JP6203048B2 - Apparatus and method for removing plating layer of gravure printing cylinder - Google Patents

Description

  The present invention relates to an apparatus and a method for removing a plating layer of a gravure printing cylinder.

  A ballad type cylinder is known as one type of gravure cylinder. This type of cylinder includes an underlayer that forms the surface of the cylinder base, and a plating layer that is formed on the surface of the underlayer by plating. The plating layer generally has a sculpture forming layer formed on the surface of the underlayer and a protective layer for protecting the engraving layer.

  Ballad type cylinders are manufactured by applying a solution called ballad liquid on the surface of the underlayer in the production process, and then sequentially forming an engraving layer and a protective layer on the surface. The plating layer (the engraving layer and the protective layer) can be peeled off relatively easily. Thereby, after the gravure printing is completed, the cylinder base is reused, so that the plating layer can be peeled while leaving the base layer on the cylinder base side.

  The invention described in Patent Document 1 relates to a method for producing a gravure plate, and FIG. 3 describes “removal of chrome plating and galvanization of used printing roll” as the first step. In paragraph [0015] of Patent Document 1, it is described as “a process in which a used printing roll is immersed and rotated in dilute sulfuric acid stored in a dechroming tank”. In addition, since there is no description regarding ballad liquid in patent document 1, and it does not describe peeling chromium plating and galvanization, when the printing roll described in patent document 1 is classified into what is called a direct printing system. Is recognized.

  The invention described in Patent Document 2 relates to a plate making method, and in paragraph [0002], “1) Ballad plating is manually removed by using a chisel and pliers as“ conventional technology ”in“ gravure plate making method of ballad plating type ”. Is described. Paragraph [0003] describes a “direct gravure plate making method”. Patent Document 3 describes an apparatus for regenerating a gravure cylinder. The cylinder reproducing device described in Patent Document 3 is a tool for flattening the surface of the copper-plated portion having a recess for printing (cutting tool and grinding tool), and a new printing device on the surface of the flattened copper-plated portion. And an engraving needle for forming the recess.

Japanese Patent Laid-Open No. 2001-80027 JP 2001-105562 A JP 2004-58347 A

  Despite the fact that most of the processes for manufacturing ballad type gravure cylinders are automated, plating layers (engraving layers and protective layers) are used from the used cylinders to recycle the cylinder base. The fact that the removal work is still done manually. As described in Patent Documents 1 and 2, the method of dissolving a plating layer by immersing a used cylinder in a liquid requires a relatively long time to remove the plating layer, and it is difficult to dissolve only the plating layer. In fact, it has not been widely adopted because it also affects the surface (underlayer) of the cylinder base below. In the cylinder reproducing device of Patent Document 3, since it is necessary to cut and grind the entire surface of the copper plating portion, there is room for improvement in that a long time is required for the regeneration processing.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a removal apparatus and a removal method useful for realizing automation of an operation of removing a plating layer from a ballad type gravure printing cylinder. .

  The present invention relates to a ballad-type gravure printing cylinder, that is, a cylinder base having a cylindrical portion, a base layer formed on the surface of the cylindrical portion of the cylinder base, and a plating layer formed outside the base layer. And an apparatus for removing the plating layer from the interface between the underlayer and the plating layer. The removal device according to the present invention includes a cylinder support portion that rotatably supports the cylinder around a center line extending in the longitudinal direction of the cylinder, a rotation mechanism that rotates the cylinder supported by the cylinder support portion, and A turning tool that moves in the longitudinal direction of the cylinder, and a turning tool for peeling disposed at a position where the tip of the turning tool is in the vicinity of the interface between the base layer and the plating layer and does not contact the base layer.

  According to the removing apparatus, the plating layer is peeled off from the underlayer with the peeling turning tool arranged at a position not in contact with the underlayer, so that the underlayer can be sufficiently prevented from being damaged.

