JP5776089B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus. For example, the present invention relates to a component mounting apparatus that sucks an electronic component and mounts the electronic component on a substrate.

  Currently, the work of mounting electronic components on boards of various electrical products is automated, and a component mounting apparatus is used at that time. The mounting of the component in the component mounting apparatus is performed by the nozzle holding the electronic component by suction and moving it onto the substrate and mounting the electronic component held by suction on the substrate.

  Patent documents 1 thru / or 3 are mentioned as conventional technology about a component mounting device. Patent Document 1 discloses that a positioning mark formed on a substrate is imaged by the second recognition camera 41 to obtain a positional deviation.

JP 2005-72046 A Japanese Patent Laid-Open No. 2005-50887 JP-A-6-209193

  Conventionally, the mounting error of a component mounting apparatus has been acceptable for the required mounting accuracy. However, in the present invention, it has been found that high-density mounting will be required in the future for the component mounting apparatus, and the required mounting accuracy will be significantly increased. In other words, it has been found that the required mounting accuracy will increase to a point where the mounting error that has been allowed until now cannot be allowed.

  Patent Document 1 discloses that a positioning mark formed on a substrate is imaged by the second recognition camera 41 to obtain a positional deviation. However, for example, no consideration has been given to the effects of mounting position deviation from the original position, errors when the head moves XY to the mounting position, and errors when the nozzle moves to the mounting position on component mounting. .

  The present invention is characterized in that component mounting is performed by obtaining an image including at least one of a position to be mounted on a substrate and a tip of a nozzle shaft.

  According to the present invention, it is possible to mount components with higher accuracy than in the past.

FIG. 3 is a top view of the entire component mounting apparatus according to the first embodiment. The figure explaining the case where it observes from the direction of the arrow 130. FIG. The front view of the head actuator 113. FIG. The figure explaining the up-and-down operation | movement of the nozzle shaft 311. FIG. The figure explaining the up-and-down operation | movement of the nozzle shaft 311. FIG. The figure explaining the nozzle selection operation | movement of the nozzle shaft 311 and rotation operation | movement. The figure explaining the nozzle selection operation | movement of the nozzle shaft 311 and rotation operation | movement. The figure explaining the nozzle rotation motor 316 and the nozzle shaft 311 periphery. FIG. 6 is a diagram illustrating a component mounting operation according to the first embodiment. 5 is a flowchart for explaining a component mounting operation according to the first embodiment. FIG. 6 is a diagram illustrating a second embodiment. 9 is a flowchart for explaining a second embodiment. FIG. 6 is a diagram illustrating Example 3; FIG. 7 is a diagram for explaining Example 3 (continuation). 9 is a flowchart for explaining a third embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

  Example 1 will be described with reference to FIGS. FIG. 1 is a top view of the entire component mounting apparatus according to the first embodiment.

  The substrate 123 is conveyed from the direction of the arrow 1000 to the electronic component mounting position by a guide. FIG. 1 shows a state in which the substrate 123 is fixed at the electronic component mounting position.

  A first Y beam 101 and a second Y beam 102 are arranged in a direction orthogonal to the arrow 1000 and above the substrate 123. X beams 103, 104, 105, and 106 are disposed in the first Y beam 101 and the second Y beam 102, respectively. The X beams 103, 104, 105, and 106 are orthogonal to the direction of the arrow 1000 by actuators 107 and 108 such as linear motors disposed on the first Y beam 101 and the second Y beam 102, respectively. Moving.

  Actuators 109, 110, 111, and 112 such as linear motors are disposed on the X beams 103, 104, 105, and 106, respectively.

  The actuators 109, 110, 111, and 112 are respectively provided with head actuators 113, 114, 115, and 116 for mounting electronic components on the substrate 123. Here, the actuators 109, 110, 111, and 112 can be configured to be inexpensive and lightweight by using a mechanism such as a ball screw instead of a linear motor.

