JP3805528B2

JP3805528B2 - Soaking equipment

Info

Publication number: JP3805528B2
Application number: JP13545398A
Authority: JP
Inventors: 真二宮崎; 功夫好永; 久明山蔭
Original assignee: Toshiba Mitsubishi Electric Industrial Systems Corp
Current assignee: Toshiba Mitsubishi Electric Industrial Systems Corp
Priority date: 1998-05-18
Filing date: 1998-05-18
Publication date: 2006-08-02
Anticipated expiration: 2018-05-18
Also published as: JPH11320555A

Description

【０００１】
【発明の属する技術分野】
この発明は例えば樹脂成型品、半導体ウエハ、液晶パネル等の被成形物を、加工される定盤上で温度を均一にする均熱装置に関するものである。
【０００２】
【従来の技術】
従来の均熱装置としては、例えば特願平８−２６３１７１号公報に示されるようなものがあり、その概要を図１３ないし図１５に基づいて説明する。これら各図において、１は例えば下面に同心状に配置される複数の環状溝２が形成された第１の板状部材で、例えば上面には複数の被成形物（図示せず）が載置される。３は各環状溝２を覆うように第１の板状部材１の下面に、例えばろう付け等で接合される第２の板状部材で、第１の板状部材１と共に定盤１０を構成しており、流通路４が形成される。５は第２の板状部材３から下方に突出して形成され、定盤１０内の流通路４と連通する複数の液溜り部で、箱部材を溶接等により接合するか、第２の板状部材３を深絞り加工する等して形成されている。６は液溜り部５内に貯溜される作動液、７は一方側が液溜り部５内の作動液中に浸漬され、他方側の端子部が液溜り部５の側壁を貫通して外部に突出する熱源であり、例えばヒータ等から構成されている。
【０００３】
次に動作について説明する。定盤１０に被成形物を載置して加熱成形を行う場合は、液溜り部５内に貯溜される作動液６中に浸漬された熱源７により作動液６を直接加熱する。加熱された作動液６は蒸発して気化し、流通路４を経て定盤１０全体に広がり、その潜熱を流通路４である環状溝２壁面で定盤１０へ伝達し被成形物の加熱を行う。潜熱を奪われた作動液６の蒸気は流通路４である環状溝２壁面で凝縮液化し、液溜り部５内に還流する。このような一連の動作を自然的に繰り返すことにより、定盤１０に載置された被成形物を均一に加熱する。
【０００４】
【発明が解決しようとする課題】
従来の均熱装置は以上のように構成され、被成形物をある設定温度で均熱処理することができるが、例えばある設定温度で均熱処理した被成形物を低い温度で再度均熱処理したい場合ある。しかし、定盤表面の温度を冷却させながら均熱化を図る構成は従来の技術背景からは全く構想されなかったものである。また、１台の均熱装置で対応する場合は、その均熱装置の温度を初期の設定温度から次工程の設定温度に変化させる必要があるが、冷却機能が無いため、表面からの自然放熱に頼るしかなく、再設定された温度に到達するまで多大の時間を要する。結果として、生産プロセス全体の時間を引き延ばしてしまうという課題がある。また、このロスタイムを少なくするため、各処理温度に設定された２台の均熱装置で対応する場合には、２台分のコストと２台分のスペースが必要となる課題がある。
【０００５】
この発明は上記のような課題を解決するためになされたものであり、定盤表面を冷却させながら均熱化を図ることができる均熱装置を提供することを目的とするものである。
【０００６】
【課題を解決するための手段】
この発明の請求項１に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、その流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体に形成され、冷却空間を流通した冷却媒体を導出する導出口とを設けたものである。
【０００７】
また、この発明の請求項２に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体に形成され、冷却空間を流通した冷却媒体を導出する導出口と、定盤の一方側の面に冷却空間に延在する放熱フィンとを設けたものである。
【０００８】
また、この発明の請求項３に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体の中央部に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体の外方近傍に形成され、冷却空間を流通した冷却媒体を導出する導出口とを設けたものである。
【０００９】
また、この発明の請求項４に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、導入口と一方側が連通され、他方側が冷却空間に延在する流路管と、流路管から流出し、冷却空間を流通した冷却媒体を導出する導出口とを設けたものである。
【００１０】
【発明の実施の形態】
実施の形態１．
図１及び図２はこの発明の実施の形態１における均熱装置の構成を示す要部平面図及び断面図である。これら各図において、１は例えば下面に同心状に配置される複数の環状溝２が形成された第１の板状部材で、例えば上面には複数の被成形物１１が載置される。３は各環状溝２を覆うように第１の板状部材１の下面に例えばろう付け等で接合される第２の板状部材で、第１の板状部材１と共に定盤１０を構成しており、流通路４が形成される。この流通路４の内部は真空減圧された後、図示しないが作動液が封入される。１２は定盤の１０の一方側の面に例えば環状のスペーサ１３を介して定盤１０の一方側の面との間に冷却空間１４を設けるカバー体、１５はカバー体１２に形成され、冷却空間１４に冷却媒体１６を導入する導入口、１７はカバー体１２に形成され、冷却空間１４を流通した冷却媒体１６を導出する導出口である。
