JP6421048B2 - Joining apparatus, joining system, joining method, program, and information storage medium - Google Patents

Description

  The present invention relates to a bonding apparatus, a bonding system, a bonding method, a program, and an information storage medium.

  In recent years, for example, in the manufacturing process of a semiconductor device, a substrate such as a silicon wafer or a compound semiconductor wafer has been increased in diameter and thinned. A thin substrate with a large diameter may be warped or cracked during transport or polishing. For this reason, after a different substrate is bonded to the substrate and reinforced, the substrate is transported or polished, and then the substrates are separated from each other.

  The bonding apparatus bonds the substrates together. The bonding apparatus includes a holding unit that holds a substrate, an imaging unit that images the substrate held by the holding unit, and an image processing unit that performs image processing on an image of the imaging unit (see, for example, Patent Document 1). The image processing unit calculates the center position of the substrate using three or more images obtained by partially capturing the outer peripheral edge of the substrate by the imaging unit.

  One of the images used for calculation of the center position of the substrate is a notch image obtained by imaging a portion of the outer peripheral edge of the substrate where the notch portion is formed. The notch image is also used for calculating the orientation of the substrate. Information such as the center position and orientation of the substrates is used to align the substrates.

JP2013-115124A

  The shape of the notch part may deviate from the standard shape, and the error of the substrate center position calculated using the notch image may be large.

  The present invention has been made in view of the above problems, and is a bonding apparatus that can accurately calculate the center position of a substrate using an image obtained by imaging a portion of the outer peripheral edge of the substrate where a notch is formed. The main purpose is provision.

In order to solve the above problems, according to one aspect of the present invention,
A joining device for joining substrates,
A holding unit for holding one substrate;
An imaging unit for imaging the substrate held by the holding unit;
An image processing unit that performs image processing on an image of the imaging unit,
The image processing unit calculates the center position of the substrate using three or more images obtained by partially capturing the outer periphery of the substrate by the imaging unit,
Of the three or more images used for calculating the center position, one is a notch image obtained by imaging a portion where a notch portion is formed, and two or more images are edge images obtained by imaging other portions. ,
The image processing unit calculates the center position based on the position of at least one of both end points of the outer peripheral edge of the substrate in the notch image that intersect the outer peripheral edge of the notch image. Is done.

  According to one embodiment of the present invention, there is provided a bonding apparatus that can accurately calculate the center position of a substrate using an image obtained by imaging a portion of the outer peripheral edge of the substrate where a notch is formed.

It is a top view which shows the outline of the joining system by one Embodiment. It is a side view of the superposition | polymerization board | substrate produced using the joining system by one Embodiment. It is a flowchart of the joining method by one Embodiment. It is a top view which shows the outline of the joining apparatus by one Embodiment. It is a side view which shows the main-body part of the joining apparatus by one Embodiment. It is a top view which shows the position alignment mechanism of the joining apparatus by one Embodiment. It is a top view which shows the imaging area of three lower cameras by one Embodiment. It is a figure which shows the notch image which imaged the part in which the notch part is formed among the outer periphery of the support substrate by one Embodiment. It is a figure which shows the edge image which imaged the other part of the outer periphery of the support substrate by one Embodiment. It is a flowchart which shows the detailed process of the joining process using the joining apparatus by one Embodiment. It is a figure which shows the 1st example of the image processing of the notch image shown in FIG. It is a figure which shows the 2nd example of the image processing of the notch image shown in FIG. It is a figure which shows the 3rd example of the image processing of the notch image shown in FIG. It is a figure which shows the 4th example of the image processing of the notch image shown in FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted. In the following description, the X direction, the Y direction, and the Z direction are directions perpendicular to each other, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

  FIG. 1 is a plan view schematically showing a joining system according to an embodiment. FIG. 2 is a side view of a polymerized substrate made using a bonding system according to one embodiment.

  The bonding system 1 creates a superposed substrate T by bringing the bonding surface of the substrate to be processed W and the bonding surface of the support substrate S face each other and bonding the substrate to be processed W and the support substrate S via the bonding layer G. To do.

  The substrate W to be processed is formed with elements, circuits, terminals, and the like. A surface on which elements, circuits, terminals, and the like are formed is a bonding surface. A surface opposite to the bonding surface of the substrate to be processed W (hereinafter also referred to as a non-bonding surface) is polished after bonding, and the substrate to be processed W is thinned. After polishing, a surface electrode, a through electrode, or the like may be formed on the non-joint surface of the substrate W to be processed. The substrate to be processed W may be a laminate of a plurality of substrates.

  The support substrate S is bonded to the substrate W to be processed and temporarily reinforces the substrate W to be processed. The support substrate S is peeled from the target substrate W after the target substrate W is polished. The peeled support substrate S may be bonded to another substrate to be processed W after being cleaned.

  As shown in FIG. 2, the superposed substrate T includes a substrate W to be processed, a support substrate S, and a bonding layer G that bonds the substrate to be processed W and the support substrate S. The bonding layer G includes, for example, an adhesive layer G1 and a release agent layer G2.

