JP4152266B2 - Cover tape for packaging electronic parts - Google Patents
Cover tape for packaging electronic parts Download PDFInfo
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- JP4152266B2 JP4152266B2 JP2003180891A JP2003180891A JP4152266B2 JP 4152266 B2 JP4152266 B2 JP 4152266B2 JP 2003180891 A JP2003180891 A JP 2003180891A JP 2003180891 A JP2003180891 A JP 2003180891A JP 4152266 B2 JP4152266 B2 JP 4152266B2
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- Prior art keywords
- cover tape
- layer
- tape
- base material
- electronic parts
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims description 4
- 239000010410 layer Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 229920001684 low density polyethylene Polymers 0.000 claims description 7
- 239000004702 low-density polyethylene Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- -1 polyethylene terephthalate Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 238000009820 dry lamination Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Images
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Description
【０００１】
【発明が属する技術分野】
本発明は、電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、収納ポケットを形成したプラスチック製キャリアテープにシールされ得るカバーテープに関するものである。
【０００２】
【従来の技術】
近年、ＩＣを始めとして、トランジスター、ダイオード、コンデンサー、圧電素子レジスター、などの表面実装用電子部品は、電子部品の形状に合わせて、収納しうるエンボス成形されたポケットを連続的に形成したプラスチック製キャリアテープとキャリアテープにシールし得るカバーテープとからなる包装体に包装されて供給されている。内容物の電子部品は包装体のカバーテープを剥離した後、自動的に取り出され電子回路基板に表面実装されている。しかし、近年の実装速度の急激な高速化に伴い、カバーテープの剥離時にかかるテンションが剥離不良を防止する為きつくなり、かつ剥離速度も0.1秒以下/タクトという瞬間的な工程であり、カバーテープには大きな衝撃応力がかかるようになったため、カバーテープが切断してしまういわゆる『テープ切れ』問題が大きなトラブルとなっている。これらの課題を克服すべく二軸延伸フィルムで構成される外層の内側に耐衝撃性向上層を設けたり、二軸延伸共重合ポリエチレンテレフタレートフィルムを用いる方法が特許文献１や２に記載されているが、新たに層を設ける為に工程増加によるコスト高や、共重合素材では耐熱性が下がる等の問題が発生する。
【０００３】
【特許文献１】
特開平８−１１９３７３号公報
【特許文献２】
特開２００３-３４３５５号公報
【０００４】
【発明が解決しようとする課題】
本発明は、前述のトラブルを防止すべく、実装工程における高速での剥離操作時にテープ切れ等の剥離不良発生を防止しうるカバーテープを提供する。
【０００５】
【課題を解決するための手段】
本発明は
（１）電子部品を収納する収納ポケットを連続的に形成したプラスチック製キャリアテープに、熱シールしうるカバーテープであって、少なくとも基材層と接着層とを積層してなり、基材層がエチレンテレフタレート単位が構成成分の９６モル％以上、ＪＩＳ Ｋ６７３４に準ずる引張り強度が１９０ＭＰａ以上、伸度が１２０％以上である二軸延伸フィルムからなることを特徴とする電子部品包装用カバーテープ、
（２）上記基材層と接着層との間に低密度ポリエチレンからなる中間層を積層した（１）項記載の電子部品包装用カバーテープ、
である。
【０００６】
【発明の実施の形態】