【００１１】
上記のように構成された実施の形態１における均熱装置において、定盤１０に載置された被成形物１１の温度をある一定温度まで下げる場合、上述した従来装置では冷却機能がないので、自然放熱に頼るしかなかった。この実施の態様１においては、定盤の１０の一方側の面に例えば環状のスペーサ１３を介してカバー体１２を設けて、定盤１０の一方側の面との間に冷却空間１４を設け、カバー体１２に形成された導入口１５から冷却媒体１６を冷却空間１４に導入し、冷却媒体１６が吹き付けられる定盤１０の冷却部に流通路４内部の蒸気の凝縮潜熱の放出により冷却する作用によって、定盤１０の表面温度を均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物１１の温度分布も均一に保ちながら所定温度まで冷却することができる。冷却空間１４を流通した冷却媒体１６はカバー体１２に形成された導出口１７から導出される。当然ながら定盤１０と環状のスペーサ１３との間、あるいは環状のスペーサ１３とカバー体１２との間は互いにシール材等でシールすることにより、冷却媒体１６の外部への無駄な漏出を防止でき冷却効果が更に高めることができる。また、図３は冷却媒体１６の導入口１５から導出口１７に至る温度特性を表したものである。定盤１０内の流通路４内における作動液の蒸気化、凝縮液化の自然的な動作の繰り返しにより、定盤１０の表面温度を均一に保つことができることは勿論のことである。
【００１２】
実施の形態２．
図４はこの発明の実施の形態２における均熱装置の構成を示す断面図である。図において、１〜４、１０〜１７は上述した実施の形態１の構成と同様である。１８は定盤１０の一方側の面、例えば第２の板状部材３に装着され、冷却空間１４に延在する放熱フィンであり、所定の間隔を置いて複数配設されている。
【００１３】
上記のように構成された実施の形態２における均熱装置においては、放熱フィン１８は例えば接着剤等で定盤１０の一方側の面、例えば第２の板状部材３に装着されており、この放熱フィン１８により放熱面積が増大させることができ、定盤１０の表面温度をより早く所定の温度まで下げることができる。
【００１４】
実施の形態３．
図５はこの発明の実施の形態３における均熱装置の構成を示す断面図である。図において、１〜４、１０、１２〜１７は上述した実施の形態１の構成と同様である。１９は定盤１０の一方側の面、例えば第２の板状部材３と一体構造体で形成され、冷却空間１４に延在する放熱フィンである。
【００１５】
このように上記実施の形態３によれば、放熱フィン１９は定盤１０の一方側の面、例えば第２の板状部材３と一体構造体で形成されているので、上述した実施の形態２のように接着剤が介在しないので、接触熱抵抗がなくなるため、より効率よく定盤１０を冷却することができる。
【００１６】
実施の形態４．
図６はこの発明の実施の形態４における均熱装置の構成を示す断面図である。図において、１〜４、１０、１２〜１４、１６は上述した実施の形態１の構成と同様である。２０はカバー体１２の中央部に形成され、冷却空間１４に冷却媒体１６を導入する導入口、２１はカバー体１２の外方近傍に形成され、冷却空間１４を流通した冷却媒体１６を導出する導出口であり、図は一例として環状のスペーサ１３に形成された場合を示している。
【００１７】
上述した各実施の形態では、図３に示すような冷却媒体の冷却効果アンバランスが発生するが、上記のように構成された実施の形態４では、カバー体１２の中央部に形成された導入口２０から冷却媒体１６を冷却空間１４に導入し、環状のスペーサ１３に形成された導出口２１から導出するようにしたことにより、冷却媒体１６温度が図７に示すように同心円状の分布となり、この冷却効果のアンバランスを解消することができ、定盤１０をより均一な温度を保ちながら冷却することができる。また、図７は冷却媒体１６の導入口２０から導出口２１に至る温度特性を表したものであるが、定盤１０内の流通路４内における作動液の蒸気化、凝縮液化の自然的な動作の繰り返しにより、定盤１０の表面温度を均一に保つことができることは勿論のことである。
【００１８】
実施の形態５．
図８はこの発明の実施の形態５における均熱装置の構成を示す断面図である。図において、１〜４、１０〜１７は上述した実施の形態４の構成と同様である。すなわち、上述した実施の形態１の構成を上下逆配置したものである。被成形物１１を定盤１０の下面に配置し、定盤１０の上面に環状のスペーサ１３を介してカバー体１２を配置して冷却空間１４を形成したものであり、上述した実施の形態と同様の効果を奏する。この実施の形態５においては、作動液の蒸発部が下、凝縮部が上となるので、凝縮部で液化した作動液が円滑に蒸発部に還流し、より効率よく冷却作用を高めることができる。
【００１９】
実施の形態６．
図９及び図１０はこの発明の実施の形態６における均熱装置の構成を示す断面図及び平面図である。これら各図において、１〜７は上述した従来装置の構成と同様である。２２は定盤の１０の一方側の面に例えば環状のスペーサ２３を介して定盤１０の一方側の面との間に冷却空間２４、２５、２６を設けるカバー体、２７はカバー体２２に形成され、冷却空間２４〜２６に冷却媒体１６を導入する導入口、２８はカバー体２２に形成され、冷却空間２４〜２６を流通した冷却媒体１６を導出する導出口である。
【００２０】