  The adhesive layer G1 is formed, for example, by applying a coating liquid made of an adhesive and an organic solvent that dissolves the adhesive to the bonding surface of the substrate to be processed W and then performing a heat treatment. The adhesive may be either a thermosetting resin or a thermoplastic resin.

  The release agent layer G2 is for smoothly peeling the target substrate W and the support substrate S. The release agent layer G2 is formed, for example, by applying a coating liquid made of an organic solvent that dissolves the release agent and the release agent to the bonding surface of the support substrate S, and then performing a heat treatment. The release agent has a lower adhesive force than the adhesive. In order to increase the adhesive strength of the bonding layer G, the thickness of the release agent layer G2 is significantly thinner than the thickness of the adhesive layer G1.

  As shown in FIG. 1, the joining system 1 includes a carry-in / out station 2, a processing station 3, and a control device 5.

  The carry-in / out station 2 carries in / out the substrate W to be processed, the support substrate S, and the superposed substrate T to / from the processing station 3. The carry-in / out station 2 includes a cassette mounting table 10 and a transfer device 20.

The cassette mounting table 10 includes a plurality of (for example, four) mounting units 12. The plurality of placement units 12 are arranged at intervals in the Y direction, and cassettes C _W , C _S , and C _T are placed on these placement units 12. The cassette _CW accommodates a substrate to be processed W, the cassette _CS contains a support substrate S, and the cassette _CT contains a plurality of superposed substrates T. Superposed substrate T is identified in the molded product is good or defective, and the cassette C _T for good, may be housed separately in a cassette C _T for defective products. The number of placement parts 12 is not limited to four.

Conveying device 20 conveys the cassette _C W on the mounting portion _12, C S, and _{C T,} between the processing station 3, to be processed the substrate W, the supporting substrate S, and the superposed substrate T. The conveyance device 20 includes a conveyance path 21 and a conveyance arm 22 that is movable in the Y direction along the conveyance path 21. The transfer arm 22 may be movable in the X direction and the Z direction, and may be rotatable about a rotation axis parallel to the Z direction.

  The processing station 3 includes a first processing block B1, a second processing block B2, a third processing block B3, and a transfer block B4. The first processing block B1, the second processing block B2, and the third processing block B3 are detachable from the transport block B4.

  The first processing block B1 includes a coating apparatus 30 and a heat treatment apparatus 50. The coating device 30 and the heat treatment device 50 are adjacent to the transport block B4.

  The coating device 30 applies the material of the bonding layer G to at least one of the target substrate W and the support substrate S. For example, the coating apparatus 30 applies the first coating liquid to the substrate W to be processed. The first coating liquid contains, for example, an adhesive and an organic solvent that dissolves the adhesive. Further, the coating device 30 applies the second coating liquid to the support substrate S. The second coating liquid contains a release agent and an organic solvent that dissolves the release agent.

  The heat processing apparatus 50 heat-processes the to-be-processed substrate W with which the 1st coating liquid was apply | coated, and forms the adhesive bond layer G1 by volatilizing the solvent contained in a 1st coating liquid. Further, the heat treatment apparatus 50 heats the support substrate S coated with the second coating liquid, and volatilizes the solvent contained in the second coating liquid, thereby forming the release agent layer G2. The heat treatment apparatuses 50 are arranged in two rows in the X direction in a state where four stages are stacked in the Z direction. Each heat treatment apparatus 50 may include a heating unit that heats at least one of the target substrate W and the support substrate S, and may further include a cooling unit that cools what is heated by the heating unit. In addition, the number and position of the heat processing apparatus 50 may be various.

  The second processing block B2 includes a joining device 60. The joining device 60 is adjacent to the transport block B4.

  The bonding apparatus 60 produces a superposed substrate T by causing the bonding surface of the substrate to be processed W and the bonding surface of the support substrate S to face each other and bonding the substrate to be processed W and the support substrate S via the bonding layer G. To do. The bonding apparatus 60 bonds the substrate to be processed W and the support substrate S under a reduced pressure atmosphere in order to suppress trapping of bubbles during bonding. In order to soften the bonding layer G, the bonding apparatus 60 heats the target substrate W and the support substrate S.

  The third processing block B3 includes a transition device 70. The transition devices 70 are stacked in two stages in the Z direction. The transition device 70 temporarily stores the substrate to be processed W, the support substrate S, and the superposed substrate T, and delivers them to the transfer device 20 and the process transfer device 80. Note that the number and positions of the transition devices 70 may vary.

  Note that the third processing block B3 may further include an inspection device that inspects the presence or absence of defects (for example, bubbles) in the superposed substrate T.

  The transport block B4 includes a process transport device 80. The process transfer apparatus 80 includes a process transfer arm 81 that transfers the substrate W to be processed, the support substrate S, and the superposed substrate T between apparatuses in the processing station 3. For example, the process transfer arm 81 is movable in the X direction, the Y direction, and the Z direction, and is rotatable about a rotation axis parallel to the Z direction.

  The control device 5 is composed of a computer including a storage medium 6 such as a memory and a CPU (Central Processing Unit) 7. Various processes are performed by causing the CPU 7 to execute a program (also referred to as a recipe) stored in the storage medium 6. Is realized. The control device 5 is provided separately from the bonding device 60 in FIG. 1, but may be a part of the bonding device 60. The control device 5 corresponds to the control unit described in the claims.

