JP6807986B2 - LED lighting device - Google Patents

Description

The present invention relates to an LED lighting device including a plurality of LED (Light Emitting Diode) elements as a light source.

Conventionally, as an LED lighting device using an LED as a light source, for example, a ceiling lighting fixture (ceiling light) disclosed in Patent Document 1 is known.
The LED lighting device (lighting device) disclosed in Patent Document 1 includes a main light source (lower unit) provided in the central portion of the fixture body, an auxiliary light source provided in a frame portion on the outer periphery of the fixture body, and a ceiling. It is equipped with an indirect light source (upper unit) provided on the upper part of the fixture body facing the surface.

The main light source is mounted on a substrate formed in an arc shape so as to divide a circular instrument body into a plurality of pieces, and a large number of LED elements (hereinafter, appropriately referred to as "LEDs") that irradiate light downward are provided. Have.
The indirect light source has a substrate on which the LED is mounted, a mounting portion for mounting the substrate on the upper surface of the fixture body, and the like. The entire mounting portion is formed in an L shape, and a substrate having LEDs arranged sideways is mounted in the vertical direction so as to be orthogonal to the horizontal upper surface of the fixture body. The indirect light source is arranged so that the light from the LED is emitted outward in parallel with the upper surface of the fixture body.
Ceiling luminaires include such a main light source, an auxiliary light source, and an indirect light source that illuminates the ceiling surface, so that the entire room can be illuminated regardless of the orientation of the luminaire. The feeling of brightness is improved.

However, in a ceiling lighting device equipped with a large number of LEDs, since the temperature of the LED substrate on which the LEDs are mounted becomes high, a heat radiating plate for cooling the LED substrate is provided. The heat radiating plate is formed with a cone-shaped convex portion, and the LED substrate is placed on the mounting surface of the convex portion, an LED cover is provided to cover the light emitting surface of the LED substrate, and the LED cover is flattened by the heat radiating plate. It is fixed to the part (mounting surface).

Japanese Unexamined Patent Publication No. 2013-145685

In the LED lighting device disclosed in Patent Document 1, the LED of the indirect light source is mounted on the back surface of the substrate (board 34) installed in the vertical direction and arranged so as to irradiate the light in the horizontal direction. Has been done. That is, the substrate of the indirect light source is placed vertically. For this reason, there is a problem that the height of the fixture main body and the heat radiating plate is increased (thickness is increased), and the entire LED lighting device is increased in size.

An object of the present invention is to provide an LED lighting device capable of lowering the overall height.

The present invention includes a first light source substrate having a plurality of LED elements as a main light source to irradiate light, a second light source substrate having a plurality of LED elements as secondary light sources to irradiate light, and the first light source. An LED lighting device including a light source substrate and a heat radiating plate for radiating heat from the second light source substrate. The heat radiating plate irradiates light downward on the lower surface side of the heat radiating plate. The first light source substrate is arranged, and the second light source substrate is horizontally arranged on the upper surface side of the heat radiating plate so as to irradiate light upward, and the second light source substrate is covered from above. An upper cover is provided, and the upper cover has a reflecting portion that reflects light radiated from the plurality of LED elements of the second light source substrate in the outer peripheral direction, and the plurality of LEDs of the second light source substrate. The light emitted from the element is irradiated in the outer peripheral direction and the upward direction, and the reflecting portion is formed from the inner surface of the upper cover in the downward direction.

According to the present invention, it is possible to provide an LED lighting device capable of lowering the overall height.

