JP5637766B2 - Mounting apparatus, mounting method, and joined body - Google Patents

Description

  The present invention relates to a mounting apparatus, a mounting method, and a bonded body on which a mounting component is mounted by the method, wherein the mounting component is bonded to a mounting portion of a substrate or panel by thermocompression bonding via an anisotropic conductive film.

  2. Description of the Related Art Conventionally, liquid crystal display devices are often used as various display means such as televisions, PC monitors, mobile phones, portable game machines, and in-vehicle monitors. In recent years, in such liquid crystal display devices, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit from the viewpoints of fine pitch, light weight, and thinning. A so-called FOG (film on glass) that directly mounts the flexible substrate on which the substrate is formed on the substrate of the liquid crystal display panel is employed.

  For example, as shown in FIG. 6, a liquid crystal display device 100 employing a COG mounting system has a liquid crystal display panel 104 that performs a main function for liquid crystal display. The liquid crystal display panel 104 is a glass substrate or the like. And two transparent substrates 102 and 103 facing each other. In the liquid crystal display panel 104, the transparent substrates 102 and 103 are bonded to each other by a frame-shaped seal 105, and the liquid crystal 106 is sealed in a space surrounded by the transparent substrates 102 and 103 and the seal 105. A panel display unit 107 is provided.

  The transparent substrates 102 and 103 have a pair of striped transparent electrodes 108 and 109 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 102 and 103 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 108 and 109.

  Of the two transparent substrates 102 and 103, one transparent substrate 103 is formed to have a larger planar dimension than the other transparent substrate 102, and the transparent electrode 109 is formed on the edge 103a of the transparent substrate 103 formed to be large. Terminal portion 109a is formed. Further, alignment films 111 and 112 subjected to a predetermined rubbing process are formed on both transparent electrodes 108 and 109, and the initial alignment of liquid crystal molecules is regulated by the alignment films 111 and 112. ing. Further, a pair of polarizing plates 118 and 119 are disposed outside both the transparent substrates 108 and 109, and the vibration direction of transmitted light from the light source 120 such as a backlight is regulated by both the polarizing plates 118 and 119. It has come to be.

  On the terminal portion 109a, a liquid crystal driving IC 115 is thermocompression bonded via an anisotropic conductive film 114. The anisotropic conductive film 114 is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between the two conductors so that the electrical conduction between the conductors is achieved by the conductive particles. The mechanical connection between the conductors is maintained by the binder resin. The liquid crystal driving IC 115 can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels. In addition, as the adhesive constituting the anisotropic conductive film 114, the most reliable thermosetting adhesive is usually used.

  When the liquid crystal driving IC 115 is connected to the terminal portion 109a through such an anisotropic conductive film 114, first, the anisotropic conductive film 114 is attached to the terminal portion 109a of the transparent electrode 109 by a temporary crimping means (not shown). Temporarily crimp. Subsequently, after the liquid crystal driving IC 115 is placed on the anisotropic conductive film 114, the liquid crystal driving IC 115 is connected to the terminal together with the anisotropic conductive film 114 by thermocompression bonding means 121 such as a thermocompression bonding head as shown in FIG. The thermocompression bonding means 121 is caused to generate heat while being pressed toward the portion 109a. Due to the heat generated by the thermocompression bonding means 121, the anisotropic conductive film 114 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 115 is bonded onto the terminal portion 109a via the anisotropic conductive film 114.

  By the way, recently, along with the trend toward thin and light display devices, the liquid crystal display device 100 itself has been reduced in size and weight, while it has been required to secure the display area of the liquid crystal display device 100 as much as possible. It is required to make the edge 103a provided with the portion 109a as small as possible.

  Along with this, the distance between the terminal portion 109a thermally pressed by the thermocompression bonding means 121 and the panel display portion 107 becomes shorter, and the heating temperature tends to increase with the miniaturization of the thermocompression bonding means 121. Therefore, there is a problem that the polarizing plates 118 and 119 attached to the liquid crystal display panel 104 and the seal 105 sealing the transparent substrates 102 and 103 are deteriorated by the heat.