  The removing device may further include a turning tool for forming a guide mark, which is a turning tool that moves in the longitudinal direction of the cylinder, and for making a guide mark on the plating layer prior to peeling by the turning tool for peeling. Alternatively, the removing device may further include a laser light source for making a guide mark on the plating layer by irradiating the surface of the cylinder supported by the cylinder support portion with a laser. By adopting these configurations, it is possible to more efficiently and stably perform the work using the turning tool for peeling. The guide mark serves as a guide when the plating layer is peeled off, and is constituted by a linear or dotted cut or a linear or dotted half cut penetrating the plated layer.

  The removing device may further include a turning tool for cutting the side surface of the cylinder. By adopting such a configuration, it is possible to more reliably remove the plating layer attached to the side surface of the cylinder.

  As the turning tool for peeling, the first surface facing the surface of the plating layer to be peeled, the second surface that forms the tip of the turning tool together with the first surface, and the front in the moving direction during the peeling operation A third surface located on the side and a fourth surface located on the rear side in the direction of movement during the peeling operation, the boundary between the first surface and the second surface being relative to the surface of the plating layer The second surface may be formed to be curved so as to go around a part of the turning tool main body, and inclined from the third surface toward the fourth surface. Since the boundary line between the first surface and the second surface is inclined with respect to the surface of the plating layer, the plating layer can be peeled off at the corner of the tip of the tool. In addition, since the second surface is curved, the tip of the tool can have a sharp angle, and further, the second surface is inclined, so that the peeled plating layer is more smoothly inclined. Can be sent out.

  The present invention provides a method for removing a plating layer of a ballad type gravure printing cylinder. The removal method according to the present invention includes a step of rotating a cylinder around a center line extending in the longitudinal direction of the cylinder, and a turning tool for peeling at a position near the interface between the base layer and the plating layer and not in contact with the base layer. A step of peeling the plating layer by moving the peeling turning tool in the longitudinal direction of the cylinder in a state where the tip is disposed.

  According to the above removal method, it is possible to sufficiently prevent the underlayer from being damaged by peeling off the plating layer from the underlayer using the peeling turning tool disposed at a position not in contact with the underlayer.

  The removing method may further include a step of making a guide mark on the plating layer prior to the step of peeling the plating layer with the turning tool for peeling. By providing a guide mark for peeling on the plating layer in advance, the subsequent work with the turning tool for peeling can be carried out more efficiently and stably. The guide traces may be formed using a guide trace forming turning tool or a laser light source.

  The removing method of the present invention may remove the plating layer using the removing device.

  ADVANTAGE OF THE INVENTION According to this invention, the removal apparatus and removal method useful for implement | achieving automation of the operation | work which removes a plating layer from the cylinder for gravure gravure printing are provided.

It is sectional drawing which shows an example of the cylinder for ballad gravure printing. It is a perspective view showing typically some composition of one embodiment of a removal device concerning the present invention. It is a perspective view which shows typically a mode that the process of making the mark for guides to a plating layer with the turning tool for guide mark formation is implemented. It is a perspective view which shows typically a mode that the preparation for the operation | work which peels a plating layer with the turning tool for peeling is performed. It is sectional drawing which shows typically a mode that the process of peeling a plating layer with the turning tool for peeling is implemented. It is a perspective view which shows an example of the turning tool for peeling. FIG. 7 is a three-side view of the peeling turning tool shown in FIG. 6. It is a perspective view which shows typically the structure of a part of other embodiment of the removal apparatus which concerns on this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

<Cylinder for ballad gravure printing>
FIG. 1 is a cross-sectional view showing an example of a ballad type gravure printing cylinder, and shows a cross section in a plane perpendicular to the longitudinal direction of the cylinder 10. As shown in FIG. 1, the cylinder 10 includes a cylinder base 1, a base layer 2 provided on the surface of the cylinder base 1, and a plating layer 5 provided outside the base layer 2. The plated layer 5 includes a sculpture forming layer 5a and a protective layer 5b, and these layers are formed in this order from the base layer 2 side. Since the cylinder base 1 is reused after the gravure printing is completed, the plating layer 5 can be peeled off while leaving the base layer 2 on the cylinder base 1 side.