It is a figure which shows the LED lighting apparatus which concerns on embodiment of this invention, and is the external perspective view which shows when it is seen from obliquely downward direction. It is an external perspective view which shows the state when the LED lighting device is seen from obliquely upward direction. It is an exploded perspective view which shows the state when the LED lighting device is seen from the diagonally downward direction. It is an exploded perspective view which shows the state when the LED lighting device is seen from obliquely upward direction. It is a central vertical sectional view of the LED lighting device. It is a perspective view which shows the LED lighting apparatus which removed the shade and cross-sectioned a part of the LED cover. It is a perspective view which shows the state when the LED lighting apparatus which cross-sectioned a part of the indirect light cover is seen from diagonally above. It is a bottom view which shows an example of the LED light source substrate. It is a perspective view which shows the state when the LED lighting device which removed the indirect light cover and the sensor unit is seen from obliquely above. It is a figure which shows the wiring state of the electric wire, and is the enlarged schematic sectional view of the main part of the LED lighting apparatus which removed the indirect light cover. FIG. 5 is an enlarged view of part A in FIG. It is the B part enlarged view of FIG. It is an enlarged sectional view of the main part which shows the 1st modification of an indirect light cover. It is an enlarged sectional view of the main part which shows the 2nd modification of an indirect light cover. It is a figure which shows the modification of the indirect light light source substrate, and is the perspective view which shows the LED lighting apparatus which removed the indirect light cover.

Next, the LED lighting device (LED ceiling light) according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the present embodiment, an example of the LED lighting device 1 will be described by taking a circular shape in a plan view as an example, but the shape is not limited to this, and for example, a quadrangle, a hexagon, or an octagon. It can also be applied to polygonal objects such as. Further, in the present embodiment, the LED lighting device 1 using a light emitting diode (LED) as the main lighting light source will be described below, but the main lighting light source is not limited to the LED.

The LED lighting device 1 shown in FIGS. 1 and 2 is, for example, via a mounting adapter (not shown) that engages with an indoor wiring fixture (not shown) such as a hook rosette or a hook ceiling provided on the ceiling surface of a house. , It is connected to an external power source and fixed at a predetermined position on the ceiling surface for use. The LED lighting device 1 is made of, for example, a round shape, a square shape, or the like (in the present embodiment, it is a round shape). In the following description, the upper side of the paper surface is the ceiling side (upper surface side) and the lower side of the paper surface is the floor side (lower surface side) based on the state in which the LED lighting device 1 is attached to the ceiling surface.

As shown in FIGS. 3 and 4, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply board 13, a heat radiating plate 14, an LED light source board 15 (first light source board), and an LED cover. The structure includes 16, a center cover 17, a ring member 18, a shade 19, an indirect light source substrate 20 (second light source substrate), an indirect light cover 21 (upper cover), a sensor unit 22, and the like.

The backbone 11 is a base member obtained by processing and molding a steel plate (for example, SECC (electrogalvanized steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) so that the concave surface faces the floor side. An adapter mounting hole 11a to which a mounting adapter (not shown) is locked is formed in the center of the backbone 11.

The adapter receiving portion 12 is formed of a flame-retardant and electrically insulating synthetic resin (for example, PP: polypropylene resin or the like), and is screw-fixed to the lower surface of the backbone 11 with a ring-shaped fixing portion 12a and the fixing portion. It has a cylindrical portion 12b extending from the inner peripheral edge portion of the 12a to the floor side (downward).

As shown in FIG. 3, the power supply board 13 has a lighting circuit board and the like including a control unit, and is screwed to the backbone 11 via an adapter receiving unit 12 (insulating plate). As a result, the power supply board 13 is arranged in a heat radiating space surrounded by the backbone 11 and the heat radiating plate 14 described later in a state of maintaining electrical insulation.

Further, the power supply board 13 is electrically connected to a mounting adapter (not shown) via an electric wire 23 connected to a power supply connector 13a fixed to the lower surface of the power supply board 13. As a result, the LED lighting device 1 is configured so that power is supplied via the indoor wiring fixture (not shown), the mounting adapter (not shown), the electric wire 23, and the power supply board 13.

The heat radiating plate 14 is made of metal that plays a role of radiating and cooling the heat of the power supply board 13, the control board, the LED light source board 15 on which a plurality of LEDs are mounted, and the indirect light light source board 20 that generate heat during operation. It is a member. The LED of the LED element group 15b described later has a property of being vulnerable to heat. In addition, since LEDs emit high-intensity light by passing a large current with a low voltage during use, the LED itself and surrounding members deteriorate due to the heat generated by this light emission, so this deterioration is suppressed and the life is long. Appropriate heat dissipation is required to achieve high reliability.

