JP3754429B2 - Barrel plating apparatus and barrel plating system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a barrel plating apparatus and a barrel plating system using the same.
[0002]
[Prior art]
Related to the barrel plating apparatus, Japanese Patent Application Laid-Open No. 2000-192299 discloses a technique for efficiently purifying the plating solution in the plating tank. Specifically, a muddy substance called slime or sludge is provided by arranging a drain pipe inside the filter bag containing the anode and anode material, and sucking and discharging the plating solution from the inside of the filter bag. Are actively discharged to the outside.
[0003]
[Patent Document 1]
JP 2000-192299 A
[0004]
[Problems to be solved by the invention]
The plating solution discharged from the plating tank through the drain pipe is used after being filtered by the filter and then returned to the plating tank for reuse. Excessive clogging occurs in a short time, and the intended plating solution purification and plating solution circulation cannot be performed, and the cost associated with cleaning and replacement of the filter material of the filter is high. In addition, the muddy substance that has been stagnated due to the flow of the plating solution when the plating solution is sucked from the inside of the filter bag by the drainage pipe flows, and this flow causes the muddy substance to leak from the filter bag and into the plating solution. There is also a risk of mixing.
[0005]
The present invention was created in view of the above circumstances, and the object of the present invention is to reliably suppress fluidization of the mud substance accompanying the plating solution circulation and mixing into the plating solution, thereby ensuring the intended plating solution circulation. It is an object of the present invention to provide a barrel plating apparatus that can effectively perform the above and a barrel plating system that uses a plurality of barrel plating apparatuses.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a barrel plating apparatus according to the present invention is a barrel plating apparatus having a plating tank in which a rotatable barrel having a cathode is taken in and out, and has a mesh portion that allows passage of a plating solution. And at least one screen detachably arranged in the plating tank so as to partition the inside of the plating tank into a plating chamber for barrel arrangement and an anode chamber for anode arrangement, and a plating solution in the plating chamber And a drainage port for discharging the plating solution in the anode chamber provided at the upper part of the wall surface of the plating tank constituting the anode chamber.
[0007]
According to this barrel plating apparatus, the inside of the plating tank is divided into a plating chamber and an anode chamber by a screen, and even if convection occurs in the plating solution in the plating chamber due to the barrel rotation, the influence is exerted on the plating solution in the anode chamber. And getting harder. In short, mud substances called slime and sludge accumulate on the lower side of the anode placed in the anode chamber during the plating process, but this mud substance is prevented from fluidizing due to the effect of convection associated with the barrel rotation. Thus, the stationary state can be maintained as much as possible. Therefore, the muddy substance is hardly mixed in the surplus plating solution discharged from the drain port provided in the anode chamber, and the filter is clogged even when the surplus plating solution is purified by the filter. Can be made as long as possible, the intended plating solution purification and plating solution circulation can be effectively performed, and the costs associated with cleaning and replacement of the filter media can be reduced as much as possible. it can.
[0008]
On the other hand, the barrel plating system according to the present invention includes a plurality of the barrel plating apparatuses, a first tank for storing a circulating plating solution, a drain port and a first tank for the plurality of barrel plating apparatuses. A drainage line to be connected, a liquid supply valve having a liquid supply valve corresponding to the liquid supply pipes of a plurality of barrel plating apparatuses, a liquid supply line connecting each liquid supply pipe and the first tank, a first pump and a first filtration And a first liquid supply means for filtering the plating liquid in the first tank and supplying it to the liquid supply pipes of the plurality of barrel plating apparatuses, a first pump and a second filter. A first tank and a second tank having a second liquid supply means connected in parallel to the means, a second tank for containing a replenishing plating solution, a third pump and a drain valve; The main feature is that it includes a recovery line to be connected, and a supply line having a liquid supply valve and connecting the second tank and the first tank. That.
[0009]
According to this barrel plating system, the plating solution can be circulated by using one of the first liquid supply means and the second liquid supply means, and the filter medium of the filter of the use-side liquid supply means can be cleaned or replaced. When necessary, it is possible to switch to the non-use side liquid supply means. In other words, if the first liquid supply means and the second liquid supply means are alternately used, the normal plating liquid circulation is not stopped, in other words, the productivity of the pump is not reduced and the pump is cleaned and replaced without lowering the productivity. Maintenance can be performed.
[0010]
The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
1 to 9 show an embodiment of a barrel plating apparatus to which the present invention is applied.
[0012]
1 is a top view of the plating tank, FIG. 2 is a sectional view taken along line a1-a1 in FIG. 1, FIG. 3 is a sectional view taken along line a2-a2 in FIG. 1, and FIG. 5 is a view showing a modification of the barrel, FIG. 6 (A) is a perspective view of the screen, FIG. 6 (B) is an exploded perspective view of FIG. 6 (A), and FIG. 7A is an exploded view of FIG. 7A, FIG. 8 is a perspective view of an anode case and a conductive handle, and a perspective view of an anode case mounting plate, and FIG. 9A is a longitudinal sectional view of the anode case. FIG. 9B is a diagram showing how the anode case is replenished with the anode case.
