JP6542579B2 - LED lighting device - Google Patents

Description

  The present invention relates to an LED lighting apparatus including a plurality of LED (Light Emitting Diode) elements as a light source.

Conventionally, as a LED lighting apparatus using LED as a light source, for example, a ceiling light fixture (sealing light) disclosed in Patent Document 1 is known.
The LED lighting apparatus (lighting apparatus) disclosed in Patent Document 1 includes a main light source (lower unit) provided at the center of the tool body, an auxiliary light source provided at a frame of the outer periphery of the tool body, and a ceiling And an indirect light source (upper unit) provided on an upper portion of the instrument body facing the surface.

The main light source is mounted on an arc-shaped substrate so as to divide a circular instrument main body into a plurality of pieces, and a number of LED elements (hereinafter appropriately referred to as “LEDs”) which emit light downward Have.
The indirect light source has a substrate on which the LED is mounted, a mounting portion for mounting the substrate on the upper surface of the tool body, and the like. The mounting portion is formed in an L-shape as a whole, and a substrate having LEDs arranged in a lateral direction is mounted vertically oriented so as to be orthogonal to the horizontal upper surface of the tool body. The indirect light source is arranged such that the light from the LED is emitted outward parallel to the top surface of the tool body.
The ceiling light fixture includes such a main light source, an auxiliary light source, and an indirect light source for illuminating the ceiling surface, thereby lighting the entire room regardless of the orientation of the fixture, and for the room. I am improving the feeling of brightness.

  However, in a ceiling lighting device on which a large number of LEDs are mounted, since the temperature of the LED substrate on which the LEDs are mounted is high, a heat sink for cooling the LED substrate is provided. The heat sink is formed with a frustum-shaped convex portion, the LED substrate is mounted on the mounting surface of the convex portion, and the LED cover is provided to cover the light emitting surface of the LED substrate. Fixing to a part (mounting surface) is performed.

JP, 2013-145685, A

  In the LED lighting device disclosed in Patent Document 1, the LED of the indirect light source is mounted on the back of a substrate (substrate 34) installed in the vertical direction, and arranged so as to emit light in the lateral direction. It is done. That is, the substrate of the indirect light source is placed vertically. For this reason, the height of the fixture body and the heat sink is also increased (the thickness is increased), and the entire LED lighting device is increased in size and size.

  An object of the present invention is to provide an LED lighting device capable of reducing the overall height.

The present invention comprises a first light source substrate comprising a plurality of LED elements as a main light source and emitting light, a second light source substrate comprising a plurality of LED elements as a secondary light source and emitting light, and the first light source substrate It is a LED lighting apparatus which has a heat sink which radiates the heat of a light source board and the 2nd light source board, and the heat sink is the above-mentioned so that light may be irradiated downward to the undersurface side of the heat sink. A first light source substrate is disposed, and the second light source substrate is horizontally disposed on the upper surface side of the heat dissipation plate so as to emit light upward, and covers the second light source substrate from above A light transmitting upper cover that transmits light, wherein the upper cover is a reflecting portion that reflects light emitted from the plurality of LED elements of the second light source substrate in an outer peripheral direction; and the second light source The reflective portion between the upper surface of the substrate and the lower surface of the upper cover Has a mountain-shaped portion for forming a space for formation, is irradiated with light emitted from the plurality of LED elements of said second light source substrate in the outer peripheral direction and the upper direction, the mountain-shaped portion, The upper surface is formed in a vertically expanded state in a mountain shape, and the reflecting portion is formed downward from the inner surface of the mountain portion .

  According to the present invention, it is possible to provide an LED lighting device capable of reducing the overall height.

It is a figure which shows the LED lighting apparatus which concerns on embodiment of this invention, and is an external appearance perspective view shown when it sees from diagonally downward. It is an external appearance perspective view which shows the state when the LED lighting apparatus is seen from diagonally upward. It is a disassembled perspective view which shows the state when the LED lighting apparatus is seen from diagonally downward. It is a disassembled perspective view which shows the state when the LED lighting apparatus is seen from diagonally upward. It is a center longitudinal cross-sectional view of a LED lighting apparatus. It is a perspective view which shows the LED lighting apparatus which removed the sword and cut a part of LED cover. It is a perspective view which shows the state when the LED lighting apparatus which looked at a part of indirect light cover from diagonally upward direction. It is a bottom view which shows an example of a LED light source substrate. It is a perspective view which shows the state when the LED lighting apparatus which removed the indirect light cover and the sensor unit from diagonally upward direction. It is a figure which shows the wiring state of an electric wire, and is a principal part expansion schematic sectional drawing of the LED lighting apparatus which removed the indirect light cover. It is the A section enlarged view of FIG. It is the B section enlarged view of FIG. It is a principal part expanded sectional view showing the 1st modification of an indirect light cover. It is a principal part expanded sectional view showing the 2nd modification of an indirect light cover. It is a figure which shows the modification of an indirect light source substrate, and is a perspective view which shows the LED lighting apparatus which removed the indirect light cover.