  In the manufacturing process of the cylinder 10, the surface 2 f of the underlayer 2 is called a ballad liquid so that the plating layer 5 is peeled off from the underlayer 2 at the interface between the surface 2 f of the underlayer 2 and the back surface 5 f of the engraving formation layer 5 a. After the coating liquid is applied, the engraving formation layer 5a and the protective layer 5b are sequentially formed thereon by plating. As the ballad liquid, for example, anhydrous sodium sulfite, silver nitrate or thiosulfuric acid aqueous solution or water can be used.

  The cylinder base 1 is a cylindrical member having a length of 300 to 5000 mm and an outer diameter of 100 to 1500 mm, for example. Examples of the material of the cylinder base 1 include aluminum and iron.

  The underlayer 2 is a layer formed so as to cover the surface of the cylinder base 1. Examples of the material of the underlayer 2 include copper, zinc, tin, nickel, and alloys thereof, stainless steel, and other alloys.

  The engraving formation layer 5a is formed so as to cover the surface of the base layer 2 to which the ballad liquid is applied. The engraving formation layer 5a is formed by plating, and the thickness thereof is, for example, about 60 to 300 μm. Examples of the material of the engraving formation layer 5a include copper, zinc, tin, and alloys thereof, stainless steel, and other alloys. The engraving layer 5a is formed by plating, and then a gravure concave portion is engraved by a laser or the like.

  The protective layer 5b is for protecting the plate formed on the engraving formation layer 5a, and is formed so as to cover the surface of the engraving formation layer 5a. The protective layer 5b is formed by a plating process, and its thickness is, for example, about 5 to 8 μm. Examples of the material of the protective layer 5b include chromium, nickel, zinc, and alloys thereof.

<Removal device>
An embodiment of the removal apparatus will be described with reference to FIGS. A removal apparatus 100 shown in FIG. 2 is for removing the plating layer 5 from the interface between the foundation layer 2 and the plating layer 5 in the cylinder 10. The removing device 100 includes a cylinder support portion 20 that rotatably supports the cylinder 10 with a center line C extending in the longitudinal direction of the cylinder 10 as a rotation center, and a rotation mechanism that rotates the cylinder 10 supported by the cylinder support portion 20. (Not shown). The cylinder 10 can be rotated in the direction of arrow R in FIG. 2 by the rotation mechanism. For example, a lathe can be used as an apparatus including the cylinder support portion 20 and a configuration for moving turning tools 30 and 40 described later.

  As shown in FIG. 3, the removing device 100 includes a turning tool 30 for forming guide marks (hereinafter simply referred to as “turning tool 30”). The turning tool 30 moves in the direction of arrow A in FIG. 3 (longitudinal direction of the cylinder 10). By rotating the cylinder 10 in the direction of the arrow R and moving the turning tool 30 in the direction of the arrow A while being in contact with the surface of the plating layer 5, the guide trace 5c can be made on the plating layer 5. . At this time, the tip of the turning tool 30 is preferably at a position that does not contact the surface of the underlayer 2 so as not to damage the underlayer 2. The guide trace 5c serves as a guide when the plating layer 5 is peeled off. Here, although the linear trace which penetrated the plating layer 5 was illustrated as the guide trace 5c, the guide trace 5c may be comprised by the dotted-line cut or the linear or dotted-line half cut.

  As shown in FIG. 4, the removing apparatus 100 includes a peeling turning tool 40 (hereinafter simply referred to as “turning tool 40”) for peeling the plating layer 5 from the base layer 2. The turning tool 40 also moves in the direction of arrow A. The cylinder 10 is rotated in the direction of the arrow R, and the tip of the turning tool 40 is moved in the direction of the arrow A in a state where the tip of the turning tool 40 is disposed in the vicinity of the interface between the plating layer 5 and the base layer 2 and not in contact with the base layer 2. Thus, the plating layer 5 can be peeled off.