The heat radiating plate 14 is formed by processing and molding a steel plate into a substantially circular shape, and has a truncated cone-shaped substrate support portion 14a protruding toward the floor. Further, the heat radiating plate 14 is made of, for example, a metal having good thermal conductivity such as a galvanized steel plate, and is integrally molded seamlessly by squeezing to increase the strength. Further, the heat radiating plate 14 is formed to have a diameter larger than that of the backbone 11, and is attached to the backbone 11 so as to project radially outward from the backbone 11. The heat radiating plate 14 has an LED light source substrate 15 (first light source substrate) arranged on the lower surface side of the radiating plate 14 so that a plurality of LED elements 15b of the main light source irradiate light downward, and the upper surface of the radiating plate 14 is arranged. The indirect light source substrate 20 (second light source substrate) is arranged so that the plurality of LED elements 20a of the sub-light source described later irradiate the light upward. Supplementally, the LED light source substrate 15 is arranged on the lower surface side of the heat radiating plate 14 so as to be along the lower surface. Further, the indirect light source substrate 20 is arranged on the upper surface side of the heat radiating plate 15 (the upper surface of the annular portion 14c described later) so as to be along the upper surface so as to suppress the height (thickness).

A circular through hole 14b is formed at the center of the heat radiating plate 14 in the radial direction at a position corresponding to the cylindrical portion 12b of the adapter receiving portion 12. Further, the outer peripheral portion of the heat radiating plate 14 has a horizontally formed circular annular portion 14c and a cover mounting portion 14e formed on the outer peripheral portion of the annular portion 14c. On the lower surface of the annular portion 14c, receivers 14d (see FIG. 3) for hooking the shade 19 described later are attached at three positions at 120 ° intervals.
As shown in FIG. 4, on the upper surface side of the annular portion 14c, an indirect light light source substrate 20 screwed to the upper surface of the annular portion 14c and an indirect light cover 21 covering the indirect light light source substrate 20 are arranged. ing.

As shown in FIGS. 5, 11 and 12, the cover mounting portion 14e is a portion to which the indirect light cover 21 is mounted, and is formed by expanding the outer peripheral portion of the heat radiating plate 14 in a substantially tapered shape. The indirect light light source substrate 20 is mounted in a ring shape on the annular portion 14c (the outer peripheral portion of the heat radiating plate 14) above the cover mounting portion 14e, and a large number of LED elements 20a as sub-light sources are arranged.

As shown in FIGS. 6 and 10, the electric wire insertion hole 14f is composed of a through hole formed in the outer peripheral wall of the storage recess 14 formed in a recess shape that is inclined so as to expand upward. A plurality of electric wires 23 are wired in the electric wire insertion hole 14f.
The electric wire insertion hole 14g is formed of a through hole formed in the annular portion 14c, and the electric wire 23 drawn out from the electric wire insertion hole 14f is wired.
The storage recess 14 is a storage space in which the power supply board 13 to which the electric wire 23 is connected is installed.

The LED light source substrate 15 (first light source substrate) is a ring-shaped wiring board 15a arranged on the lower surface side of the backbone 11 with a heat radiation plate 14 interposed therebetween, and one surface side (floor surface side) of the wiring board 15a. It is configured to include a main light source LED element group 15b in which a plurality of LEDs arranged concentrically are mounted by soldering or the like. The details of the LED element group 15b will be described later.

The wiring board 15a is formed by, for example, forming an insulating layer and a copper foil pattern on a substantially annular metal plate made of an aluminum alloy, or a flat plate of a resin having good thermal conductivity (for example, polyimide resin). It is composed by forming a copper foil pattern, solder resist, etc. on the top. Further, the wiring board 15a is screwed to the heat radiating plate 14.

In the present embodiment, by providing the backbone 11 having the above-described configuration and the heat radiating plate 14, the volume of the heat radiating space is increased (the amount of air in the heat radiating space is increased), and the power supply board 13 and the LED light source board are provided. The heat dissipation efficiency of 15 is improved. As a result, the luminous efficiency of the LED element group 15b can be increased.

