JP7192083B2 - LED lighting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an LED lighting device including a plurality of LED (Light Emitting Diode) elements as light sources.

Conventionally, a ceiling lighting fixture (ceiling light) disclosed in Patent Document 1, for example, is known as an LED lighting device using an LED as a light source.

The LED lighting device (lighting device) disclosed in Patent Document 1 includes a first light source substrate provided as a main light source and arranged to emit light downward, and a first light source substrate provided as a secondary light source and emitting light upward. and a radiator plate for dissipating heat generated by the first light source substrate and the second light source substrate.

The first light source board, which is the main light source, has a large number of LED elements (hereinafter referred to as "LEDs" as appropriate) that irradiate light downward. An LED cover that guides downward the light emitted from the first light source substrate is provided, and the LED cover has transparency and electrical insulation. A shade made of a translucent material for diffusing the light emitted from the LED is provided below the LED cover, and is engaged and held by a holder provided on the radiator plate. A ring member is provided on the outside of the shade, and the ring member is made of a light-transmissive material.

The second light source board, which is a secondary light source, has a board on which LEDs are mounted and a mounting portion for mounting the board on the upper surface of the heat sink. A translucent cover is provided on the second light source substrate.

Ceiling light fixtures are equipped with such a main light source and a secondary light source that illuminates the ceiling surface. are improving.

In Patent Document 1, the main light source that emits light downward controls the light emitted downward by two optical members, the LED cover and the shade, whereas the sub light source controls the light emitted from the cover. Since it is controlled by one, a method is described in which a reflective member is attached to the cover to control the light emitted from the secondary light source.

JP 2016-219119 A

Another object of the present invention is to provide an LED lighting apparatus capable of suppressing costs, reducing the glare of light emitted from the auxiliary light source, and uniformizing the brightness of the space.

The present invention provides an LED lighting device comprising a first light source substrate that includes a plurality of LED elements as a light source and irradiates light to the side opposite to the side on which the LED lighting device is installed; and a second light source board for irradiating light on the side where the LED lighting device is installed, and a base member, and the side where the LED lighting device of the base member is installed is the second 2 light source substrates are arranged, and the first light source substrate is arranged on the opposite side of the base member to the side on which the LED lighting device is installed, and the light emitted from the second light source substrate A transmission part protruding outside the second light source substrate is arranged so that part or all of the light is incident once even indirectly and diffused, and the transmission part is irradiated from the second light source substrate. and receive the light reflected by the building material on which the LED lighting device is installed, and scatter the light reflected by the building material on which the LED lighting device is installed at a plurality of parts. Characterized by

According to the present invention, it is possible to provide an LED lighting device capable of suppressing costs, reducing the glare of light emitted from the auxiliary light source, and uniformizing the brightness of the space.

It is a figure which shows the LED lighting apparatus which concerns on embodiment of this invention, and is an external appearance perspective view shown when it sees from diagonally downward. It is an external appearance perspective view which shows the state when an LED lighting apparatus is seen from diagonally upward direction. It is an exploded perspective view which shows the state when an LED lighting apparatus is seen from diagonally downward direction. It is an exploded perspective view which shows the state when an LED lighting apparatus is seen from diagonally upward direction. It is a center longitudinal cross-sectional view of an LED lighting apparatus. It is a perspective view which shows the LED lighting apparatus which removed a shade and cut a part of LED cover. It is a perspective view which shows the state when the LED lighting apparatus which cut away a part of indirect light cover is seen from the diagonally upward direction. It is a bottom view which shows an example of a LED light source board|substrate. It is a perspective view which shows the state when the LED lighting apparatus which removed the indirect light cover and the sensor unit was seen from the diagonally upward direction. It is a figure which shows the wiring state of an electric wire, and is a principal part enlarged schematic sectional drawing of the LED lighting apparatus which removed the indirect light cover. It is a central vertical cross-sectional view when the LED lighting device is installed on the ceiling. . FIG. 12 is an enlarged view of part A in FIG. 11; It is a principal part enlarged view which shows the 1st modification which integrated the shade and the transmission part. It is a figure which shows the modification of an indirect light source board|substrate, and is a perspective view which shows the LED lighting apparatus which removed the indirect light cover. FIG. 4 is a diagram showing an example of calculation results of the relationship between the diameter of fine particles of a diffusing agent and the scattering coefficient when the wavelength of light is 600 nm. FIG. 4 is a diagram showing an example of calculation results of the relationship between the diameter of fine particles of a diffusing agent and the forward scattering coefficient when the wavelength of light is 600 nm.