  Next, an LED lighting device (LED ceiling light) according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the present embodiment, an example of the LED lighting device 1 will be described by taking a plan view and taking a circular shape as an example, but the shape is not limited to this, and for example, a square, a hexagon, an octagon It can also be applied to polygons such as. Moreover, although this embodiment demonstrates as LED lighting apparatus 1 which used a light emitting diode (LED) as a light source for main illumination hereafter, the light source for main illumination is not limited to LED.

  The LED lighting device 1 shown in FIG. 1 and FIG. 2 is, for example, via a mounting adapter (not shown) engaged with an indoor wiring device (not shown) such as a hooked rosette or hooked ceiling provided on a ceiling surface of a house. It is connected to an external power source and fixed at a predetermined position on the ceiling surface for use. The LED lighting device 1 is, for example, of a round shape, a square shape, or the like (in the present embodiment, it is a round shape). In the following description, the upper side in the drawing is the ceiling side (upper surface side), and the lower side in the drawing is the floor side (lower surface side) based on the state in which the LED lighting device 1 is attached to the ceiling surface.

  As shown in FIGS. 3 and 4, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulation plate), a power supply substrate 13, a heat dissipation plate 14, an LED light source substrate 15 (first light source substrate), and an LED cover A center cover 17, a ring member 18, a shade 19, an indirect light source substrate 20 (second light source substrate), an indirect light cover 21 (upper cover), a sensor unit 22 and the like are provided.

  The backbone 11 is a base member formed by processing a steel plate (for example, SECC (electro-galvanized steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) such that the concave surface faces the floor side. Further, at the center of the backbone 11, an adapter mounting hole 11a is formed in which a mounting adapter (not shown) is locked.

  The adapter receiving portion 12 is formed of a flame retardant and electrically insulating synthetic resin (for example, PP: polypropylene resin etc.), and has a ring-shaped fixing portion 12 a screwed to the lower surface of the backbone 11 and the fixing portion And a cylindrical portion 12b extending from the inner peripheral edge portion 12a to the floor side (downward).

  As shown in FIG. 3, the power supply substrate 13 has a lighting circuit substrate and the like including a control unit, and is screwed to the backbone 11 via the adapter receiving unit 12 (insulation plate). Thus, the power supply substrate 13 is disposed in the heat dissipating space surrounded by the backbone 11 and the heat dissipating plate 14 described later while maintaining the electrical insulation.

Further, the power supply substrate 13 is electrically connected to a mounting adapter (not shown) via the electric wire 24 connected to the power supply connector 13 b fixed to the lower surface of the power supply substrate 13.
The power supply connector 13 a is for connecting the power supply substrate 13 to the LED light source substrate 15 and the indirect light source substrate 20 by the electric wire 23.
Thus, the LED lighting device 1 is configured to be supplied with electric power through the indoor wiring apparatus (not shown), the attachment adapter (not shown), the electric wires 23 and 24 and the power supply substrate 13 respectively.

  The heat sink 14 is made of metal that plays a role of releasing heat of the power source substrate 13 generating heat during operation, the control substrate, the LED light source substrate 15 on which a plurality of LEDs are mounted, and the indirect light source substrate 20 It is a member. The LEDs of the LED element group 15b described later have a property of being vulnerable to heat. In addition, since the LED performs high-intensity light emission by flowing a large current of low voltage at the time of use, the LED itself and surrounding members are deteriorated by the heat generation associated with this light emission, so this deterioration is suppressed and the long lifetime In order to realize high reliability, it is required to perform appropriate heat dissipation.