このように上記実施の形態６によれば、カバー体２２に形成された導入口２７から導入された冷却媒体１６は、冷却空間２４、２５、２６をそれぞれ流通し、冷却媒体１６が吹き付けられる定盤１０の冷却部に液溜り部５、流通路４内部の蒸気の凝縮潜熱の放出により冷却する作用によって、定盤１０の表面温度を均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物１１の温度分布も均一に保ちながら所定温度まで冷却することができる。冷却空間２４、２５、２６を流通した冷却媒体１６はカバー体２２に形成された導出口２８７から導出される。
【００２１】
実施の形態７．
上述した実施の形態６においては、液溜り部５が平行して配置された場合を示しているが、この発明の実施の形態７における均熱装置は図１１に示す平面図の通り、平行配置された液溜り部５間を連通体２９で連通させたものであり、上述した実施の形態６と同様の効果を奏する。この場合には冷却空間２４は連通体２９により冷却空間２４ａ、２４ｂに分離されるため、導入口２７の位置を連通体２９側に設け、冷却空間２４ａ、冷却空間２５，２６を経て冷却空間２４ｂに集流させて導出口２８から導出するように構成されている。
【００２２】
実施の形態８．
上述した実施の形態７においては、平行配置された液溜り部５間を連通体２９で連通させ、冷却空間２４ａ側に導入口２７、冷却空間２４ｂ側に導出口２８を設けたものであり、冷却媒体１６の出入り口を２か所必要である。この発明の実施の形態８における均熱装置は図１２に示す平面図の通り、冷却空間２４ａに冷却媒体１６を導入する導入口３０と、その導入口３０と一方側が連通され、他方側３１ａが冷却空間２４ｂに延在する流路管３１と、冷却空間２４ａの導入口３０近傍に設けられ、流路管３１の他方側３１ａから流出し、冷却空間２４ｂ、２５，２６を流通した冷却媒体１６を冷却空間２４ａに集流させて導出する導出口３２とを設けたものである。
【００２３】
このように上記実施の形態８によれば、冷却媒体１６の導入口３０と導出口３２を冷却空間２４ａの１か所に配置したことにより、冷却媒体１６を供給する装置との接続なども容易に行うことができる。
【００２４】
【発明の効果】
以上のように、この発明の請求項１に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、その流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体に形成され、冷却空間を流通した冷却媒体を導出する導出口とを設けたことにより、定盤の表面温度を均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物の温度分布も均一に保ちながら所定温度まで冷却することができる。
【００２５】
また、この発明の請求項２に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体に形成され、冷却空間を流通した冷却媒体を導出する導出口と、定盤の一方側の面に冷却空間に延在する放熱フィンとを設けたことにより、定盤の表面温度を均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物の温度分布も均一に保ちながら所定温度まで冷却することができると共に放熱フィンにより放熱面積が増大させることができ、定盤の表面温度をより早く所定の温度まで下げることができる。
【００２６】
また、この発明の請求項３に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体の中央部に形成され、冷却空間に冷却媒体を導入する導入口と、カバー体の外方近傍に形成され、冷却空間を流通した冷却媒体を導出する導出口とを設けたことにより、定盤の表面温度をより一層均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物の温度分布も均一に保ちながら所定温度まで冷却することができる。
【００２７】
また、この発明の請求項４に係る均熱装置は、被成形物が載置される定盤内部に流通路が形成され、流通路内部に作動液が封入された均熱装置において、定盤の一方側の面にスペーサを介して定盤の一方側の面との間に冷却空間を設けるカバー体と、カバー体に形成され、冷却空間に冷却媒体を導入する導入口と、導入口と一方側が連通され、他方側が冷却空間に延在する流路管と、流路管から流出し、冷却空間を流通した冷却媒体を導出する導出口とを設けたことにより、定盤の表面温度を均一に保ちながら短時間に所定の温度まで下げることができ、これにより被成形物の温度分布も均一に保ちながら所定温度まで冷却することができると共に、冷却媒体の導入口と導出口を１か所に配置したことにより、冷却媒体を供給する装置との接続なども容易に行うことができる。
【図面の簡単な説明】
【図１】この発明の実施の形態１における均熱装置の構成を示す要部平面図である。
【図２】この発明の実施の形態１における均熱装置の構成を示す側断面図である。
【図３】この発明の実施の形態１における均熱装置の特性を示す特性図である。
【図４】この発明の実施の形態２における均熱装置の構成を示す断面図である。
【図５】この発明の実施の形態３における均熱装置の構成を示す断面図である。
【図６】この発明の実施の形態４における均熱装置の構成を示す断面図である。
【図７】この発明の実施の形態４における均熱装置の特性を示す特性図である。
【図８】この発明の実施の形態５における均熱装置の構成を示す平面図である。
【図９】この発明の実施の形態６における均熱装置の構成を示す断面図である。
【図１０】この発明の実施の形態６における均熱装置の構成を示す平面図である。
【図１１】この発明の実施の形態７における均熱装置の構成を示す平面図である。
【図１２】この発明の実施の形態８における均熱装置の構成を示す平面図である。
【図１３】従来の均熱装置を示す要部断面平面図である。
【図１４】従来の均熱装置を示す要部平面図である。
【図１５】従来の均熱装置を示す断面図である。
【符号の説明】
４流通路、１０定盤、１１被成形物、１２カバー体、
１３スペーサ、１４冷却空間、１５導入口、１６冷却媒体、