  The program of the control device 5 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), and a memory card. The program may be downloaded from a server via the Internet and installed.

  Next, a joining method using the joining system 1 will be described with reference to FIG. FIG. 3 is a flowchart of a bonding method according to an embodiment. Here, the bonding method will be described focusing on the substrate W to be processed.

  The bonding method includes a carry-in process S11, a coating process S13, a heat treatment process S15, a bonding process S17, and a carry-out process S19. These steps are performed under the control of the control device 5.

In the carry-in process S11, the transfer device 20 transfers the substrate W to be processed from the cassette _CW on the placement unit 12 to the transition device 70, and then the process transfer device 80 transfers the substrate W to be processed from the transition device 70 to the coating device 30. Transport to.

  In the coating step S <b> 13, the coating apparatus 30 applies the first coating liquid to the bonding surface of the target substrate W. The first coating liquid contains, for example, an adhesive and an organic solvent that dissolves the adhesive. After the application of the first coating liquid, the process transfer device 80 transfers the substrate W to be processed from the coating device 30 to the heat treatment device 50.

  In the heat treatment step S15, the substrate W to which the first coating liquid is applied is heat treated by the heat treatment apparatus 50, and the solvent contained in the first coating liquid is volatilized to form the adhesive layer G1. After the heat treatment, the process transfer device 80 transfers the substrate W to be processed from the heat treatment device 50 to the bonding device 60.

In this manner, the target substrate W is taken out of the cassette C _W, the coating apparatus 30, are sequentially transported to the heat treatment apparatus 50. Thus, the adhesive layer G1 is formed on the bonding surface of the target substrate W. Thereafter, the substrate to be processed W is transferred to the bonding apparatus 60.

During this time, in the same manner, the supporting substrate S is taken out from the cassette C _S, the coating apparatus 30, are sequentially transported to the heat treatment apparatus 50. The coating device 30 applies the second coating liquid to the bonding surface of the support substrate S. The second coating liquid contains, for example, a release agent and an organic solvent that dissolves the release agent. The heat processing apparatus 50 heat-processes the support substrate S with which the 2nd coating liquid was apply | coated, and volatilizes the solvent contained in a 2nd coating liquid, and forms release agent layer G2. Thereafter, the process transfer device 80 transfers the support substrate S to the bonding device 60.

  In the bonding step S <b> 17, the bonding apparatus 60 faces the bonding surface of the substrate to be processed W and the bonding surface of the support substrate S, and bonds the substrate to be processed W and the support substrate S through the bonding layer G, thereby polymerizing. A substrate T is produced.

In unloading step S19, to convey the process transport device 80 is superposed substrate T from the bonding apparatus 60 in the transition unit 70, then, conveyed on the conveying device 20 is superposed substrate T in a cassette C _T on the mounting section 12 from the transition device 70 To do.

  Next, with reference to FIGS. 4-5, the detail of the said joining apparatus 60 is demonstrated.

  As shown in FIG. 4, the joining apparatus 60 includes a processing container 100 that can seal the inside. A loading / unloading port 101 is formed on the side surface of the processing container 100 on the process transfer device 80 side, and an opening / closing shutter (not shown) is provided at the loading / unloading port 101. The interior of the processing container 100 is partitioned into a preprocessing region D1 and a joining region D2 by a partition wall 103. A loading / unloading port 104 is formed in the partition wall 103.

  The joining device 60 includes a delivery unit 110 and a reversing unit 120 in the pretreatment region D1.

  The delivery unit 110 delivers the substrate W to be processed, the support substrate S, and the superposed substrate T to and from the process transfer device 80 via the carry-in / out port 101. The delivery unit 110 includes a delivery arm 111 and a support pin 112. The delivery arm 111 delivers the substrate W to be processed, the support substrate S, and the superposed substrate T between the process transfer device 80 and the support pins 112. A plurality of (for example, three) support pins 112 are provided to support the substrate W to be processed, the support substrate S, and the superposed substrate T.

  The delivery unit 110 is arranged in a plurality of, for example, two stages in the vertical direction, and can deliver any two of the target substrate W, the support substrate S, and the superposed substrate T at the same time. For example, the substrate W to be processed or the support substrate S before joining may be delivered by one delivery unit 110, and the superposed substrate T after joining may be delivered by another delivery unit 110. Alternatively, the substrate W to be processed before bonding may be delivered by one delivery unit 110 and the support substrate S before joining may be delivered by another delivery unit 110.

  The reversing unit 120, for example, reverses the top and bottom of the substrate to be processed W and turns the bonding surface of the substrate to be processed W downward. The reversing unit 120 includes a holding arm unit 121 that holds the substrate W to be processed. The holding arm unit 121 is rotatable around a horizontal axis and is movable in the horizontal direction and the vertical direction. The reversing unit 120 flips the substrate W to be processed held by the holding arm unit 121 upside down by rotating the holding arm unit 121 around the horizontal axis. The holding arm unit 121 can also hold the support substrate S instead of the substrate W to be processed.