The LED light source substrate 15 shown in FIG. 3 shows an example of an LED arrangement pattern for 18 tatami mats. As shown in FIG. 8, the LED element group 15b includes a plurality of daylight color LEDs (Light Emitting Diodes) 15b1 that emit light of daylight color (D color) and a plurality of light bulb colors that emit light of light bulb color (L color). A main lighting light source is configured to include LEDs 15b2, a plurality of blue LEDs 15b3 that emit blue light, and LEDs 15b4 for security lights. Further, at the outer peripheral end of the LED light source substrate 15, a substantially arc-shaped protruding piece 15c formed so as to project outward, and an electric wire insertion hole 15d (see FIG. 4) formed at the base end of the protruding piece 15c. , It has three connector portions 15e (see FIG. 6) mounted on the protruding piece 15c and connected to the electric wire 23.

The daylight color LED 15b1 has a peak wavelength of 430 nm to 460 nm, and is formed in a plurality of rows (for example, 9 rows) concentrically from the outer peripheral side to the inner peripheral side.

The light bulb color LED 15b2 has a peak wavelength of 550 nm to 650 nm, and is arranged with the daylight color LED 15b1 sandwiched in each row arranged in a plurality of concentric rows. That is, the light bulb color LEDs 15b2 are arranged in each concentric row with two daylight color LEDs 15b1 sandwiched in the circumferential direction. The light bulb color LED 15b2 in the second row from the inner peripheral side is arranged with one or two daylight color LEDs 15b1 sandwiched between them. Further, the daylight color LED 15b1 and the light bulb color LED 15b2 are arranged at equal intervals or substantially equal intervals in the circumferential direction in each concentric row.

The blue LED 15b3 has a peak wavelength of 470 nm to 480 nm, and is circularly spaced in the circumferential direction between the daylight color LEDs 15b1 arranged in a plurality of concentric rows and the outermost circumference and the innermost circumference of the light bulb color LED 15b2. It is arranged in a ring. In the embodiment of FIG. 8, the rows in which the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged are arranged in 5 rows concentrically on the inner peripheral side of the blue LEDs 15b3 arranged in an annular shape, and 4 concentrically on the outer peripheral side. It is arranged in columns.

The LED element group 15b shown in FIG. 8 is composed of, for example, 275 daylight color LEDs 15b1, 142 light bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and light bulb color LEDs 15b2.

The heat radiating plate 14 and the LED light source substrate 15 are reflectively coated with a white paint that reflects light from the LED element group 15b toward the floor.

The LED cover 16 has a function of guiding light rays emitted from a plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 so as to be in close contact with the heat radiation plate 14, and a main illumination. It has a function of covering the entire lower surface side of the LED element group 15b, which is a light source for use.

The LED cover 16 is integrally molded by injection molding or the like using, for example, a resin having translucency and electrical insulation such as polystyrene (PS), polycarbonate (PC), and acrylic (PMMA). In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. Further, the material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

As shown in FIG. 6, the cover 16 includes a substantially circular LED cover portion 16a that covers the entire light emitting surface (the surface on which the LED element group 15b is mounted) of the LED light source substrate 15, and an outer peripheral edge of the LED cover portion 16a. A cylindrical wall portion 16b extending from the portion toward the back surface side (ceiling side), a brim portion 16c protruding radially outward from the upper end (rear surface side) of the wall portion 16b, and an LED light source substrate 15 are housed. It has a board housing portion 16d.

Further, in the LED cover 16, the LED cover portion 16a is screw-fixed to the substrate support portion 14a of the heat radiating plate 14, and the brim portion 16c is screw-fixed to the annular portion 14c of the heat radiating plate 14.

The wall portion 16b is formed so as to extend in a direction substantially orthogonal to the LED cover portion 16a. Further, a notch (not shown) is formed in the wall portion 16b so that the heat in the LED cover 16 can be released to the outside. The opening area of the notch is set to a size that does not allow the user's finger to be inserted. As a result, it is possible to prevent the user from directly touching the LED light source substrate 15 with his / her hand (finger).