１７導出口、１８放熱フィン、１９放熱フィン、２０導入口、
２１導出口、２２カバー体、２３スペーサ、２４冷却空間、
２５冷却空間、２６冷却空間、２７導入口、２８導出口、
３０導入口、３１流路管、３２導出口。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat equalizing device for uniformizing the temperature of a molded object such as a resin molded product, a semiconductor wafer, or a liquid crystal panel on a surface plate to be processed.
[0002]
[Prior art]
As a conventional heat equalizing device, there is one as disclosed in Japanese Patent Application No. 8-263171, for example, and the outline thereof will be described with reference to FIGS. In each of these drawings, reference numeral 1 denotes a first plate-like member in which a plurality of annular grooves 2 arranged concentrically on the lower surface, for example, and a plurality of objects (not shown) are placed on the upper surface, for example. Is done. Reference numeral 3 denotes a second plate member which is joined to the lower surface of the first plate member 1 by brazing or the like so as to cover each annular groove 2, and constitutes the surface plate 10 together with the first plate member 1. Thus, the flow passage 4 is formed. Reference numeral 5 denotes a plurality of liquid reservoirs that are formed to project downward from the second plate-like member 3 and communicate with the flow passage 4 in the surface plate 10. The box members are joined by welding or the like, or are second plate-like. The member 3 is formed by deep drawing or the like. 6 is a hydraulic fluid stored in the liquid reservoir 5, 7 is immersed in the hydraulic fluid in the liquid reservoir 5, and the terminal on the other side penetrates the side wall of the liquid reservoir 5 and protrudes to the outside. For example, a heater or the like.
[0003]
Next, the operation will be described. When the object to be molded is placed on the surface plate 10 and heat molding is performed, the hydraulic fluid 6 is directly heated by the heat source 7 immersed in the hydraulic fluid 6 stored in the liquid reservoir 5. The heated hydraulic fluid 6 evaporates and vaporizes, spreads through the flow path 4 to the entire surface plate 10, and transmits the latent heat to the surface plate 10 through the wall surface of the annular groove 2, which is the flow path 4, to heat the molding. Do. The vapor of the working fluid 6 that has been deprived of latent heat is condensed and liquefied on the wall surface of the annular groove 2 that is the flow passage 4, and is returned to the liquid reservoir 5. By repeating such a series of operations naturally, the molding object placed on the surface plate 10 is heated uniformly.
