JP4032813B2 - Printed circuit board and outline processing method of printed circuit board - Google Patents
Printed circuit board and outline processing method of printed circuit board Download PDFInfo
- Publication number
- JP4032813B2 JP4032813B2 JP2002123805A JP2002123805A JP4032813B2 JP 4032813 B2 JP4032813 B2 JP 4032813B2 JP 2002123805 A JP2002123805 A JP 2002123805A JP 2002123805 A JP2002123805 A JP 2002123805A JP 4032813 B2 JP4032813 B2 JP 4032813B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- slit
- outer shape
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003672 processing method Methods 0.000 title description 4
- 238000000034 method Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、プリント回路板（以下基板と略す）およびプリント回路板の外形加工方法に係り、とくに薄型で小さな基板の外形加工に適した外形加工方法に関するものである。
【０００２】
【従来の技術】
基板の外形加工は、銅張積層板に穴あけ加工、めっき、エッチング加工工程を経て、所要の回路パターンを形成した後、所要の外形寸法に切り出す。基板は複数枚を重ね合わせて加工する。
それに供する外形加工機はたとえば、実開昭６１−５５０９号に開示された構造のものがある。
【０００３】
複数枚重ねた基板は上下に当て板を介し、基板間での位置合わせと前記外形加工機への位置決めの為にワークの外側（外縁部）に予め形成した複数の穴にガイドピンを差込み一体化したのち、外形加工機のテーブル上に載置し固定する。所要の外形形状の切り出し作業は、上面当て板をプレッシャーフットで抑え、スピンドルをＸ、Ｙ方向に移動させ、スピンドルヘッドに装着したルータカッタによって切削加工処理される。
【０００４】
【発明が解決しようとする課題】
基板のなかでも小型で厚みの薄い半導体チップ実装用の基板は、その後の実装工程や製品の組み込み工程での厳しい仕様により、基板変形や平坦性の裕度が少なく、いわゆるそり、ねじれの発生を少なく抑える必要がある。前記した従来の外形加工方法のもとで切り出した個片のそり、ねじれはワーク外周に位置する個片で大きくなり、製品歩留まりが低下する問題点があった。
【０００５】
本発明の目的は、基板の外形加工方法において、切り取った個片にそり、ねじれ等の変形を少なくし、部分搭載や組み込み工程の時の精度を確保し、歩留まりを向上する手段を提供することにある。
【０００６】
【課題を解決するための手段】
この発明は前記問題点を解決するものであって、基板のワークの外側に、予めスリットを設けて外形加工を行う。このスリットは、プリント回路板固定用のガイドピンとワーク外周との中間に位置し、直近のワーク外周と平行に３０ｍｍ以上の長さを有する。なお、このスリットはプリント回路板を外形加工機に固定した後、加工して設ける。
【０００７】
【発明の実施の形態】
この発明において、基板とはＱＦＰ及びＢＧＡなどのパッケージの所定数を多面形成したガラス布入りエポキシ樹脂などのプラスチック製のものを指し、一般的には０．１ｍｍから０．８ｍｍの厚みのものが多いが限定するものではない。ワークは所定のパッケージの切り出す部分を指し、切り出した個片の寸法は２０ｍｍ〜５０ｍｍ角の寸法が多いが、特に限定はしない。スリット長さは３０ｍｍ以上が望ましく、最大長は特に限定しない。
【０００８】
以下、本発明の実施例を図面に基づいて説明する。
図１は、本発明の実施例であるプリント回路板を示す図である。図において、プリント回路板３は上当て板１と下当て板２間に複数枚重ねられ、位置決め固定の為のガイドピン４によって一体化され、積層体１０が形成される。ワーク５内に切り出すべき個片６の位置と寸法は外形加工機の数値制御（ＮＣ）により設定してある。
【０００９】
この状態で、外形加工機のテーブル（図示せず）上に積層体１０を固定した後に、上当て板１およびプリント回路板３に上当り板１側から、スリット７をガイドピン４とワーク５の外枠（外側）の中間に設ける。すなわち、ガイドピン４の内側に設ける。スリットでは、ワーク５の外周と平行にして３０ｍｍ以上の長さに形成するのがよい。図の場合、上側に３個の３０ｍｍのスリットおよび下側にこれに遂行して３個の３０ｍｍのスリットを設けている。このようにすることによって、プリント回路板３にはワーク５の外側に位置する部分に上当て板１を介して、すなわち上側からスリット７を設けることができる。
【００１０】
その後に、ワーク５内の個片の切り出し作業（外形加工）はＮＣで設定された位置及び寸法に従って行う。この外形形状の切り出し作業は、通常の加工工程に従って、上面で板１をプレッシャーフットで抑え、スピンドルをＸ，Ｙ方向に移動させ、スピンドルヘッドに装着したルータカッタによって切削加工することになって施行される。
【００１１】
外形加工機として、実開昭６１−５５０９号公報に記載されたスピンドルの外周に、スピンドルの軸方向に摺動可能に配置されたピストンの下端に支持された本体と、この本体の下端に固定され、本体との間に、外周に向けて開口する案内溝を形成し、かつ下端面に下方に向けて開口する環状の溝が形成された案内部材と、内周面の一端に前記案内溝と摺動自在に嵌合する環状のフランジ部が形成された円筒状の押え部材と、前記案内部材の溝に、スピンドルの軸方向に摺動可能に支持された環状のブラシとを設けたプリント基板外形加工用プレッシャフットを採用し得る。
【００１２】
