JP6181515B2 - Apparatus and method for removing plating layer of gravure printing cylinder - Google Patents

Description

  The present invention relates to an apparatus and a method for removing a plating layer of a gravure printing cylinder.

  A ballad type cylinder is known as one type of gravure cylinder. This type of cylinder includes an underlayer that forms the surface of the cylinder base, and a plating layer that is formed on the surface of the underlayer by plating. The plating layer generally has a sculpture forming layer formed on the surface of the underlayer and a protective layer for protecting the engraving layer.

  Ballad type cylinders are manufactured by applying a solution called ballad liquid on the surface of the underlayer in the production process, and then sequentially forming an engraving layer and a protective layer on the surface. The plating layer (the engraving layer and the protective layer) can be peeled off relatively easily. Thereby, after the gravure printing is completed, the cylinder base is reused, so that the plating layer can be peeled while leaving the base layer on the cylinder base side.

  The invention described in Patent Document 1 relates to a method for producing a gravure plate, and FIG. 3 describes “removal of chrome plating and galvanization of used printing roll” as the first step. In paragraph [0015] of Patent Document 1, it is described as “a process in which a used printing roll is immersed and rotated in dilute sulfuric acid stored in a dechroming tank”. In addition, since there is no description regarding ballad liquid in patent document 1, and it does not describe peeling chromium plating and galvanization, when the printing roll described in patent document 1 is classified into what is called a direct printing system. Is recognized.

  The invention described in Patent Document 2 relates to a plate making method, and in paragraph [0002], “1) Ballad plating is manually removed by using a chisel and pliers as“ conventional technology ”in“ gravure plate making method of ballad plating type ”. Is described. Paragraph [0003] describes a “direct gravure plate making method”.

Japanese Patent Laid-Open No. 2001-80027 JP 2001-105562 A

  Despite the fact that most of the processes for manufacturing ballad type gravure cylinders are automated, plating layers (engraving layers and protective layers) are used from the used cylinders to recycle the cylinder base. The fact that the removal work is still done manually. As described in Patent Documents 1 and 2, the method of dissolving a plating layer by immersing a used cylinder in a liquid requires a relatively long time to remove the plating layer, and it is difficult to dissolve only the plating layer. In fact, it has not been widely adopted because it also affects the surface (underlayer) of the cylinder base below.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a removal apparatus and a removal method useful for realizing automation of an operation of removing a plating layer from a ballad type gravure printing cylinder. .

  The present invention relates to a ballad-type gravure printing cylinder, that is, a cylinder base having a cylindrical portion, a base layer formed on the surface of the cylindrical portion of the cylinder base, and a plating layer formed outside the base layer. And an apparatus for removing the plating layer from the interface between the underlayer and the plating layer. The removal apparatus according to the present invention includes a cylinder support part that supports the cylinder, a laser light source that melts a part of the plating layer by irradiating a laser on the surface of the cylinder that is supported by the cylinder support part, A laser irradiation position adjusting unit that changes a relative position of the laser light source with respect to the cylinder.

  According to the removing device, the laser light source can be moved relative to the cylinder to irradiate the laser, whereby the plating layer can be continuously cut or half cut. Since the treatment with the laser is a non-contact process, it is possible to sufficiently prevent the cylinder base underlayer from being damaged by the treatment by selecting an appropriate intensity laser.

  The first aspect of the removal apparatus may further include the following configuration. That is, the first aspect is a part of the plating layer that is disposed between the part peeled off from the cylinder base by being irradiated with the laser and the base layer, and is in contact with the surface on the base layer side of the part. You may further provide a member and the peeling member position adjustment part which changes the relative position of the peeling member with respect to a cylinder. By adopting a peeling member, it is possible to apply a force in the direction away from the base layer to the part peeled from the cylinder base and to continuously remove the remaining plating layer by adjusting the position of the peeling member Can do.