[0004]
[Problems to be solved by the invention]
The conventional soaking apparatus is configured as described above, and can heat-treat the molding at a certain set temperature. For example, there is a case where it is desired to re-heat-treat the molding that has been soaked at a certain setting temperature at a low temperature. . However, a configuration for equalizing the temperature while cooling the temperature of the surface of the surface plate has never been conceived from the background of the conventional technology. In addition, when using a single soaking device, it is necessary to change the temperature of the soaking device from the initial set temperature to the set temperature of the next process, but since there is no cooling function, natural heat dissipation from the surface It takes a lot of time to reach the reset temperature. As a result, there is a problem that the time of the entire production process is extended. Moreover, in order to reduce this loss time, when it respond | corresponds with two heat equalization apparatuses set to each process temperature, there exists a subject for which the cost for two units and the space for two units are needed.
[0005]
The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a heat equalizing apparatus that can achieve temperature equalization while cooling the surface of the surface plate.
[0006]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path. A cover body that provides a cooling space between one surface of the surface plate with a spacer on one surface, an inlet formed in the cover body for introducing a cooling medium into the cooling space, and a cover body And a lead-out port for leading out the cooling medium flowing through the cooling space.
[0007]
According to a second aspect of the present invention, there is provided a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path. A cover body in which a cooling space is provided between one surface of the surface plate and a surface of the one side of the surface plate via a spacer, an inlet formed in the cover body for introducing a cooling medium into the cooling space, and a cover body A lead-out port for leading the cooling medium formed and flowing through the cooling space, and a radiating fin extending to the cooling space on one surface of the surface plate are provided.
[0008]
According to a third aspect of the present invention, there is provided a heat equalizing apparatus according to a third aspect of the present invention, wherein the flow path is formed in the surface plate on which the workpiece is placed, and the working liquid is sealed in the flow path. A cover body in which a cooling space is provided between one surface of the platen and a surface of one surface of the surface plate via a spacer, an introduction port formed in the center of the cover body and for introducing a cooling medium into the cooling space; A lead-out port that is formed near the outside of the cover body and leads out the cooling medium that flows through the cooling space is provided.
[0009]
According to a fourth aspect of the present invention, there is provided a heat equalizing apparatus according to a fourth aspect of the present invention, wherein the flow path is formed in the surface plate on which the workpiece is placed, and the working liquid is sealed in the flow path. A cover body in which a cooling space is provided between one surface of the surface plate and a surface on one side of the surface plate, an introduction port formed in the cover body for introducing a cooling medium into the cooling space, and an introduction port; One side is connected, and the other side is provided with a channel pipe extending to the cooling space, and a lead-out port for leading out the cooling medium flowing out of the channel pipe and flowing through the cooling space.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
1 and 2 are a main part plan view and a cross-sectional view showing a configuration of a heat equalizing apparatus according to Embodiment 1 of the present invention. In each of these drawings, reference numeral 1 denotes a first plate-like member in which a plurality of annular grooves 2 arranged concentrically on the lower surface, for example, and a plurality of moldings 11 are placed on the upper surface, for example. Reference numeral 3 denotes a second plate member that is joined to the lower surface of the first plate member 1 by, for example, brazing so as to cover each annular groove 2, and constitutes a surface plate 10 together with the first plate member 1. The flow path 4 is formed. The inside of the flow passage 4 is vacuum-depressurized, and then a working fluid is enclosed (not shown). 12 is a cover body in which a cooling space 14 is provided on one surface of the surface plate 10 with, for example, an annular spacer 13 between one surface of the surface plate 10, and 15 is formed on the cover body 12. An introduction port 17 for introducing the cooling medium 16 into the space 14, and an outlet port 17 for leading out the cooling medium 16 that is formed in the cover body 12 and flows through the cooling space 14.
[0011]
In the heat equalizing apparatus according to the first embodiment configured as described above, when the temperature of the object 11 placed on the surface plate 10 is lowered to a certain temperature, the conventional apparatus described above has no cooling function. I had to rely on natural heat dissipation. In the first embodiment, a cover body 12 is provided on one surface of the surface plate 10 via, for example, an annular spacer 13, and a cooling space 14 is provided between the surface 10 and one surface of the surface plate 10. Then, the cooling medium 16 is introduced into the cooling space 14 from the inlet 15 formed in the cover body 12, and is cooled by the discharge of the latent heat of condensation inside the flow path 4 to the cooling portion of the surface plate 10 to which the cooling medium 16 is blown. By the action, the surface temperature of the surface plate 10 can be lowered to a predetermined temperature in a short time while keeping the surface temperature uniform, and thereby the temperature of the molding 11 can be cooled to the predetermined temperature while keeping the temperature distribution uniform. The cooling medium 16 that has passed through the cooling space 14 is led out from a lead-out port 17 formed in the cover body 12. Needless to say, unnecessary leakage of the cooling medium 16 to the outside can be prevented by sealing between the surface plate 10 and the annular spacer 13 or between the annular spacer 13 and the cover body 12 with a sealant or the like. The cooling effect can be further enhanced. FIG. 3 shows temperature characteristics from the inlet 15 to the outlet 17 of the cooling medium 16. Of course, the surface temperature of the surface plate 10 can be kept uniform by repeating the natural operation of vaporizing and condensing the working fluid in the flow passage 4 in the surface plate 10.
