JP4880831B2 - Mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting device used in, for example, a probe device, and more particularly to a mounting device that can improve load resistance during probe inspection.
[0002]
[Prior art]
The probe device includes a mounting device for mounting an object to be inspected such as a wafer to perform predetermined electrical characteristics. In order to generate heat during the inspection of the inspection object, the inspection object is cooled via the mounting device, or depending on the type of the inspection object, the inspection object is set to a high or low temperature via the mounting device. May be inspected.
[0003]
For example, a conventional mounting apparatus includes a mounting body that also serves as a cooling jacket, a heater, and a lifting body. When cooling, a cooling medium is supplied to the cooling jacket to cool the upper surface of the mounting body, thereby In the case of cooling to a predetermined temperature and heating, the mounting body is heated using a heater to heat the object to be inspected on the mounting body to a predetermined temperature.
[0004]
In addition, a plurality of elevating pins are provided in the inside of the above-mentioned mounting body so as to be able to move up and down, and the object to be inspected is delivered via these elevating pins. When inspecting the object to be inspected, the mounting body is raised to overdrive the object to be inspected, and the electrode pad of the object to be inspected and the probe disposed above it are brought into contact with each other with a predetermined needle pressure. The electrical characteristics of the specimen are inspected.
[0005]
[Problems to be solved by the invention]
However, in the case of a conventional mounting apparatus, the mounting body is formed in a hollow shape by a top plate and a bottom plate having an outer peripheral wall, so that the mounting pad overdrives the electrode pad of the object to be inspected. When the needle pressure is received from the probe, the top plate of the mounting body is slightly deformed and sinks due to the needle pressure, the probe is displaced from the electrode pad, and the bottom plate is also slightly distorted, and the reliability of the inspection There was a possibility of lowering. In particular, a slight misalignment may become a serious problem as ultra-miniaturization of an object to be inspected progresses.
[0006]
The present invention has been made in order to solve the above-described problems, and improves load resistance against needle pressure, prevents elastic deformation of the top plate and distortion of the bottom plate, and enhances the airtightness of the mounting body. It aims at providing the mounting apparatus which can perform a test | inspection with high reliability.
[0007]
[Means for Solving the Problems]
Mounting apparatus according to claim 1 of the present invention, and the top to form a space therein overlapping a bottom plate having a top plate and an outer peripheral wall having a plurality of circular grooves formed concentrically on the upper surface adsorbing the object to be inspected placed on the plate, the mounting body to be fixed, and a temperature adjusting mechanism for adjusting the temperature of the inspection object on the mounting body, electrical of the object to be inspected when performing characteristic test, the mounting apparatus for adjusting the temperature of the object to be inspected on the upper described mounting body via the temperature adjustment mechanism, the top throughout the space provided with a case for housing the bottom plate plate the bottom plate and formed integrally with a plurality of supports for supporting the lower surface and distributed and through these supports comprises a structure for supporting the top plate, in the radial direction in the above described mounting body Arranged A plurality of exhaust passages that respectively penetrate the plurality of support bodies and open by the plurality of circular grooves formed in the top plate are provided, and the plurality of exhaust passages are connected through a plurality of nozzles corresponding thereto. An exhaust nozzle that joins two exhaust passages to exhaust is attached to the case .
[0009]
Also, mounting device according to claim 2 is the invention according to claim 1, it is characterized in that the casing is formed by a material having higher elasticity modulus than the bottom plate.
[0010]
According to a third aspect of the present invention, there is provided the mounting apparatus according to the first or second aspect , wherein the bottom plate and the case are provided with a plurality of heat medium supply ports dispersed therein. A small number of heat medium discharge ports are provided in a distributed manner from the heat medium supply port.
[0011]
According to a fourth aspect of the present invention, there is provided a mounting apparatus according to the third aspect , wherein a supply nozzle is replaceably attached to each of the heat medium supply ports.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on the embodiment shown in FIGS.