[0013]
The plating tank 1 has a rectangular container shape with an open upper surface, and is formed of a hard plastic such as polyvinyl chloride having resistance to the plating solution PL, a metal material provided with a plastic coating, or the like, and has an insulating property. Yes. Further, a substantially rectangular drainage port 1a for discharging a plating solution PL in an anode chamber 7 to be described later is provided on both upper sides of the lower wall of the plating tank 1 in FIG.
[0014]
Further, a merging case 3 for sending the plating solution PL flowing out from the two drainage ports 1 a to the drainage pipe 2 is provided outside the wall surface of the plating tank 1 where the drainage port 1 a is provided. The merging case 3 and the drainage pipe 2 are formed of a hard plastic such as polyvinyl chloride having resistance against the plating liquid PL, a metal material provided with a plastic coating, or the like, and has an insulating property. The bottom surface of the merging case 3 is inclined downward toward the center, and the upper end of the drainage pipe 2 is connected to the hole in the center of the bottom surface.
[0015]
Further, inside the plating tank 1, a mounting frame 4 having a U-shaped cross section for inserting and mounting an outer frame portion 5b of the screen 5 to be described later extends over the upper and lower walls in FIG. Has been. The mounting frame 4 is formed of a hard plastic such as polyvinyl chloride having resistance against the plating solution PL, a metal material provided with a plastic coating, or the like, and has an insulating property.
[0016]
The screen 5 has a rectangular plate shape as a whole, and includes a mesh portion 5a and an outer frame portion 5b that holds the periphery thereof as shown in FIG. As shown in FIGS. 6B, 7A, and 7B, the screen 5 includes a first frame member 5-1 having a rectangular annular groove 5-1a on one surface, and a rectangular annular groove 5 as shown in FIG. -1a includes a second frame member 5-2 having a rectangular annular protrusion 5-2a on one side, a mesh member 5-3, and a rectangular packing 5-4. -3 is pressed against one surface of the first frame member 5-1, and then the packing 5-4 is pushed into the rectangular annular groove 5-1a. Then, the rectangular annular protrusion 5-2a of the second frame member 5-2 is It is assembled by fitting into a rectangular annular groove 5-1a of one frame member 5-1. The first frame member 5-1 and the second frame member 5-2 are made of a hard plastic such as polyvinyl chloride having resistance to the plating solution PL and have insulation properties. Further, the mesh material 5-3 is made of plastic such as polyester or polyethylene and has insulation properties, and the packing 5-4 is made of synthetic rubber such as silicone rubber and has insulation properties.
[0017]
Two identical screens 5 are prepared after assembly, and each screen 5 is mounted in the plating tank 1 by inserting its outer frame portion 5b into each of the mounting frames 4 provided in the plating tank 1. Each screen 5 can be removed from the plating tank 1 by being extracted from the mounting frame 4, and can be disassembled after the extraction to replace the mesh portion 5 a (mesh material 5-5).
[0018]
In the state where two screens 5 are attached in the plating tank 1, the inside of the plating tank 1 is divided into three regions, and the region sandwiched between the two screens 5 is a plating chamber 6. The opposite areas are two anode chambers 7. Moreover, as shown in FIG. 3, the upper end height of each screen 5 is set higher than the lower end height of the drainage port 1a, and lower than the upper end height of the plating tank 1 and the upper end height of the drainage port 1a. Being
The barrel 8 has a hexagonal cross section, and as shown in FIG. 4, a frame portion 8a having rectangular openings on six side surfaces, a mesh portion 8b provided in each opening, and both ends thereof are framed. And a crank-shaped cathode 8c supported on both end faces of the portion 8a. The frame portion 8a and the mesh portion 8b are made of a hard plastic such as polyvinyl chloride having resistance to the plating solution PL and have an insulating property, and the cathode 8c is made of a conductive metal material such as titanium (Ti). Has been.
[0019]
Both ends of the barrel 8 are supported by a barrel hanger (not shown) that can move up and down and horizontally, and the axis of rotation of the barrel 8 is connected to the screen 5 in the plating chamber 6 by lowering the barrel hanger. It is inserted so as to be parallel to each other, and is rotated in a predetermined direction by a motor and a gear mechanism provided on the barrel hanger.
[0020]
A part of the barrel 8 is provided with an opening / closing window (not shown) for taking the workpiece W into and out of the barrel 8. In the drawing, the frame 8a has no meshed window holes on both end faces. However, as shown in FIG. 5, the frame 8a has a plurality of meshed window holes 8d on both end faces. It may be used as the barrel 8.