The brim portion 16c is a fixing portion for fixing the LED cover 16 to the heat radiating plate 14 on the outer peripheral side of the LED light source substrate 15. The brim portion 16c extends along the circumferential direction and is formed by being divided into three parts.
The substrate accommodating portion 16d is formed in a state of being inclined and recessed from the brim portion 16c, and the LED light source substrate 15 is horizontally arranged on the inner bottom portion thereof to accommodate the LED element group 15a.

FIG. 6 is a perspective view showing an example of a state in which the LED cover 16 having a partial cross section is attached to the lower side of the LED light source substrate 15. The LED of the LED element group shown in FIG. 8 is configured to emit light to the floor side through the corresponding plurality of dome-shaped portions 16a2 in the LED cover 16 shown in FIG. In the present embodiment, a set of two LEDs is housed in one dome-shaped portion 162a, but the number of LEDs housed in the dome-shaped portion 16a2 is not limited to this. For example, of the two LED sets arranged in one dome-shaped portion 16a2, one is a daylight LED 15b1 and the other is a light bulb color LED 15b2.

The center cover 17 is a member that covers a mounting adapter (not shown) exposed in the center of the main body of the apparatus, and is formed of, for example, a flame-retardant synthetic resin (for example, PP: polypropylene resin). Further, the center cover 17 is formed in a disk shape and is detachably attached to the LED cover 16.

The ring member 18 is configured such that the inner peripheral side of the ring portion is held on the outer peripheral side of the shade 19 made of a translucent material, and the outer peripheral side of the ring portion protrudes outward from the outer peripheral side of the shade 19. The ring member 18 is made of a light-transmitting material.

As shown in FIG. 5 (also shown in FIGS. 3 and 4), the LED cover portion 16a has a circular through hole 16a1 formed in the central portion in the radial direction. In the LED cover portion 16a, a dome-shaped portion 16a2 is formed at a position corresponding to each of the LED element groups 15b (daylight color LED15b1, light bulb color LED15b2, blue LED15b3) of the LED light source substrate 15. The dome-shaped portion 16a2 has a lens function, and is a member that diffuses light flux from the daylight color LED15b1, the light bulb color LED15b2, and the blue LED15b3.

The shade 19 is a translucent cover made of a resin (for example, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white), and is formed in a dome shape. The shade 19 diffuses the luminous flux emitted from the light source (LED element group 15b) to reduce the glare when the user directly looks at the LED lighting device 1, or in the space where the LED lighting device 1A is installed. It plays a role in making the brightness uniform. The shade 19 is detachably engaged and held by the receiver 14d of the heat radiating plate 14.

As shown in FIG. 9, the indirect light light source substrate 20 (second light source substrate) is arranged on the outer peripheral portion on the upper surface side of the heat radiating plate so as to irradiate light from the entire position of the outer peripheral portion. The indirect light light source substrate 20 is configured by arranging and connecting four substantially fan-shaped substrates in a C shape, and is mounted with a plurality of LED elements 20a as sub-light sources. The indirect light source board 20 includes a board connecting connector 20b provided at the end in the circumferential direction, a board connecting wire 20c wired between the connectors 20b, a power supply connecting wire 23, and this wire. A wiring notch 20e for inserting the 23 and a power supply connection connector 20d attached in the vicinity of the notch 20e are provided. The indirect light source substrate 20 is screwed and arranged on the annular portion 14c of the peripheral portion on the upper surface side of the heat radiating plate 14.

Therefore, as shown in FIGS. 11 and 12, the LED element 20a is arranged so as to irradiate light from the position of the entire peripheral portion on the upper surface side of the heat radiating plate 14. Further, the LED element 20a is arranged on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15.