Next, an LED lighting device (LED ceiling light) according to an embodiment of the present invention will be described in detail with appropriate reference to the drawings. In this embodiment, an example of the LED lighting device 1 is described as being circular in plan view. However, the shape is not limited to this. It can also be applied to polygonal shapes such as Further, in this embodiment, the LED lighting device 1 using a light-emitting diode (LED) as a main illumination light source will be described below, but the main illumination light source is not limited to an LED.

The LED lighting device 1 shown in FIGS. 1 and 2 includes, for example, a hook rosette 80 (FIG. 11) provided on the ceiling surface of a house or a mounting adapter 90 (FIG. 11) that engages with an indoor wiring device (not shown) such as a hook ceiling. 11), it is connected to an external power source and fixed to a predetermined position on the ceiling surface for use. The LED illumination device 1 is, for example, round or square (round in this embodiment). In the following description, the upper side of the paper surface is the ceiling side (upper surface side), and the lower side of the paper surface is the floor side (lower surface side), based on the state in which the LED lighting device 1 is attached to the ceiling surface.

As shown in FIGS. 3 and 4, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply board 13, a radiator plate 14, an LED light source board 15 (first light source board), and an LED cover. 16, a center cover 17, a substantially annular transmitting portion 18, a shade 19, an indirect light source board 20 (second light source board), an indirect light cover 21 (upper cover), a sensor unit 22, and the like.

The backbone 11 is a base member formed by processing a steel plate (for example, SECC (electrogalvanized steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) so that the concave surface faces the floor. At the center of the backbone 11, an adapter mounting hole 11a is formed in which a mounting adapter 90 (FIG. 11) is locked.

The mounting adapter receiving portion 12 is made of a synthetic resin (for example, PP: polypropylene resin, etc.) having flame retardancy and electrical insulation. and a cylindrical portion 12b extending from the inner peripheral edge portion of the portion 12a to the floor side (downward).

As shown in FIG. 3, the power supply board 13 has a lighting circuit board including a control section and the like, and is screwed to the backbone 11 via an attachment adapter receiving section 12 (insulating plate). As a result, the power supply substrate 13 is arranged in a heat dissipation space surrounded by the backbone 11 and a heat dissipation plate 14, which will be described later, while maintaining electrical insulation.

Also, the power board 13 is electrically connected to a mounting adapter 90 (FIG. 11) through a wire 23 connected to a power connector 13a fixed to the lower surface of the power board 13. As shown in FIG. As a result, the LED lighting device 1 is configured to receive power via the indoor wiring fixture (not shown), the mounting adapter 90 (FIG. 11), the electric wire 23, and the power supply board 13, respectively.

The heat sink 14 is a metal member that plays a role of cooling the power supply board 13 that generates heat during operation, the LED light source board 15 on which a plurality of LEDs are mounted, and the indirect light source board 20 by dissipating heat. . The LEDs of the LED element group 15b, which will be described later, are vulnerable to heat. In addition, when LEDs are used, a large current of low voltage is passed through them to emit high-brightness light, and the heat generated by this light emission causes deterioration of the LED itself and surrounding materials. Appropriate heat dissipation is required to achieve high reliability.