  The heat sink 14 is formed by processing and forming a steel plate into a substantially circular shape, and is formed with a frusto-conical substrate support portion 14 a projecting to the floor side. Further, the heat sink 14 is made of, for example, a metal having a good thermal conductivity such as a galvanized steel sheet, and is squeezed to be integrally molded seamlessly to improve strength. Further, the heat sink 14 is formed to have a diameter larger than that of the backbone 11 and is attached to the backbone 11 so as to project radially outward of the backbone 11. The heat sink 14 arranges the LED light source substrate 15 (first light source substrate) on the lower surface side of the heat sink 14 so that the plurality of LED elements (LED element group 15b) of the main light source irradiate light downward. The indirect light source substrate 20 (second light source substrate) is disposed such that a plurality of LED elements 20a of the sub-light source described later irradiate light upward on the upper surface side of the heat sink 14. Supplementally, the LED light source substrate 15 is disposed on the lower surface side of the heat sink 14 so as to follow the lower surface. In addition, the indirect light source substrate 20 is disposed on the upper surface side of the heat sink 14 (the upper surface of the annular portion 14c described later) so as to follow the upper surface so as to reduce the height (thickness).

A circular through hole 14 b is formed at the center of the heat sink 14 in the radial direction at a position corresponding to the cylindrical portion 12 b of the adapter receiving portion 12. Further, the outer peripheral portion of the heat sink 14 has a circular annular portion 14c formed horizontally and a cover attaching portion 14e formed on the outer peripheral portion of the annular portion 14c. On the lower surface of the annular portion 14c, receptacles 14d (see FIG. 3) for latching a shade 19 described later are attached at three intervals of 120 °.
As shown in FIG. 4, on the upper surface side of the annular portion 14c, an indirect light source substrate 20 screwed to the upper surface of the annular portion 14c and an indirect light cover 21 covering the indirect light source substrate 20 are disposed. ing.

  As shown in FIGS. 5, 11 and 12, the cover attachment portion 14 e is a portion to which the indirect light cover 21 is attached, and is formed on the outer peripheral portion of the heat sink 14 so as to expand in a substantially tapered shape. The indirect light source substrate 20 is mounted in a ring shape on an annular portion 14c (an outer peripheral portion of the heat sink 14) in the upper portion of the cover mounting portion 14e, and a large number of LED elements 20a as auxiliary light sources are disposed.

As shown in FIGS. 6 and 10, the wire insertion hole 14f is a through hole formed in the outer peripheral wall of the housing recess 14h which is formed in a concave shape inclined so as to expand upward. A plurality of electric wires 23 are wired in the electric wire insertion hole 14 f.
The wire insertion hole 14g is a through hole formed in the annular portion 14c, and the wire 23 drawn from the wire insertion hole 14f is wired.
The housing recess 14 h is a housing space in which the power supply substrate 13 to which the electric wire 23 is connected is provided.

  The LED light source substrate 15 (first light source substrate) includes a ring-shaped wiring substrate 15a disposed on the lower surface side of the backbone 11 with the heat sink 14 interposed, and one surface side (floor surface side) of the wiring substrate 15a. A plurality of LEDs arranged concentrically are configured by including an LED element group 15b of a main light source mounted by soldering or the like. The details of the LED element group 15b will be described later.

  The wiring substrate 15a is formed, for example, by forming an insulating layer, a copper foil pattern, etc. on a substantially annular metal plate made of aluminum alloy, or a flat plate of a resin (for example, polyimide resin etc.) having good thermal conductivity. It is comprised by forming a copper foil pattern, a soldering resist, etc. on it. The wiring board 15 a is screwed to the heat sink 14.

  In the present embodiment, by providing the backbone 11 configured as described above and the heat dissipation plate 14, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the power supply substrate 13 and the LED light source substrate We are aiming to improve the heat dissipation efficiency of 15. As a result, the luminous efficiency of the LED element group 15b can be increased.

  The LED light source substrate 15 shown in FIG.3 and FIG.8 has shown an example of the arrangement pattern of LED for 18 tatami. As shown in FIG. 8, the LED element group 15 b includes a plurality of daylight color LEDs (Light Emitting Diodes) 15 b 1 that emit daylight color light (D color) and a plurality of light bulb colors that emit light bulb color (L color) A main illumination light source is configured by including an LED 15 b 2, a plurality of blue LEDs 15 b 3 emitting blue light, and an LED 15 b 4 for security light. Further, at the outer peripheral end of the LED light source substrate 15, a substantially arc shaped protruding piece 15c formed to protrude outward, and a wire insertion hole 15d formed at the base end of the protruding piece 15c (see FIG. 4) There are three connector portions 15e (see FIG. 6) mounted on the projecting piece 15c and connected to the electric wire 23.