On the upper side of the indirect light source substrate 20 (second light source substrate), an indirect light cover 21 (upper cover) made of an annular translucent resin that covers the indirect light source substrate 20 from above is provided (upper cover). (See FIG. 3). The indirect light cover 21 has reflecting portions 21a and 21b that reflect the light radiated from the LED element 20a of the sub light source, a substrate accommodating portion 21c that covers the upper surface of the indirect light light source substrate 20, and the substrate accommodating portion 21c on the upper surface side. The formed mountain-shaped portion 21d, the inner edge portion 21e formed on the inner edge of the indirect light cover 21 (see FIGS. 3, 4 and 7), and the outer edge portion 21f formed on the outer peripheral portion of the mountain-shaped portion 21d. ,have.

As shown in FIG. 11, the reflecting portion 21a is composed of a substantially annular projecting piece formed so as to project downward from the inner surface (ceiling surface) of the mountain portion 21d, and the light radiated from the LED element 20a on the outer surface. Is formed so as to reflect toward the outer periphery.
The reflecting portion 21b is formed of a substantially annular thick portion formed downward from the inner surface (ceiling surface) of the mountain portion 21d, and reflects the light radiated from the LED element 20a on the outer wall surface toward the outer peripheral direction. It is formed to do.
The reflecting portions 21a and 21b formed in a substantially annular shape when viewed from the bottom surface are formed in a concave shape (substantially C-shaped) in order to avoid the reflection portions 21a and 21b where the sensor unit 22 is arranged. ing.

The substrate accommodating portion 21c is formed of a chevron portion 21d and a flat annular portion formed on the inner peripheral portion side of the chevron portion 21d.
The mountain-shaped portion 21d is a portion that forms a space for forming the reflecting portions 21a and 21b between the upper surface of the indirect light light source substrate 20 and the lower surface of the indirect light cover 21. The mountain-shaped portion 21d is formed in a mountain-shaped (triangular shape) shape when the upper surface is vertically viewed, and is formed in a state of bulging upward.

As shown in FIG. 7, the inner edge portion 21e is formed so as to be formed on the inner peripheral portion of the inner edge portion of the indirect light source substrate 20.
As shown in FIGS. 11 and 12, the outer peripheral portion 21f is formed so as to face downward from the outer peripheral portion of the mountain-shaped portion 21d, and is arranged so as to cover the outer peripheral surface of the cover mounting portion 14e of the heat radiating plate 14. ing.

As shown in FIGS. 3 and 4, the sensor unit 22 changes the power supply to the LED element group 15b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example, to perform LED lighting. It provides a function to obtain a constant illuminance under the device 1. It also detects the illuminance under the LED lighting device 1. The sensor unit 22 is attached to the upper portion of the indirect light source substrate 20 in which a C-shaped notch is formed.

[Action]
Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described with reference to FIGS. 5, 11 and 12, mainly referring to each figure.

The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with electric power from a power source and a power supply circuit (not shown). The power supply circuit has a function of adjusting the power of the power supply to a predetermined voltage or current. Further, the LED lighting device 1 has a function of receiving a signal (for example, infrared light) output from the remote controller by the light receiving unit (not shown) and transmitting the received signal to the control unit (not shown).

Further, the lighting circuit (not shown) has a function of driving the daylight color LED15b1, the light bulb color LED15b2, and the blue LED15b3 based on the control signal received from the control unit. Further, the lighting circuits 102, 103, 104 have a function of individually changing the drive current for driving the daylight color LED15b1, the light bulb color LED15b2, and the blue LED15b3 based on the daylight color LED15b1 and the control signal received from the control unit.

The remote controller (not shown) has a function of outputting a set signal by operating a button. For example, all light mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition. It can be set to the mode etc.
By the way, to make the characters in books and newspapers easier to read, pressing a predetermined button on the remote control increases the brightness of the daylight LED15b1 and the light bulb color LED15b2, and the blue LED15b3 lights up to add blue-green light, making it even brighter. Achieve natural light that is closer to sunlight. This makes it easier to see characters and photographs.

When the LED element group 15b of the main light source shown in FIG. 3 is turned on, the light emitted from the LED element group 15b irradiates the floor side through the LED cover 16 and the shade 19. When the LED element group 15b is irradiated with light, heat is also dissipated.