  Further, as shown in FIG. 8, when a flexible substrate 122 on which a liquid crystal driving circuit is formed is mounted near the liquid crystal driving IC 115 that is bare-chip mounted on the terminal portion 109a of the liquid crystal panel, thermocompression bonding means There is also a problem that a thermal shock is applied to the liquid crystal driving IC 115 due to heat from the crimping portion 121, and the mounting state on the terminal portion 109a becomes unstable.

JP 2003-195335 A

  Therefore, the present invention provides a mounting apparatus and mounting method for mounting an electronic component on a narrowed terminal portion by applying heat and pressure via an anisotropic conductive film to a component such as a panel display unit or another electronic component. It is an object of the present invention to provide a mounting apparatus, a mounting method, and a bonded body that can reduce thermal shock.

In order to solve the above-described problem, the mounting apparatus according to the present invention can face and close to the mounting portion of the board or panel to which the mounting component is connected via the anisotropic conductive film. a heating press head, the heating press head, the heat blocking portion is provided on the side facing the other components provided in the mounting portion near the substrate or panel, the hot-pressing head, the mounting portion The mounting component placed on the anisotropic conductive film that has been temporarily press-bonded to the mounting portion is subjected to thermo-pressing on the mounting portion to cause a thermosetting reaction to the mounting component. It is to be mounted on a substrate .

In addition, the mounting method according to the present invention is a method in which an anisotropic conductive film is temporarily pressure-bonded on a mounting portion of a substrate or a panel, and a mounting component is placed on the mounting portion via the anisotropic conductive film. The anisotropy is achieved by heat-pressing the mounting component on the mounting portion with a heat pressing head provided with a heat-blocking portion on the side facing the other component provided near the mounting portion of the substrate or panel. The mounting component is mounted on the substrate by causing a thermosetting reaction in the conductive film .

  Moreover, the joined body concerning this invention is manufactured using the said mounting method.

  According to the present invention, since the heat blocking part is provided on the side facing the other component parts provided in the vicinity of the board mounting part of the heating and pressing head, the heat of the head can be prevented from being transmitted. It is possible to prevent the component parts from being deteriorated by heat and the connectivity to the substrate from being impaired.

It is a side view which shows the mounting apparatus with which this invention was applied. It is sectional drawing which shows the other heating press head to which this invention was applied. It is sectional drawing which shows the other heating press head to which this invention was applied. It is sectional drawing which shows the other heating press head to which this invention was applied. It is a side view which shows the FOG mounting process to which this invention was applied. It is sectional drawing which shows the conventional liquid crystal display panel. It is sectional drawing which shows the COG mounting process of the conventional liquid crystal display panel. It is sectional drawing which shows the FOG mounting process of the conventional liquid crystal display panel.

  Hereinafter, a mounting apparatus, a mounting method, and a joined body to which the present invention is applied will be described in detail with reference to the drawings. The mounting apparatus 1 to which the present invention is applied includes a so-called COG (chip on glass) mounting in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel, and a flexible substrate on which a liquid crystal driving circuit is formed. So-called FOG (film on glass) mounting is performed.

  Prior to the description of the mounting apparatus 1, a liquid crystal display panel 10 on which a flexible substrate on which a liquid crystal driving IC and a liquid crystal driving circuit are formed by the mounting apparatus 1 is mounted will be described with reference to FIG. In the liquid crystal display panel 10, similarly to the liquid crystal display panel 104, two transparent substrates 11 and 12 made of a glass substrate or the like are arranged to face each other, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. Yes. In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.

  The transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 16 and 17.

  Of the transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and a liquid crystal driving edge is formed on the edge 12a of the formed transparent substrate 12. A COG mounting unit 20 on which an electronic component 18 such as an IC is mounted is provided, and an FOG mounting unit 22 on which a flexible substrate 21 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting unit 20. ing.

  Note that the liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.