[0021]
The anode case 9 is made of a conductive metal material such as titanium (Ti) that is resistant to the plating solution PL, and has a flat rectangular container shape with an open top as shown in FIGS. 8 and 9A. The case portion 9a, the hook portion 9b1 having a U-shaped cross section at the upper end, two hook portions 9b connected to both sides of the upper end of the case portion 9a, the lower portions of the two hook portions 9b, and the upper end of the case portion 9a And a flat plate-like guide portion 9c that covers the surrounded gap portion. The case portion 9a is for housing the anode material AM having a predetermined shape, and the guide portion 9c is for guiding and preventing the fall when the anode material AM is put into the case portion 9a. In addition, a rectangular mesh portion 9a1 extending downward from the upper end of the case portion 9a is provided on the two largest surfaces of the case portion 9a, and the reduced anode material AM ′ is dropped on the bottom surface of the case portion 9a. A plurality of drop openings 9a2 are provided.
[0022]
Two anode cases 9 are prepared for one anode chamber 7, and the two anode cases 9 are corners made of a conductive metal material such as titanium (Ti) having resistance to the plating solution PL. The columnar conductive handle 10 is coupled in series. Specifically, the upper end of the hook portion 9b of each anode case 9 is electrically coupled to a bracket 10a provided on the lower surface of the conductive handle 10 with or without a rod 10b. The bracket 10a of the conductive handle 10 or the handle itself is provided with a connection terminal 11 made of a bolt and a nut, and an anode power supply cord 12 is connected to the connection terminal 11.
[0023]
In the two anode cases 9 to which the conductive handles 10 are coupled, the hook portions 9b of the two anode cases 9 are hooked on a suspension bar 13 installed on the upper end of the plating tank 1 corresponding to each anode chamber 7. Is disposed in each anode chamber 7. As can be seen from FIG. 1, each of the anode cases 9 after being arranged has their mesh portions 9 a 1 oriented in parallel with the screen 5.
[0024]
The suspension bar 13 is made of a conductive metal material such as titanium (Ti), and both ends thereof are supported by a metal fitting 14 screwed to the upper end surface of the plating tank 1. Further, the hanging bar 13 has a notch 13a at the upper end edge for positioning when the hook portions 9b of the two anode cases 9 are hooked. Incidentally, in the case where the plating tank 1 is made of a plastic-coated metal material and the screw for fastening the metal fitting 14 is electrically connected to the plating tank 1, an insulating material is provided at both end support portions of the suspension bar 13. Thus, the insulating property can be secured between the plating tank 1 and the suspension bar 13.
[0025]
The two liquid supply pipes 15 are provided for supplying the plating liquid PL into the plating chamber 6. Here, two same ones are prepared, and each of the liquid supply pipes 15 is provided from a barrel 8 disposed in the plating chamber 6. It is separated and disposed in the vicinity of the wall surface of the plating tank 1 constituting the plating chamber 6. Each liquid supply pipe 15 is closed at the lower end and has a plurality (five in the figure) of liquid supply ports 15a at equal intervals in a portion immersed in the plating liquid PL accommodated in the plating tank 1. The direction of the plating liquid PL supplied from each liquid supply port 15 a is set to a direction in which the plating liquid does not directly hit the barrel 8, specifically, a direction parallel to the screen 5.
[0026]
Hereinafter, a method of forming a metal film such as a nickel film, a tin film, a copper film, or a solder film on a base metal film provided on a minute object W, for example, an electronic component chip, by the above barrel plating apparatus. Will be described.
[0027]
When performing the plating process on the workpiece W, first, the screen 5 is attached to each of the two mounting frames 4 of the plating tank 1, and a predetermined amount of the plating liquid PL corresponding to the plating process is supplied to the plating chamber 6 as a supply pipe. 15 through. Since the mesh portion 5 a of each screen 5 allows the plating solution 5 to pass, the plating solution PL supplied into the plating chamber 6 flows into the anode chamber 7 through the mesh portion 5 a of each screen 5. As a result, the liquid levels in the plating chamber 6 and the anode chamber 7 are the same.
[0028]
Next, the two anode cases 9 coupled to the conductive handle 10 are inserted into the two anode chambers 7 respectively, and the hook portions 9b are hooked on the notches 13a of the hanging bar 13 for positioning. Before or after each anode case 9 is inserted into the anode chamber 7, a predetermined amount of anode material AM corresponding to the plating process is put into each anode case 9.
[0029]
Each anode case 9 is provided with a flat guide portion 9c that covers a gap surrounded by the lower portions of the two hook portions 9b and the upper end of the case portion 9a. Since the guide portion 9c can be guided by the guide portion 9c (see FIG. 9B), the anode material AM can be loaded easily and in a short period of time, and the anode material AM spills out during loading. Can be prevented.