As shown in FIG. 1, for example, the mounting apparatus 1 of the present embodiment includes a mounting body 2 on which an object to be inspected (for example, a wafer) W is mounted, and a temperature adjustment mechanism that adjusts the temperature of the mounting body 2. And a base 3 that supports the mounting body 2, and a lifting / lowering body 4 that moves the mounting body 2 up and down in the Z direction via the base 3, and on the mounting body 2 through a temperature adjustment mechanism. The electrical characteristics of the object to be inspected are inspected at a predetermined temperature by adjusting the temperature of the wafer W. The mounting device 1 is configured to be movable in the X and Y directions via an XY drive mechanism in an inspection room (not shown) of the probe device, and ascends and descends in the Z direction via a lifting body 4. It is configured to be possible. Further, the mounting body 2 itself is configured to be able to rotate forward and backward in the θ direction within a predetermined range via a θ driving mechanism (not shown). A probe card (not shown) is disposed above the placement device 1, and the placement device 1 cooperates with an alignment mechanism (not shown) on the placement body 2 as is conventionally known at the time of inspection. After aligning the wafer W with the probe of the probe card, the wafer W is indexed to bring the electrode pad of the wafer W into electrical contact with the probe, and the electrical property inspection of the wafer W is repeatedly performed.
[0014]
Thus, as shown in FIG. 1 to FIG. 3, the mounting body 2 supports a circular top plate 2 </ b> A provided with a ceramic heater (not shown) such as aluminum nitride and the top plate 2 </ b> A. A bottom plate 2B having a slightly smaller diameter and a case 2C having the same outer diameter as the top plate 2A in which the bottom plate 2B is accommodated, and a space is formed between the top plate 2A and the bottom plate 2B. ing. As shown in FIGS. 1 to 3, the bottom plate 2 </ b> B has an outer peripheral wall 2 </ b> D formed along the outer peripheral edge, and is formed of ceramic such as machinable ceramic. On the inner surface of the bottom plate 2B, a large number of prismatic supports 2E are integrally formed of ceramic with the bottom plate 2B. These supports 2E are distributed and arranged in a matrix on the entire surface of the bottom plate 2B as shown in FIG. 3, and support the top plate 2A in cooperation with the outer peripheral wall 2D as shown in FIG. Accordingly, since the support 2E exists immediately below or in the vicinity of the stylus pressure at any location on the wafer W on the top plate 2A, the top plate 2A does not bend and has high load resistance. It has become. Further, the case 2C has an outer peripheral wall 2F that contacts the top plate 2A together with the outer peripheral wall 2D of the bottom plate 2B by a metal such as aluminum having a higher elastic modulus than the bottom plate 2B, for example. Increases airtightness. Therefore, the bottom plate 2B is reinforced in strength by the case 2C to prevent distortion.
[0015]
As shown in FIG. 2A, the bottom plate 2B and the case 2C have, for example, eight heat medium supply ports (hereinafter simply referred to as “supply ports”) 2G and two heat medium discharge ports 2H. Are respectively provided, supply a refrigerant as a heat medium from each supply port 2G, directly cool the top plate 2A, and discharge the endothermic refrigerant from the discharge port 2H. For example, a gas such as air can be used as the refrigerant. In this embodiment, for example, air is used as the refrigerant. Of the eight supply ports 2G, the four first supply ports 2G are arranged at symmetrical positions in the vertical and horizontal directions, and a regular square is formed by the connection of these supply ports 2G. The other four second supply ports 2G are respectively arranged outside the midpoint of each side of the regular square. Further, the two outlets 2H are arranged on the diameter of the bottom plate 2B as shown in FIGS. 2 (a) and 2 (b). Two second supply ports 2G are also located on this straight line. Further, supply nozzles 5 (see FIG. 4A) are attached to the eight supply ports 2G, respectively, so that refrigerant is injected from each supply nozzle 5. As shown by the arrows in FIG. 1, the injected refrigerant instantaneously spreads over the entire internal space by sewing the gap between the supports 2 </ b> E within the mounting body 2. Since the refrigerant forms a turbulent flow through the support 2E, the top plate 2A can be efficiently cooled. As shown by arrows in FIG. 1, the refrigerant that has spread throughout the entire mounting body 2 converges at two outlets 2H near the center of the mounting body 2, and is discharged from these outlets 2H. A discharge nozzle (not shown) formed in the same manner as the supply nozzle 5 is attached to the discharge port 2H, and is exhausted to the outside through the discharge nozzle. The area of the opening 5A of the supply nozzle 5 is set to be smaller than the opening area of the discharge nozzle, so that the refrigerant can be supplied from the supply nozzle 5 at a higher speed and can spread more quickly in the mounting body 2. ing.
