to the lower opening end face of the conductive cap 3. Therefore, when the electronic component 1 with a cap shown in FIGS. 1 and 2 is manufactured, the position of the suction hole 12b and the conductivity are set so that the suction hole 12b is located at the position corresponding to the portion provided on the electrode 4. By selecting the mounting position of the cap 3, the conductive cap 3 can be easily and reliably joined to the substrate.
[0042]
Note that after the adhesive is selectively applied to the lower opening end face of the conductive cap 3, if the suction by the suction means is released, the adhesive is again returned from the suction hole 12 b to the bonding stage 12 by the elastic restoring force of the diaphragm 16. Returned to the upper surface 12a. Therefore, the operation | work which apply | coats an adhesive agent to the downward opening end surface of the electroconductive cap 3 can be continued by repeating the said operation | movement.
[0043]
Preferably, if a suction pressure pneumatic means capable of performing both suction and compressed air operations is used instead of the suction means, relatively high pressure air is injected from the suction pressure pneumatic means, as shown in FIG. By doing so, the adhesive can be moved onto the upper surface 12 a of the bonding stage 12. Also in this case, as shown in FIG. 6 (b), when the adhesive is partially removed, the adhesive on the suction hole 12b is sucked by the suction / pressure air means as in the above embodiment. Removed. Further, after the adhesive is selectively applied to the lower opening end face of the conductive cap 3, the adhesive is removed from the suction hole 12 b by supplying relatively high pressure air from the suction / pressure air means. It can be moved to the upper surface 12a to be in an initial state.
[0052]
As described above, by using an adhesive application device 1 1 shown in FIGS. 3 and 4, it is possible to easily and quickly manufacture the electronic component 1 with the cap shown in FIG.
[0053]
In the method for manufacturing an electronic component with a cap according to the present invention, an apparatus for applying an insulating adhesive except for a portion in contact with the electrode on the substrate on the opening end surface of the conductive cap is provided with the adhesive application. It is not limited to the apparatus 1 1.
[0054]
【The invention's effect】
In the method of manufacturing an electronic component with a cap according to the present invention, an insulating adhesive is applied to the opening end surface of the conductive cap except for a portion that is in contact with an electrode on the substrate that is conducted to the conductive cap. Before the conductive paste for forming the electrode electrically connected to the conductive cap is cured, the conductive cap is bonded to the substrate surface, thereby joining the conductive cap to the substrate. Therefore, the productivity of the electronic component with a cap can be significantly increased as compared with the conventional method that requires temporary curing of the conductive paste. In addition, since the conductive cap portion to which the electrode formed by curing the conductive paste is not contacted in advance is not provided with an insulating adhesive, the electrode formed by curing the conductive paste and the conductive cap The continuity of is surely fulfilled.
[0055]
Therefore, according to the manufacturing method of the present invention, it is possible to manufacture a highly reliable electronic component with a cap with high productivity.
In the adhesive application device according to the second invention, a suction hole is opened on the upper surface of the bonding stage, and suction of the adhesive applied to the upper surface of the bonding stage is performed by suction by a suction means connected to the suction hole. Part is removed. Accordingly, by placing the conductive cap on the bonding stage so that a part of the opening end face of the conductive cap coincides with the position overlapping the suction hole, an insulating adhesive is applied to a part of the opening end face of the conductive cap. It is possible to reliably apply the insulating adhesive to the remaining portion without adhering.
[0056]
In the adhesive applicator according to the second invention, a suction chamber having a volume larger than the suction hole is provided in the stage, and when the suction chamber is connected to the suction means, The insulating adhesive can be sucked and removed more reliably.
[0057]
When the diaphragm is provided in the suction chamber so as to partition the suction hole side space and the opposite side space, it is possible to reliably prevent the sucked insulating adhesive from leaking to the suction means side. Can do. Further, when suction is released, the adhesive sucked into the suction hole can be returned to the upper surface of the bonding stage by the elastic restoring force of the diaphragm. Therefore, the consumption of the adhesive can be reduced.
[0058]
In order to make the thickness of the adhesive applied on the stage constant, in the case of further comprising a squeegee that is moved relatively parallel to the upper surface of the stage, the thickness of the adhesive on the upper surface of the adhesive stage is surely constant. can do.
[Brief description of the drawings]
FIGS. 1A and 1B are a plan view and a front view showing an electronic component with a cap obtained by an embodiment of the present invention.
FIG. 2 is a schematic front view showing a step of selectively applying an insulating adhesive to a conductive cap in a method of manufacturing an electronic component with a cap according to an embodiment of the present invention.
FIG. 3 is a front sectional view of an embodiment of the adhesive application device of the present invention.
4 is a schematic plan view of the adhesive application device of the embodiment shown in FIG. 3. FIG.
FIG. 5 is an exploded perspective view for explaining the adhesive application device of the embodiment shown in FIG. 3;
FIGS. 6A and 6B show a step of returning the adhesive in the suction hole to the upper surface of the bonding stage using the suction pressure pneumatic means, and a state in which the adhesive above the suction hole is removed by suction. FIG.
FIG. 7 is a schematic plan view for explaining a process of bonding a conductive cap to a substrate in manufacturing a conventional electronic component with a cap.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic component with a cap 2 ... Board | substrate 2a ... Upper surface 3 ... Conductive cap 4 ... Electrode 6 ... Insulating adhesive 11 ... Adhesive coating device 12 ... Adhesion stage 12a ... Upper surface 12b ... Suction hole 13 ... Squeegee 14 ... Suction chamber DESCRIPTION OF SYMBOLS 15 ... Base 16 ... Diaphragm 18 ... Suction path 19 ... Suction path 20 ... Spindle 21 ... Joint

Claims (5)

Applying a conductive paste on the substrate;
Mounting an electronic component element on the substrate;
Providing a conductive cap having an opening opened downward and electrically connected to an electrode formed by curing of the conductive paste;
Provided with an adhesive stage on the upper surface where the adhesive is applied to a predetermined thickness,
In the bonding stage, at least one suction hole that is open on the upper surface of the bonding stage in a region where the adhesive is applied and extends below the bonding stage is formed,
A suction means connected to the suction hole;
In the opening end surface of the conductive cap using an adhesive application device, the electrode is configured so that a part of the adhesive applied to the upper surface of the adhesive stage is removed by suction by the suction means. Applying an insulating adhesive except for the part that is in contact with
And a step of bonding the conductive cap to the substrate surface via the insulating adhesive before the conductive paste is cured. An adhesive application device for applying an adhesive to a conductive cap when the conductive cap is bonded to the substrate via an insulating adhesive so as to surround an electronic component element mounted on the substrate. ,
Provided with an adhesive stage on the upper surface where the adhesive is applied to a predetermined thickness,
In the bonding stage, at least one suction hole that is open on the upper surface of the bonding stage in a region where the adhesive is applied and extends below the bonding stage is formed,
A suction means connected to the suction hole;
An adhesive application device configured to remove a part of the adhesive applied to the upper surface of the adhesive stage by being suctioned by the suction means. Is communicated with a lower end of the suction hole, it said has a large aspiration chamber volume than the suction holes provided in the adhesion stage, the suction chamber is connected to the suction means, to claim 2 The adhesive application device described. The adhesion according to claim 3 , wherein a diaphragm made of an elastic film is provided in the suction chamber so as to partition the suction chamber into a space on the suction hole side and a space opposite to the suction hole. Agent applicator. Further comprising a squeegee is moved parallel to the upper surface of the adhesive stage to the constant thickness of the applied adhesive on the adhesive stage, the adhesive coating apparatus according to any one of claims 2-4 .

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