[0030]
Next, the barrel 8 into which a predetermined amount of the object to be plated W has been charged is inserted into the plating chamber 6 by descent of the barrel hanger and immersed in the plating solution PL. Incidentally, when the plating process on the workpiece W in the barrel 8 is first or when another plating process is performed on the plating object W in the barrel 8 in advance, a water washing process (after plating) The barrel 8 after the treatment of washing the object to be plated W with water is inserted and arranged in the plating chamber 6.
[0031]
Next, the anode case disposed in each anode chamber 7 while rotating the barrel 8 disposed in the plating chamber 6 in a direction indicated by an arrow in FIG. 4 at a predetermined speed, for example, approximately 8 rotations / minute. A predetermined current and voltage are applied between each of 9 and the cathode 8b of the barrel 8 to perform an intended plating process on the workpiece W in the barrel 8.
[0032]
At the time of this plating process, the plating solution PL is supplied into the plating chamber 6 through the liquid supply pipe 15, and the excess plating solution PL is discharged from the drain port 1 a provided in each anode chamber 7 and the liquid level in the plating tank 1. Keep constant. The surplus plating solution PL discharged from each drainage port 1a flows into the drainage pipe 2 through the junction case 3, and the surplus plating solution PL that has flowed into the drainage pipe 2 is a circulation path including a filter and a pump ( (Not shown in the figure) and after purification, it is returned to the liquid supply pipe 15 again.
[0033]
In the barrel plating apparatus described above, the inside of the plating tank 1 is divided into one plating chamber 6 and two anode chambers 7 by two screens 5, and convection is caused by the rotation of the barrel 8 to the plating solution PL in the plating chamber 6. Even if it occurs, it is difficult to affect the plating solution PL in the two anode chambers 7. In short, mud substances called slime and sludge accumulate under the anode cases 9 arranged in the two anode chambers 7 during the plating process, but this mud substance is influenced by convection due to the barrel rotation. Therefore, it is possible to prevent the fluidization and keep the stationary state as much as possible. Accordingly, the surplus plating solution PL discharged from the drainage port 1a provided in each anode chamber 7 is hardly mixed with a muddy substance, and even when this surplus plating solution PL is purified by a filter. The time until the filter is clogged can be made as long as possible, the intended plating solution purification and plating solution circulation can be performed effectively, and the costs associated with cleaning and replacement of the filter material in the filter can be reduced. It can be reduced as much as possible. Incidentally, the muddy substances that have settled in the anode chambers 7 are collectively removed when the entire apparatus is regularly cleaned.
[0034]
Further, in the barrel plating apparatus described above, the drainage port 1 a is provided in each anode chamber 7, and the plating solution PL supplied from the liquid supply ports 15 a of the two liquid supply pipes 15 into the plating chamber 6 is the plating chamber 6. Since the liquid flows into the two anode chambers 7 through the mesh portion 5a of each screen 5, the drainage port 1a may be provided on the same wall surface as the wall of the plating tank 1 to which the liquid supply pipe 15 is adjacent. Together, fluidization and diffusion of the mud material due to the flow of the plating solution PL can be prevented as much as possible, and the excess plating solution PL with less mixing of the mud material can be discharged from the drain port 1a. Of course, the plating process is not adversely affected by the flow of the plating solution PL.
[0035]
Further, in the barrel plating apparatus described above, the upper end height of the screen 5 disposed in the plating tank 1 is higher than the lower end height of the drainage port 1a, and the upper end height of the plating tank 1 and the drainage port 1a. Since the upper end height is set lower than the upper end height, the amount of liquid passing through the mesh portion 5a of the screen 5 is temporarily reduced, and the plating liquid PL which exceeds the upper end height of the screen 5 even if the liquid level in the plating chamber 6 exceeds the upper end height. Can be discharged to the anode chamber 7, and the drainage port 1 a can be discharged, and it is possible to reliably prevent the excess plating solution PL from overflowing the plating tank 1.
[0036]
Further, in the barrel plating apparatus described above, the plating solution PL in the barrel 8 is exchanged with the surrounding plating solution PL by the pump action accompanying the rotation, but each liquid supply pipe 15 is disposed in the plating chamber 6. The plating solution PL is disposed away from the barrel 8 and in the vicinity of the wall surface of the plating tank 1 constituting the plating chamber 6, and the direction of the plating solution PL supplied from each liquid supply port 15 a is directly applied to the barrel 8. Therefore, the plating liquid PL supplied from the liquid supply port 15a of each liquid supply pipe 15 can be prevented from flowing into the barrel 8 directly. In short, when the plating solution PL is supplied so that the plating solution flows directly into the barrel 8, the plating process of the object to be plated W in the vicinity of the supply point is locally promoted, and the mutual adhesion and the plating state of the objects to be plated W vary. Although there is a fear, since the plating liquid PL supplied from the liquid supply port 15a of each liquid supply pipe 15 can be prevented from flowing directly into the barrel 8, the plating liquid PL in the barrel 8 and the surrounding plating liquid PL The liquid exchange can be appropriately performed to eliminate the fear of mutual adhesion and variation.