  The head actuators 113, 114, 115, and 116 are driven in the direction orthogonal to the first Y beam 101 and the second Y beam 102 (in the direction of the arrow 1000) by the actuators 109, 110, 111, and 112, respectively. The

  Component supply devices 121 and 122 that supply electronic components to the head actuators 113, 114, 115, and 116 are disposed at both ends of the first Y beam 101 and the second Y beam 102. When there are no more electronic components to be mounted, the X beams 103, 104, 105, 106 are moved to the front (or above) the component supply devices 121, 122 by the actuators 107, 108, and the actuators 109, 110 are further moved. , 111, 112 causes the head actuators 113, 114, 115, 116 to move in an arbitrary direction and replenish electronic components.

  In the component mounting apparatus, cameras 117, 118, 119, and 120 for confirming the posture of the electronic component are disposed between the first Y beam 101 and the second Y beam 102, and the supplied electronic component Are confirmed by the cameras 117, 118, 119, and 120, respectively. If tilt is detected in the posture, the head actuators 113, 114, 115, 116 adjust the tilt of the electronic component. At this camera position, when components are mounted near the center of the substrate 123, the moving distance of the head actuators 113, 114, 115, 116 is the shortest.

  In addition, the control unit 124 performs processing and control of various operations described above, and processing and control of various operations described later.

  2 is an arrow view when the component mounting apparatus of FIG. 1 is observed from the arrow 130 of FIG. Here, a portion around the first Y beam 101 will be described in detail, but the same applies to the second Y beam 102.

  An actuator 107 is disposed below the first Y beam 101, and the X beam 103 is connected to the actuator 107 so as to be movable in a direction orthogonal to the transport direction of the substrate 123 on the loading platform 201. An actuator 109 is arranged in the direction perpendicular to the paper surface of the X beam 103, and a head actuator 113 is connected to the actuator 109 so as to be movable in a direction parallel to the substrate transport direction.

  As in the embodiment shown in FIG. 1 and FIG. 2, a component mounting apparatus that is faster than the conventional one is configured by adopting a configuration that can move independently in a direction orthogonal to and parallel to the substrate transport direction. be able to.

  Although FIG. 1 illustrates the case where there are four X beams, the number of X beams is not limited. The X beams 103, 104, 105, and 106 may be removable. In that case, for example, different types of head actuators can be connected, and mounting of more various parts can be realized. With the beam configuration described above, each head actuator 113, 114, 115, 116 can be freely driven independently.

  Next, the configuration of the head actuator 113 will be described. Although the configuration of the head actuator 113 is described here, the configuration of the other head actuators 114, 115, and 116 is the same.

  FIG. 3 is a front view of the head actuator 113. The head frame 301 is connected to the X beam 103 in FIG. The nozzle up / down motor 302 is connected to the frame 301. A ball screw 308 is connected to the nozzle up / down motor 302. Further, the end of the ball screw 308 is supported by a guide 318. An arm 309 is connected to the ball screw 308. The tip of the arm 309 has a structure (concave type) that sandwiches a convex portion 350 (convex portion) formed at least around the nozzle moving portion 310.

  A nozzle shaft 311 having a hollow structure is connected to the nozzle moving unit 310. Further, the nozzle shaft 311 is connected to the rotor 313.

  A nozzle 317 for adsorbing an electronic component having an opening is detachably connected to the tip of the nozzle shaft 311. The nozzle rotation motor 316 is connected to the frame 301 and has a function of rotating the nozzle 317 about the head center as a rotation axis.

  Next, the configuration of the head actuator 113 will be described in more detail with respect to the nozzle selection operation, the vertical operation, and the rotation operation.