上記方法によれば、基板から個片を切り出す作業において、外形加工機に基板を載置、固定するガイドピンの近くでルータカッタによる切削加工を行う外周部分での切り出しの際、プレッシャーフットによる基板への押し圧の歪みとルータカッタによる切削応力歪みがガイドピン周辺に集中するのを、予め設けられたスリット部分により緩和することができ、その結果切り出した個片のそり、ねじれが少なくなり、製品歩留まりが向上する。さらに、スリット加工作業はを外形加工機に基板を固定した後に行うことで、固定の際にガイドピンの近傍で残留する歪みを開放させる効果が発揮され、製品歩留まりが向上する。
【００１３】
図２は、スリット加工有りの場合と、スリット加工無しの場合の製品Ａ，製品Ｂについての歩留まり（％）の状況を示すグラフである。この図に示すように、いずれの製品にあってもスリット加工有りの場合の方が歩留状況がよい。
【００１４】
【発明の効果】
以上のように本発明によれば、スリットをプリント回路板に設けてから切り出し作業を行うことができ、切り取った個片にそり、ねじれ等の変形を少なくすることができ、部品搭載や組み立て工程の時の精度を確保することができるから製品の歩留まりを向上することができる。
【図面の簡単な説明】
【図１】本発明の実施例の積層体の構成図。
【図２】製品の歩留まりを示すグラフ図。
【符号の説明】
１…上当て板、２…下当て板、３…プリント回路板、４…ガイドピン、５…ワーク、６…個片、７…スリット、１０…積層体。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board (hereinafter abbreviated as a substrate) and a printed circuit board outer shape processing method, and more particularly to an outer shape processing method suitable for outer shape processing of a thin and small substrate.
[0002]
[Prior art]
For the external processing of the substrate, a copper-clad laminate is drilled, plated, and etched to form a required circuit pattern, and then cut out to the required external dimensions. Substrates are processed by overlapping multiple sheets.
For example, there is a structure machine disclosed in Japanese Utility Model Publication No. 61-5509.
[0003]
Multiple substrates are placed on top and bottom with a contact plate, and guide pins are inserted into a plurality of holes formed in advance on the outside (outer edge) of the workpiece for positioning between the substrates and positioning to the outline processing machine. After that, it is placed and fixed on the table of the outline processing machine. The required outer shape is cut out by a router cutter attached to the spindle head while holding the top plate with the pressure foot and moving the spindle in the X and Y directions.
[0004]
[Problems to be solved by the invention]
Among the substrates, small and thin semiconductor chip mounting substrates have less tolerance for substrate deformation and flatness due to strict specifications in the subsequent mounting process and product assembly process, and so-called warpage and twisting occur. It is necessary to keep it low. There has been a problem that warping and twisting of the pieces cut out under the above-described conventional outer shape processing method become larger at the pieces located on the outer periphery of the workpiece, and the product yield is lowered.
[0005]
An object of the present invention is to provide means for improving the yield in a method for processing an outer shape of a substrate by reducing deformation such as warping and twisting on a cut piece, ensuring accuracy during partial mounting and assembling processes. It is in.