[0037]
Further, in the above barrel plating apparatus, since the two anode cases 9 are coupled to the conductive handle 10 and the power supply cord 12 is connected to the conductive handle 10, each anode case 9 can always be at the same potential. . In short, when the power supply cord is connected to the suspension bar 13, the potential of each anode case 9 may vary depending on the contact state between the suspension bar 13 and the hook portions 9b of the two anode cases 9. Such a difference can be surely prevented and metal ion generation and plating can be performed satisfactorily.
[0038]
Further, in the barrel plating apparatus described above, the drop port 9a2 is provided on the bottom surface of each anode case 9, so as shown in FIG. 9A, the anode material AM ′ reduced by the plating process is supplied from the drop port 9a2 to the anode. It is possible to let it fall naturally toward the bottom surface of the chamber 7. Therefore, the trouble in taking out the reduced anode material AM ′ from each anode case 9 can be omitted.
[0039]
Further, in the barrel plating apparatus described above, each anode case 9 is provided with a guide portion 9c for guiding the introduction of the anode material AM, so that the anode material AM can be loaded easily and in a short time and the anode material AM. Can be prevented from spilling at the time of charging.
[0040]
FIG. 10 shows an embodiment of a barrel plating system using a plurality of barrel plating apparatuses shown in FIGS.
[0041]
This system includes a plurality (four in the figure) of barrel plating devices 21, a first tank 22 for temporarily storing a plating solution for circulation, and a drain pipe 21a of the plurality of barrel plating devices 21. A drain line 23 connecting the first tank 22 and a liquid supply valve 24 corresponding to the liquid supply pipes 21b of the plurality of barrel plating apparatuses 21 are provided, and each liquid supply pipe 21b and the first tank 22 are connected. A first liquid supply line 25, a first pump 26, and a first filter 27 are provided to filter the plating liquid PL in the first tank 22 and supply the liquid supply pipes 21 b of the plurality of barrel plating apparatuses 21. A first liquid supply means 28, a second pump 29 and a second filter 30; a second liquid supply means 31 connected in parallel to the first means; and a second liquid supply for storing the replenishment plating liquid PL ′. Tank 32, a third pump 33 and a drain valve 34, and the first tank 22 A recovery line 35 connecting the second tank 32 and a supply line 37 having a liquid supply valve 36 and connecting the second tank 32 and the first tank 22 are provided.
[0042]
The first liquid supply means 28 and the second liquid supply means 31 are provided in parallel to the single pipe portion of the liquid supply pipe 25, and control valves 38 are provided at the inlet side and the outlet side of each liquid supply means 28, 31. Each is provided. Although not shown, the first tank 22 includes a temperature detection means for detecting the temperature of the plating solution PL in the first tank 22, a cooling means for adjusting the temperature, and a heating means. A temperature means is provided.
[0043]
During normal plating liquid circulation, one pump of the first liquid supply means 28 and the second liquid supply means 31, for example, the first pump 26 of the first liquid supply means 28 is operated, and the inlet of the first liquid supply means 28 is operated. The control valves 38 on the side and outlet side are open, and excess plating solution PL that has flowed into the drainage pipes 21a of the plurality of barrel plating apparatuses 21 flows into the first tank 22 through the drainage pipe 23, and is necessary. In response to the temperature adjustment, the liquid is filtered by the first filter 27 of the first liquid supply means 28 and then fed to the liquid supply pipes 21 b of the plurality of barrel plating apparatuses 21 through the liquid supply conduit 25.
[0044]
When it becomes necessary to clean or replace the filter medium of the first filter 27 of the first liquid supply means 28 by normal circulation, the first pump 26 of the first liquid supply means 28 is stopped, and the first The control valve 38 on the inlet side and the outlet side of the liquid supply means 28 is closed to interrupt the use of the first liquid supply means 28, the second pump 29 of the second liquid supply means 31 is operated, and the second The control valves 38 on the inlet side and the outlet side of the liquid supply means 31 are opened, and the second liquid supply means 31 is used instead. That is, if the first liquid supply means 28 and the second liquid supply means 31 are alternately used, the normal plating liquid circulation is not stopped, in other words, the filter medium is not washed and replaced without reducing the productivity. Maintenance of the pump can be performed.
[0045]
Incidentally, the timing notification for performing filtering media cleaning, replacement, etc. is provided with a hydraulic pressure detector on the upstream side and the downstream side of the first filter 27 and the second filter 30 and a means for detecting the differential pressure between the two. When the differential pressure on the use side exceeds a predetermined value, an alarm may be issued by sound or display.