[0016]
Further, for example, a plurality of supply nozzles 5 (see FIG. 4A) and a plurality of discharge nozzles are embedded in the base 3 in a replaceable manner, and these supply nozzles 5 and discharge nozzles are shown in FIGS. 1 is attached to the supply port 2G and the discharge port 2H of the mounting body 2 to form a flow path as shown in FIG. The supply nozzle 5 and the discharge nozzle are connected to a supply source and discharge means via an air supply pipe (not shown) and a discharge pipe (not shown), respectively. Each of these supply nozzles 5 branches from the supply pipe and communicates with the eight supply ports 2G of the mounting body 2, and the discharge nozzle 3B also branches from the discharge pipe and discharges at two places on the mounting body 2. It communicates with the outlet 2H. Since the supply nozzle 5 and the discharge nozzle are configured to be replaceable as described above, the supply nozzle 5 and the discharge nozzle can be appropriately replaced in accordance with the specifications of the mounting device 1, and a plurality of different calibers and shapes are prepared. It can also be left.
[0017]
Further, as shown in FIG. 3, a plurality of supports 2E arranged in a straight line in the radial direction in the mounting body 2 are formed with vacuum exhaust passages 2I used for vacuum suction of the wafer W, and these vacuums are formed. The exhaust passage 2I is open at a plurality of circular grooves 2J formed concentrically on the surface of the top plate 2A. As shown in FIG. 3, a long hole 2K is formed in the case 2C in accordance with a range where a plurality of vacuum exhaust passages 2I are arranged, and a vacuum exhaust nozzle 6 (see FIG. 4B) is mounted in the long hole 2K. Has been. The vacuum exhaust nozzle 6 is integrally formed with a plurality of nozzles 6A corresponding to the vacuum exhaust path 2I. And the exhaust passage (not shown) of a plurality of nozzles merges in the vacuum exhaust nozzle 6, and the vacuum exhaust device is connected to the opening of the confluence passage. The vacuum exhaust nozzle 6 is embedded in the base 3 like the supply nozzle 5 and the discharge nozzle. Further, in the vicinity of the center of the mounting body 2, holes 2 </ b> L through which a plurality of (for example, three) elevating pins (not shown) elevate and lower are formed on the same circumference at equal intervals in the circumferential direction. The lift pins protrude from the top plate 2 </ b> A when the wafer W is transferred, and retract into the mounting body 2 after the wafer W is transferred.
[0018]
Further, as shown in FIG. 1, the temperature adjusting mechanism includes a heater built in the top plate 2A, a refrigerant supply port 2G and a discharge port 2H, and is controlled by a control device (not shown). When the wafer W is heated, the heater is operated, and when the wafer W is cooled, the refrigerant is supplied and discharged through the supply port 2G and the discharge port 2H in the mounting body 2. Since the heater is built in the top plate 2A, the wafer W is directly heated, so that the wafer W can be heated to a predetermined set temperature in a short time. In addition, since the refrigerant forms a turbulent flow from the supply port 2G to the entire space in the mounting body 2 and spreads in a short time, and the top plate 2A is directly cooled by the refrigerant, the wafer W is cooled in a short time. Can do.