  The reversing unit 120 includes a detection unit 122 that detects the position of the notch portion of the substrate (the substrate to be processed W or the support substrate S) held by the holding arm unit 121. The reversing unit 120 detects the position of the notch portion of the substrate by the detection unit 122 while rotating the substrate held horizontally by the holding arm unit 121 in a horizontal plane, so that the substrate held by the holding arm unit 121 Adjust the orientation in the horizontal plane. The notch portion represents the crystal orientation of the substrate.

  The joining device 60 includes a conveyance unit 130 and a main body unit 150 in the joining region D2.

  The transport unit 130 transports the substrate W, the support substrate S, and the superposed substrate T to the delivery unit 110, the reversing unit 120, and the main body unit 150. The transport unit 130 includes two transport arms 131 and 132. The transfer arms 131 and 132 are arranged in two stages in this order from the bottom in the vertical direction, and are movable in the horizontal direction and the vertical direction. The lower transfer arm 131 transfers, for example, the support substrate S from the reversing unit 120 to the main body unit 150. For example, the upper transfer arm 132 transfers the substrate W to be processed from the reversing unit 120 to the main body 150.

  The main body 150 joins the substrate W to be processed and the support substrate S. As shown in FIG. 5, the main body 150 includes a chamber 151, a decompression mechanism 157, a lower chuck 161, an upper chuck 162, a pressurization mechanism 170, an alignment mechanism 180, a lower camera 191, and an upper camera 192.

  The chamber 151 is a processing container whose inside can be sealed, and is divided into a chamber lower part 152 and a chamber upper part 153. The lower chamber 152 accommodates the lower chuck 161 and the like, and the upper chamber 153 accommodates the upper chuck 162 and the like. The chamber upper part 153 is moved up and down with respect to the chamber lower part 152 by an elevator mechanism (not shown). By bringing the chamber upper portion 153 into contact with the chamber lower portion 152, a sealed space is formed inside the chamber 151. This sealed space is decompressed by a decompression mechanism 157 such as a vacuum pump.

  In the present embodiment, the chamber upper portion 153 is raised and lowered, but the chamber lower portion 152 may be raised and lowered, or both may be raised and lowered. It is sufficient that the chamber upper part 153 and the chamber lower part 152 can be moved up and down relatively.

  The lower chuck 161 is a holding unit that holds the surface opposite to the bonding surface of the support substrate S with the bonding surface of the support substrate S facing upward. The lower chuck 161 includes an electrostatic adsorption unit that electrostatically adsorbs the support substrate S and a heating unit that heats the support substrate S to a predetermined temperature. The lower chuck 161 may include a vacuum suction unit in addition to the electrostatic suction unit.

  The upper chuck 162 is a holding unit that holds the surface opposite to the bonding surface of the target substrate W with the bonding surface of the target substrate W facing downward. The upper chuck 162 includes an electrostatic adsorption unit that electrostatically adsorbs the substrate W to be processed, and a heating unit that heats the substrate W to be processed to a predetermined temperature. The upper chuck 162 may have a vacuum suction unit in addition to the electrostatic suction unit.

  In this embodiment, the lower chuck 161 holds the support substrate S and the upper chuck 162 holds the substrate W to be processed, but the lower chuck 161 holds the substrate W to be processed and the upper chuck 162 holds the support substrate S. May be.

  The pressurizing mechanism 170 lowers the upper chuck 162 in the chamber 151, thereby pressing the substrate W to be processed to the support substrate S through the bonding layer G. The pressurizing mechanism 170 includes, for example, a pressure vessel 171 that can expand and contract in the vertical direction, a gas supply source 172 that supplies gas to the pressure vessel 171, and the like. The pressure vessel 171 is made of, for example, a stainless bellows. The lower end portion of the pressure vessel 171 is fixed to the upper chuck 162, and the upper end portion of the pressure vessel 171 is fixed to the upper chamber portion 153. The pressurizing mechanism 170 expands and contracts the pressure vessel 171 by adjusting the amount of gas in the pressure vessel 171 and moves the chamber upper portion 153 up and down. Further, the pressurizing mechanism 170 adjusts the pressure between the substrate to be processed W and the support substrate S by adjusting the atmospheric pressure in the pressure vessel 171.

  The alignment mechanism 180 aligns the support substrate S held by the lower chuck 161 and the target substrate W held by the upper chuck 162. In this alignment, the position in the horizontal direction (X-direction position and Y-direction position) and the rotation position around the vertical axis (orientation in the horizontal plane) are matched.

  The alignment mechanism 180 moves the upper chuck 162 in the horizontal direction by moving the chamber upper part 153 in the horizontal direction. Further, the alignment mechanism 180 rotates the upper chuck 162 around the vertical axis by rotating the chamber upper part 153 around the vertical axis.

  The alignment mechanism 180 has, for example, a plurality of sets (for example, five sets) of a cam 181, a shaft 182, and a rotary motor 183. The rotation motor 183 rotates the cam 181 via the shaft 182. The center of the cam 181 is shifted from the center of rotation.