  First, the vertical movement of the nozzle will be described with reference to FIGS. 4A and 4B. As shown in FIG. 4A, the nozzle moving unit 310 is connected to the center spline 306. The center spline 306 serves as a guide for defining the moving direction of the nozzle moving unit. The nozzle moving part 310 has at least the convex part 350 (convex part) around the aforementioned part, and the convex part is held by the arm 309. Further, an L-shaped arm 351 is connected to the convex portion 350. The tip of the arm 351 is disposed in a notch 352 (in other words, a recess) of the first nozzle base 320. Further, each nozzle shaft 311 is disposed on the first nozzle base 320 via the rotating body 353. 4B, when the arm 309 is moved downward by the nozzle up / down motor 302, the nozzle moving unit 310, the arm 351 connected to the nozzle moving unit 310, the rotating body 353 on the tip of the arm 351, The nozzle shaft 311 connected to the rotating body 353 also moves downward.

  Next, the nozzle selection operation will be described with reference to FIGS. 5A and 5B. In the center spline 306, when the nozzle selection belt 307 is rotated by the nozzle selection motor 303, the center spline 306 is also rotated, and the nozzle moving unit 310 connected to the center spline 306 and the first nozzle base 320 are also synchronized. Rotate by the same angle. Then, as the first nozzle pedestal 320 rotates, the notch 352 also rotates. Accordingly, the relative positional relationship between the nozzle shaft 311 and the notch 352 responsible for selection of the nozzle shaft 311 is changed, and an arbitrary nozzle on the first nozzle base 320 can be selected. In addition, since the rotating body 353 such as the roller is in contact with the first nozzle pedestal 320, it is possible to reduce the influence of friction when the first nozzle pedestal 320 rotates. Here, considering the influence of dust generation, it is desirable that the hardness of the rotating body 353 and the hardness of the first nozzle base 320 be the same.

  With such a configuration, it is possible to efficiently perform the nozzle selection operation and the vertical operation within the limited space of the head actuator 113.

  Next, the head rotation operation will be described with reference to FIGS. 5A and 5B. The nozzle rotation motor 316 rotates the rotor 313 to rotate the nozzle shaft 311 attached to the rotor 313 with the center of the rotor 313 as the rotation axis. Thereby, the rotating body 353 such as a roller attached to the nozzle shaft 311 rotates on the first nozzle base 320. As a result, an arbitrary nozzle shaft 311 can be moved at an arbitrary angle, and can also be moved onto the L-shaped arm 351.

  Next, the component mounting operation in the present embodiment will be specifically described. FIG. 6 is a diagram for explaining the periphery of the nozzle rotation motor 316 and the nozzle shaft 311 among the head actuators 113. A head camera 701 is disposed inside the nozzle shaft 311. As another expression, it can be expressed that the head camera 701 is arranged on the rotation axis 6001 of the rotor 313 of the nozzle rotation motor 316. This arrangement has an advantage that the position of the head camera 701 does not change even if the nozzle selection operation and the head rotation operation described above are performed. In addition, the head camera 701 is disposed at a position higher than the height at which the nozzle shaft 311 is retracted from the substrate 123 with respect to the substrate 123 so as not to hinder the mounting of components.

  The imaging range of the head camera 701 (which can also be expressed as a field of view 702) is desirably a mounting position 6002 where components are to be mounted (transmitted from design data in the control unit 124), the periphery of the mounting position 6002, nozzle shaft 311 is set to include the tip 606 and the electronic component 602. By setting the imaging range in this way, it is possible to obtain the position to be mounted and the position of the nozzle shaft 311. Note that the imaging range can be arbitrarily changed.

  The depth of focus of the head camera 701 will be described. As indicated by a range 6003, the depth of focus is set to include the mounting position 6002, the periphery of the mounting position 6002, the tip 606 of the nozzle shaft 311, and the electronic component 602. By setting the depth of focus in this way, it is possible to clearly obtain both the image on the substrate 123 side and the image on the component mounting apparatus side by one imaging. This configuration is the same not only for the head actuator 113 but also for the other head actuators 114, 115, and 116.

  FIG. 7 is a diagram for explaining the component mounting operation of the present embodiment, and FIG. 8 is a flowchart thereof. First, it is assumed that the head camera 701 obtains an image of a certain area on the substrate 123 as shown in FIG. 7 (step 901 in FIG. 8). It is assumed that the image includes a nozzle shaft 311, an electronic component 602, and a circuit pattern 802 that is a mounting position.