[0019]
Next, the operation will be described. First, when the wafer W is transferred to the mounting body 2 via a transfer mechanism (not shown), the wafer W is received via the lifting pins and placed on the top plate 2A. Next, after the air is exhausted from the vacuum exhaust nozzle 6 and the wafer W is vacuum-adsorbed and fixed on the top plate 2A, the mounting apparatus 1 moves in the X, Y, Z, and θ directions and cooperates with the alignment mechanism. Then, the wafer W and the probe are aligned. For example, when performing a high-temperature inspection of the wafer W, the heater operates to heat the wafer W to a predetermined temperature during alignment.
[0020]
Subsequently, the mounting table 1 feeds the wafer W to the position just below the probe by index feeding, and then overdrives the wafer W via the lifting body 4 to bring the wafer W and the probe into electrical contact. At this time, the needle pressure acts on the wafer W, but since the top plate 2A is supported by the support 2E, there is no possibility that the top plate 2A is elastically deformed, and the probe is displaced from the electrode pad of the wafer W. Therefore, the high-temperature inspection of the wafer W can be reliably performed. When the index feed is repeated and the high temperature inspection of the wafer W is completed, the temperature adjusting mechanism turns off the power of the heater, and the air is cooled into the mounting body 2 from the eight supply ports 2G through the supply nozzles 5. Supply as. When air is ejected from each supply nozzle 5 as shown by arrows in FIG. 1, the gap between the supports 2E is sewn to form a turbulent flow as shown in FIG. The top plate 2A is cooled in a short time to lower the temperature of the top plate 2A. The endothermic air is discharged from the outlet 2H as indicated by an arrow in FIG.
[0021]
As described above, according to the present embodiment, a plurality of supports 2E are distributed and arranged in a matrix in the entire space in the mounting body 2, and the top plate 2A is supported via these supports 2E. Since the bottom plate 2B is reinforced by the case 2C, even if the needle pressure acts on the wafer W when the wafer W is inspected, the point of action of the needle pressure is directly above or near the support 2E. In addition, in combination with the reinforcing action of the case 2C, the top plate 2A can be prevented from sinking (elastically deformed). As a result, the positional deviation between the electrode of the wafer W and the probe can be eliminated, and a highly reliable inspection can be performed. . Further, when the mounting body 2 is cooled using the refrigerant, the refrigerant spreads over the entire space in the mounting body 2 while forming a turbulent flow through the support 2E, so that the cooling capacity of the refrigerant is maximized. Can do.
[0022]
Further, according to the present embodiment, since the plurality of support bodies 2E are formed integrally with the bottom plate 2B, it can be formed with high accuracy by a mold or the like. In addition, a plurality of supply ports 2G are provided in the bottom plate 2B in a distributed manner, and a smaller number of discharge ports 2H than the supply ports 2G are provided and more supply ports 2G are provided than the discharge ports 2H. Fresh refrigerant (air in the present embodiment) can be vigorously supplied to uniformly contact the entire area of the top plate 2A at high speed, and the endothermic refrigerant can be focused to extend the residence time of the refrigerant, As a result, the top plate 2A can be cooled in a short time.
[0023]
Further, according to the present embodiment, since the case 2C is formed of a material having a higher elastic modulus than the bottom plate 2B, the outer peripheral wall 2F of the case 2C is more familiar with the contact with the top plate 2A than the outer peripheral wall 2D of the bottom plate 2B. The outer peripheral walls 2F and 2D simultaneously come into contact with the top plate 2A to increase the contact area, and the airtightness of the mounting body 2 can be further improved. Further, since the supply nozzle 5 is replaceably mounted, if the supply nozzle 5 having a different diameter of the air supply hole is prepared according to the air flow rate, the supply nozzle 5 is appropriately replaced according to the air flow rate at that time. be able to. Further, since the vacuum discharge passage 2I for sucking the wafer W is connected to each of the top plate 2A and the support 2E, it is not necessary to provide a unique pipe in the mounting body 2 for evacuation. It can be simplified.
