JP3797272B2 - Optical fiber array, manufacturing method thereof, and optical fiber fixing plate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical transmission line forming technique using an optical fiber, and more particularly to an optical fiber array, a manufacturing method thereof, and an optical fiber fixing plate used for carrying out this manufacturing method.
[0002]
[Prior art]
Conventionally, as a two-dimensional optical fiber array, the one shown in FIGS. 23 and 24 has already been proposed by the same applicant as the present application (for example, see Japanese Patent Application No. 2001-241180).
[0003]
In the optical fiber array shown in FIGS. 23 and 24, the holding hole J extends from one end of the optical fiber holder 1 to the other end.₁~ J₈And the holding hole J at the end of the holder 1₁~ J₈Positioning hole H corresponding to₁~ H₈A positioning plate 2 having a mounting hole J is mounted, and the holding hole J is mounted with the positioning plate 2 mounted.₁~ J₈To positioning hole H₁~ H₈Each of the optical fibers F₁~ F₈It is configured to be inserted and fixed. According to such an optical fiber array, since the positioning plate 2 can be easily and accurately formed by a thin film process, high-accuracy positioning is possible.
[0004]
[Problems to be solved by the invention]
According to the above-described prior art, since the metal positioning plate 2 is mounted on the end surface of the holder 1, there are the following problems.
[0005]
(1) When the positioning plate 2 is mounted on the end face of the holder 1, it is necessary to precisely align the corresponding positioning holes with respect to the holding holes at the micron level, and the alignment work is not easy. If such alignment is insufficient, the optical fiber will break during insertion.
[0006]
(2) Since the thickness of the positioning plate 2 is as thin as about 100 μm, it is difficult to hold it on the side portions along the four sides. Therefore, when the positioning plate 2 is mounted on the end surface of the holder 1, the main surface on the holder 1 side of the positioning plate 2 is usually adhered and fixed to the end surface of the holder 1 with an adhesive. In this case, the operation of attaching the positioning plate 2 in parallel to the end face of the holder 1 is not easy. If the parallelism of the surfaces is insufficient, the adhesive layer becomes non-uniform, and troubles such as warping of the positioning plate 2 occur during thermal expansion.
[0007]
(3) After mounting the positioning plate 2 on the end surface of the holder 1, J₁H through each holding hole such as₁An optical fiber is inserted into each positioning hole such as, and a metal is filled between each positioning hole and the optical fiber by plating to fix the optical fiber. And after cutting the optical fiber which protruded from the front surface of the positioning plate 2, the front surface of the positioning plate 2 is grind | polished and planarized. Since the mechanical strength of the positioning plate 2 is reduced at the fiber penetration portion in which a large number of positioning holes are arranged, the positioning plate 2 is swelled forward or swelled forward during the polishing process, resulting in sufficient flatness. It may not be obtained.
[0008]
An object of the present invention is to provide a novel optical fiber array, a manufacturing method thereof, and an optical fiber fixing plate capable of easily and accurately determining the position of an optical fiber at one end of an optical fiber holder.
[0009]
[Means for Solving the Problems]
  An optical fiber array according to the present invention includes:
  One or more optical fibers;
  An optical fiber holder provided so that an optical fiber holding hole corresponding to each of the one or more optical fibers penetrates from one end to the other end;
  A positioning pin provided on the optical fiber holder so as to protrude from one end of the optical fiber holder;
  An optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder and a pin insertion hole corresponding to the positioning pin are provided so as to penetrate from one main surface to the other main surface and each light. It is formed to increase in size as the fiber fixing hole approaches the other main surface.The aboveThe other main surface is provided with a reinforcing layer having an optical fiber insertion hole corresponding to each optical fiber fixing hole and a pin insertion hole corresponding to the pin insertion hole.And an optical fiber fixing plate formed by a thin film process,
  The optical fiber fixing plate is reinforced with the positioning pin inserted into the pin insertion hole of the reinforcing layer and the pin insertion hole of the optical fiber fixing plate, and the optical fiber holder and the optical fiber fixing plate are aligned. At one end of the optical fiber holder on the layer sideAttach each optical fiberIs inserted into the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding optical fiber fixing hole of the optical fiber fixing plate. InFixedIs. Here, the hole size refers to the diameter of the hole, the dimension of one side of the hole, and the like. The positioning pin may be held by the optical fiber holder, or may be formed integrally with the optical fiber holder.
[0010]
According to the optical fiber array of the present invention, the positioning pin provided on the optical fiber holder is inserted into the pin insertion hole of the reinforcing layer and the pin insertion hole of the optical fiber fixing plate to align the optical fiber holder and the optical fiber fixing plate. Thus, the corresponding optical fiber fixing hole of the optical fiber fixing plate can be easily and accurately positioned with respect to each optical fiber holding hole of the optical fiber holder. In addition, since the optical fiber fixing plate is provided with a reinforcing layer on the mounting surface to improve the mechanical strength, the parallelism of the surface can be easily obtained when the optical fiber fixing plate is mounted on the end surface of the optical fiber holder by bonding or the like. , Warpage and the like hardly occur.