[0006]
[Means for Solving the Problems]
The present invention solves the above-described problems, and external processing is performed by providing a slit in advance on the outside of the work on the substrate. The slit is located between the guide pin for fixing the printed circuit board and the outer periphery of the work, and has a length of 30 mm or more in parallel with the nearest outer periphery of the work. The slits are provided after the printed circuit board is fixed to the outer shape processing machine.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the substrate means a plastic substrate such as an epoxy resin with glass cloth in which a predetermined number of packages such as QFP and BGA are formed, and generally has a thickness of 0.1 mm to 0.8 mm. Many but not limited. The workpiece refers to a portion to be cut out of a predetermined package, and the size of the cut piece is often 20 mm to 50 mm square, but is not particularly limited. The slit length is desirably 30 mm or more, and the maximum length is not particularly limited.
[0008]
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing a printed circuit board according to an embodiment of the present invention. In the figure, a plurality of printed circuit boards 3 are stacked between an upper plate 1 and a lower plate 2 and are integrated by
[0009]
In this state, after fixing the laminated
[0010]
Thereafter, the cutting operation (outer shape processing) of the individual pieces in the
[0011]
As a contouring machine, a main body supported by the lower end of a piston arranged on the outer periphery of the spindle described in Japanese Utility Model Publication No. 61-5509 so as to be slidable in the axial direction of the spindle, and fixed to the lower end of the main body A guide member having a guide groove that opens toward the outer periphery and an annular groove that opens downward on the lower end surface, and the guide groove at one end of the inner peripheral surface. A cylindrical presser member in which an annular flange portion is formed that is slidably fitted to the guide member, and an annular brush supported in the groove of the guide member so as to be slidable in the axial direction of the spindle. A pressure foot for processing the substrate outer shape may be employed.
[0012]
According to the above method, in the operation of cutting the individual piece from the substrate, the substrate by the pressure foot is used for cutting at the outer peripheral portion where the cutting is performed by the router cutter near the guide pin for placing and fixing the substrate on the outer shape processing machine. It is possible to relieve the strain of the pressing pressure and the cutting stress distortion caused by the router cutter around the guide pin by the slit part provided in advance, resulting in less warping and twisting of the cut pieces, Product yield is improved. Furthermore, the slit machining operation is performed after the substrate is fixed to the outer shape processing machine, so that the effect of releasing the distortion remaining in the vicinity of the guide pins at the time of fixing is exhibited, and the product yield is improved.
[0013]
FIG. 2 is a graph showing the yield (%) for products A and B when slit processing is performed and when slit processing is not performed. As shown in this figure, the yield situation is better in the case of slitting with any product.
[0014]
【The invention's effect】
As described above, according to the present invention, the cutting operation can be performed after the slit is provided in the printed circuit board, and the deformation such as warping and twisting can be reduced on the cut piece, and the component mounting and assembly process can be performed. Therefore, the product yield can be improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a laminate according to an embodiment of the present invention.
FIG. 2 is a graph showing product yield.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Upper plate, 2 ... Lower plate, 3 ... Printed circuit board, 4 ... Guide pin, 5 ... Workpiece, 6 ... Piece, 7 ... Slit, 10 ... Laminate.
Claims (2)
該積層体を外形加工機のテーブル上に固定し、前記上当て板およびプリント回路板に該上当て板側から、前記ガイドピンと前記ワークの外枠との中間にスリットを形成し、The laminate is fixed on a table of an outline processing machine, and a slit is formed in the middle of the guide pin and the outer frame of the workpiece from the top plate side of the top plate and the printed circuit board.
その後に、固定した状態で、前記ワークの切り出し作業を行うことThereafter, the work is cut out in a fixed state.
を特徴とするプリント回路板の外形加工方法。A method for processing an outer shape of a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002123805A JP4032813B2 (en) | 2002-04-25 | 2002-04-25 | Printed circuit board and outline processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002123805A JP4032813B2 (en) | 2002-04-25 | 2002-04-25 | Printed circuit board and outline processing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003318497A JP2003318497A (en) | 2003-11-07 |
| JP4032813B2 true JP4032813B2 (en) | 2008-01-16 |
Family
ID=29538996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002123805A Expired - Lifetime JP4032813B2 (en) | 2002-04-25 | 2002-04-25 | Printed circuit board and outline processing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4032813B2 (en) |
-
2002
- 2002-04-25 JP JP2002123805A patent/JP4032813B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003318497A (en) | 2003-11-07 |
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