  The daylight color LED 15b1 has a peak wavelength of 430 nm to 460 nm, and is formed concentrically in a plurality of lines (for example, 9 lines) from the outer circumferential side to the inner circumferential side.

  The light bulb color LED 15b2 has a peak wavelength of 550 nm to 650 nm, and is disposed with the daylight color LED 15b1 interposed in each of the plurality of concentrically arranged rows. That is, the light bulb color LEDs 15b2 are arranged in the respective concentric circular rows with two daylight color LEDs 15b1 interposed therebetween in the circumferential direction. The bulb color LEDs 15b2 in the second row from the inner circumferential side are disposed with one or two daylight color LEDs 15b1 interposed therebetween. In addition, the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are disposed at equal intervals or substantially equal intervals in the circumferential direction in each concentric row.

  The blue LED 15b3 has a peak wavelength of 470 nm to 480 nm, and is circularly spaced circumferentially between the outermost circumference and the innermost circumference of the daylight color LED 15b1 and the bulb color LED 15b2 concentrically arranged in a plurality of rows It is arranged in a ring. In the embodiment of FIG. 8, the row in which the daylight color LED 15b1 and the light bulb color LED 15b2 are arranged is arranged concentrically in five rows on the inner peripheral side of the blue LED 15b3 arranged in an annular shape and 4 in a concentric shape on the outer peripheral side. It is arranged in columns.

  The LED element group 15b shown in FIG. 8 is configured of, for example, 275 daylight color LEDs 15b1, 142 bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and bulb color LEDs 15b2.

  In addition, reflection coating is performed to the heat sink 14 and the LED light source substrate 15 by the white paint which reflects light from the LED element group 15b to the floor side.

  The LED cover 16 has a function of guiding the light flux emitted from the plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 in close contact with the heat sink 14, and main illumination It has a function etc. which cover the whole under surface side of LED element group 15b which is a light source.

  The LED cover 16 is integrally molded by injection molding or the like using, for example, a resin having a light transmitting property and an electrical insulating property such as polystyrene (PS), polycarbonate (PC), acrylic (PMMA) or the like. In particular, polystyrene is preferably used in terms of transparency, cost and moldability. Further, the material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

  As shown in FIG. 6, the LED cover 16 includes a substantially circular LED cover portion 16a covering the entire light emitting surface of the LED light source substrate 15 (the surface on which the LED element group 15b is mounted), and the outside of the LED cover portion 16a. A cylindrical wall portion 16b extending from the peripheral portion toward the back side (ceiling side), a flange portion 16c projecting radially outward from the upper end (back side) of the wall portion 16b, and the LED light source substrate 15 are accommodated. And a substrate storage unit 16d.

  Further, in the LED cover 16, the LED cover portion 16 a is screwed to the substrate support portion 14 a of the heat sink 14, and the flange portion 16 c is screwed to the annular portion 14 c of the heat sink 14.

  The wall portion 16 b is formed to extend in a direction substantially orthogonal to the LED cover portion 16 a. Moreover, the notch which is not shown in figure is formed in the wall part 16b, and the heat in LED cover 16 can be released outside. In addition, the opening area of the notch is set to such a size that the user's finger can not be inserted. This can prevent the user from directly touching the LED light source substrate 15 with a hand (finger).

The flange portion 16 c is a fixing portion that fixes the LED cover 16 to the heat sink 14 on the outer peripheral side of the LED light source substrate 15. The collar portion 16 c extends along the circumferential direction and is formed to be divided into three parts.
The substrate storage portion 16d is formed to be inclined and recessed from the collar portion 16c, and the LED light source substrate 15 is horizontally disposed at the inner bottom portion thereof, and the LED element group 15b is accommodated.

  FIG. 6 is a perspective view showing an example of a state in which the LED cover 16 having a partial cross section is attached to the lower side of the LED light source substrate 15. The LED of the LED element group shown in FIG. 8 is configured to emit light to the floor side via the corresponding plurality of dome-shaped portions 16a2 in the LED cover 16 shown in FIG. In the present embodiment, one LED set is accommodated in one dome-shaped portion 16a2, but the number of LEDs accommodated in the dome-shaped portion 16a2 is not limited to this. For example, as an example, one of two LED sets arranged in one dome-shaped portion 16a2 is a daylight color LED 15b1, and the other is a light bulb color LED 15b2.