  FIG. 6 is a plan view showing an alignment mechanism of the bonding apparatus according to the embodiment. The two cams 181 sandwich the chamber upper portion 153 from both sides in the X direction and are simultaneously rotated to move the chamber upper portion 153 in the X direction. The other two cams 181 sandwich the chamber upper portion 153 from both sides in the Y direction and are simultaneously rotated to move the chamber upper portion 153 in the Y direction. The remaining one cam 181 is in contact with a blade portion 154 protruding from the outer peripheral surface of the chamber upper portion 153, and rotates the chamber upper portion 153 around the vertical axis. The blade portion 154 is pressed against the cam 181 by the elastic restoring force of the spring portion 155.

  The lower camera 191 is an imaging unit that partially images the outer peripheral edge of the support substrate S held by the lower chuck 161. The upper camera 192 is an imaging unit that partially images the outer peripheral edge of the substrate W to be processed held by the upper chuck 162.

  Note that the arrangement of the support substrate S and the substrate to be processed W may be reversed. The lower camera 191 holds the substrate to be processed W held by the lower chuck 161, and the upper camera 192 shows the support substrate S held by the upper chuck 162. You may image each.

  The lower camera 191 and the upper camera 192 are integrated, and are horizontally moved integrally by a horizontal movement mechanism (not shown). The lower camera 191 and the upper camera 192 are movable between an imaging position where the support substrate S and the target substrate W are imaged and a retracted position retracted from the moving path of the chamber upper part 153.

  The lower camera 191 and the upper camera 192 may be horizontally moved independently. In this case, the lower camera 191 and the upper camera 192 capture a common target, and the relative position information between the lower camera 191 and the upper camera 192 is corrected.

  FIG. 7 is a plan view showing imaging areas of three lower cameras according to an embodiment. FIG. 8 is a diagram illustrating a notch image obtained by imaging a portion where the notch portion is formed in the outer peripheral edge of the support substrate according to the embodiment. FIG. 9 is a diagram illustrating an edge image obtained by imaging the other part of the outer peripheral edge of the support substrate according to the embodiment. 8 and 9, in order to make the drawings easy to see, the support substrate is hatched, and the unevenness of the outer peripheral edge of the support substrate is exaggerated. The imaging areas of the three upper cameras are the same as the imaging areas of the three lower cameras shown in FIG.

  The three lower cameras 191 capture images of three portions of the outer peripheral edge S1 (hereinafter also referred to as “substrate outer peripheral edge S1”) of the support substrate S. As shown in FIG. 7, the three lower cameras 191 are arranged so that the center line 191 </ b> L of the imaging area 191 </ b> A of the three lower cameras 191 intersects at one point in plan view.

  Of the three images captured by the three lower cameras 191, one is a notch image NP (see FIG. 8) obtained by imaging a portion where the notch portion S <b> 2 is formed, and the remaining two images are other portions. It is the imaged edge image EP (see FIG. 9).

  The control device 5 performs image processing on the single notch image NP and the two edge images EP, and calculates the center position of the support substrate S (hereinafter also referred to as “substrate center position”). A method for calculating the substrate center position will be described later. Further, the control device 5 performs image processing on one notch image NP, calculates the position of the vertex S3 of the notch portion S2, and calculates the orientation of the support substrate S in the horizontal plane. The control device 5 corresponds to the image processing unit described in the claims.

  In the present embodiment, the control device 5 functions as an image processing unit, but an image processing unit may be provided separately from the control device 5.

  The number of lower cameras 191 is not limited to three. The number of the lower cameras 191 may be one, for example, and in this case, the lower camera 191 is sequentially moved to the three imaging positions shown in FIG. Further, the number of lower cameras 191 may be four or more.

  FIG. 10 is a flowchart showing details of a bonding process using the bonding apparatus according to the embodiment. The bonding step S17 may include a substrate setting step S21, a substrate imaging step S23, an image processing step S25, a substrate alignment step S27, a substrate superposition step S29, and the like.

  In the substrate setting step S21, the reversing unit 120 adjusts the orientation of the substrate to be processed W in the horizontal plane, and reverses the substrate to be processed W upside down so that the bonding surface of the substrate to be processed W faces downward. Thereafter, the transfer unit 130 transfers the substrate W to be processed from the reversing unit 120 to the upper chuck 162, and the upper chuck 162 holds the substrate W to be processed.

  In the substrate setting step S21, after the reversing unit 120 adjusts the orientation of the support substrate S in the horizontal plane, the transport unit 130 transports the support substrate S from the reversing unit 120 to the lower chuck 161, and the lower chuck 161 supports the support substrate. Hold S.

  In the substrate imaging step S23, the lower camera 191 images three portions of the outer peripheral edge S1 of the support substrate S. Of the three images picked up by the lower camera 191, one is a notch image NP (see FIG. 8), and the other two are edge images EP (see FIG. 9).

  Further, in the substrate imaging step S23, the upper camera 192 is caused to image three portions of the outer peripheral edge of the substrate W to be processed. Of the three images captured by the upper camera 192, one is a notch image, and the remaining two are edge images.

  In the image processing step S25, the image captured in the substrate imaging step S23 is subjected to image processing to calculate the center position and orientation of the support substrate S and the center position and orientation of the substrate W to be processed. The relative positions of the support substrate S and the substrate to be processed W are obtained.