  Next, the control unit 124 obtains the actual position of the circuit pattern 802 from the obtained image (step 902 in FIG. 8). More specifically, the control unit 124 differentiates the obtained image of the circuit pattern 802 to emphasize the edge, the differentiated image with the edge emphasized, and the reference pattern stored in the control unit 124. The position of the circuit pattern 802 is obtained by pattern matching. As long as the position of the circuit pattern 802 can be obtained, other image processing techniques may be adopted as the method.

  Next, the control unit 124 obtains the current position 804 of the nozzle shaft 311 (which can also be expressed as the position of the electronic component 602) from the obtained image (step 903 in FIG. 8).

  Next, the control unit 124 obtains a desired position for component mounting from the relationship between the position of the circuit pattern 802 obtained in step 902 of FIG. 8 and the current position 804 of the nozzle shaft 311 (step 904 of FIG. 8). .

  Then, the actuators 107 and 109 move the head actuator 113 to move the nozzle shaft 311 to a desired position (step 905 in FIG. 8). Here, the desired position can be expressed in various ways. For example, it can be expressed as a position where the electronic component 602 can be mounted on the circuit pattern 802 simply by lowering the nozzle shaft 311.

  Then, the electronic component 602 is mounted after this (step 906 in FIG. 8).

  The component mounting operation is described as follows from the viewpoint of the head camera 701. In FIG. 7, the nozzle shaft 311 that was initially at the position 804 is moved by Δx1 and Δy1 by the actuator 107 and the actuator 109, and is changed to the position 803. Thereafter, the nozzle shaft 311 is lowered by the above-described vertical movement. At this time, since the head camera 701 is disposed on the rotation axis 6001 of the rotor 313, the head camera 701 moves toward the center of the visual field by Δx2 and approaches the circuit pattern 802 when the nozzle shaft 311 descends. To be observed. This operation is the same not only for the head actuator 113 but also for the other head actuators 114, 115, 116.

In the present embodiment, the head camera 701 captures the actual mounting position including the nozzle shaft 311 so that the positional relationship between the mounting position and the nozzle shaft 311 can be obtained more accurately, and more accurate component mounting is possible. Is possible. To describe the effect of this embodiment more specifically, it can be expressed as follows, for example.
(1) Even if the circuit pattern printed on the substrate 123 is shifted and abnormal, the state is confirmed by the head camera 701, and the position of the nozzle shaft 311 is confirmed, so that high-precision component mounting is performed. Is possible.
(2) Since the head camera 701 is arranged in a space inside the nozzle shaft 311, the head actuator 113 can be configured compactly.

  Next, Example 2 will be described with reference to FIG. In Example 1, the board was imaged by the head camera 701 before the component mounting operation. However, the timing at which the head camera 701 images the board may be after the component mounting operation. If the board is imaged after the component mounting operation, it can be confirmed whether the electronic component is correctly mounted at the mounting position. The present embodiment is characterized by this point. In the following, with respect to the present embodiment, portions different from the first embodiment will be mainly described.

  FIG. 9 is a diagram illustrating the present embodiment, and is an image captured by the head camera 701 after the component mounting operation in step 906 of FIG. FIG. 10 is a flowchart for explaining the present embodiment.

  In this embodiment, after the operation of step 906 in FIG. 8, the head camera 701 images the substrate 123 to obtain the image shown in FIG. 9 (step 1101 in FIG. 10). Now, it is assumed that the electronic component 1002 is mounted on the circuit pattern 1004 and the electronic component 1003 is mounted on the circuit pattern 1005 in the image obtained by the head camera 701.