本発明のカバーテープ（１）の層構成の一例を図１で説明する。基材層（２）は分子構造制御を施したポリエチレンテレフタレートを二軸延伸したフィルムであり、二軸延伸ポリエチレンテレフタレートフィルム元来の引張り強度を維持しているが、通常の二軸延伸ポリエチレンテレフタレートフィルムに比べて伸びやすく、張力が強くかかった時にも伸びにより力を緩和し、切れにくい、厚みが６〜５０μｍの透明で剛性の高いフィルムである。必要に応じて滑剤や、カバーテープの帯電性を制御する為の導電性微粉末などを塗布しても構わない。
【０００７】
接着層（３）は、ヒートシールによりキャリアテープに接着可能な材料であれば特に限定されず、従来カバーテープの接着層として用いられていたエチレン系共重合体やポリエステル系樹脂、アクリル系樹脂等で形成される。
本発明では上記基材層（２）と接着層（３）の間に低密度ポリエチレン（ＬＤＰＥ）からなる中間層（４）を積層することでヒートシール時に良好なクッション性を得ることが出来る。
【０００８】
【実施例】
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。
《実施例及び比較例１〜３》
表１には、実施例及び比較例１〜３に用いた基材層フィルムの各々の物性を、実施例及び比較例１、２においては市販のフィルムに関して直接測定を行い、比較例３においては基材層の二軸延伸フィルム二種をドライラミネートにより張り合わせたものについて測定を行い、まとめて示した。引張り強度・伸度測定はＪＩＳ Ｋ６７３４に準拠した方法で実施した。
実施例及び比較例１、２では外層を二軸延伸フィルムとし、中間層、接着層を押出しラミネーターにより積層した。また、比較例３においては、基材層の二軸延伸フィルム二種をドライラミネートにより張り合わせた後、他の例と同様の方法により積層した。得られた積層フィルムについて5.5mm巾にスリット後、ピール強度（測定速度：300mm/min）が同等(0.7N)となる様に8mm巾のPS製キャリアテープとヒートシールを行い、高速剥離機(42000mm/min)でテープ切れの有無を判定し、表２に示した。
【０００９】
基材層としては下記のものを使用した。
実施例：分子構造制御を施したポリエチレンテレフタレートを二軸延伸したフィルム（東レ社製「ルミラー・２０ＱＲ０１」）、
比較例１：二軸延伸共重合ポリエステルフィルム（帝人・デュポン社製「TEFREX-FT」）、
比較例２：通常の二軸延伸ポリエチレンテレフタレートフィルム（アイ・シー・アイ・ジャパン社製「メリネックス」）
比較例３：通常の二軸延伸ポリエチレンテレフタレートフィルム（アイ・シー・アイ・ジャパン社製「メリネックス」）に二軸延伸ナイロン（ユニチカ社製「エンブレムＯＮ」）を積層したフィルム
中間層としては、低密度ポリエチレン（三井住友ポリオレフィン社製「スミカセンＬ２１１」）を使用した。
接着層としては、エチレン-酢酸ビニル共重合体を使用した。
【００１０】
各実施例及び比較例の右側の数字は各層の厚み（単位：μｍ）を示す。剥離強度以下の右枠内の記号はそれぞれの単位を示す。
【００１１】
【表１】
【表２】
表１において、実施例のみが引張り強度１９０ＭＰａ以上及び伸度１２０％以上の値であった。
【００１４】
表２において、使用基材を実際にカバーテープとして使用した際の優位性を比較した所、実施例でテープ切れは発生しなかったが、比較例１〜３ではあってはならないテープ切れが発生した。
【００１５】
表１、２中の記号は以下の通りである。
ＰＥＴ ：通常のポリエチレンテレフタレートフィルム
NEW PET ：分子構造制御を施したポリエチレンテレフタレートフィルム
CO PET ：共重合ポリエチレンテレフタレートフィルム
ＤＬ ：ドライラミネート接着剤
Ｏ− ：二軸延伸の意味
ＬＤＰＥ ：低密度ポリエチレン
ＥＶＡ ：エチレンー酢酸ビニル共重合体
【００１６】
【発明の効果】
本発明に従うと、実装機の高速化が進んでもテープ切れトラブルの発生する危険性が無くなり、従来の問題点である剥離時にテープ切れを起すという問題を解決することができた。
【図面の簡単な説明】
【 図１】本発明のカバーテープの基本の層構成を示す断面図である。
【符号の説明】
１：カバーテープ
２：基材層
３：接着層
４：中間層[0001]
[Technical field to which the invention belongs]
The present invention relates to a plastic carrier in which a storage pocket is formed, out of a package having a function of protecting electronic components from contamination and arranging and taking them out for mounting on an electronic circuit board when storing, transporting and mounting the electronic components. The present invention relates to a cover tape that can be sealed to the tape.