[0024]
In addition, this invention is not restrict | limited at all to the said embodiment, The design change of each component of this invention can be carried out as needed. For example, in the present embodiment, the support is integrally formed with the bottom plate. However, the support may be integrated with the top plate.
[0025]
【Effect of the invention】
According to the first aspect of the present invention, the load resistance against needle pressure is improved, the elastic deformation of the top plate and the distortion of the bottom plate are prevented, and the airtightness of the mounting body that also serves as a cooling jacket is improved. In addition, there is no need to provide a unique pipe in the mounting body for evacuation when suctioning the object to be inspected. It is possible to provide a mounting device that can independently adjust the suction force and can perform a highly reliable inspection.
[0027]
According to the invention described in claim 2 of the present invention, in the invention described in claim 1 , the case is more adapted to contact with the top plate than the bottom plate, so that the airtightness is increased and the airtightness of the mounting body is increased. The mounting apparatus which can be raised can be provided.
[0028]
Further, according to the invention described in claim 3 of the present invention, in the invention described in claim 1 or 2 , fresh refrigerant is vigorously supplied through a plurality of heat medium supply ports, so that the top is reached at high speed. It is possible to provide a mounting device that can uniformly contact the entire region of the plate, focus the endothermic refrigerant, extend the residence time of the refrigerant, and can cool the top plate in a short time. .
[0029]
According to the invention described in claim 4 of the present invention, in the invention described in claim 3 , if a plurality of types of supply nozzles having different diameters and shapes of the air supply holes are prepared, the heat at that time is prepared. It is possible to provide a mounting device that can appropriately replace the supply nozzle in accordance with specifications such as the flow rate of the medium.
[Brief description of the drawings]
FIG. 1 is a schematic diagram for explaining a main part of an embodiment of a mounting apparatus of the present invention.
2 is an enlarged view of the bottom plate shown in FIG. 1, wherein (a) is a plan view thereof, and (b) is a sectional view taken along the line BB.
3 is an exploded perspective view showing a main part of the mounting body shown in FIG. 1. FIG.
4A and 4B are diagrams showing a nozzle used in the mounting body shown in FIG. 1, wherein FIG. 4A is a perspective view showing a supply nozzle, and FIG. 4B is a perspective view showing a vacuum exhaust nozzle.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Mounting body 2A Top plate 2B Bottom plate 2C Case 2E Support body 2G Supply port (heat medium supply port)
5 Supply nozzle 2I Vacuum exhaust path (exhaust path)

Claims (4)

Top concentrically formed a plurality of adsorption of the object to be inspected placed on the bottom plate inside to form a space overlapping with and the top plate having a top plate and an outer peripheral wall having a circular groove, secured a mounting body to a temperature adjusting mechanism for adjusting the temperature of the inspection object on the mounting body comprises, when inspecting electrical characteristics of the inspection object, through the temperature adjusting mechanism in mounting apparatus for adjusting the temperature of the object to be inspected on the upper described mounting body, a plurality of supports for supporting the top plate from the lower surface to the entire the space provided with a case for accommodating the bottom plate and distributed Te the bottom plate and integrally formed, having a structure for supporting the top plate through these supports, a plurality of the support arranged in the radial direction in the above described mounting body and through respective且Exhaust gas that is provided with a plurality of exhaust passages that are respectively opened by the plurality of circular grooves formed in the top plate and exhausts the plurality of exhaust passages through a plurality of nozzles corresponding to the exhaust passages. A mounting apparatus comprising a nozzle mounted on the case . The mounting apparatus according to claim 1, wherein the case is formed of a material having a higher elastic modulus than the bottom plate. Each said bottom plate and the casing, according to claim 1 or claim, characterized in that provided a small number of heat medium outlet is dispersed from the heat medium supply port provided with dispersing a plurality of heating medium supply port 2. The mounting device according to 2 . The mounting apparatus according to claim 3 , wherein a supply nozzle is replaceably attached to each of the heat medium supply ports.

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