  In the substrate alignment step S27, the alignment mechanism 180 aligns the target substrate W and the support substrate S based on the processing result of the image processing step S25. In this alignment, the position in the horizontal direction (X-direction position and Y-direction position) and the rotation position around the vertical axis (orientation in the horizontal plane) are aligned.

  In the substrate superposition step S29, the lower camera 191 and the upper camera 192 are moved from the imaging position to the retracted position, the chamber upper part 153 is lowered and brought into contact with the chamber lower part 152, and a sealed space is formed inside the chamber 151. Thereafter, the decompression mechanism 157 decompresses the sealed space inside the chamber 151, and the pressurization mechanism 170 lowers the upper chuck 162 in the chamber 151, so that the substrate W to be processed becomes the support substrate S via the bonding layer G. Crimp. Thereby, the superposition | polymerization board | substrate T is obtained.

  Next, a method for calculating the center position of the support substrate S will be described. Since the calculation method of the center position of the substrate W to be processed is the same, the description thereof is omitted.

  The center position of the support substrate S is calculated based on the result of image processing of two edge images EP and the result of image processing of one notch image NP.

  For example, in the image processing of the edge image EP, as shown in FIG. 9, the outer peripheral edge S1 imaged in the edge image EP is detected, and the outer peripheral edge S1 is approximated by an arcuate approximate curve EP1 to obtain an arcuate shape. The position of the intersection S4 between the approximate curve EP1 and the image center line EP2 is calculated. The image center line EP2 of the edge image EP corresponds to the center line 191L of the imaging area of the lower camera 191.

  On the other hand, in the image processing of the notch image NP, image processing different from the image processing of the edge image EP is performed. The substrate outer peripheral edge S1 imaged in the notch image NP has a shape in which a recess is formed in a part of the arc. When the shape of the notch part deviates from the standard shape, specifically, for example, when the corner part of the remaining part of the arc and the recessed part is rounded due to wear or polishing, the remaining part of the arc is removed as shown in FIG. When approximated by the arc-shaped approximate curve NP1, the approximate curve NP1 is a convex curve opposite to the substrate outer peripheral edge S1.

  Therefore, in the image processing of the notch image NP, the position of at least one of both end points S5 and S6 of the substrate outer periphery S1 imaged in the notch image NP is calculated. Both the end points S5 and S6 are far from the notch portion S2 as compared to the points between them, and are hardly affected by the fact that the shape of the notch portion S2 deviates from the standard shape. Therefore, the substrate center position can be accurately calculated based on the result of the image processing of the notch image NP.

For example, in the image processing shown in FIG. 11, the following processes (1A) to (3A) are performed.
(1A) A circle C1 passing through a total of three points: one end point S5 of the substrate outer periphery S1 in the notch image NP and a point (for example, the intersection S4 shown in FIG. 9) of the substrate outer periphery S1 in each of the two edge images EP. The center C1a is set as the first virtual center point. Note that the number of edge images EP may be two or more, and the number of outer peripheral edges S1 used for calculating the first virtual center point may be three or more. When the number of points is four or more, it is only necessary that the outer circumference of the circle substantially overlaps each point, and the circle may be calculated by approximate calculation.
(2A) A circle C2 passing through a total of three points, that is, the other end point S6 of the substrate outer peripheral edge S1 in the notch image NP and the point of the substrate outer peripheral edge S1 in each of the two edge images EP (for example, the intersection S4 shown in FIG. 9). The center C2a is set as the second virtual center point. Note that the number of edge images EP may be two or more, and the number of outer peripheral edges S1 used for calculating the second virtual center point may be three or more. When the number of points is four or more, it is only necessary that the outer circumference of the circle substantially overlaps each point, and the circle may be calculated by approximate calculation.
(3A) The position of the midpoint between the first virtual center point and the second virtual center point is calculated as the substrate center position.
Since the radius of the support substrate S is not used for calculation of the center position of the support substrate S, it is suitable when the radius deviates from the standard.

In the image processing shown in FIG. 12, the following processes (1B) to (2B) are performed.
(1B) On a circle C3 having a predetermined radius passing through both end points S5 and S6 of the substrate outer periphery S1 in the notch image NP, a midpoint S7 of equal distance from both end points S5 and S6 is calculated. Here, as the radius of the circle, for example, the standard radius of the support substrate S is used.
(2B) The position of the center of the circle passing through a total of three points, the middle point S7 in the notch image NP and the point of the substrate outer peripheral edge S1 in each of the two edge images EP (for example, the intersection S4 shown in FIG. 9) Calculate as position. Note that the number of edge images EP may be two or more, and the number of substrate outer peripheral edges S1 used for calculating the substrate center position may be three or more. When the number of points is four or more, it is only necessary that the outer circumference of the circle substantially overlaps each point, and the circle may be calculated by approximate calculation.