[0011]
In addition, since the optical fiber fixing plate can be made with submicron accuracy by a thin film process, the optical fiber can be positioned with high accuracy at one end of the optical fiber holder. The optical fiber fixing plate is attached to one end of the optical fiber holder so that the large size end of each optical fiber fixing hole faces the other end of the optical fiber holder. An optical fiber can be easily inserted.
[0012]
  The manufacturing method of the first optical fiber array according to the present invention is as follows:
  One or more optical fibers and an optical fiber holding hole corresponding to each of the one or more optical fibers are provided so as to penetrate from one end to the other end, and from the one end toward the other end To extendFirstAn optical fiber holder provided with a pin insertion hole (or groove);FirstCorresponding to positioning pins to be inserted into pin insertion holes (or grooves), optical fiber fixing holes corresponding to the respective optical fiber holding holes of the optical fiber holder, and the positioning pinsSecondEach of the pin insertion holes is provided so as to penetrate from one main surface to the other main surface, and each optical fiber fixing hole is formed to increase in size as it approaches the other main surface.The aboveOn the other main surface, an optical fiber insertion hole corresponding to each optical fiber fixing hole and the above-mentionedSecondA reinforcing layer having a pin insertion hole corresponding to the pin insertion hole is provided.Optical fiber fixing plate formed by thin film processAnd a step of preparing
  Of the optical fiber holderFirstPin insertion holes (or grooves), pin insertion holes of the reinforcing layer, and the optical fiber fixing plateSecondInserting the positioning pin into a pin insertion hole and aligning the optical fiber holder and the optical fiber fixing plate; and
  Attaching the optical fiber fixing plate to one end of the optical fiber holder on the reinforcing layer side in a state where the optical fiber holder and the optical fiber fixing plate are aligned; and
  With the optical fiber fixing plate attached to one end of the optical fiber holder on the reinforcing layer side, each optical fiber is connected to the corresponding optical fiber holding hole of the optical fiber holder from the other end of the optical fiber holder, Inserting into a corresponding optical fiber insertion hole and a corresponding optical fiber fixing hole of the optical fiber fixing plate;
  Each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding optical fiber fixing hole of the optical fiber fixing plate. Fixing to the fiber fixing plate;
Is included.
[0013]
  In addition, the method for producing the second optical fiber array according to the present invention is as follows:
  One or a plurality of optical fibers and an optical fiber holding hole corresponding to each of the one or a plurality of optical fibers are provided so as to penetrate from one end to the other end and are positioned so as to protrude from the one end Are formed from one main surface to the other main surface, the optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder, and the pin insertion hole corresponding to the positioning pin. The optical fiber fixing hole is formed so as to increase in size as it approaches the other main surface.The aboveThe other main surface is provided with a reinforcing layer having an optical fiber insertion hole corresponding to each optical fiber fixing hole and a pin insertion hole corresponding to the pin insertion hole.Optical fiber fixing plate formed by thin film processAnd a step of preparing
  Inserting the positioning pin into the pin insertion hole of the reinforcing layer and the pin insertion hole of the optical fiber fixing plate to align the optical fiber holder and the optical fiber fixing plate;
  Attaching the optical fiber fixing plate to one end of the optical fiber holder on the reinforcing layer side in a state where the optical fiber holder and the optical fiber fixing plate are aligned; and
  With the optical fiber fixing plate attached to one end of the optical fiber holder on the reinforcing layer side, each optical fiber is connected to the corresponding optical fiber holding hole of the optical fiber holder from the other end of the optical fiber holder, Inserting into a corresponding optical fiber insertion hole and a corresponding optical fiber fixing hole of the optical fiber fixing plate;
  Each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding optical fiber fixing hole of the optical fiber fixing plate. Fixing to the fiber fixing plate;
Is included.
[0014]
According to the first or second optical fiber array manufacturing method, the above-described optical fiber array of the present invention can be manufactured easily and accurately. According to the second method for manufacturing an optical fiber array, since the positioning pin is formed at one end of the optical fiber holder, the operation of inserting the positioning pin into the pin insertion hole or the like of the optical fiber holder is unnecessary.
[0015]
In the manufacturing method of the first or second optical fiber array, a step of polishing and flattening one main surface (front surface) of the optical fiber fixing plate in a state where each optical fiber is fixed to the optical fiber holder is performed. It may be. In this case, since the reinforcing layer is provided on the mounting surface of the optical fiber fixing plate, it is possible to prevent waviness from occurring in the optical fiber fixing plate during polishing. When the optical fiber fixing plate is polished, the end of the optical fiber holder can be made flat and clean, and the coupling loss can be reduced when coupling with other optical devices.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a two-dimensional optical fiber array according to an embodiment of the present invention. A cross section taken along line XX ′ in FIG. 1 is shown in FIG. 2, and a cross section taken along line YY ′ in FIG. Is shown in FIG.
[0017]
The optical fiber holder 10 has a quadrangular prism shape as an example, and is made of ceramic (for example, zirconia), metal (for example, Ni—Fe alloy), plastic, or the like. The holder 10 has an optical fiber holding hole H as shown in FIG.₁₁, H₂₁, H₃₁, H₄₁Are provided so as to penetrate from one end of the holder 10 to the other end in a substantially parallel state, and the holding hole H₁₁~ H₄₁Each holding hole H arranged in a row of holding holes₁₁~ H₄₁Seven rows of holding holes including optical fiber holding holes similar to the above are provided. That is, the holder 10 is provided with 32 optical fiber holding holes in a matrix. The shape of each optical fiber holding hole is circular as an example.