  In each of the mounting portions 20 and 22, a terminal portion 17a of the transparent electrode 17 is formed. On the terminal portion 17a, an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 are thermocompression bonded via an anisotropic conductive film 23. The anisotropic conductive film 23 contains conductive particles, and the electrode of the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 are electrically conductive. Electrical connection is made through particles. The anisotropic conductive film 23 is a thermosetting adhesive, and is cured in a state where the conductive particles are crushed by being thermocompression bonded by a heating and pressing head 3 described later, and the transparent substrate 12 and the electronic component. 18 and the flexible substrate 21 are connected.

  Specifically, the anisotropic conductive film 23 has a composition in which conductive particles are contained in an organic resin binder, and the organic resin binder includes a film forming material, a liquid curing component, a silane coupling agent, a curing agent, and the like. The As the film forming material, any organic resin having film forming ability such as phenoxy resin and solid epoxy resin can be used as appropriate. As the liquid curing component, a thermosetting compound such as a liquid epoxy resin or liquid acrylate can be appropriately used. As a curing agent when a liquid epoxy resin is used, an amine-based curing agent, imidazoles, sulfonium salts, onium salts and the like can be preferably used. As a curing agent when a liquid acrylate is used, a thermal radical generator such as an organic peroxide can be preferably used. Furthermore, you may use an inorganic filler and various additives.

  When the electronic component 18 or the flexible substrate 21 is connected to the terminal portion 17a through such an anisotropic conductive film 23, first, the anisotropic conductive film 23 is not illustrated on the terminal portion 17a of the transparent electrode 17. Temporary pressure bonding is performed by a pressure bonding means. Subsequently, after the electronic component 18 and the flexible substrate 21 are placed on the anisotropic conductive film 23, the electronic component 18 and the flexible substrate 21 together with the anisotropic conductive film 23 are connected to the terminal portion by the heat pressing head 3 serving as a thermocompression bonding means. The heating and pressing head 3 generates heat while pressing toward the 17a side. Due to the heat generated by the heating and pressing head 3, the anisotropic conductive film 23 undergoes a thermosetting reaction, whereby the electronic component 18 and the flexible substrate 21 are bonded onto the terminal portion 17a via the anisotropic conductive film 23. .

  Further, an alignment film 24 subjected to a predetermined rubbing process is formed on both the transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24. In addition, a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.

[Mounting device 1]
The mounting apparatus 1 mounts the electronic component 18 on the COG mounting portion 20 of the liquid crystal display panel 10 and also mounts the flexible substrate 21 on the FOG mounting portion 22. As shown in FIG. A stage 2 on which the panel 10 is placed, and a heating and pressing head 3 for mounting an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 on the mounting parts 20 and 22 of the liquid crystal display panel 10 placed on the stage 2. And a head driving mechanism 4 that moves the heating and pressing head 3 close to and away from the mounting parts 20 and 22.

  The stage 2 has a size sufficient for mounting the liquid crystal display panel 10, and the liquid crystal display panel 10 is positioned and mounted. When the liquid crystal display panel 10 is positioned and placed on the stage 2, the heating press head 3 is provided so as to face the COG mounting portion 20 and the FOG mounting portion 22 provided on the edge portion 12 a of the transparent substrate 12. ing.

  The heating and pressing head 3 includes a pressing surface 3a that presses the electronic component 18 and the flexible substrate 21, and a head body 3b that incorporates a heater. The heating and pressing head 3 presses the pressing surface 3a heated to a predetermined temperature against the electronic component 18 and the flexible substrate 21 at a predetermined pressure and time, so that the anisotropic conductive film 23 is pressed by the conductive particles. It cures in a crushed state.

  Further, the heat pressing head 3 is provided with a heat blocking portion 5 in the head main body 3b. The heat shield 5 prevents the heat of the head body 3b from being transmitted to the components on the transparent substrate 12, such as the electronic component 18 and the panel display unit 15. The heat blocking part 5 can be formed using any material such as metal or resin as long as it has a lower thermal conductivity than the head body 3b. Moreover, the heat shield 5 may have an air layer. The air layer may be formed by a planar space along the side surface of the head body 3b in the low thermal conductivity material, or may be formed as a bubble in the low thermal conductivity material.