[0012]
Embodiment 2. FIG.
FIG. 4 is a cross-sectional view showing the configuration of the heat equalizing device according to Embodiment 2 of the present invention. In the figure, 1-4 and 10-17 are the same as the structure of Embodiment 1 mentioned above. Reference numeral 18 denotes a heat radiating fin that is attached to one surface of the surface plate 10, for example, the second plate-like member 3, and extends to the cooling space 14. A plurality of heat radiating fins are arranged at predetermined intervals.
[0013]
In the heat equalizing device according to the second embodiment configured as described above, the radiating fins 18 are attached to one surface of the surface plate 10 with, for example, an adhesive, for example, the second plate-shaped member 3. The heat radiation area can be increased by the heat radiation fins 18, and the surface temperature of the surface plate 10 can be lowered to a predetermined temperature more quickly.
[0014]
Embodiment 3 FIG.
FIG. 5 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 3 of the present invention. In the figure, 1-4, 10, and 12-17 are the same as the structure of Embodiment 1 mentioned above. Reference numeral 19 denotes a heat radiating fin that is formed as an integral structure with one surface of the surface plate 10, for example, the second plate-like member 3, and extends into the cooling space 14.
[0015]
As described above, according to the third embodiment, the heat radiating fins 19 are formed as an integral structure with the one surface of the surface plate 10, for example, the second plate-like member 3, so that the second embodiment described above. Thus, since no adhesive is present, the contact thermal resistance is eliminated, and the surface plate 10 can be cooled more efficiently.
[0016]
Embodiment 4 FIG.
FIG. 6 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 4 of the present invention. In the figure, 1-4, 10, 12-14, and 16 are the same as the structure of Embodiment 1 mentioned above. 20 is formed in the center part of the cover body 12 and introduces the cooling medium 16 into the cooling space 14, and 21 is formed in the vicinity of the outside of the cover body 12 to lead out the cooling medium 16 that has circulated through the cooling space 14. As an example, the drawing shows a case where the annular spacer 13 is formed.
[0017]
In each of the above-described embodiments, the cooling medium imbalance of the cooling medium as shown in FIG. 3 occurs. However, in the fourth embodiment configured as described above, the introduction formed in the central portion of the cover body 12 is performed. Since the cooling medium 16 is introduced into the cooling space 14 from the port 20 and led out from the outlet 21 formed in the annular spacer 13, the temperature of the cooling medium 16 has a concentric distribution as shown in FIG. The unbalance of the cooling effect can be eliminated, and the surface plate 10 can be cooled while maintaining a more uniform temperature. FIG. 7 shows the temperature characteristics of the cooling medium 16 from the inlet 20 to the outlet 21. Naturally, the working liquid is vaporized and condensed in the flow path 4 in the surface plate 10. It goes without saying that the surface temperature of the surface plate 10 can be kept uniform by repeating the operation.
[0018]
Embodiment 5 FIG.
FIG. 8 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 5 of the present invention. In the figure, 1 to 4 and 10 to 17 are the same as the configuration of the fourth embodiment described above. That is, the configuration of the first embodiment described above is arranged upside down. The molding object 11 is arranged on the lower surface of the surface plate 10, and the cover body 12 is arranged on the upper surface of the surface plate 10 via the annular spacer 13 to form the cooling space 14. The same effect is produced. In the fifth embodiment, since the working liquid evaporating part is on the lower side and the condensing part is on the upper side, the working liquid liquefied in the condensing part is smoothly returned to the evaporating part, and the cooling action can be enhanced more efficiently. .
[0019]
Embodiment 6 FIG.
9 and 10 are a sectional view and a plan view showing the configuration of the heat equalizing device according to Embodiment 6 of the present invention. In each of these figures, 1 to 7 are the same as the configuration of the conventional apparatus described above. 22 is a cover body in which cooling spaces 24, 25, and 26 are provided on one surface of the surface plate 10 with, for example, an annular spacer 23 between one surface of the surface plate 10, and 27 is a cover body 22. An inlet 28 formed for introducing the cooling medium 16 into the cooling spaces 24 to 26 and an outlet 28 for leading out the cooling medium 16 formed in the cover body 22 and flowing through the cooling spaces 24 to 26.