[0018]
As shown in FIG. 3, the holder 10 is provided with pin insertion holes 10 a and 10 b so as to penetrate from one end of the holder 10 to the other end in a substantially parallel state. The pin insertion holes 10a and 10b are H₁₁Etc., and are substantially parallel to each holding hole. H₁₁Each of the holding holes and the pin insertion holes 10a and 10b are increased in size as they approach the other end of the holder 10 as shown in FIGS. This is to facilitate insertion of the optical fiber and the positioning pin.
[0019]
The optical fiber fixing plate 14 has a thickness t of 50 μm, for example.₁An optical fiber fixing hole S corresponding to each of the 32 holding holes of the holder 10 so as to penetrate from one main surface to the other main surface.₁₁~ S₄₈Are provided in a matrix. 2 and 4 show the fixing hole S.₁₁~ S₄₈S₂₂, S₃₂, S₃₃, S₁₁, S₂₁, S₃₁, S₄₁Is illustrated. Each fixing hole is formed to increase in size as it approaches the other main surface of the fixing plate 14 in order to facilitate insertion of the optical fiber. The shape of each fixing hole is circular as an example, and the diameter D of the large size end and the diameter d (see FIG. 4) of the small size end can be 220 μm and 126 μm, respectively, as an example.
[0020]
As shown in FIGS. 1 and 3, the fixing plate 14 is provided with pin insertion holes Sa and Sb corresponding to the pin insertion holes 10 a and 10 b of the holder 10 so as to penetrate from one main surface to the other main surface. ing. Each of the pin insertion holes Sa and Sb is formed to increase in size as it approaches the other main surface of the fixing plate 14 in order to facilitate the insertion of the positioning pin. The shape of each pin insertion hole is circular as an example.
[0021]
As shown in FIGS. 2 and 4, a fixing hole S is formed on one main surface of the fixing plate 14.₂₂, S₃₂, S₃₃, S₁₁, S₂₁, S₃₁, S₄₁Bonding holes M each having a size larger than that of each of the small size ends.₂₂, M₃₂, M₃₃, M₁₁, M₂₁, M₃₁, M₄₁A similar adhesive hole is formed for the other fixing holes. M₁₁Each of the bonding holes is used for bonding and fixing the optical fiber to the fixing plate 14. Further, as shown in FIG. 3, adhesive holes Ma and Mb larger in size than the small size ends are formed on one main surface of the fixing plate 14 in succession to the small size ends of the pin insertion holes Sa and Sb, respectively. ing. Each bonding hole such as Ma is used for bonding and fixing the positioning pin to the fixing plate 14. In FIG. 1, for simplicity, M₁₁, Ma and the like are not shown.
[0022]
The other main surface of the fixing plate 14 has a thickness t of, for example, 50 μm.₂A reinforcing layer 16 made of a metal such as a Ni—Fe alloy having (see FIG. 2) is provided. The reinforcing layer 16 is provided in order to enhance the mechanical strength of the thin fixing plate 14 having a thickness of about 50 to 100 μm. As shown in FIGS.₂₂, S₃₂, S₃₃, S₁₁, S₂₁, S₃₁, S₄₁An optical fiber insertion hole U having a larger size than each of the large size ends.₂₂, U₃₂, U₃₃, U₁₁, U₂₁, U₃₁, U₄₁The same optical fiber insertion hole is formed for the other fixing holes. The arrangement of the optical fiber insertion holes in the reinforcing layer 16 is, for example, a honeycomb arrangement, and the distance L between two sides facing each other in the hexagonal holes constituting each optical fiber insertion hole can be 230 μm. The shape of each optical fiber insertion hole may be a circle or an ellipse, or may be a polygon other than a hexagon (triangle, quadrilateral, parallelogram, etc.).
[0023]
As shown in FIG. 3, the reinforcing layer 16 is formed with pin insertion holes Ua and Ub each having a size larger than that of the large-sized end in succession to the large-sized ends of the pin insertion holes Sa and Sb. The pin insertion holes Ua and Ub have a circular shape as an example, but may have a polygonal shape or the like. The optical fiber fixing plate 14 having the reinforcing layer 16 can be easily and accurately produced using a thin film process as will be described later.
[0024]
When the optical fiber array shown in FIG. 1 is manufactured, the pin insertion holes 10a and 10b, the pin insertion holes Ua and Ub, and the fixing plate 14 are arranged so that the reinforcing layer 16 faces one end of the holder 10. The positioning pins 12a and 12b are inserted into the pin insertion holes Sa and Sb and the bonding holes Ma and Mb as shown in FIGS. Each of the positioning pins 12a and 12b is made of a metal such as stainless steel having a diameter of about 1 mm or a ceramic such as alumina. Since the positioning pins are inserted into the pin insertion holes 10a, 10b, Sa, and Sb from the large size ends, the insertion operation is facilitated. When the positioning pins 12a and 12b are inserted as described above, the fixing plate 14 and the holder 10 are aligned, and in this alignment state, the fixing plate 14 is bonded to the holder 10 on the reinforcing layer 16 side. Attach (fix) by etc. Further, the positioning pins 12a and 12b are fixed to the fixing plate 14 by bonding with adhesives in the bonding holes Ma and Mb, respectively, in the same manner as the optical fiber bonding described later with reference to FIG. As a result, each fixing hole of the fixing plate 14 is precisely aligned with the holder 10 so as to communicate with the corresponding holding hole of the holder 10.