[0002]
[Prior art]
In recent years, surface mount electronic components such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc., are made of plastic with a continuous embossed pocket that can be accommodated according to the shape of the electronic components. The carrier tape and the cover tape that can be sealed with the carrier tape are packaged and supplied. The electronic components of the contents are automatically taken out after the cover tape of the package is peeled off and mounted on the surface of the electronic circuit board. However, with the rapid increase in mounting speed in recent years, the tension applied when peeling the cover tape is tight to prevent peeling failure, and the peeling speed is an instantaneous process of less than 0.1 seconds / tact. Since a large impact stress is applied to the cover, the so-called “tape break” problem that the cover tape is cut is a major problem.
[0003]
[Patent Document 1]
JP-A-8-119373 [Patent Document 2]
Japanese Patent Laid-Open No. 2003-34355
[Problems to be solved by the invention]
The present invention provides a cover tape that can prevent the occurrence of peeling failure such as tape breakage at the time of high-speed peeling operation in the mounting process in order to prevent the above-described troubles.
[0005]
[Means for Solving the Problems]
The present invention is (1) a cover tape that can be heat-sealed on a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, and is formed by laminating at least a base material layer and an adhesive layer. A cover tape for packaging electronic parts, characterized in that the material layer comprises a biaxially stretched film having an ethylene terephthalate unit of 96 mol% or more of the constituent components, a tensile strength in accordance with JIS K6734 of 190 MPa or more, and an elongation of 120% or more. ,
(2) The cover tape for packaging electronic parts according to (1), wherein an intermediate layer made of low-density polyethylene is laminated between the base material layer and the adhesive layer,
It is.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
An example of the layer structure of the cover tape (1) of the present invention will be described with reference to FIG. The base material layer (2) is a biaxially stretched film of polyethylene terephthalate that has been subjected to molecular structure control, and maintains the original tensile strength of the biaxially stretched polyethylene terephthalate film. It is a transparent and highly rigid film with a thickness of 6 to 50 μm that is easy to stretch, relaxes the force even when tension is applied, and is hard to break. If necessary, a lubricant or conductive fine powder for controlling the charging property of the cover tape may be applied.
[0007]
The adhesive layer (3) is not particularly limited as long as it is a material that can be adhered to the carrier tape by heat sealing. An ethylene copolymer, a polyester resin, an acrylic resin, or the like conventionally used as an adhesive layer of a cover tape Formed with.
In the present invention, a good cushioning property can be obtained during heat sealing by laminating an intermediate layer (4) made of low density polyethylene (LDPE) between the base material layer (2) and the adhesive layer (3).
[0008]
【Example】
Examples of the present invention are shown below, but the present invention is not limited to these examples.
<< Examples and Comparative Examples 1 to 3 >>
In Table 1, the physical properties of each of the base layer films used in Examples and Comparative Examples 1 to 3 were directly measured for commercially available films in Examples and Comparative Examples 1 and 2, and in Comparative Example 3 It measured about what laminated | stacked the biaxially stretched film of the base material layer by the dry lamination, and showed it collectively. Tensile strength and elongation were measured by a method based on JIS K6734.
In Examples and Comparative Examples 1 and 2, the outer layer was a biaxially stretched film, and the intermediate layer and the adhesive layer were laminated by an extrusion laminator. In Comparative Example 3, the two biaxially stretched films of the base material layer were laminated together by dry lamination, and then laminated by the same method as in the other examples. The resulting laminated film was slit to 5.5mm width, heat-sealed with 8mm width PS carrier tape so that the peel strength (measuring speed: 300mm / min) was equivalent (0.7N), and a high-speed peeling machine ( 42000 mm / min), the presence or absence of tape breakage was determined and shown in Table 2.