[0046]
Further, when the concentration of the plating solution PL is lowered by the normal circulation, the third pump 33 is operated and the drain valve 34 is opened to collect a part of the plating solution PL in the first tank 22. Taken into the second tank 32 through the pipe 35, and added a suitable powder material or liquid material to the plating liquid PL taken into the second tank 32 to generate a replenishing plating liquid PL ' Later, the liquid supply valve 36 is opened, and the replenishment plating solution PL ′ is fed into the first tank 22 through the replenishment conduit 37 and mixed with the plating liquid PL in the tank 22. That is, if the above-described operation is performed as necessary, the plating solution can be replenished without stopping the normal circulation, in other words, without reducing the productivity. In addition, if a stirrer is permanently installed in the second tank 32, the replenishment plating solution PL 'can be easily generated, and a similar stirrer is provided in the first tank 22 to be used for liquid mixing. It doesn't matter.
[0047]
FIG. 11A to FIG. 11C show modifications in the direction in which the plating liquid PL is supplied from the liquid supply pipe 15.
[0048]
In the barrel plating apparatus shown in FIGS. 1 to 9, the direction of the plating liquid PL supplied from the liquid supply ports 15 a of the two liquid supply pipes 15 is set to be parallel to the screen 5. Since it is sufficient that the supply plating solution does not directly contact the barrel 8, the direction of the plating solution PL supplied from the supply pipe 15 is at an acute angle with the screen 5 as shown in FIG. The liquid supply port position is set, or the liquid supply port position is set so that the direction of the plating liquid PL supplied from the liquid supply pipe 15 is perpendicular to the screen 5 as shown in FIG. Alternatively, as shown in FIG. 11C, the direction of the plating liquid PL supplied from the liquid supply pipe 15 may be set in a direction opposite to the barrel 8 and at an acute angle with the screen 5.
[0049]
12A to 12F show an example in which one liquid supply pipe is provided.
[0050]
Although the two liquid supply pipes 15 are used in the barrel plating apparatus shown in FIGS. 1 to 9, even if there is only one liquid supply pipe 15, an intended plating liquid can be supplied. FIG. 12A shows one in which one of the two liquid supply pipes 15 used in the barrel plating apparatus shown in FIGS. FIG. 12B shows the liquid supply port position set so that the direction of the plating liquid PL supplied from the liquid supply pipe 15 in FIG. 12A is perpendicular to the screen 5. FIG. 12C shows the liquid supply port position set so that the direction of the plating liquid PL supplied from the liquid supply pipe 15 of FIG. 12A is perpendicular to the screen 5. FIG. 12 (D) shows that the direction of the plating liquid PL supplied from the liquid supply pipe 15 of FIG. 12 (A) is set in a direction opposite to the barrel 8 and forming an acute angle with the screen 5. In FIG. 12E, one liquid supply pipe 15 is arranged between the end face of the barrel 8 and the wall surface of the plating tank 1, and the directions of the plating liquid PL supplied from the liquid supply pipe 15 are two screens. The liquid supply port position is set so as to be in a direction perpendicular to 5. FIG. 12 (F) shows that the direction of the plating liquid PL supplied from the liquid supply pipe 15 in FIG. 12 (E) is set in a direction opposite to the barrel 8 and forming an acute angle with the two screens 5.
[0051]
FIG. 13 shows an example in which a perforated plate 41 for diffusing the supplied plating solution PL is provided between the supply pipe 15 and the barrel 8.
[0052]
In the barrel plating apparatus shown in FIGS. 1 to 9, the plating liquid PL is supplied into the plating chamber 6 from the liquid supply ports 15a of the two liquid supply pipes 15. However, as shown in FIG. If the perforated plate 41 having holes or polygonal holes is provided between the liquid supply pipe 15 and the barrel 8, the liquid flow of the plating solution PL supplied from the liquid supply port 15 a of each liquid supply pipe 15 is perforated plate 41. It is possible to more reliably suppress the supply plating solution PL from flowing directly into the barrel 8 by being dispersed and relaxed. The perforated plate 41 shown here is a modification of the supply direction shown in FIGS. 11 (A) to 11 (C) or the single liquid supply pipe shown in FIGS. 12 (A) to 12 (F). It can also be applied to each example.
[0053]
FIGS. 14 (A), 14 (B) and 15 and FIGS. 16 (A) and 16 (B) show examples of promoting the pumping action accompanying the rotation of the barrel 8, respectively.
[0054]
14 (A) and 14 (B) are provided with blade portions 51 that form acute angles with the mesh portions 8b at the rotation side edge of the mesh portions 8b of the barrel 8, and the blades from the mesh portions 8b. The height of the portion 51 is preferably 10 mm or more although it depends on the size of the barrel 8 and the rotational speed. FIG. 15 is a view in which blade portions 51 ′ perpendicular to each mesh portion 8b are provided at the rotation side edge of each mesh portion 8b of the barrel 8, and the height dimension of the blade portion 51 ′ in this case is also 10 mm or more. Preferably there is. When such blade portions 51 and 51 ′ are provided, the plating solution outflow in the barrel 8 is caused by the liquid flow generated outside the blade portions 51 and 51 ′ when the barrel 8 rotates in the direction of the arrow. It induces to promote the pumping action, and thereby it is possible to suppress the occurrence of variations in the plating state by smoothly performing liquid exchange.