  The heat blocking unit 5 is formed on at least a side surface of the head main body 3b facing the electronic component 18 and the panel display unit 15. This is because the liquid crystal display panel 10 forms the panel display unit 15, mounts the electronic component 18 by COG, and then mounts the flexible substrate 21 by FOG. This is to prevent the heat of the head body 3b from being transmitted to the portion 15 and the electronic component 18.

  0.02-0.5 W / mk is preferable and 0.02-0.08 W / mk is more preferable as the thermal conductivity of the material constituting the heat blocking portion 5. Examples of such materials include glass wool (thermal conductivity: 0.05 W / mk), rock wool (thermal conductivity: 0.04 W / mk), and rigid urethane foam (thermal conductivity: 0.026 W / mk). Etc.

  Further, as shown in FIG. 2, the heat shut-off unit 5 may be formed over other sides including the side facing the electronic component 18 and the panel display unit 15 of the head main body 3 b and the entire periphery. Thereby, the heat press head 3 can prevent the heat | fever of the head main body 3b from diffusing to circumference | surroundings, and can suppress the influence by the heat with respect to a surrounding member.

[Connector]
Further, as shown in FIG. 3, the heat shield 5 may be connected to the head body 3 b via a connector 30. The heat pressing head 3 increases the heat blocking effect on the electronic component 18 and the panel display unit 15 by separating the heat blocking unit 5 and the head main body 3b through the connector 30 and interposing an air layer. be able to. Further, since the heat shield 5 is connected to the head body 3b via the connector 30, replacement due to deterioration of the heat shield 5 or the like is facilitated.

[heatsink]
In addition, as shown in FIG. 4, the heat pressing head 3 may connect the heat blocking unit 5 to the head main body 3 b and connect it via 30, and may provide a heat sink 31 on the heat blocking unit 5. By providing the heat sink 31, the heat transmitted to the heat blocking unit 5 can be dissipated and the heat blocking efficiency can be maintained. The heat sink 31 is provided in a part of the heat blocking part 5, for example, the upper end part 5a. By providing the heat sink 31 at the upper end portion 5a of the heat blocking unit 5, heat is transmitted to these components without the heat sink 31 facing the components on the transparent substrate 12 such as the electronic component 18 and the panel display unit 15. There is nothing.

[Head drive mechanism]
The head driving mechanism 4 that drives the heating and pressing head 3 supports the heating and pressing head 3 so as to be movable up and down so as to be close to and away from the COF mounting unit 20 and the FOG mounting unit 22, as well as the head body 3 b moving up and down. The drive of the heater built in the head main body 3b is controlled. The head driving mechanism 4 drives the heater in the head main body 3b to heat it to a predetermined temperature when mounting the electronic component 18 and the flexible substrate 21, and also heats the heating and pressing head 3 with a predetermined pressure for a predetermined time. 18 and the flexible substrate 21 are driven to be pressed.

[Mounting method]
Next, a process of performing COG mounting and FOG mounting on the liquid crystal display panel 10 using the mounting apparatus 1 will be described. As shown in FIG. 1, the mounting apparatus 1 has a liquid crystal display panel 10 positioned and placed on a stage 2. At this time, in the liquid crystal display panel 10, the transparent substrates 11 and 12 are bonded together by the seal 13, and the liquid crystal is sealed in the internal space. Further, the liquid crystal display panel 10 is provided with transparent electrodes 16 and 17 on the inner surfaces facing each other, and the edge of the transparent substrate 12 is provided with the COG mounting portion 20 and the FOG in which the terminal portions 17a of the transparent electrodes 17 are formed, respectively. A mounting portion 22 is provided. Further, in the liquid crystal display panel 10, an alignment film 24 subjected to a predetermined rubbing process is formed on the transparent electrodes 16 and 17. A pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12.