[0009]
The following were used as the base material layer.
Example: A film obtained by biaxially stretching polyethylene terephthalate subjected to molecular structure control ("Lumirror 20QR01" manufactured by Toray Industries, Inc.)
Comparative Example 1: Biaxially stretched copolymer polyester film (“TEFREX-FT” manufactured by Teijin DuPont)
Comparative Example 2: Normal biaxially stretched polyethylene terephthalate film ("Melinex" manufactured by ICI Japan)
Comparative Example 3: A film intermediate layer in which biaxially stretched nylon (“Emblem ON” manufactured by Unitika) was laminated on a normal biaxially stretched polyethylene terephthalate film (“Melinex” manufactured by ICI Japan) was low Density polyethylene (“Sumikasen L211” manufactured by Sumitomo Mitsui Polyolefin Co., Ltd.) was used.
As the adhesive layer, an ethylene-vinyl acetate copolymer was used.
[0010]
The numbers on the right side of each example and comparative example indicate the thickness (unit: μm) of each layer. The symbol in the right frame below the peel strength indicates each unit.
[0011]
[Table 1]
[Table 2]
In Table 1, only Examples had values of a tensile strength of 190 MPa or more and an elongation of 120% or more.
[0014]
In Table 2, the superiority when the substrate used was actually used as a cover tape was compared. In the examples, tape breakage did not occur, but tape breakage that should not be in Comparative Examples 1 to 3 occurred. did.
[0015]
The symbols in Tables 1 and 2 are as follows.
PET: Normal polyethylene terephthalate film
NEW PET: Polyethylene terephthalate film with molecular structure control
CO PET: Copolymerized polyethylene terephthalate film DL: Dry laminate adhesive O-: Meaning of biaxial stretching LDPE: Low density polyethylene EVA: Ethylene-vinyl acetate copolymer
【The invention's effect】
According to the present invention, even if the speed of the mounting machine is increased, there is no risk of occurrence of a tape break problem, and the problem of tape breakage at the time of peeling, which is a conventional problem, can be solved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a basic layer structure of a cover tape of the present invention.
[Explanation of symbols]
1: Cover tape 2: Base material layer 3: Adhesive layer 4: Intermediate layer
Claims (2)
該基材層が、エチレンテレフタレート単位が構成成分の９６モル％以上である樹脂からなる二軸延伸フィルムであり、
更に該二軸延伸フィルムのＪＩＳ Ｋ６７３４に順ずる引張強度が１９０ＭＰａ以上であり、かつ伸度が１２０％以上であることを特徴とする電子部品包装用カバーテープ。It is a cover tape that can be heat-sealed on a plastic carrier tape in which storage pockets for storing electronic components are continuously formed, and is formed by laminating at least a base material layer and an adhesive layer,
The substrate layer is a biaxially oriented film of ethylene terephthalate units consists of a resin is not less than 96 mol% of the component,
A cover tape for packaging electronic parts, wherein the biaxially stretched film has a tensile strength in accordance with JIS K6734 of 190 MPa or more and an elongation of 120% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003180891A JP4152266B2 (en) | 2003-06-25 | 2003-06-25 | Cover tape for packaging electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003180891A JP4152266B2 (en) | 2003-06-25 | 2003-06-25 | Cover tape for packaging electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005014955A JP2005014955A (en) | 2005-01-20 |
| JP4152266B2 true JP4152266B2 (en) | 2008-09-17 |
Family
ID=34181747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003180891A Expired - Fee Related JP4152266B2 (en) | 2003-06-25 | 2003-06-25 | Cover tape for packaging electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4152266B2 (en) |
-
2003
- 2003-06-25 JP JP2003180891A patent/JP4152266B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JP2005014955A (en) | 2005-01-20 |
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