  The control unit 124 performs pattern matching with the reference image for the portions indicated by the solid lines 1006 and 1007. That is, it is determined whether or not the mounting error is within an allowable value (step 1102 in FIG. 10). If the degree of matching is within the allowable value, that is, if the mounting error is within the allowable value, it is determined that the mounting of the component is normal (step 1103 in FIG. 10), and if it is larger than the allowable value, the mounting of the component is abnormal. Determination is made (step 1104 in FIG. 10). This allowable value can be arbitrarily changed. In the image of FIG. 9, it is determined that the mounting of the electronic component 1002 on the circuit pattern 1004 is normal, and the mounting of the electronic component 1003 on the circuit pattern 1005 is determined to be abnormal. Note that an error may be notified to the worker for the mounting portion determined to be abnormal. This operation is the same not only for the head actuator 113 but also for the other head actuators 114, 115, and 116. According to the present embodiment, it becomes possible to confirm a mounting failure at an early stage, and it becomes easier to manage the mounting failure.

  Next, Example 3 will be described. In the first and second embodiments, the example in which the head camera 701 obtains an image on the substrate 123 has been described. Here, in order to increase the density of component mounting, the electronic component itself may be reduced in size. The present embodiment takes this point into consideration, and is characterized in that the head camera 701 images an electronic component on at least one of the component supply apparatuses 121 and 122.

  This embodiment will be described more specifically. FIG. 11 is a diagram for explaining the present embodiment, and is a cross-sectional view for explaining the operation in which the head actuator 113 moves onto the component supply device 121 and replenishes the electronic component 1111 to the nozzle shaft 311.

  Now, it is assumed that the electronic component 1111 is stored in the transport tape 1110. Although the upper part of the electronic component 1111 may be covered with a sealing tape, the sealing tape is removed by an exposure device in the component supply device 121. The nozzle shaft 311 sucks and holds the electronic component 1111 by performing the vertical movement described above.

  The imaging range of the head camera 701 (which can also be expressed as a visual field 702) is desirably set to include an electronic component 1111 that should hold the component by suction and the tip 606 of the nozzle shaft 311. By setting the imaging range in this way, it is possible to obtain the position of the electronic component 1111 and the position of the tip 606 of the nozzle shaft 311 with one imaging. Note that the imaging range can be arbitrarily changed.

  The depth of focus of the head camera 701 will be described. The depth of focus is set to include the position of the electronic component 1111 and the tip 606 of the nozzle shaft 311 as indicated by a range 6003. By setting the depth of focus in this way, it is possible to clearly obtain both the electronic component 1111 and the tip 606 of the nozzle shaft 311 with one imaging. This configuration is the same not only for the head actuator 113 but also for the other head actuators 114, 115, and 116.

  Next, an actual suction holding operation will be described with reference to FIGS. FIG. 12 is a view for explaining the transport tape 1110 from above, and FIG. 13 is a flowchart for explaining the suction holding operation.

  First, it is assumed that the head camera 701 obtains an image of a certain area on the transport tape 1110 as shown in FIG. 12 (step 1301 in FIG. 13). It is assumed that the image includes a nozzle shaft 311 and an electronic component 1111.

  Next, the control unit 124 obtains the actual position of the electronic component 1111 from the obtained image (step 1302 in FIG. 13). More specifically, the control unit 124 differentiates the obtained image of the electronic component 1111 to emphasize the edge, the differentiated image with the edge enhanced, the reference pattern stored in the control unit 124, and the like. The position of the electronic component 1111 is obtained by pattern matching. As long as the position of the electronic component 1111 can be obtained, other image processing techniques may be adopted as the method.

  Next, the control unit 124 obtains the current position 804 of the nozzle shaft 311 (which can also be expressed as the position of the electronic component 602) from the obtained image (step 1303 in FIG. 8).

  Next, the control unit 124 obtains a position desirable for suction holding from the relationship between the position of the electronic component 1111 obtained in step 1302 in FIG. 13 and the current position 804 of the nozzle shaft 311 (step 1304 in FIG. 13). .

  Then, the actuators 107 and 109 move the head actuator 113 to move the nozzle shaft 311 to a desired position (step 1305 in FIG. 13). Here, the desired position can be expressed in various ways. For example, the desired position can be expressed as a position where the electronic component 1111 can be sucked and held only by lowering the nozzle shaft 311.