[0025]
In the state where the positioning pins 12a and 12b are fixed to the fixing plate 14 and the fixing plate is fixed to the holder 10 as described above, as shown in FIG.₁₁And insertion hole U₁₁And fixing hole S₁₁And bonding hole M₁₁Communication hole, holding hole H₂₁And insertion hole U₂₁And fixing hole S₂₁And bonding hole M₂₁Communication hole, holding hole H₃₁And insertion hole U₃₁And fixing hole S₃₁And bonding hole M₃₁Communication hole and holding hole H₄₁And insertion hole U₄₁And fixing hole S₄₁And bonding hole M₄₁In the communication hole with the optical fiber F from the other end of the holder 10₁₁, F₂₁, F₃₁And F₄₁Are inserted through each. The same applies to the communication holes of the other holding holes, the insertion holes, the fixing holes, and the bonding holes. Since the optical fiber is inserted into each holding hole and each fixing hole from the large size end, the insertion work becomes easy. Each optical fiber is bonded and fixed to the fixing plate 14 with an adhesive at a corresponding bonding hole.
[0026]
FIG. 5 shows the bonding / fixing structure at this time as a bonding hole M.₁₁, M₂₁It illustrates about. Holding hole H₁₁, Insertion hole U₁₁, Fixing hole S₁₁And adhesive hole M₁₁Has optical fiber F₁₁Holding hole H₂₁, Insertion hole U₂₁, Fixing hole S₂₁And adhesive hole M₂₁Has optical fiber F₂₁After inserting each through the adhesive hole M₁₁, M₂₁Adhesive layer is filled with adhesive layer A₁₁, A₂₁To form an adhesive layer A₁₁, A₂₁Optical fiber F by curing₁₁, F₂₁Is fixed to the fixing plate 14.
[0027]
Thereafter, the optical fiber protruding from the front surface of the fixing plate 14 is cut. Then, the front surface of the fixing plate 14 is subjected to a polishing process so that F₁₁Remaining part after cutting of optical fiber such as₁₁The bulging portion of the adhesive layer such as is removed, and the front surface of the fixing plate 14 is flattened. In this way, coupling loss can be reduced when coupling with other optical devices.
[0028]
In addition, as a grinding | polishing process, you may perform a diagonal grinding | polishing process as needed. As the optical fiber fixing means, as described above with respect to the prior art, F is used by plating metal.₁₁For example, a method of fixing each optical fiber to the fixing plate 14 may be used.
[0029]
FIG. 6 shows a modification of the method for aligning the holder and the fixing plate. The same parts as those in FIGS.
[0030]
In the example of FIG. 6, positioning pin insertion grooves 10 p, 10 q, and 10 r are provided on the upper and both sides of the holder 10 so as to extend from one end of the holder 10 toward the other end (or to reach the other end). Each of the pin insertion grooves 10p to 10r extends from the front surface of the fixed plate 14 to the other end side of the holder 10 through each edge portion of the fixed plate 14 and the reinforcing layer 16.
[0031]
In the alignment, as shown in FIG. 6, the plate-like positioning pins 12p, 12q are respectively inserted into the pin insertion grooves 10p, 10q, 10r in a state where the fixing plate 14 is arranged so that the reinforcing layer 16 contacts one end of the holder 10. , 12r are inserted as shown by arrows in FIG. 6, and fixed to the holder 10 and the fixing plate 14 by adhesion or the like. In this case, the fixing plate 14 is fixed to the holder 10 by bonding each positioning pin. In such a fixed state, the optical fiber insertion operation is performed in the same manner as described above. The portions of the positioning pins 12p to 12r that protrude from the holder 10, the fixing plate 14, and the reinforcing layer 16 can be removed by a polishing process or the like.
[0032]
As another positioning method, positioning pins 12x and 12y are formed integrally with the holder 10 in advance so as to protrude from one end of the holder 10 as indicated by a broken line in FIG. 16, the positioning pins 12x and 12y may be inserted into the pin insertion holes Ua and Ub, the fixing holes Sa and Sb, and the bonding holes Ma and Mb provided as shown in FIG. In such an insertion state, the fixing plate 14 is bonded and fixed to the positioning pins 12x and 12y (that is, the holder 10) with an adhesive in the bonding holes Ma and Mb. According to such a method, the labor for passing the positioning pin through the holder 10 can be saved, so that the working efficiency is improved. In addition, you may perform the grinding | polishing process as mentioned above to the front surface of the fixing plate 14 as needed.
[0033]
According to the above-described embodiment, the fixing plate 14 can be precisely positioned with respect to the holder 10 using the positioning pins 12a, 12b, 12p to 12r or 12x, 12y. In addition, since the reinforcing plate 16 is provided on the mounting surface of the fixing plate 14, it is possible to prevent warpage and peeling, and to prevent undulation such as dents and bulges during the polishing process. Furthermore, since the accuracy of the diameter of each fixing hole of the fixing plate 14 can be 1 μm or less with respect to the outer diameter of the optical fiber, high-precision positioning is possible at one end of the optical fiber.