In the image processing shown in FIG. 13, the following processes (1C) to (2C) are performed.
(1C) A circle C4 having a predetermined radius passing through an end point S5 far from the vertex S3 of the notch S2 among both end points S5 and S6 of the substrate outer periphery S1 in the notch image NP, and the center of the circle is the notch image NP. An intersection S8 between the circle C4 set on the image center line NP2 and the image center line NP2 is calculated. Here, as the radius of the circle, for example, the standard radius of the support substrate S is used.
(2C) The position of the center of the circle passing through a total of three points of the intersection S8 in the notch image NP and the point of the substrate outer peripheral edge S1 in each of the two edge images EP (for example, the intersection S4 shown in FIG. 9) Calculate as Note that the number of edge images EP may be two or more, and the number of substrate outer peripheral edges S1 used for calculating the substrate center position may be three or more. When the number of points is four or more, it is only necessary that the outer circumference of the circle substantially overlaps each point, and the circle may be calculated by approximate calculation.
Since only the end point S5 far from the notch S2 of both end points S5 and S6 is used to calculate the center position of the support substrate S, the influence of the notch S2 being out of the standard shape is affected. The calculation accuracy of the center position of the support substrate S can be improved.

In the image processing shown in FIG. 14, the following (1D) processing is performed.
(1D) Of both end points S5 and S6 of the substrate outer periphery S1 in the notch image NP, an end point S5 far from the vertex S3 of the notch S2 and a point of the substrate outer periphery S1 in each of the two edge images EP (for example, The position of the center C1a of the circle C1 passing through a total of three points S4) shown in FIG. 9 is calculated as the substrate center position. Note that the number of edge images EP may be two or more, and the number of substrate outer peripheral edges S1 used for calculating the substrate center position may be three or more. When the number of points is four or more, it is only necessary that the outer circumference of the circle substantially overlaps each point, and the circle may be calculated by approximate calculation.
Since the radius of the support substrate S is not used for calculation of the center position of the support substrate S, it is suitable when the radius deviates from the standard. In addition, since the center position of the support substrate S is calculated using only the end point S5 far from the notch portion S2 of both end points S5 and S6, the shape of the notch portion S2 deviates from the standard shape. The influence can be eliminated, and the calculation accuracy of the center position of the support substrate S can be improved.

  In (1D) above, the first virtual center point obtained in (1A) is set as the substrate center position. When both the end points S5 and S6 are substantially equidistant from the vertex S3 of the notch S2, the image processing shown in FIG. 11 in which the center position of the substrate is calculated using both end points S5 and S6 can improve the calculation accuracy.

  As mentioned above, although embodiment, such as a joining apparatus, was described, although embodiment etc. were described, the present invention is not limited to the above-mentioned embodiment etc., and within the limits of the gist of the present invention indicated in a claim, Various modifications and improvements are possible.

  For example, the type of substrate W to be processed may be various, and may be, for example, a substrate for an FPD (flat panel display), a mask reticle for a photomask, or the like in addition to a semiconductor substrate.

  The image processing shown in FIGS. 11 to 14 is applied to both the target substrate W and the support substrate S, but may be applied to only one of them. Since the support substrate S is reused, the shape of the notch portion of the support substrate S tends to deviate from the standard shape due to wear or chipping. Therefore, the image processing shown in FIGS. 11 to 14 may be applied only to the support substrate S.

  In the image processing shown in FIGS. 11 to 14, an intersection S4 between the approximate curve EP1 and the image center line EP2 shown in FIG. 9 is used as a point of the substrate outer peripheral edge S1 in the edge image EP. Not. For example, at least one of both end points of the approximate curve EP1 shown in FIG. 9 may be used as the point of the substrate outer periphery S1 in the edge image EP.

  The bonding layer G of the polymerization substrate T of the above embodiment has a two-layer structure of the adhesive layer G1 and the release agent layer G2, but the structure is not particularly limited. For example, the bonding layer G may have a one-layer structure including only the adhesive layer G1, or a three-layer structure including the adhesive layer G1, the release agent layer G2, and the protective agent layer. In the case of a three-layer structure, the protective agent layer, the release agent layer G2, and the adhesive layer G1 may be arranged in this order from the substrate to be processed W to the support substrate S, for example. The protective agent layer protects elements formed on the bonding surface of the substrate W to be processed.

DESCRIPTION OF SYMBOLS 1 Joining system 2 Carrying in / out station 3 Processing station 5 Control apparatus 30 Coating apparatus 50 Heat processing apparatus 60 Joining apparatus 80 Process conveyance apparatus 161 Lower chuck 162 Upper chuck 191 Lower camera 192 Upper camera

Claims (13)