[0055]
16 (A) and 16 (B) are effective for a barrel 8 having a plurality of meshed window holes 8d on the end face of the barrel. Here, the introduction case surrounds two of the six meshed window holes 8d. Three 61 are provided for each end face. Each introduction case 61 has an intake port 61a inclined on the rotation side of the barrel 8, and the inclination angle indicated by θ in the figure is in the range of 15 to 60 degrees. When such an introduction case 61 is provided, when the barrel 8 rotates in the direction of the arrow, the plating solution PL in the vicinity of the end surface is taken into the introduction case 61 through the intake port 61a, and this is passed through the meshed window hole 8d. It is possible to feed into the barrel 8 and to suppress the occurrence of variation in the plating state by smoothly performing the liquid exchange by promoting the pump action by the feeding.
[0056]
【The invention's effect】
As described above in detail, according to the present invention, the barrel plating apparatus can effectively perform the intended plating solution circulation by surely suppressing the fluidization of the muddy substance accompanying the plating solution circulation and the mixing into the plating solution. In addition, a barrel plating system configured by using a plurality of barrel plating apparatuses can be provided.
[Brief description of the drawings]
FIG. 1 is a top view of a plating tank showing an embodiment of a barrel plating apparatus to which the present invention is applied.
2 is a view taken along line a1-a1 in FIG.
3 is a cross-sectional view taken along line a2-a2 of FIG.
4 is a cross-sectional view taken along line a3-a3 in FIG.
FIG. 5 is a diagram showing a modification shown in FIG.
6 is a perspective view of the screen shown in FIG. 1 and an exploded perspective view thereof. FIG.
7 is a longitudinal sectional view of the screen shown in FIG.
8 is a perspective view of the anode case and conductive handle shown in FIG. 1, and a perspective view of an anode case mounting plate. FIG.
FIG. 9 is a longitudinal sectional view of the anode case shown in FIG. 1 and a view showing how the anode material is replenished to the anode case.
10 is a view showing an embodiment of a barrel plating system using a plurality of barrel plating apparatuses shown in FIGS. 1 to 9; FIG.
11 is a view showing a modification of the plating solution supply direction from the liquid supply pipe of the barrel plating apparatus shown in FIGS.
12 is a view showing an example in which one liquid supply pipe is used in the barrel plating apparatus shown in FIGS.
13 is a view showing an example in which a perforated plate for diffusing a supply plating solution is provided between a supply pipe and a barrel of the barrel plating apparatus shown in FIG. 1 to FIG. 9;
FIG. 14 is a diagram showing an example of promoting a pump action accompanying barrel rotation.
FIG. 15 is a view showing another example of promoting the pump action accompanying the barrel rotation.
FIG. 16 is a diagram showing still another example of promoting the pump action accompanying the barrel rotation.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Plating tank, 1a ... Drainage port, PL ... Plating liquid, 2 ... Drainage pipe, 3 ... Junction case, 4 ... Mounting frame, 5 ... Screen, 5a ... Mesh part, 5b ... Outer frame part, 6 ... Plating Chamber 7: Anode chamber 8 Barrel 8a Frame portion 8b Mesh portion 8c Cathode 8d Mesh window hole 9 Anode case 9a Case portion 9a1 Mesh portion 9a2 Falling Mouth, 9b ... hook part, 9b1 ... hook part, 9c ... guide part, AM, AM '... anode material, 10 ... conductive handle, 11 ... connection terminal, 12 ... feeding cord, 13 ... hanging bar, 14 ... metal fittings 15 ... liquid supply pipe, 15a ... liquid supply port, 21 ... barrel plating device, 21a ... drainage pipe, 21b ... liquid supply pipe, 22 ... first tank, 23 ... drainage pipe, 24 ... liquid supply valve , 25 ... Supply line, 26 ... First pump, 27 ... First DESCRIPTION OF SYMBOLS 1 filter, 28 ... 1st liquid supply means, 29 ... 2nd pump, 30 ... 2nd filter, 31 ... 2nd liquid supply means, 32 ... 2nd tank, 33 ... 3rd pump, 34 ... Drainage Valve 35, recovery line 36, liquid supply valve 37, replenishment line 38, control valve 41, perforated plate 51, 51 ′ blade section 61, introduction case 61 a, intake port

Claims (18)

A barrel plating apparatus having a plating tank in which a rotatable barrel having a cathode is taken in and out,
At least one having a mesh portion that allows the plating solution to pass therethrough and detachably arranged in the plating tank so as to partition the inside of the plating tank into a plating chamber for barrel arrangement and an anode chamber for anode arrangement With two screens,
A liquid supply pipe for supplying a plating solution into the plating chamber, and a drain port for discharging the plating solution in the anode chamber provided at the upper part of the wall surface of the plating tank constituting the anode chamber ,
One or more liquid supply pipes are prepared, the liquid supply pipes are separated from the barrel disposed in the plating chamber, and are disposed in the vicinity of the wall surface of the plating tank constituting the plating chamber.