  The center cover 17 is a member that covers a mounting adapter (not shown) exposed at the center of the apparatus body, and is made of, for example, a flame retardant synthetic resin (for example, PP: polypropylene resin). Further, the center cover 17 is formed in a disk shape and is detachably attached to the LED cover 16.

  The ring member 18 is configured such that the inner peripheral side of the ring portion is held on the outer peripheral side of the shade 19 made of a light transmitting material, and the outer peripheral side of the ring portion protrudes outside the outer periphery of the shade 19. The ring member 18 is formed of a light transmitting material.

  As shown in FIG. 5 (as shown collectively in FIGS. 3 and 4), the LED cover portion 16a is formed with a circular through hole 16a1 at the central portion in the radial direction. In the LED cover portion 16a, dome-shaped portions 16a2 are formed at positions respectively corresponding to the LED element groups 15b (the daylight color LED 15b1, the bulb color LED 15b2, and the blue LED 15b3) of the LED light source substrate 15. The dome-shaped portion 16a2 has a lens function, and is a member for diffusing light flux from the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3.

  The shield 19 is a light transmitting cover made of a resin (for example, acrylic, polystyrene, etc.) having a light transmitting property (transparent, semitransparent, or milk white included), and is formed in a dome shape. The sword 19 diffuses the light flux emitted from the light source (the LED element group 15b) to reduce glare when the user directly looks at the LED lighting device 1 or in the space where the LED lighting device 1 is installed. It plays a role in making the brightness uniform. The sword 19 is detachably engaged with and held by the receiver 14 d of the heat sink 14.

  As shown in FIG. 9, the indirect light source substrate 20 (second light source substrate) is disposed on the outer peripheral portion on the upper surface side of the heat sink so as to emit light from the entire position of the outer peripheral portion. The indirect light source substrate 20 is configured by arranging and connecting three substantially fan-shaped substrates in a C-shape, and the LED elements 20 a as a plurality of sub-light sources are mounted. The indirect light source substrate 20 includes a connector 20b for substrate connection provided at an end in the circumferential direction, an electric wire 20c for substrate connection wired between the connectors 20b, an electric wire 23 for power supply connection, and the electric wire A wiring notch portion 20e for inserting 23 and a connector 20d for power supply connection mounted in the vicinity of the wiring notch portion 20e (in this example, the indirect light source substrate 20 has an arc shape 3 Three substrates are connected). Then, the indirect light source substrate 20 is screwed and disposed on the annular portion 14 c of the peripheral portion on the upper surface side of the heat sink 14.

  For this reason, as shown in FIG.11 and FIG.12, the LED element 20a is arrange | positioned so that light may be irradiated from the position of the whole peripheral part by the side of the upper surface of the heat sink 14. As shown in FIG. Further, the LED elements 20 a are disposed on the outer peripheral side than the outer peripheral portion of the LED light source substrate 15.

The upper side of the indirect light source substrate 20 (second light source substrate), indirect light cover 21 (upper cover) is provided an annular light transmitting resin covering the indirect light source substrate 20 from above ( See Figure 3). The indirect light cover 21 includes reflectors 21a and 21b for reflecting the light emitted from the LED elements 20a of the auxiliary light sources, a substrate accommodation unit 21c covering the upper surface of the indirect light source substrate 20, and a substrate accommodation unit 21c on the upper surface side. The formed mountain-like portion 21d, the inner edge 21e formed at the inner edge of the indirect light cover 21 (see FIGS. 3, 4 and 7), and the outer edge 21f formed at the outer periphery of the mountain-like portion 21d ,have.

As shown in FIG. 11, the reflecting portion 21a is formed of a substantially annular projecting piece formed to project downward from the inner surface (ceiling surface) of the mountain-like portion 21d, and emitted from the LED element 20a at the outer surface It is formed to reflect light toward the outer peripheral direction.
Further, as shown in FIG. 12, the reflecting portion 21b is formed of a substantially annular thick portion formed downward from the inner surface (ceiling surface) of the mountain-like portion 21d, and the radiation from the LED element 20a is performed on the outer wall surface. It is formed to reflect the emitted light toward the outer peripheral direction.
In addition, light can be more efficiently emitted to the outer peripheral portion by attaching a reflective sheet or the like having a high reflectance to the outer peripheral surface of the reflective portion wall or coating a reflective material that reflects light.
The reflecting portions 21a and 21b formed in a substantially annular shape as viewed from below are formed in a concave shape (substantially C shape) in order to avoid the location where the sensor unit 22 is disposed. ing.