  The second aspect of the removal apparatus may further include the following configuration. That is, the second aspect is a gripping part that grips a part of the plating layer that is peeled off from the cylinder base by being irradiated with a laser, and a gripping part that changes a relative position of the gripping part with respect to the cylinder You may further provide a position adjustment part. By adopting the gripping part, it is possible to apply a force in the direction away from the base layer to the part peeled off from the cylinder base and to continuously remove the remaining plating layer by adjusting the position of the gripping part Can do.

  You may employ | adopt what can adjust the output of the laser irradiated as said laser light source. By adopting such a configuration, the output of the laser can be adjusted according to the thickness of the plating layer and the type of the constituent metal. Further, by irradiating the plating layer with a laser having a low output, damage to the underlayer by the laser can be sufficiently suppressed. For example, a state in which the laser does not completely cut the plating layer (half-cut state) can be used. If the plating layer is half-cut with a laser, then the plating layer can be peeled off from the underlayer simply by giving a light impact to the cylinder, for example.

  The present invention provides a method for removing a plating layer of a ballad type gravure printing cylinder. The removal method according to the present invention includes a step of melting the plating layer over a predetermined length by irradiating the surface of the cylinder with a laser, and a portion of the plating layer that has been peeled off by irradiation with the laser. And a step of continuously removing the remaining plating layer by applying a force in a direction away from the base layer.

  According to the above removal method, the plating layer can be continuously cut or half cut by irradiating the cylinder with laser. Since the treatment with the laser is a non-contact process, it is possible to sufficiently prevent the cylinder base underlayer from being damaged by the treatment by selecting an appropriate intensity laser.

  The removing method of the present invention may remove the plating layer using the removing device.

  ADVANTAGE OF THE INVENTION According to this invention, the removal apparatus and removal method useful for implement | achieving automation of the operation | work which removes a plating layer from the cylinder for gravure gravure printing are provided.

It is sectional drawing which shows an example of the cylinder for ballad gravure printing. It is a front view which shows one Embodiment of the removal apparatus which concerns on this invention. It is a side view of the removal apparatus shown in FIG. It is a perspective view which shows the state which the clearance gap produced between the edge part of a plating layer, and a base layer by having cut | disconnected a part of plating layer.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

<Cylinder for ballad gravure printing>
FIG. 1 is a cross-sectional view showing an example of a ballad type gravure printing cylinder, and shows a cross section in a plane perpendicular to the longitudinal direction of the cylinder 10. As shown in FIG. 1, the cylinder 10 includes a cylinder base 1, a base layer 2 provided on the surface of the cylinder base 1, and a plating layer 5 provided outside the base layer 2. The plated layer 5 includes a sculpture forming layer 5a and a protective layer 5b, and these layers are formed in this order from the base layer 2 side. Since the cylinder base 1 is reused after the gravure printing is completed, the plating layer 5 can be peeled off while leaving the base layer 2 on the cylinder base 1 side.

  In the manufacturing process of the cylinder 10, the surface 2 f of the underlayer 2 is called a ballad liquid so that the plating layer 5 is peeled off from the underlayer 2 at the interface between the surface 2 f of the underlayer 2 and the back surface 5 f of the engraving formation layer 5 a. After the coating liquid is applied, the engraving formation layer 5a and the protective layer 5b are sequentially formed thereon by plating. As the ballad liquid, for example, anhydrous sodium sulfite, silver nitrate or thiosulfuric acid aqueous solution or water can be used.

  The cylinder base 1 is a cylindrical member having a length of 300 to 5000 mm and an outer diameter of 100 to 1500 mm, for example. Examples of the material of the cylinder base 1 include aluminum and iron.

  The underlayer 2 is a layer formed so as to cover the surface of the cylinder base 1. Examples of the material of the underlayer 2 include copper, zinc, tin, nickel, and alloys thereof, stainless steel, and other alloys.

  The engraving formation layer 5a is formed so as to cover the surface of the base layer 2 to which the ballad liquid is applied. The engraving formation layer 5a is formed by a plating process, and the thickness thereof is, for example, about 60 to 155 μm. Examples of the material of the engraving formation layer 5a include copper, zinc, tin, and alloys thereof, stainless steel, and other alloys. The engraving layer 5a is formed by plating, and then a gravure concave portion is engraved by a laser or the like.