A barrel plating apparatus characterized by that. The number of screens is two, the area sandwiched between the two screens is a plating chamber, and the area on the opposite side of the two screens is the anode chamber.
The barrel plating apparatus according to claim 1. On the outside of the wall surface of the plating tank provided with the drainage port, a merging case for sending the plating solution flowing out from the drainage port of each anode chamber to the drainage pipe is provided,
The barrel plating apparatus according to claim 2. The upper end height of the screen disposed in the plating tank is set higher than the lower end height of the drainage port and lower than the upper end height of the plating tank and the upper end height of the drainage port.
The barrel plating apparatus according to claim 1, wherein the apparatus is a barrel plating apparatus. The screen has a mesh portion and an outer frame portion that holds the mesh portion, and the plating tank is provided with an attachment frame for inserting and attaching the outer frame portion of the screen.
The barrel plating apparatus according to claim 1, wherein the apparatus is a barrel plating apparatus. The liquid supply pipe is immersed in a plating solution accommodated in a plating tank and has at least one liquid supply port in the immersion portion. The plating solution supplied from the liquid supply port does not directly contact the barrel with the plating solution. Set to orientation,
The barrel plating apparatus according to claim 1, wherein the apparatus is a barrel plating apparatus. Between the liquid supply pipe and the barrel, a perforated plate for diffusing the plating liquid supplied from the liquid supply pipe is provided,
The barrel plating apparatus according to claim 6. The drain port is provided on the same wall as the wall of the plating tank close to the liquid supply pipe.
The barrel plating apparatus according to claim 6 or 7, wherein the apparatus is a barrel plating apparatus. The barrel has a polygonal cylindrical shape with a mesh portion on the peripheral surface, and is arranged in the plating chamber so that its rotational axis is parallel to the screen.
The barrel plating apparatus according to claim 1 , wherein the apparatus is a barrel plating apparatus. At least one blade portion is provided on the peripheral surface of the barrel to promote the outflow of the plating solution from the barrel as the barrel rotates.
The barrel plating apparatus according to claim 9 . The barrel also has a mesh portion on the end surface, and the end surface is provided with at least one introduction case for promoting the inflow of the plating solution into the barrel as the barrel rotates.
The barrel plating apparatus according to claim 9 or 10, wherein: The anode is in the shape of a case having a mesh portion, and is arranged in the anode chamber so that the mesh portion is parallel to the screen.
The barrel plating apparatus according to claim 1, wherein the apparatus is a barrel plating apparatus. Two or more case-shaped anodes are prepared per one anode chamber, and the two or more anodes are coupled in series to a conductive handle, and a power supply cord is connected to the conductive handle.
The barrel plating apparatus according to claim 12 . The upper part of the case-shaped anode is provided with a guide part for guiding the introduction of the anode material.
The barrel plating apparatus according to claim 12 or 13, wherein the apparatus is a barrel plating apparatus. The bottom of the case-shaped anode is provided with a drop opening for dropping the reduced anode material.
The barrel plating apparatus according to claim 12 , wherein the apparatus is a barrel plating apparatus. A plurality of barrel plating apparatuses according to any one of claims 1 to 15,
A first tank for containing a circulating plating solution;
A drainage conduit connecting the drainage ports of the plurality of barrel plating apparatuses and the first tank;
A liquid supply line having a liquid supply valve corresponding to the liquid supply pipes of the plurality of barrel plating apparatuses and connecting each liquid supply pipe and the first tank;
A first liquid supply means having a first pump and a first filter and filtering the plating liquid in the first tank and supplying it to the liquid supply pipes of the plurality of barrel plating apparatuses;
A second liquid supply means having a second pump and a second filter and connected in parallel to the first means;
A second tank for containing a replenishing plating solution;
A recovery line having a third pump and a drain valve and connecting the first tank and the second tank;
A replenishment pipe line having a liquid supply valve and connecting the second tank and the first tank;
A barrel plating system characterized by that. The first tank is provided with temperature detection means for detecting the temperature of the plating solution, and cooling means and heating means for adjusting the temperature of the plating solution.
The barrel plating system according to claim 16 . The second tank is provided with stirring means.
The barrel plating system according to claim 16 or 17, characterized in that

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