The substrate accommodation portion 21c is formed of a mountain-like portion 21d and a flat annular portion formed on the inner peripheral side of the mountain-like portion 21d.
The mountain-like portion 21 d is a portion that forms a space for forming the reflective portions 21 a and 21 b between the upper surface of the indirect light source substrate 20 and the lower surface of the indirect light cover 21. The mountain-like portion 21 d is formed in a chevron shape (triangular shape) when the upper surface is vertically cut, and is formed in a state of being expanded upward.

As shown in FIG. 7, the inner edge portion 21 e is formed to be formed on the inner peripheral portion of the inner edge portion of the indirect light source substrate 20.
As shown in FIGS. 11 and 12, the outer edge portion 21f is formed downward from the outer peripheral portion of the mountain shaped portion 21d, and is disposed so as to cover the outer peripheral surface of the cover mounting portion 14e of the heat sink 14. ing.

  As shown in FIGS. 3 and 4, the sensor unit 22 changes the power supplied to the LED element group 15 b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example. It provides a function to make it possible to obtain a constant illuminance under the device 1. Further, the illuminance under the LED lighting device 1 is detected. The sensor unit 22 is attached to the upper part of the C-shaped cutout portion of the indirect light source substrate 20.

[Effect]
Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described with reference to FIGS. 5, 11 and 12 mainly.

  The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with power from a power supply and a power supply circuit (not shown). The power supply circuit has a function of adjusting the power of the power supply to a predetermined voltage or current. In addition, the LED lighting device 1 has a function of receiving a signal (for example, infrared light) output from the remote control by a light receiving unit (not shown) and transmitting the received signal to a control unit (not shown).

  The lighting circuit (not shown) has a function of driving the daylight color LED 15b1, the bulb color LED 15b2, and the blue LED 15b3 based on the control signal received from the control unit. Further, the lighting circuit (not shown) has a function of individually changing the drive current for driving the daylight color LED 15b1, the light bulb color LED 15b2 and the blue LED 15b3 based on the control signal received from the control unit.

A remote control (not shown) has a function of outputting a set signal by operating a button. For example, full light mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition The mode can be set.
By the way, when you want to make the letters of a book or a newspaper easy to see, pressing a predetermined button on the remote control increases the brightness of the daylight color LED 15b1 and the light bulb color LED 15b2 and turns on the blue LED 15b3 to add blue green light to make it brighter Realize a natural light closer to sunlight. This makes it easier to see the letters, pictures, etc.

  When the LED element group 15b of the main light source shown in FIG. 3 is lit, the light emitted from the LED element group 15b illuminates the floor side via the LED cover 16 and the shade 19. When the LED element group 15 b emits light, it also dissipates heat.

  As shown in FIG. 5, the LED cover 16 is screwed to the heat sink 14 with the LED light source substrate 15 interposed between the heat sink 14 and the LED cover 16. Thereby, the adhesion of the LED light source substrate 15 to the heat sink 14 can be enhanced, and the heat dissipation can be improved. Therefore, it is possible to realize the LED illumination device 1 in which the density of the light emitting surface of the main light source is uniform and the light emission efficiency of the LED element group 15b is excellent. Furthermore, the heat sink 14 has the effect of correcting the arrangement of the LEDs of the LED element group 15b at an appropriate position with respect to the LED cover 16, and reducing the warpage and deformation of the LED light source substrate 15.

  Further, as shown in FIG. 3, the heat sink 14 is provided with the LED light source substrate 15 (first light source board) on the lower surface side of the heat sink 14 so as to irradiate light downward. The indirect light source substrate 20 (second light source substrate) is disposed on the upper surface side so as to emit light upward. That is, since the indirect light source substrate 20 is formed of a flat plate substrate connected in a C-shape and arranged horizontally, the height is reduced in the vertical direction, and the entire LED lighting device 1 is miniaturized and thinned. can do.