  The protective layer 5b is for protecting the plate formed on the engraving formation layer 5a, and is formed so as to cover the surface of the engraving formation layer 5a. The protective layer 5b is formed by a plating process, and its thickness is, for example, about 5 to 8 μm. Examples of the material of the protective layer 5b include chromium, nickel, zinc, and alloys thereof.

<Removal device>
An embodiment of the removal apparatus will be described with reference to FIGS. A removal apparatus 100 shown in the figure is for removing the plating layer 5 from the interface between the base layer 2 and the plating layer 5 in the cylinder 10. The removing device 100 includes a cylinder support portion 20 that supports the cylinder 10, and a laser head 30 that melts a part of the plating layer 5 by irradiating the surface of the cylinder 10 supported by the cylinder support portion 20 with laser L. And a peeling support portion 40 for peeling the plating layer 5 cut to a predetermined width by the laser L from the underlayer 2.

  The cylinder support portion 20 has two arms 21 and is configured to be able to rotatably support the cylinder 10 at the tip end portion 21 a of the arm 21. 2 and 3 indicate the rotation direction of the cylinder 10. In the present embodiment, it is assumed that the cylinder 10 is supported so that the longitudinal direction of the cylinder 10 is the horizontal direction. However, the direction is not limited to this, and for example, the longitudinal direction is the vertical direction. The cylinder 10 may be supported as described above.

  The laser head 30 has a laser light source 31 and is configured to be able to irradiate the laser L toward the cylinder 10. The plating layer 5 is cut by melting part of the plating layer 5 with the laser L. The laser head 30 is provided so as to be movable in the longitudinal direction of the cylinder 10 (left-right direction in FIG. 2). Specifically, the laser head 30 is slidably provided on a rail-shaped guide G (laser irradiation position adjusting unit) extending in parallel with the cylinder 10. By rotating the cylinder 10 in the direction of arrow R while moving the laser head 30 in the direction of arrow A in FIG. 2, a spiral cut can be made in the plated layer 5 (see FIG. 2).

  As the laser light source 31, for example, a laser light source that can irradiate a laser L having a wavelength of 1056 nm or less may be adopted. The laser light source 31 is preferably capable of adjusting the output of the laser L. For example, a laser light source 31 that can be adjusted within a range of 15 W or more may be adopted.

  The peeling support part 40 is for supporting peeling of the plating layer 5 cut by the laser L irradiation. The peeling support part 40 is disposed between the peeled plating layer 5 and the base layer 2, and has a peeling member that contacts the back surface 5 f of the peeled portion of the plating layer 5. In this embodiment, the peeling support part 40 has an opening 42 through which the plated layer 5 cut into a strip shape passes. As shown in FIGS. 2 and 3, a portion 45 a on the cylinder 10 side of the frame 45 constituting the opening 42 corresponds to a peeling member. The peeling support unit 40 is connected to the laser head 30 and moves together with the laser head 30 in the extending direction of the guide G (arrow A direction). In the present embodiment, the guide G also serves as a peeling member position adjusting unit. The frame 45 may have a guide portion 45b extending toward the cylinder 10 so that the tip of the plated layer 5 cut into a strip shape is introduced into the opening 42.

  In the said embodiment, although the peeling support part 40 which has a peeling member (part 45a) was illustrated, the structure of the peeling support part 40 is not limited to this. For example, instead of the peeling member, a peeling support portion including a gripping portion that grips an end portion of the peeled plating layer 5 may be employed. The grip portion may be configured to move with the laser head 30 by a grip portion position adjusting unit such as the guide G and change the relative position with the cylinder 10, or not to move with the laser head 30. There may be.