[0020]
As described above, according to the sixth embodiment, the cooling medium 16 introduced from the introduction port 27 formed in the cover body 22 flows through the cooling spaces 24, 25, and 26, respectively, and the cooling medium 16 is sprayed. By the action of cooling the cooling part of the panel 10 by releasing the latent heat of condensation inside the liquid reservoir 5 and the flow path 4, the surface temperature of the surface plate 10 can be lowered to a predetermined temperature in a short time while keeping the surface temperature uniform. Thus, it is possible to cool to a predetermined temperature while keeping the temperature distribution of the article 11 uniform. The cooling medium 16 that has passed through the cooling spaces 24, 25, and 26 is led out from a lead-out port 287 formed in the cover body 22.
[0021]
Embodiment 7 FIG.
In the sixth embodiment described above, the case where the liquid reservoirs 5 are arranged in parallel is shown. However, the heat equalizing device in the seventh embodiment of the present invention is arranged in parallel as shown in the plan view of FIG. The liquid reservoirs 5 communicated with each other through the communication body 29, and the same effects as those of the above-described sixth embodiment are obtained. In this case, since the cooling space 24 is separated into the cooling spaces 24a and 24b by the communication body 29, the position of the introduction port 27 is provided on the communication body 29 side, and the cooling space 24b passes through the cooling space 24a and the cooling spaces 25 and 26. And are led out from the outlet port 28.
[0022]
Embodiment 8 FIG.
In the above-described seventh embodiment, the liquid reservoirs 5 arranged in parallel are communicated with each other by the communication body 29, and the introduction port 27 is provided on the cooling space 24a side, and the outlet port 28 is provided on the cooling space 24b side. Two entrances for the cooling medium 16 are required. As shown in the plan view of FIG. 12, the heat equalizing apparatus according to the eighth embodiment of the present invention introduces the cooling medium 16 into the cooling space 24a, the inlet 30 is connected to one side, and the other side 31a is connected to the other side 31a. The cooling medium 16 provided in the vicinity of the inlet 30 of the cooling space 24a and the flow path pipe 31 extending to the cooling space 24b, flows out from the other side 31a of the flow path pipe 31, and flows through the cooling spaces 24b, 25, and 26. Are provided in the cooling space 24a.
[0023]
As described above, according to the eighth embodiment, the inlet 30 and the outlet 32 of the cooling medium 16 are arranged at one place in the cooling space 24a, so that the connection with the apparatus that supplies the cooling medium 16 is easy. Can be done.
[0024]
【The invention's effect】
As described above, the heat equalizing apparatus according to the first aspect of the present invention includes a heat equalizing apparatus in which a flow passage is formed in a surface plate on which a workpiece is placed, and a working fluid is sealed in the flow passage. A cover body in which a cooling space is provided between one surface of the surface plate and a surface on one side of the surface plate via a spacer, and an introduction port formed in the cover body for introducing a cooling medium into the cooling space; In addition, by providing a lead-out port that is formed in the cover body and leads out the cooling medium flowing through the cooling space, the surface temperature of the surface plate can be lowered to a predetermined temperature in a short time while maintaining the surface temperature uniform. It is possible to cool to a predetermined temperature while maintaining a uniform temperature distribution of the molding.
[0025]
According to a second aspect of the present invention, there is provided a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path. A cover body in which a cooling space is provided between one surface of the surface plate and a surface of the one side of the surface plate via a spacer, an inlet formed in the cover body for introducing a cooling medium into the cooling space, and a cover body The surface of the surface plate is kept uniform by providing a lead-out port through which the cooling medium formed and circulated through the cooling space is provided, and a radiating fin extending to the cooling space on one surface of the surface plate. The temperature can be lowered to a predetermined temperature in a short time, and the temperature distribution of the molding can be kept uniform while cooling to the predetermined temperature, and the radiation area can be increased by the radiation fins. The temperature can be lowered more quickly to the specified temperature. Can.
[0026]
According to a third aspect of the present invention, there is provided a heat equalizing apparatus according to a third aspect of the present invention, wherein the flow path is formed in the surface plate on which the workpiece is placed, and the working liquid is sealed in the flow path. A cover body in which a cooling space is provided between one surface of the platen and a surface of one surface of the surface plate via a spacer, an introduction port formed in the center of the cover body and for introducing a cooling medium into the cooling space; Lowering the surface temperature of the surface plate to a predetermined temperature in a short time while maintaining a more uniform surface temperature by providing a lead-out port that is formed near the outside of the cover body and leads out the cooling medium flowing through the cooling space. Thus, it is possible to cool to a predetermined temperature while maintaining a uniform temperature distribution of the molding.