[0034]
7-13 shows an example of the manufacturing method of an optical fiber fixing plate.
[0035]
In the process of FIG. 7, for example, a Cu / Cr laminate (a laminate in which a Cu layer is laminated on a Cr layer) 22 is formed as a plating underlayer on one main surface of a substrate 20 made of glass or quartz by a sputtering method. The Cr layer is for improving the adhesion of the Cu layer to the substrate 20, and the thicknesses of the Cr layer and the Cu layer can be about 20 nm and 200 nm, respectively. After forming the Cu / Cr laminate 22, a resist (negative resist) layer R corresponding to each desired adhesive hole pattern by photolithography processing.₁₁~ R₁₆Is formed on the Cu / Cr laminate 22.
[0036]
Next, in the step of FIG. 8, resist (negative resist) layers R corresponding respectively to desired fixed hole patterns by photolithography processing.₂₁~ R₂₆Resist layer R₁₁~ R₁₆Form on each.
[0037]
In the process of FIG. 9, the resist layer R₁₁~ R₁₆, R₂₁~ R₂₆An optical fiber fixing plate 14 made of a Ni—Fe alloy layer is formed by selective plating treatment of a Ni—Fe alloy using as a mask. At this time, the fixing plate 14 is R₂₁Each of the resist layers is formed so as to move away from each resist layer as it goes upward (having a fixing hole whose size increases as it goes upward).
[0038]
FIG. 14 shows the growth state of the plating layer 14 at this time as a resist layer R.₁₁, R₂₁Is illustrated. Resist layer R on the Cu / Cr laminate 22₁₁When viewed from a point P in the vicinity of, the illustrated points Q and R on the surface of the plating layer 14 are equidistant. Since the plating layer 14 isotropically grows, the resist layer R is directly below.₁₁At the point R where the plating base is not exposed, the plating layer 14 extends from the point P to the resist layer R.₁₁Overcoming the growth. For this reason, the plating layer (fixing plate) 14 is formed so as to move away from each resist layer as it progresses upward around each resist layer.
[0039]
In the process of FIG. 10, resist layers R respectively corresponding to desired optical fiber insertion hole patterns are formed on the fixing plate 14 by photolithography.₃₁~ R₃₆Form. At this time, the resist layer R₃₁~ R₃₆Resist layer R₂₁~ R₂₆Are formed so as to cover each.
[0040]
In the process of FIG. 11, the resist layer R₃₁~ R₃₆A reinforcing layer 16 made of a Ni—Fe alloy layer is formed by selective plating of a Ni—Fe alloy using as a mask.
[0041]
In the process shown in FIG.₁₁~ R₁₆, R₂₁~ R₂₆And the fixing hole 14 is fixed to the fixing plate 14.₁₁~ S₁₆And adhesive hole M₁₁~ M₁₆And an optical fiber insertion hole U in the reinforcing layer 16₁₁~ U₁₆Is granted. As a result, in the fixing plate 14, the fixing hole S is so penetrated from one main surface to the other main surface and increases in size as it approaches the other main surface.₁₁~ S₁₆And the fixing hole S₁₁~ S₁₆Bonding holes M each having a size larger than the small size end in succession to the small size end₁₁~ M₁₆Is formed. Further, in the reinforcing layer 16, the fixing hole S₁₁~ S₁₆An optical fiber insertion hole U having a size larger than each of the large size ends so as to be continuous with each of the large size ends.₁₁~ U₁₆Is formed.
[0042]
In the process of FIG. 13, the Cu layer in the Cu / Cr laminate 22 is removed by etching, and the fixing plate 14 having the reinforcing layer 16 is separated from the substrate 20. On the substrate 20, the Cr layer 22a remains.
[0043]
As the reinforcing layer 16 for reinforcing the fixing plate 14, an insulating material layer such as silicon oxide or aluminum oxide (alumina) may be formed by using a lift-off method instead of the selective plating method. As an example, the reinforcing layer 16 made of an insulating material can be manufactured as shown in FIGS. 15-17, the same code | symbol is attached | subjected to the part similar to FIGS. 7-13, and detailed description is abbreviate | omitted.
[0044]
In the process of FIG. 15, the fixing plate 14 and the resist layer R are followed by the selective plating process shown in FIG.₂₁~₂₆On top of the silicon oxide (SiO2) by sputtering₂) To form a reinforcing layer 16 made of a deposition layer (silicon oxide layer). At this time, the thickness of the silicon oxide layer can be 200 nm.
[0045]
In the process of FIG. 16, the resist layer R is obtained by chemical treatment or the like.₁₁~ R₁₆, R₂₁~ R₂₆Resist layer R₂₁~ R₂₆By removing the silicon oxide together with the upper silicon oxide, a fixing hole S is formed in the fixing plate 14.₁₁~ S₁₆And adhesive hole M₁₁~ M₁₆And an optical fiber insertion hole U in the reinforcing layer 16₁₁~ U₁₆Is granted. As a result, in the fixing plate 14, the fixing hole S is penetrated from one main surface to the other main surface.₁₁~ S₁₆And the fixing hole S₁₁~ S₁₆Bonding holes M each having a size larger than the small size end in succession to the small size end₁₁~ M₁₆Is formed. Further, in the reinforcing layer 16, the fixing hole S₁₁~ S₁₆The optical fiber insertion holes U are continuous with the large size ends of the optical fiber and increase in size toward the outside.₁₁~ U₁₆Is formed.