  The plating layer 5 is easily peeled off from the base layer 2 from the viewpoint of the influence of the ballad liquid applied to the interface with the base layer 2. In addition, the plating layer 5 can be peeled off efficiently and stably by the turning tool 40 by making the guide trace 5 c on the plating layer 5 in advance by the turning tool 30.

  As shown in FIGS. 5 to 7, the turning tool 40 includes a first surface 41 that faces the surface of the plating layer 5, a second surface 42 that forms the tip 40 a of the turning tool 40 together with the first surface 41, A third surface 43 located on the front side in the moving direction (direction of arrow A) during the peeling operation and a fourth surface 44 located on the rear side in the moving direction (direction of arrow A) during the peeling operation. Have. 7A is a plan view of the turning tool 40, FIG. 7B is a front view, and FIG. 7C is a side view.

  As shown in FIG. 7A, the tip 40 a (the boundary line between the first surface 41 and the second surface 42) is inclined with respect to the surface of the plating layer 5. Thereby, the plating layer 5 can be peeled off at the corner 40b of the tip 40a of the turning tool 40. The distance (clearance) between the corner 40b of the turning tool 40 and the base layer 2 is preferably about 0.001 to 0.300 mm (see FIG. 5).

  As shown in FIG. 7B, the second surface 42 is curved and formed so as to go around a part of the tool body 40c. Since the second surface 42 has the curved portion 42a, the tip 40a of the turning tool 40 can be set to a sharp angle. The second surface 42 is inclined from the third surface 43 toward the fourth surface 44. More specifically, when the turning tool 40 is arranged so that the second surface 42 faces upward, the second surface 42 is inclined so as to become lower from the third surface 43 toward the fourth surface 44. doing. The plating layer 5 peeled off by the inclination of the second surface 42 can be smoothly fed out to the fourth surface 44 side (see FIG. 5).

<Removal method>
Next, a method for removing the plating layer 5 from the used cylinder 10 will be described. In the method according to the present embodiment, the plating layer 5 is turned by the turning tool 30 prior to the peeling of the plating layer 5 by the turning tool 40 in a state where the cylinder 10 is rotated about the center line C extending in the longitudinal direction of the cylinder 10. The step of making a guide mark 5c on the surface, and the turning tool 40 in the direction of the arrow A with the tip 40a of the turning tool 40 arranged in the vicinity of the interface between the base layer 2 and the plating layer 5 and not in contact with the base layer 2 And a step of peeling the plating layer 5 by moving to.

  According to the above-described removal method, the peeling work by the turning tool 40 can be carried out more efficiently and stably by attaching the guide trace 5c for peeling to the plating layer 5 in advance. The guide trace 5c may be formed on the entire cylinder 10 (from one end side to the other end side), or from the viewpoint of shortening the working time, as shown in FIG. You may form only from the edge part side to the middle. Once peeling of the plating layer 5 is started, the entire plating layer 5 can be peeled off by the turning tool 40 without the guide trace 5c depending on the performance of the ballad liquid or the like.

  Moreover, according to the said removal method, it can fully suppress that the base layer 2 is damaged by peeling the plating layer 5 from the base layer 2 with the turning tool 40 arrange | positioned in the position which does not contact the base layer 2. FIG. . The apparatus and method according to this embodiment are useful for realizing automation of the operation of removing the plating layer 5 from the ballad type gravure cylinder 10.

<Other embodiments>
The removal apparatuses 100 and 200 according to the above embodiment may further include a turning tool (not shown) for cutting the side surface 10a of the cylinder 10. By adopting such a configuration, the plating layer attached to the side surface 10a can be more reliably removed. When performing the removal process of the plating layer 5 using the removal apparatuses 100 and 200 equipped with a turning tool for cutting the side surface 10 a, first, after the guide mark 5 c is made on the plating layer 5 by the turning tool 30, It is preferable to cut 10a and then peel the plating layer 5 with a turning tool 40. By attaching the guide trace 5c before cutting the side surface 10a, it is possible to suppress the plating layer 5 from peeling at an unintended timing when attaching the guide trace 5c.