  First, the anisotropic conductive film 23 is disposed on the terminal portion 17 a of the COG mounting portion 20. At this time, the heating and pressing head 3 is supported above the COG mounting portion 20 by the head driving mechanism 4. Next, an electronic component 18 such as a liquid crystal driving IC is disposed on the anisotropic conductive film 23. The heating and pressing head 3 is controlled so that the head main body 3b is heated to a predetermined temperature by the head driving mechanism 4 and the pressing surface 3a is lowered so as to press the electronic component 18 and is pressed for a predetermined pressure and time. Is done. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the electronic component 18 and the terminal part 17a.

  At this time, the heat-pressing head 3 is provided with the heat blocking portion 5 on the side surface facing the panel display portion 15 of the head main body 3b. Can be prevented from being transmitted. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 is narrowed and the head main body 3b is close to the panel display unit 15, deterioration or damage caused by thermal shock applied to each part of the panel display unit 15 Etc. can be prevented.

  Following the COG implementation, FOG implementation is performed. First, the anisotropic conductive film 23 is temporarily disposed on the terminal portion 17 a of the FOG mounting portion 22. Also at this time, the heating and pressing head 3 is supported above the FOG mounting portion 22 by the head driving mechanism 4. Subsequently, the terminal part of the flexible substrate 21 in which a liquid crystal driving circuit or the like is formed on the anisotropic conductive film 23 is disposed. Then, as shown in FIG. 5, the heating and pressing head 3 is such that the head main body 3 b is heated to a predetermined temperature by the head driving mechanism 4 and the pressing surface 3 a is lowered so as to press the terminal portion of the flexible substrate 21. The pressure is controlled so as to be pressed only for the time. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the flexible substrate 21 and the terminal part 17a.

  At this time, the heat pressing head 3 is provided with the heat blocking portion 5 on the side surface facing the panel display portion 15 of the head main body 3b and the electronic component 18 previously mounted on the COG. Transmission to the polarizing plates 25 and 26 of the display unit 15, the seal 13, the electronic component 18, and the like can be prevented. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 and the FOG mounting unit 22 is reduced and the head body 3b is close to the electronic component 18 or the panel display unit 15, the electronic component 18 or the panel display unit 15 can be prevented from being altered or damaged due to a thermal shock applied thereto, and the connection of the electronic component 18 to the COG mounting portion 20 does not become unstable.

  In this way, the liquid crystal display panel 10 in which the electronic component 18 is COG mounted on the liquid crystal display panel 10 and the flexible substrate 21 is FOG mounted is manufactured.

  In the above description, the case where the electronic component 18 and the flexible substrate 21 are mounted on the liquid crystal display panel 10 has been described. However, even when the liquid crystal display panel 10 is replaced with a wiring substrate, it can be similarly mounted. Moreover, although it described about mounting the flexible substrate 21 in the panel in which the COG mounting part exists previously, the mounting part mounted previously is not limited to COG.

  Next, an example (see FIG. 5) in which the flexible substrate 21 is FOG-mounted using the heating and pressing head 3 connected to the head body 3b of the heat shield 5 via the connector 30, and heating without the heat shield 5 provided. A comparative example in which a flexible substrate is FOG-mounted using a pressing head will be described.

  In both the examples and comparative examples, FOG mounting in which a flexible substrate is bonded to an FOG mounting portion provided in the vicinity of the COG mounting portion of a glass substrate on which a liquid crystal driving IC is previously COG mounted. The temperature of the lower part of the liquid crystal driving IC at that time was measured.

  In both the examples and the comparative examples, the heat and pressure conditions by the heating and pressing head are 196 ° C., 2 MPa, and 10 seconds. The distance from the heating and pressing head to the liquid crystal driving IC is 0.5 mm. Moreover, the heat interruption | blocking part 5 was formed using the aluminum plate (thermal conductivity: 236 W / mk). Table 1 shows the measurement results of the lower temperature of the liquid crystal driving IC under such conditions.