  As shown in FIG. 9, FIG. 11 and FIG. 12, the large number of LED elements 20a of the indirect light source substrate 20 irradiate light to the outer peripheral portion on the upper surface side of the heat sink 14 from the entire position of the outer peripheral portion. Is located in

Further, on the upper surface side of the heat dissipation plate 14, a translucent indirect light cover 21 covering the indirect light source substrate 20 from above is provided, and the indirect light cover 21 includes a plurality of LED elements on the indirect light source substrate 20. It has reflecting parts 21a and 21b which reflect the light radiated from 20a in the outer peripheral direction.
For this reason, the light emitted from the LED element 20a is reflected in the outer peripheral direction by the reflection portions 21a and 21b of the indirect light cover 21. Therefore, the outer peripheral direction (lateral direction) is irradiated to illuminate the entire room brightly. Can.

  The LED elements 20 a of the indirect light source substrate 20 are disposed on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15 (first light source substrate). Therefore, the LED elements 20a that generate heat on the indirect light source substrate 20 and the LED element groups 15b that are arranged on the LED light source substrate 15 and that generate heat can be offset from the heat dissipation plate 14 and arranged. The heat can be efficiently dissipated and cooled. Moreover, since the LED element 20a can be arrange | positioned in the LED lighting apparatus 1 in the position from the outer peripheral end, the outer peripheral direction of the LED lighting apparatus 1 can be illuminated brightly.

As shown in FIGS. 5, 11 and 12, an indirect light cover 21 (upper cover) is attached to the cover attachment portion 14 e of the outer peripheral portion of the heat sink 14. Further, the LED elements 20a of the indirect light source substrate 20 (second light source substrate) are disposed on the top of the cover mounting portion 14e.
For this reason, since the LED element 20a can illuminate the light irradiated from the LED element 20a in the outer peripheral direction and the upper direction without being blocked by another member, the outer peripheral direction and the ceiling direction of the LED lighting device 1 The amount of light can be increased compared to conventional devices to provide bright illumination.

  As described above, the LED lighting device 1 according to the embodiment of the present invention can reduce the height (thickness) of the lighting device and can direct the light of the indirect light source substrate 20 outward. The ceiling surface of the room and the upper surface of the wall can be illuminated, which can increase the brightness of the room. Moreover, the LED lighting device 1 can reduce the overall height to make the entire LED lighting device 1 thinner and smaller.

Further, in the present embodiment, the LEDs of the indirect light source substrate 20 face the upper surface (ceiling surface), but in Patent Document 1, the LEDs of the substrate 34 corresponding to the indirect light source substrate 20 of the present embodiment are lateral. Is facing For this reason, in patent document 1, the glare (glare) by which a high-intensity light source sees directly is easy to arise. On the other hand, in the present embodiment, since the LEDs of the indirect light source substrate 20 face the upper surface (ceiling surface), glare is prevented or significantly reduced as compared with the example of Patent Document 1.
The light emitted from the LED element 20a is diffused or reflected in the space between the lower surface of the indirect light cover 21 and the LED element 20a to prevent or reduce glare more reliably. It is preferable to comprise so that it may radiate | emit from a predetermined position to an outer peripheral direction. In addition, it is preferable that at least a predetermined position from which the light of the indirect light cover 21 is emitted is configured to diffuse the light like the shade 19.
Further, in Patent Document 1, the substrate of the indirect light source (substrate of reference 34 in Patent Document 1) is a flat plate shape (linear shape), and a large gap is provided between the substrates. Since the indirect light source substrate 20 has an arc shape (C shape) and does not have such a gap, the LED elements 20a can be appropriately disposed (without a gap) on the indirect light source substrate 20.

[Modification]
The present invention is not limited to the above embodiment, and various modifications and changes are possible within the scope of the technical idea, and the present invention extends to the modified and changed inventions. Of course. In addition, the same thing as what was demonstrated by the said embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

First Modification of Indirect Optical Cover
FIG. 13 is an enlarged sectional view of an essential part showing a first modification of the indirect light cover 21A (upper cover).
As shown in FIG. 13, the indirect light cover 21A refracts the light emitted from the LED element 20a in the outer peripheral direction in addition to the reflection part 21a that reflects the light of the LED element 20a for the sub light source (A prism) may be included.

  In this case, the light guide portion 21Aa forms a triangular annular protrusion 21Ab formed to project upward on the outer inclined surface of the mountain portion 21d. As described above, when the light guide portion 21Aa is formed, the light emitted from the LED element 20a is reflected toward the outer peripheral direction by the inclined surface of the protrusion 21Ab.