[0046]
In the process of FIG. 17, the Cu layer in the Cu / Cr laminate 22 is removed by etching, and the fixing plate 14 having the reinforcing layer 16 is separated from the substrate 20. On the substrate 20, the Cr layer 22a remains.
[0047]
The reinforcing layer 16 made of a silicon oxide layer has an effect of reinforcing the fixing plate 14 made of metal. In addition, since the silicon oxide layer has a smaller linear expansion coefficient (0.5 ppm) than that of metal, there is also an effect that it is possible to prevent the optical fiber pitch from being shifted due to temperature changes during and after the assembly of the optical fiber array. Note that the manufacturing method, material, thickness, and the like of the reinforcing layer 16 can be arbitrarily selected, and a laminated layer may be used as the reinforcing layer 16.
[0048]
As the optical fiber fixing plate 14 shown in FIGS.₂₂, M₃₂, M₃₃, M₁₁~ M₄₁, Ma, Mb, etc. may be used without the bonding holes. In this case, the fixing plate 14 can be manufactured as shown in FIGS.
[0049]
In the step of FIG. 18, after the Cu / Cr layer 22 is formed on the surface of the substrate 20 in the same manner as described above with reference to FIG. 7, the resist layer 24, R is formed on the Cu / Cr layer 22 by photolithography.₁~ R₆Form. The resist layer 24 is formed so as to have a quadrangular hole corresponding to the plane pattern of the desired fixing plate, and the resist layer R₁~ R₆Each has a pattern corresponding to a desired fixing hole in the quadrangular hole, and is formed so that its size increases as it goes from the upper part to the lower part. Where layer R₁~ R₆When using a stepper (reduced projection exposure apparatus) to obtain a forward tapered resist shape like
(1) A method of setting the focus position in the resist,
(2) A method of setting a small exposure amount at the bottom of the resist (a method for positive resist),
(3) Method of gradually changing the transmittance of the mask portion in the exposure mask (increasing the transmittance as it goes to the bottom of the resist)
Any one of the methods can be used.
[0050]
Resist layer R₁~ R₆After forming the resist layer 24, R₁~ R₆A fixing plate 14 made of a Ni—Fe alloy layer is formed by selective plating of a Ni—Fe alloy using as a mask.
[0051]
In the process of FIG. 19, the fixing plate 14 and the resist layer R₁~ R₆24, a substrate 30 such as glass or quartz is attached to the surface opposite to the substrate 20 side through an adhesive layer 32. Then, by removing the Cu layer of the Cu / Cr layer 22 by etching, the fixing plate 14 and the resist layer R held by the substrate 30 are removed.₁~ R₆, 24, the substrate 20 is separated. FIG. 19 shows the fixing plate 14 and the resist layer R.₁~ R₆24 with the substrate up. As the substrate 30, a peelable resin substrate may be used.
[0052]
In the process of FIG. 20, the fixing plate 14 and the resist layer R are processed by photolithography.₁~ R₆, 24 on resist layer K₁~ K₆, 34 are formed. At this time, the resist layer 34 is formed to have the same quadrangular holes as the resist layer 24, and the resist layer K₁~ K₆Each have a pattern corresponding to a desired optical fiber insertion hole in the quadrilateral hole and each of the resist layers R.₁~ R₆To cover. After this, resist layer K₁~ K₆, 34 as a mask, the reinforcing layer 16 made of a Ni—Fe alloy layer is formed by selective plating of a Ni—Fe alloy.
[0053]
In the process of FIG. 21, the resist layer K is obtained by chemical treatment or the like.₁~ K₆, 34, R₁~ R₆, 24 are removed. Resist layer R₁~ R₆Is removed, the fixing plate 14 has a fixing hole S.₁~ S₆Is granted. Each fixing hole is formed to increase in size as the corresponding resist layer progresses from the top to the bottom in the process of FIG. 18 and upside down in the process of FIG. As the size increases, it is formed. Further, in the reinforcing layer 16, the fixing hole S₁~ S₆An optical fiber insertion hole U having a size larger than each of the large size ends so as to be continuous with each of the large size ends.₁~ U₆Is formed. Thereafter, the adhesive layer 32 is removed by chemical treatment or the like, and the fixing plate 14 having the reinforcing layer 16 is separated from the substrate 30.
[0054]
According to the manufacturing method of the optical fiber fixing plate described above, the hole S₁₁~ S₁₆, M₁₁~ M₁₆, S₁~ S₆Can be set with submicron accuracy such as 0.5 μm. Further, as the fixing plate 14, the hole S₁₁~ S₁₆, M₁₁~ M₁₆, S₁~ S₆However, the fixing holes and the bonding holes can be formed in the same manner as described above. Further, the pin insertion holes Sa and Sb and the bonding holes Ma and Mb shown in FIG.₁₁~ S₁₆And bonding hole M₁₁~ M₁₆The pin insertion holes Sa and Sb can be formed without bonding holes as required.₁~ S₆You may make it like.
[0055]
The present invention is not limited to the above-described embodiment, and can be implemented in various modifications. For example, the following changes are possible.