As shown in FIG. 5, the LED cover 16 is screwed to the heat radiating plate 14 with the LED light source substrate 15 interposed between the heat radiating plate 14 and the LED cover 16. As a result, the adhesion of the LED light source substrate 15 to the heat radiating plate 14 is increased, and the heat radiating property can be improved. Therefore, it is possible to realize the LED lighting device 1 in which the density of the light emitting surface of the main light source is uniform and the light emitting efficiency of the LED element group 15b is excellent. Further, the heat radiating plate 14 has an effect of correcting the arrangement of the LEDs of the LED element group 15 at an appropriate position with respect to the LED cover 17 and reducing the warp and deformation of the LED light source substrate 15.

Further, as shown in FIG. 3, in the heat radiating plate 14, the LED light source substrate 15 (first light source substrate) is arranged so as to irradiate light downward on the lower surface side of the heat radiating plate 14, and the heat radiating plate An indirect light source substrate 20 (second light source substrate) is arranged on the upper surface side so as to irradiate light upward. That is, since the indirect light source substrate 20 is composed of a flat plate-shaped substrate connected in a C shape and arranged horizontally, the height is lowered in the vertical direction to reduce the size and thickness of the entire LED lighting device 1. can do.

As shown in FIGS. 11 and 12, a large number of LED elements 20a of the indirect light source substrate 20 are arranged so as to irradiate the outer peripheral portion on the upper surface side of the heat radiating plate 14 with light from the entire position of the outer peripheral portion. ing.

Further, on the upper surface side of the heat radiation plate 14, a translucent indirect light cover 21 that covers the indirect light light source substrate 20 from above is provided, and the indirect light cover 21 is a plurality of LED elements on the indirect light light source substrate 20. It has reflecting portions 21a and 21b that reflect the light emitted from the 20a in the outer peripheral direction.
Therefore, the light emitted from the LED element 20a is reflected in the outer peripheral direction by the reflecting portions 21a and 21b of the indirect light cover 21, so that the outer peripheral direction (lateral direction) is irradiated to brightly illuminate the entire room. Can be done.

The LED element 20a of the indirect light source substrate 20 is arranged on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15 (first light source substrate). Therefore, the LED element 20a that generates heat on the indirect light light source substrate 20 and the LED element group 15a that is arranged on the LED light source substrate 15 and generates heat can be arranged so as to be offset from the heat radiating plate 14. , It is possible to efficiently dissipate heat and cool it. Further, since the LED element 20a can be arranged at a position from the outer peripheral end of the LED lighting device 1, the outer peripheral direction of the LED lighting device 1 can be brightly illuminated.

As shown in FIGS. 5, 11 and 12, an indirect light cover 21 (upper cover) is attached to the cover attachment portion 14e on the outer peripheral portion of the heat radiating plate 14. Further, the LED element 20a of the indirect light source substrate 20 (second light source substrate) is arranged above the cover mounting portion 14e.
Therefore, the LED element 20a can illuminate the light emitted from the LED element 20a in the outer peripheral direction and the upward direction without being blocked by other members, and thus the outer peripheral direction and the ceiling direction of the LED lighting device 1. In addition, the amount of light can be increased compared to conventional devices to illuminate brightly.

As described above, in the LED lighting device 1 according to the embodiment of the present invention, the height (thickness) of the lighting device can be reduced, and the light of the indirect light source substrate 20 can be directed to the outside. Since it can be used, the ceiling surface and the upper surface of the wall in the room can be illuminated, so that the brightness of the room can be increased. Further, the LED lighting device 1 can be made thinner and smaller as a whole by lowering the overall height.

Further, in the present embodiment, the LED of the indirect light light source substrate 20 faces the upper surface (ceiling surface), but in Patent Document 1, the LED of the substrate 34 corresponding to the indirect light light source substrate 20 of the present embodiment is lateral. Is facing. Therefore, in Patent Document 1, glare is likely to occur due to the direct visibility of the high-luminance light source. On the other hand, in the present embodiment, since the LED of the indirect light source substrate 20 faces the upper surface (ceiling surface), glare is prevented or significantly reduced as compared with the example of Patent Document 1.