  As shown in Table 1, in the embodiment in which the FOG mounting was performed using the heating and pressing head 3 in which the heat blocking portion 5 made of an aluminum plate was connected via the connector 30, the liquid crystal driving device was previously COG mounted. The lower temperature of the IC remains at 58 ° C. On the other hand, in the comparative example in which FOG mounting was performed using a heating and pressing head that does not include a heat shut-off unit, the lower temperature of the liquid crystal driving IC that was previously COG mounted rose to 97 ° C. As described above, according to the mounting method using the mounting apparatus 1, the heat of the heating and pressing head 3 is transmitted to the lower portion of the liquid crystal driving IC mounted in the vicinity, that is, the mounting portion of the liquid crystal driving IC. The influence by this can be suppressed, and the adhesive force and connection resistance in the COG mounting part 20 can be maintained.

  Further, according to the mounting method using the mounting apparatus 1, in addition to suppressing the temperature rise of the COG mounting unit 20 in the FOG mounting process, other component parts adjacent to the COG mounting unit 20 in the COG mounting process, that is, the panel Thermal shock to the seal 13 and the polarizing plates 25 and 26 constituting the display unit 15 or the electronic component 18 mounted before the COG mounting process can be suppressed. Therefore, according to the mounting method using the mounting apparatus 1, it is possible to suppress adverse effects such as the maintenance of the adhesive strength and connection resistance of these other components and the deterioration due to thermal shock.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus, 2 stage, 3 heating press head, 3a press surface, 3b head main body, 4 head drive mechanism, 5 heat shut-off part, 10 liquid crystal display panel, 11, 12 transparent substrate, 12a edge, 13 seal, 14 liquid crystal , 15 Panel display part, 16, 17 Transparent electrode, 18 Electronic component, 20 COG mounting part, 21 Flexible substrate, 22 FOG mounting part, 23 Anisotropic conductive film, 24 Alignment film, 25, 26 Polarizing plate, 30 Connector 31 heat sink

Claims (15)

A heating press head that is opposed to the mounting portion of the substrate or panel to which the mounting component is connected via the anisotropic conductive film and that can be moved close to and away from the mounting portion,
The heating and pressing head is provided with a heat blocking part on the side facing the other component parts provided in the vicinity of the mounting part of the substrate or panel ,
The heating and pressing head thermally cures the anisotropic conductive film by thermally pressing the mounting component placed on the anisotropic conductive film temporarily press-bonded to the mounting portion onto the mounting portion. A mounting device that causes the mounting component to be mounted on the substrate .   The mounting apparatus according to claim 1, wherein the heat blocking part is made of a low thermal conductivity material.   The mounting device according to claim 2, wherein the low thermal conductivity material has a thermal conductivity of 0.02 to 0.5 W / m · k.   The mounting apparatus according to claim 2 or 3, wherein the low thermal conductivity material is coupled to the heating and pressing head via a connector.   The mounting apparatus according to any one of claims 1 to 4, wherein the heat blocking section is provided around the entire circumference of the heating and pressing head.   The mounting apparatus according to claim 1, wherein a heat sink is provided in the heat blocking part.   The mounting device according to claim 1, wherein the substrate is glass, and the mounting component is a flexible substrate and / or an IC. Temporarily press the anisotropic conductive film on the mounting part of the substrate or panel, and the mounting component is placed on the mounting part via the anisotropic conductive film ,
The different by hot-pressing pressure on the mounting portion of the mounting component by heating the pressing head heat blocking section on the side facing the other components provided in the mounting portion near the substrate or panel is provided A mounting method for mounting the mounting component on the substrate by causing a thermosetting reaction to the anisotropic conductive film .   The mounting method according to claim 8, wherein the heat blocking portion is made of a low thermal conductivity material.   The mounting method according to claim 9, wherein the low thermal conductivity material has a thermal conductivity of 0.02 to 0.5 W / m · k.   The mounting method according to claim 9 or 10, wherein the low thermal conductivity material is coupled to the heating and pressing head via a connector.   The mounting method according to any one of claims 8 to 11, wherein the heat blocking portion is provided around the entire circumference of the heating and pressing head.   The mounting method according to claim 8, wherein a heat sink is provided in the heat blocking part.   The mounting method according to claim 8, wherein the substrate is glass, and the mounting component is a flexible substrate and / or an IC.   The joined body manufactured by the mounting method according to any one of claims 8 to 14.

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