  In the above-described embodiment, the case where the turning tool 30 is used to apply the guide trace 5c to the plated layer 5 is exemplified, but a laser light source may be used instead of the turning tool 30. FIG. 8 is a diagram illustrating a state in which a work for making a guide mark 5d on the plating layer 5 is performed by the laser L emitted from the light source 35 moving in the arrow A direction. As the light source 35, what can irradiate the laser L with a wavelength of 1056 nm or less, for example may be adopted. The light source 35 is preferably capable of adjusting the output of the laser L. For example, a light source that can be adjusted within a range of 15 W or more may be adopted.

DESCRIPTION OF SYMBOLS 1 ... Cylinder base, 2 ... Underlayer, 5 ... Plating layer, 5a ... Engraving formation layer, 5b ... Protective layer, 5c, 5d ... Trace for guide, 10 ... Cylinder for gravure printing, 10a ... Side, 20 ... Cylinder support part , 30 ... Turning tool for forming guide marks, 35 ... Light source, 40 ... Turning tool for peeling, 40a ... Tip, 40b ... Square, 40c ... Tool body, 41 ... First surface, 42 ... Second surface, 42a ... curved portion, 43 ... third surface, 44 ... fourth surface, 100,200 ... removal device, C ... center line, L ... laser.

Claims (8)

A cylinder base having a cylindrical part, a base layer formed on a surface of the cylindrical part of the cylinder base, and a plating layer formed outside the base layer, the base layer and the plating layer An apparatus for removing the plating layer of the gravure cylinder of the ballad system capable of peeling the plating layer from the interface,
A cylinder support that rotatably supports the cylinder around a center line extending in the longitudinal direction of the cylinder as a rotation center;
A rotation mechanism for rotating the cylinder in a state supported by the cylinder support portion;
A turning tool that moves in the longitudinal direction of the cylinder, and a turning tool for peeling disposed at a position where the tip of the turning tool is in the vicinity of the interface between the base layer and the plating layer and does not contact the base layer;
A removal apparatus comprising:   2. The turning tool for moving in the longitudinal direction of the cylinder, further comprising a guide trace forming turning tool for making a guide mark on the plating layer prior to peeling by the turning tool for peeling. Removal device.   The removal apparatus according to claim 1, further comprising a laser light source for making a guide mark on the plating layer by irradiating the surface of the cylinder supported by the cylinder support portion with a laser.   The removal apparatus according to any one of claims 1 to 3, further comprising a turning tool for cutting a side surface of the cylinder. The peeling turning tool includes a first surface that faces the surface of the plating layer to be peeled, a second surface that forms the tip of the turning tool together with the first surface, and a moving direction during the peeling operation. A third surface located on the front side of the first and a fourth surface located on the rear side in the moving direction during the peeling operation,
The boundary line between the first surface and the second surface is inclined with respect to the surface of the plating layer,
The said 2nd surface is curved and formed so that a part of said turning tool main-body part may be gotten, and it inclines toward the said 4th surface from the said 3rd surface. The removal apparatus according to claim 1. A cylinder base having a cylindrical part, a base layer formed on a surface of the cylindrical part of the cylinder base, and a plating layer formed outside the base layer, the base layer and the plating layer A method for removing the plating layer of a ballad type gravure printing cylinder capable of peeling the plating layer from the interface,
Rotating the cylinder around a center line extending in the longitudinal direction of the cylinder as a rotation center;
By moving the peeling turning tool in the longitudinal direction of the cylinder in the state where the tip of the peeling turning tool is arranged in the vicinity of the interface between the underlayer and the plating layer and not in contact with the underlayer. A step of peeling the plating layer;
A removal method comprising:   The removal method according to claim 6, further comprising a step of making a guide mark on the plating layer prior to the step of peeling the plating layer with the turning tool for peeling.   The removal method of removing the said plating layer using the removal apparatus as described in any one of Claims 1-6.

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