[Modification example]
The present invention is not limited to the above-described embodiment, and various modifications and modifications can be made within the scope of the technical idea thereof, and the present invention may extend to these modified and modified inventions. Of course. The same components as those described in the above-described embodiment are designated by the same reference numerals, and the description thereof will be omitted.

<First modification of the indirect light cover>
FIG. 13 is an enlarged cross-sectional view of a main part showing a first modification of the indirect light cover 21A (upper cover).
As shown in FIG. 13, the indirect light cover 21A has a light guide portion 21Aa (which refracts the light emitted from the LED element 20a in the outer peripheral direction, in addition to the reflecting portion 21a that reflects the light of the LED element 20a for the sub light source. It may have a prism).

In this case, the light guide portion 21Aa forms a triangular annular protrusion 21Ab formed so as to protrude upward on the outer inclined surface of the mountain-shaped portion 21d. When the light guide portion 21Aa is formed in this way, the light radiated from the LED element 20a is reflected toward the outer peripheral direction on the inclined surface of the protrusion 21Ab.

<Second modification of the indirect light cover>
FIG. 14 is an enlarged cross-sectional view of a main part showing a second modification of the indirect light cover 21B (upper cover).
As shown in FIG. 14, the indirect light cover 21B forms a light guide portion 21Aa that functions as a prism at a position near the outer peripheral portion of the upper surface portion of the substrate accommodating portion 21Ac above the LED element 20 for the sub light source. You may.

In this case, the light guide portion 21Ba forms a triangular annular protrusion 21Bb formed so as to project upward at a position closer to the outer peripheral side of the flatly formed substrate accommodating portion 21Ac. When the light guide portion 21Ba is formed in this way, the light radiated from the LED element 20a is reflected by the inclined surface (light guide portion 21Ba) of the protrusion 21Bb toward the outer peripheral direction. When the indirect light cover 21A is formed in this way, the height in the upward direction can be made low, so that the height of the entire LED lighting device can be made low to reduce the thickness.

<Modification example of indirect light source substrate>
FIG. 15 is a view showing a modified example of the indirect light source substrate 20A, and is a perspective view showing an LED lighting device with the indirect light cover removed.
In the above embodiment, as an example of the indirect light source substrate 20 (see FIG. 9), a case where the circuit boards divided into three are connected in a C shape in a plan view has been described, but the present invention is not limited to this. ..
As shown in FIG. 15, the indirect light source substrate 20A may be one circuit board formed in a C shape.
Further, the indirect light source substrate 20A may be a circuit board formed in one annular shape.

1 LED lighting device 11 Bag bone 14 Heat dissipation plate 14e Cover mounting part 15 LED light source board (first light source board)
15b LED element group (LED element)
16 LED cover 20 Indirect light source board (second light source board)
20a LED element 21 Indirect light cover (upper cover)
21a, 21b Reflector

Claims (2)

A first light source substrate that has a plurality of LED elements as main light sources and irradiates light,
A second light source substrate that irradiates light with a plurality of LED elements as secondary light sources,
An LED lighting device including a first light source substrate and a heat radiating plate that dissipates heat from the second light source substrate.
The lower surface of said heat sink, said first light source substrate to illuminate the light is downwardly disposed,
On the upper surface of the heat sink such that said irradiated upward the light second light source substrate is disposed horizontally,
On the upper surface side of the second light source substrate, a translucent upper cover that covers the second light source substrate from above and transmits light is arranged.
The upper cover has a reflecting portion that reflects light radiated from the plurality of LED elements of the second light source substrate in the outer peripheral direction.
The LED lighting device is characterized in that the reflecting portion is formed substantially perpendicular to the second light source substrate from the inner surface to the lower surface side of the upper cover.
A claim, wherein the plurality of LED elements of the second light source substrate are arranged on an outer peripheral portion on the upper surface side of the heat radiating plate so as to irradiate light from the entire position of the outer peripheral portion. The LED lighting device according to 1.

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