[0056]
(1) The shape of the optical fiber holder 10 is not limited to a quadrangular prism shape, but may be a cylindrical shape, a polygonal column (for example, a triangular prism, a hexagonal column), or the like.
[0057]
(2) The shape of the holding hole or pin insertion hole of the optical fiber holder 10 and the fixing hole or pin insertion hole of the fixing plate 14 is not limited to a circular shape, but is a polygon (for example, a triangle, a square, a parallelogram, a hexagon). Or the like. When the pin insertion hole of the holder 10 and the pin insertion hole of the fixing plate 14 are polygonal, the sectional shape of the positioning pin is also a polygonal shape corresponding to the polygonal shape of the pin insertion hole. In this case, since the positioning pin does not rotate, one positioning pin can be used.
[0058]
(3) This invention is applicable not only to a two-dimensional optical fiber array but also to a one-dimensional optical fiber array or a single-core optical fiber holder (positioning of one optical fiber).
[0059]
【The invention's effect】
As described above, according to the present invention, the positioning pins provided on the optical fiber holder are inserted into the pin insertion holes of the reinforcing layer and the pin insertion holes of the optical fiber fixing plate to align the optical fiber holder and the optical fiber fixing plate. With this configuration, the corresponding optical fiber fixing hole of the optical fiber fixing plate can be easily and accurately positioned with respect to each optical fiber holding hole of the optical fiber holder. The optical fiber fixing plate with the reinforcing layer can be easily and accurately manufactured using a thin film process. Therefore, it is possible to easily and accurately position each optical fiber at one end of the optical fiber holder.
[0060]
In addition, since a reinforcing layer is provided on the mounting surface of the optical fiber fixing plate, the mechanical strength of the optical fiber fixing plate is improved, and it is possible to prevent the optical fiber fixing plate from being warped or peeled, and to fix the optical fiber. When polishing the front surface of the plate, an effect of preventing the occurrence of undulation such as dents and bulges can also be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a two-dimensional optical fiber array according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line X-X ′ of FIG.
FIG. 3 is a cross-sectional view taken along line Y-Y ′ of FIG.
FIG. 4 is an enlarged perspective view showing a part of the mounting surface of the optical fiber fixing plate.
FIG. 5 is an enlarged sectional view showing an optical fiber bonding portion.
FIG. 6 is a perspective view showing a modification of the method for aligning the holder and the fixing plate.
FIG. 7 is a cross-sectional view showing a resist layer forming step in an example of a method for producing an optical fiber fixing plate according to the present invention.
8 is a cross-sectional view showing a resist layer forming step that follows the step of FIG. 7. FIG.
FIG. 9 is a cross-sectional view showing a selective plating step subsequent to the step of FIG.
10 is a cross-sectional view showing a resist layer forming step that follows the step of FIG. 9. FIG.
11 is a cross-sectional view showing a selective plating step following the step of FIG.
12 is a cross-sectional view showing a resist removal step subsequent to the step of FIG.
13 is a cross-sectional view showing a separation step that follows the step of FIG. 12. FIG.
FIG. 14 is a cross-sectional view showing a growth state of a plating layer in the selective plating process.
FIG. 15 is a cross-sectional view showing a sputtering step in another example of a method for producing an optical fiber fixing plate according to the present invention.
16 is a cross-sectional view showing a resist removal step that follows the step of FIG. 15. FIG.
FIG. 17 is a cross-sectional view showing a separation step that follows the step of FIG. 16;
FIG. 18 is a cross-sectional view showing a selective plating step in still another example of the method for producing an optical fiber fixing plate according to the present invention.
FIG. 19 is a cross-sectional view showing a substrate replacement step that follows the step of FIG. 18;
20 is a cross-sectional view showing a selective plating step following the step of FIG.
FIG. 21 is a cross-sectional view showing a resist removing step that follows the step of FIG. 20;
22 is a cross-sectional view showing a separation step that follows the step of FIG. 21. FIG.
FIG. 23 is a perspective view showing a conventional two-dimensional optical fiber array.
24 is a cross-sectional view taken along line A-A ′ of FIG. 23. FIG.
[Explanation of symbols]
10: optical fiber holder, 10a, 10b, Sa, Sb: pin insertion hole, 10p-10r: pin insertion groove, 12a, 12b, 12p-12r, 12x, 12y: positioning pin, 14: optical fiber fixing plate, 16: Reinforcing layer, 20, 30: substrate, 22: Cu / Cr laminate, 32, A₁₁, A₂₁: Adhesive layer, M₁₁~ M₄₁, Ma, Mb, M₁₁~ M₁₆: Adhesive hole, S₁₁~ S₄₈, S₂₂, S₃₂, S₁₁~ S₁₆, S₁~ S₆: Optical fiber fixing hole, U₂₂, U₃₂, U₃₃, U₁₁~ U₄₁, U₁₁~ U₁₆, U₁~ U₆: Optical fiber insertion hole, Ua, Ub: Pin insertion hole, H₁₁~ H₄₁: Optical fiber holding hole, F₁₁~ F₄₈: Optical fiber, R₁₁~ R₁₆, R₂₁~ R₂₆, R₃₁~ R₃₆, R₁~ R₆, K₁~ K₆, 24, 34: resist layers.