A joining device for joining substrates,
A holding unit for holding one substrate;
An imaging unit for imaging the substrate held by the holding unit;
An image processing unit that performs image processing on an image of the imaging unit,
The image processing unit calculates the center position of the substrate using three or more images obtained by partially capturing the outer periphery of the substrate by the imaging unit,
Of the three or more images used for calculating the center position, one is a notch image obtained by imaging a portion where a notch portion is formed, and two or more images are edge images obtained by imaging other portions. ,
The said image processing part is a joining apparatus which calculates the said center position based on the position of the outer periphery of the said board | substrate in the said notch image of at least one of the both end points which cross | intersect the outer periphery of the said notch image . The image processing unit
A total of three points: one end point of both of the end points of the outer peripheral edge of the substrate in the notch image intersecting with the outer peripheral edge of the notch image , and the point of the outer peripheral edge of the substrate in each of the two or more edge images. The center of the circle whose outer circumference substantially overlaps the above points is taken as the first virtual center point,
Wherein the outer peripheral edge of the substrate in the notch image and the other endpoint of the endpoints of both intersecting the outer peripheral edge of the notch image and one total of three points of the outer peripheral edge of the substrate in two or more of each of the edge images The center of the circle whose outer periphery substantially overlaps the above points is taken as the second virtual center point,
The joining apparatus according to claim 1, wherein a position of a midpoint between the first virtual center point and the second virtual center point is calculated as the center position. The image processing unit
On the outer peripheral edge of the substrate in the notch image , on a circle with a predetermined radius passing through both end points intersecting the outer peripheral edge of the notch image, a midpoint equidistant from the both end points is calculated,
The center of a circle whose outer periphery substantially overlaps with a total of three or more points including the middle point in the notch image and the outer peripheral edge point of the substrate in each of the two or more edge images is calculated as the center position. Item 2. The joining apparatus according to Item 1. The image processing unit
A circle having a predetermined radius passing through an end point far from the apex of the notch portion among both end points intersecting with the outer periphery of the notch image at the outer periphery of the substrate in the notch image, and the center of the circle is the notch image The intersection of the circle set on the image center line and the image center line is calculated,
The center of a circle whose outer periphery substantially overlaps a total of three or more points of the intersection point in the notch image and the outer peripheral edge point of the substrate in each of two or more edge images is calculated as the center position. The joining apparatus according to 1. The image processing unit
Of both end points of the outer peripheral edge of the substrate in the notch image intersecting with the outer peripheral edge of the notch image, an end point far from the apex of the notch part, and the outer peripheral edge of the substrate in each of the two or more edge images The joining apparatus according to claim 1, wherein a center of a circle whose outer periphery substantially overlaps with a total of three or more points is calculated as the center position. A coating station that applies a material for the bonding layer to the substrate, a bonding device that bonds the substrates to each other via the bonding layer, and a processing station that includes a transfer device that transfers the substrate;
A loading / unloading station for loading / unloading substrates to / from the processing station;
The joining system which has a joining apparatus of any one of Claims 1-5 as said joining apparatus. A bonding method for bonding substrates,
A substrate setting step of holding one of the substrates in the holding unit;
A substrate imaging step of causing the imaging unit to image the substrate held by the holding unit;
An image processing step of performing image processing on the image of the imaging unit,
In the image processing step, the center position of the substrate is calculated using three or more images obtained by partially capturing the outer periphery of the substrate by the imaging unit,
Of the three or more images used for calculating the center position, one is a notch image obtained by imaging a portion where a notch portion is formed, and two or more images are edge images obtained by imaging other portions. ,
In the image processing step, the center position is calculated based on the position of at least one of both end points of the outer peripheral edge of the substrate in the notch image that intersect the outer peripheral edge of the notch image . In the image processing step,
A total of three points: one end point of both of the end points of the outer peripheral edge of the substrate in the notch image intersecting with the outer peripheral edge of the notch image , and the point of the outer peripheral edge of the substrate in each of the two or more edge images. The center of the circle whose outer circumference substantially overlaps the above points is taken as the first virtual center point,
Wherein the outer peripheral edge of the substrate in the notch image and the other endpoint of the endpoints of both intersecting the outer peripheral edge of the notch image and one total of three points of the outer peripheral edge of the substrate in two or more of each of the edge images The center of the circle whose outer periphery substantially overlaps the above points is taken as the second virtual center point,
The joining method according to claim 7, wherein a position of a midpoint between the first virtual center point and the second virtual center point is calculated as the center position. In the image processing step,
On the outer peripheral edge of the substrate in the notch image , on a circle with a predetermined radius passing through both end points intersecting the outer peripheral edge of the notch image, a midpoint equidistant from the both end points is calculated,
The center of a circle whose outer periphery substantially overlaps with a total of three or more points including the middle point in the notch image and the outer peripheral edge point of the substrate in each of the two or more edge images is calculated as the center position. Item 8. The joining method according to Item 7. In the image processing step,
A circle having a predetermined radius passing through an end point far from the apex of the notch portion among both end points intersecting with the outer periphery of the notch image at the outer periphery of the substrate in the notch image, and the center of the circle is the notch image The intersection of the circle set on the image center line and the image center line is calculated,
The center of a circle whose outer periphery substantially overlaps a total of three or more points of the intersection point in the notch image and the outer peripheral edge point of the substrate in each of two or more edge images is calculated as the center position. 8. The joining method according to 7. In the image processing step,
Of both end points of the outer peripheral edge of the substrate in the notch image intersecting with the outer peripheral edge of the notch image, an end point far from the apex of the notch part, and the outer peripheral edge of the substrate in each of the two or more edge images The joining method according to claim 7, wherein a center of a circle whose outer periphery substantially overlaps with a total of three or more points is calculated as the center position.   The program for making a computer perform the joining method in any one of Claims 7-11.   An information storage medium storing the program according to claim 12.

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