  Then, the lowering operation and suction holding operation of the nozzle shaft 311 are performed after this (step 1306 in FIG. 13).

  Note that the suction holding operation is described as follows from the viewpoint of the head camera 701. In FIG. 12, the nozzle shaft 311 that was initially at the position 804 is moved by Δx1 and Δy1 by the actuator 107 and the actuator 109 to be changed to the position 803. Thereafter, the nozzle shaft 311 is lowered by the above-described vertical movement. At this time, since the head camera 701 is disposed on the rotation shaft 6001 of the rotor 313, the head camera 701 moves toward the center of the visual field by Δx2 and approaches the electronic component 1111 when the nozzle shaft 311 descends. To be observed. This operation is the same not only for the head actuator 113 but also for the other head actuators 114, 115, 116.

  As mentioned above, although this invention was demonstrated using Example 1 and Example 2, this invention is not limited to an Example. The configuration of the head actuator may be other configurations, and it is within the scope of the disclosure of this specification to obtain an image including at least one of the position to be mounted on the substrate and the tip of the nozzle shaft and mount the component.

101 First Y beam 102 Second Y beam 103, 104, 105, 106 X beam 107, 108, 109, 110, 111, 112 Actuator 113, 114, 115, 116 Head actuator 117, 118, 119, 120 Camera 121, 122 Component supply device 123 Substrate 124 Control unit 302 Nozzle up / down motor 303 Nozzle selection motor 304 Center shaft 305 Rotary joint 306 Center spline 307 Nozzle selection belt 308 Ball screw 310 Nozzle moving unit 311 Nozzle shaft 317 Nozzle 318 Guide 320 First Nozzle base 321 Screw hole 350 Convex part 351 Arm 352 Notch 353 Rotating body 380 Second nozzle base 501 Convex part 502 Sealing member 701 Head camera

Claims (8)

A component mounting section for mounting components on the board;
A moving unit for moving the component mounting unit;
A processing unit,
The component mounting unit includes a nozzle for holding the component, and a camera.
The camera obtains a first image including a position where the component is to be mounted on the substrate and a tip of the nozzle,
The component mounting apparatus, wherein the processing unit obtains a movement amount by which the moving unit moves the component mounting unit from the first image. The component mounting apparatus according to claim 1,
The component mounting apparatus, wherein a position where the component is to be mounted and a tip of the nozzle are included in a depth of focus of the camera when the first image is obtained. In the component mounting apparatus according to claim 2,
The camera obtains an image of a region where the component is mounted after the component is mounted at a position where the component is to be mounted,
The component mounting apparatus, wherein the processing unit determines whether or not the component is correctly mounted from an image of an area where the component is mounted. In the component mounting apparatus according to claim 3,
A component supply unit for supplying the component to the nozzle;
The camera obtains a second image including the tip of the component and the nozzle on the component supply unit,
The component mounting apparatus, wherein the processing unit obtains a movement amount by which the moving unit moves the component mounting unit from the second image. In the component mounting apparatus according to claim 4,
The component mounting apparatus, wherein the focal point of the camera when obtaining the second image includes the component stored on a transport tape and the tip of the nozzle. The component mounting apparatus according to claim 1,
The camera obtains an image of a region where the component is mounted after the component is mounted at a position where the component is to be mounted,
The component mounting apparatus, wherein the processing unit determines whether or not the component is correctly mounted from an image of an area where the component is mounted. The component mounting apparatus according to claim 1,
A component supply unit for supplying the component to the nozzle;
The camera obtains a second image including the tip of the component and the nozzle on the component supply unit,
The component mounting apparatus, wherein the processing unit obtains a movement amount by which the moving unit moves the component mounting unit from the second image. In the component mounting apparatus according to claim 7,
The component mounting apparatus, wherein the focal point of the camera when obtaining the second image includes the component stored on a transport tape and the tip of the nozzle.

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