Claims (5)

One or more optical fibers;
An optical fiber holder provided so that an optical fiber holding hole corresponding to each of the one or more optical fibers penetrates from one end to the other end;
A positioning pin provided on the optical fiber holder so as to protrude from one end of the optical fiber holder;
An optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder and a pin insertion hole corresponding to the positioning pin are provided so as to penetrate from one main surface to the other main surface and each light. An optical fiber insertion hole corresponding to each optical fiber fixing hole and a pin corresponding to the pin insertion hole are formed on the other main surface so as to increase in size as the fiber fixing hole approaches the other main surface. reinforcing layer provided we are having a through hole, and an optical fiber fixing plate formed by a thin film process,
The optical fiber fixing plate is reinforced with the positioning pin inserted into the pin insertion hole of the reinforcing layer and the pin insertion hole of the optical fiber fixing plate, and the optical fiber holder and the optical fiber fixing plate are aligned. The optical fiber holder is attached to one end of the optical fiber holder on the layer side, and each optical fiber is associated with the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding light of the optical fiber fixing plate. An optical fiber array in which each optical fiber is fixed to the optical fiber fixing plate while being inserted into a fiber fixing hole. One or more optical fibers and an optical fiber holding hole corresponding to each of the one or more optical fibers are provided so as to penetrate from one end to the other end, and from the one end toward the other end An optical fiber holder provided with a first pin insertion hole (or groove) so as to extend, a positioning pin to be inserted into the first pin insertion hole (or groove), and each optical fiber of the optical fiber holder An optical fiber fixing hole corresponding to the holding hole and a second pin insertion hole corresponding to the positioning pin are provided so as to penetrate from one main surface to the other main surface, and each optical fiber fixing hole is is formed so as to increase the size approaches the other main surface, the pin insertion holes wherein the other main surface corresponding to the second pin insertion hole and an optical fiber insertion holes corresponding to the respective optical fiber fixing hole When Reinforcing layer provided we are having the steps of providing an optical fiber fixing plate formed by a thin film process,
The positioning pin is inserted into the first pin insertion hole (or groove) of the optical fiber holder, the pin insertion hole of the reinforcing layer, and the second pin insertion hole of the optical fiber fixing plate, and the optical fiber holder Aligning the optical fiber securing plate;
Attaching the optical fiber fixing plate to one end of the optical fiber holder on the reinforcing layer side in a state where the optical fiber holder and the optical fiber fixing plate are aligned; and
With the optical fiber fixing plate attached to one end of the optical fiber holder on the reinforcing layer side, each optical fiber is connected to the corresponding optical fiber holding hole of the optical fiber holder from the other end of the optical fiber holder, Inserting into a corresponding optical fiber insertion hole and a corresponding optical fiber fixing hole of the optical fiber fixing plate;
Each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding optical fiber fixing hole of the optical fiber fixing plate. And a step of fixing to a fiber fixing plate. One or a plurality of optical fibers and an optical fiber holding hole corresponding to each of the one or a plurality of optical fibers are provided so as to penetrate from one end to the other end and are positioned so as to protrude from the one end Are formed from one main surface to the other main surface, the optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder, and the pin insertion hole corresponding to the positioning pin. An optical fiber insertion hole corresponding to each optical fiber fixing hole is formed on the other main surface so as to increase in size as each optical fiber fixing hole approaches the other main surface. a step wherein the reinforcing layer having a pin insertion hole corresponding to the pin insertion hole is provided, et al is, to provide an optical fiber fixing plate formed by a thin film process and,
Inserting the positioning pin into the pin insertion hole of the reinforcing layer and the pin insertion hole of the optical fiber fixing plate to align the optical fiber holder and the optical fiber fixing plate;
Attaching the optical fiber fixing plate to one end of the optical fiber holder on the reinforcing layer side in a state where the optical fiber holder and the optical fiber fixing plate are aligned; and
With the optical fiber fixing plate attached to one end of the optical fiber holder on the reinforcing layer side, each optical fiber is connected to the corresponding optical fiber holding hole of the optical fiber holder from the other end of the optical fiber holder, Inserting into a corresponding optical fiber insertion hole and a corresponding optical fiber fixing hole of the optical fiber fixing plate;
Each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder, the corresponding optical fiber insertion hole of the reinforcing layer, and the corresponding optical fiber fixing hole of the optical fiber fixing plate. And a step of fixing to a fiber fixing plate. 4. The method of manufacturing an optical fiber array according to claim 2, further comprising a step of polishing and flattening one main surface of the optical fiber fixing plate in a state where each optical fiber is fixed to the optical fiber fixing plate. One or a plurality of optical fiber holding holes are provided so as to penetrate from one end to the other end, and a positioning pin is inserted (or formed) so as to protrude from the one end. An optical fiber fixing plate used,
An optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder and a pin insertion hole corresponding to the positioning pin are provided so as to penetrate from one main surface to the other main surface and each light. The fiber fixing hole is formed to increase in size as it approaches the other main surface, and an optical fiber insertion hole corresponding to each optical fiber fixing hole and a pin insertion corresponding to the pin insertion hole are formed on the other main surface. reinforcing layer provided we are having a hole, the optical fiber fixing plate formed by a thin film process.

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