Second Modification of Indirect Light Cover
FIG. 14 is an enlarged sectional view of an essential part showing a second modification of the indirect light cover 21B (upper cover).
As shown in FIG. 14, the indirect light cover 21B forms a light guiding portion 21Ba that functions as a prism at a position near the outer peripheral portion of the upper surface portion of the substrate accommodation portion 21Bc above the LED element 20a for sub light source You may

  In this case, the light guide portion 21Ba forms a triangular annular protrusion 21Bb which is formed so as to project upward at a position near the outer peripheral side of the substrate accommodation portion 21Bc formed flat. As described above, when the light guide portion 21Ba is formed, the light emitted from the LED element 20a is reflected in the outer peripheral direction by the inclined surface (light guide portion 21Ba) of the protrusion 21Bb. When the indirect light cover 21B is formed as described above, the height in the upward direction can be reduced, so that the overall height of the LED lighting device can be reduced to achieve thinning.

<Modification of Indirect Light Source Substrate>
FIG. 15 is a view showing a modified example of the indirect light source substrate 20A, and a perspective view showing the LED lighting device from which the indirect light cover has been removed.
In the embodiment, as an example of the indirect light source substrate 20 (see FIG. 9), the case where the circuit board divided into three is planarly viewed and connected in a C shape is described, but the invention is not limited thereto. .
As shown in FIG. 15, the indirect light source substrate 20A may be a circuit board formed in a single C-shape.
In addition, the indirect light source substrate 20A may be a circuit substrate formed in a single ring shape.

<Other Modifications>
In the embodiment and the modification described above, as in the indirect light cover 21A and the indirect light cover 21B, the prism (the light guide 21Aa and the light guide 21Ba) is provided in the indirect light cover 21 itself. , And the indirect light cover 21 may be separately or integrally provided corresponding to each of the LED elements (one set).
Further, although the optical axis of the LED of the indirect light source substrate 20 is directed to the ceiling direction, it may have an optical axis inclined in the outer peripheral direction.
Further, in the present embodiment, to avoid wasting the material of the substrate at the time of producing the substrate, that is, for convenience of taking a substrate, C-shaped indirect light is produced by creating three arc-shaped substrates and connecting them. Although the light source substrate 20 is used, the indirect light source substrate 20 may be configured of a single substrate. In this case, there is an advantage that the connector 20b for substrate connection and the like becomes unnecessary.

DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 11 Backbone 14 Heat sink 14e Cover mounting part 15 LED light source board (1st light source board)
15b LED element group (LED element)
16 LED cover 20, 20A Indirect light source board (second light source board)
20a LED element 21, 21A, 21B indirect light cover (upper cover)
21a, 21b reflective part 21Aa light guide part (prism)
21Ab, 21Bb Projection 21Ba Light guide (inclined surface)

Claims (4)

A first light source substrate including a plurality of LED elements as a main light source and emitting light;
A second light source substrate provided with a plurality of LED elements as an auxiliary light source and emitting light;
An LED lighting apparatus, comprising: a heat sink for radiating heat of the first light source substrate and the second light source substrate,
The heat sink is
The first light source substrate is disposed on the lower surface side of the heat sink so as to irradiate light downward.
The second light source substrate is horizontally disposed on the upper surface side of the heat sink so as to emit light upward, and a translucent upper portion covering the second light source substrate from above and transmitting light. Equipped with a cover
The upper cover is
A reflective portion that reflects light emitted from the plurality of LED elements of the second light source substrate in an outer peripheral direction ;
And a mountain-like portion forming a space for forming the reflection portion between the upper surface of the second light source substrate and the lower surface of the upper cover ;
The light emitted from the plurality of LED elements of the second light source substrate is irradiated in the outer peripheral direction and the upper direction ,
The mountain-like portion is formed in a state in which the upper surface is vertically cut and bulged in a mountain shape,
The LED lighting device , wherein the reflecting portion is formed downward from the inner surface of the mountain-like portion . The plurality of LED elements of the second light source substrate are disposed on the outer peripheral portion on the upper surface side of the heat dissipation plate so as to emit light from the entire position of the outer peripheral portion. The LED lighting apparatus as described in 1 . The LED lighting device according to claim 1 or 2, wherein the plurality of LED elements of the second light source substrate are disposed on an outer peripheral side than an outer peripheral portion of the first light source substrate. . The outer peripheral portion of the heat sink has a cover attachment portion to which the upper cover is attached;
The LED lighting device according to claim 2 or 3, wherein the plurality of LED elements of the second light source substrate are disposed on the top of the cover mounting portion.

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