[0027]
According to a fourth aspect of the present invention, there is provided a heat equalizing apparatus according to a fourth aspect of the present invention, wherein the flow path is formed in the surface plate on which the workpiece is placed, and the working liquid is sealed in the flow path. A cover body in which a cooling space is provided between one surface of the surface plate and a surface on one side of the surface plate, an introduction port formed in the cover body for introducing a cooling medium into the cooling space, and an introduction port; The surface temperature of the surface plate is reduced by providing a flow path pipe that communicates on one side and that extends to the cooling space on the other side, and a lead-out port that leads out the cooling medium that flows out of the flow path pipe and flows through the cooling space. While maintaining a uniform temperature, the temperature can be lowered to a predetermined temperature in a short period of time, so that the temperature distribution of the molding can be maintained at a uniform temperature while maintaining a uniform temperature distribution. Because of the location of the Or the like can be easily performed.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part showing the configuration of a heat equalizing device according to Embodiment 1 of the present invention.
FIG. 2 is a side sectional view showing a configuration of a heat equalizing device according to Embodiment 1 of the present invention.
FIG. 3 is a characteristic diagram showing characteristics of the heat equalizer in Embodiment 1 of the present invention.
FIG. 4 is a cross-sectional view showing a configuration of a heat equalizing device in Embodiment 2 of the present invention.
FIG. 5 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 3 of the present invention.
FIG. 6 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 4 of the present invention.
FIG. 7 is a characteristic diagram showing characteristics of a heat equalizing device according to Embodiment 4 of the present invention.
FIG. 8 is a plan view showing a configuration of a heat equalizing device according to Embodiment 5 of the present invention.
FIG. 9 is a cross-sectional view showing a configuration of a heat equalizing device according to Embodiment 6 of the present invention.
FIG. 10 is a plan view showing a configuration of a heat equalizing device according to Embodiment 6 of the present invention.
FIG. 11 is a plan view showing a configuration of a heat equalizing device according to Embodiment 7 of the present invention.
FIG. 12 is a plan view showing a configuration of a heat equalizing device according to Embodiment 8 of the present invention.
FIG. 13 is a cross-sectional plan view of an essential part showing a conventional heat equalizer.
FIG. 14 is a plan view of an essential part showing a conventional heat equalizer.
FIG. 15 is a cross-sectional view showing a conventional heat equalizer.
[Explanation of symbols]
4 flow path, 10 surface plate, 11 molded object, 12 cover body,
13 spacer, 14 cooling space, 15 inlet, 16 cooling medium,
17 outlet port, 18 heat radiation fin, 19 heat radiation fin, 20 inlet port,
21 outlet, 22 cover body, 23 spacer, 24 cooling space,
25 cooling space, 26 cooling space, 27 inlet, 28 outlet,
30 Inlet port, 31 Channel tube, 32 Outlet port.

Claims

In a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path, the surface plate is interposed on one surface of the surface plate via a spacer. A cover body provided with a cooling space between the one side surface thereof, an introduction port formed in the cover body for introducing a cooling medium into the cooling space, and formed in the cover body and circulated through the cooler space And a soaking device for leading out the cooled cooling medium.

In a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path, the surface plate is interposed on one surface of the surface plate via a spacer. A cover body provided with a cooling space between the one side surface thereof, an inlet formed in the cover body for introducing a cooling medium into the cooling space, and formed in the cover body, and circulated through the cooling space. A heat equalizing apparatus comprising a lead-out port through which a cooling medium is led out and a heat radiation fin extending to the cooling space on one surface of the surface plate.

In a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path, the surface plate is interposed on one surface of the surface plate via a spacer. A cover body provided with a cooling space between one surface of the cover body, an inlet formed at the center of the cover body, for introducing a cooling medium into the cooling space, and formed near the outside of the cover body. And a heat equalizing device comprising a lead-out port for leading out the cooling medium flowing through the cooling space.

In a heat equalizing apparatus in which a flow path is formed inside a surface plate on which a workpiece is placed, and a working fluid is sealed inside the flow path, the surface plate is interposed on one surface of the surface plate via a spacer. A cover body provided with a cooling space between the surface of the first side, an introduction port formed in the cover body for introducing a cooling medium into the cooling space, the introduction port communicated with one side, and the other side with the cooling space. A heat equalizing apparatus, comprising: a flow channel pipe extending into the space; and a lead-out port through which the cooling medium flowing out from the flow channel pipe and flowing through the cooling space is led out.