<Removal method>
Next, a method for removing the plating layer 5 from the used cylinder 10 will be described. In the method according to the present embodiment, the surface of the cylinder 10 is irradiated with a laser L to melt the plating layer 5 over a predetermined length, and the laser L is irradiated as part of the plating layer 5. A step of continuously removing the remaining plating layer by applying a force in a direction away from the base layer 2 to the part peeled from the base layer 2.

  When the plating layer 5 is cut with a laser L in a direction oblique to the longitudinal direction of the cylinder 10, the plating layer 5 is peeled off from the base layer 2, and as shown in FIG. 4, the end 5c of the plating layer 5 and the base layer A gap is formed between the two. The end portion 5c may be introduced into the opening 42 of the peeling support portion 40 or may be gripped. By applying a force in a direction away from the base layer 2 to the end portion 5c of the strip-shaped plating layer 5, the remaining plating layer can be continuously removed. By adjusting the output of the laser L, for example, a state where the laser L does not completely cut the plating layer 5 (half-cut state) can be obtained. If the plating layer 5 is half-cut by the laser L, the plating layer 5 can be peeled off from the base layer 2 only by giving a light impact to the cylinder 10 thereafter.

  As described above, the apparatus and method according to the present embodiment are useful for realizing automation of the operation of removing the plating layer 5 from the ballad type gravure cylinder 10. In the above-described embodiment, the case where the cylinder 10 rotates is illustrated. However, for example, the laser light source 31 may move around the cylinder 10 without rotating the cylinder 10.

DESCRIPTION OF SYMBOLS 1 ... Cylinder base, 2 ... Base layer, 2f ... Surface of base layer, 5 ... Plating layer, 5a ... Engraving formation layer, 5b ... Protection layer, 5c ... End of plating layer, 5f ... Back surface of plating layer, 10 ... Gravure cylinder, 20 ... cylinder support, 21 ... arm, 21a ... tip of arm, 30 ... laser head, 31 ... laser light source, 40 ... peeling support, 42 ... opening, 45 ... frame, 45a ... part ( Peeling member), 45b ... guide part, 100 ... removal device, G ... guide, L ... laser, R ... arrow.

Claims (7)

A cylinder base having a cylindrical part, a base layer formed on a surface of the cylindrical part of the cylinder base, and a plating layer formed outside the base layer, the base layer and the plating layer An apparatus for removing the plating layer of the gravure cylinder of the ballad system capable of peeling the plating layer from the interface,
A cylinder support for supporting the cylinder;
A laser light source that melts a part of the plating layer by irradiating the surface of the cylinder supported by the cylinder support with a laser; and
A laser irradiation position adjusting unit for changing a relative position of the laser light source with respect to the cylinder;
A removal apparatus comprising: A peeling member that is a part of the plating layer and is disposed between the base layer and a portion peeled from the cylinder base by being irradiated with the laser;
A peeling member position adjusting unit for changing a relative position of the peeling member with respect to the cylinder;
The removal apparatus according to claim 1, further comprising: A gripping part for gripping a part of the plating layer that is peeled off from the cylinder base by being irradiated with the laser;
A gripper position adjusting unit that changes a relative position of the gripper with respect to the cylinder;
The removal apparatus according to claim 1, further comprising:   The removal device according to any one of claims 1 to 3, wherein the laser light source is capable of adjusting an output of a laser to be irradiated.   The removal apparatus according to any one of claims 1 to 4, wherein an outer diameter of the cylindrical portion of the cylinder base is 100 to 1500 mm. A cylinder base having a cylindrical part, a base layer formed on a surface of the cylindrical part of the cylinder base, and a plating layer formed outside the base layer, the base layer and the plating layer A method for removing the plating layer of a ballad type gravure printing cylinder capable of peeling the plating layer from the interface,
Melting the plating layer over a predetermined length by irradiating the surface of the cylinder with a laser;
A step of continuously removing the remaining plating layer by applying a force in a direction away from the base layer to a part of the plating layer that is peeled off by irradiation with the laser;
A removal method comprising:   The removal method of removing the said plating layer using the removal apparatus as described in any one of Claims 1-5.

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