The radiator plate 14 is formed by processing a steel plate into a substantially circular shape, and has a truncated conical substrate support portion 14a protruding toward the floor. The radiator plate 14 is made of a metal having good thermal conductivity, such as a galvanized steel plate, and is formed seamlessly and integrally by squeezing to increase its strength. Moreover, the heat sink 14 is formed to have a larger diameter than the backbone 11 and is attached to the backbone 11 so as to protrude radially outward from the backbone 11 . The heat dissipation plate 14 has an LED light source board 15 (first light source board) arranged on the lower surface side of the heat dissipation plate 14 so that the plurality of LED elements 15b of the main light source emit light downward. The indirect light source board 20 (second light source board) is arranged so that a plurality of LED elements 20a of a secondary light source, which will be described later, emit light upward. Supplementally, the LED light source substrate 15 is arranged on the lower surface side of the radiator plate 14 so as to follow the lower surface. Further, the indirect light source substrate 20 is arranged on the upper surface side of the radiator plate 15 (the upper surface of the annular portion 14c described later) so as to follow the upper surface so as to reduce the height (thickness).

A circular through-hole 14b is formed in the radial center of the radiator plate 14 at a position corresponding to the cylindrical portion 12b of the adapter receiving portion 12 . Further, the outer peripheral portion of the heat sink 14 has a horizontally formed circular annular portion 14c and a cover mounting portion 14e formed on the outer peripheral portion of the annular portion 14c. Three receivers 14d (see FIG. 3) for hooking a shade 19, which will be described later, are attached to the lower surface of the annular portion 14c at intervals of 120°.

As shown in FIG. 4, an indirect light source substrate 20 screwed to the upper surface of the annular portion 14c and an indirect light cover 21 covering the indirect light source substrate 20 are arranged on the upper surface side of the annular portion 14c. ing.

As shown in FIGS. 5 and 10, the cover attachment portion 14e is a portion to which the indirect light cover 21 is attached, and is formed on the outer peripheral portion of the radiator plate 14 so as to expand in a substantially tapered shape. An indirect light source board 20 is mounted in a ring shape on the annular portion 14c (peripheral portion of the radiator plate 14) of the upper portion of the cover mounting portion 14e, and a large number of LED elements 20a as auxiliary light sources are arranged.

As shown in FIGS. 6 and 10, the wire insertion hole 14f is a through hole formed in the outer peripheral wall of the storage recess 14 formed in a recess shape that is inclined to expand upward. A plurality of electric wires 23 are wired in the electric wire insertion hole 14f.

The wire insertion hole 14g is a through hole formed in the annular portion 14c, and the wire 23 drawn out from the wire insertion hole 14f is wired.

The storage recess 14 is a storage space in which the power supply board 13 to which the electric wire 23 is connected is provided.

The LED light source substrate 15 (first light source substrate) includes a ring-shaped wiring substrate 15a disposed on the lower surface side of the backbone 11 with the heat sink 14 interposed therebetween, and one surface side (floor surface side) of the wiring substrate 15a. and an LED element group 15b as a main light source in which a plurality of concentrically arranged LEDs are mounted by soldering or the like. Details of the LED element group 15b will be described later.

The wiring board 15a is, for example, formed by forming an insulating layer and a copper foil pattern on a substantially annular metal plate made of an aluminum alloy, or a flat plate made of a resin having good thermal conductivity (for example, polyimide resin, etc.). It is configured by forming a copper foil pattern, a solder resist, etc. on it. Also, the wiring board 15a is screwed to the radiator plate 14 .

In this embodiment, by providing the backbone 11 and the heat dissipation plate 14 configured as described above, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the power supply board 13 and the LED light source board 15 is intended to improve the heat dissipation efficiency. As a result, the luminous efficiency of the LED element group 15b can be increased.

The LED light source board 15 shown in FIG. 3 shows an example of an arrangement pattern of LEDs for 18 tatami mats. As shown in FIG. 8, the LED element group 15b includes a plurality of daylight-colored LEDs (Light Emitting Diodes) 15b1 that emit daylight-colored (D color) light, and a plurality of light-emitting diodes (LEDs) that emit light bulb-colored (L-color) light. The LED 15b2, a plurality of blue LEDs 15b3 that emit blue light, and an LED 15b4 for security light constitute a light source for main illumination. Further, at the outer peripheral end of the LED light source board 15, a substantially arc-shaped projecting piece 15c projecting outward and a wire insertion hole 15d (see FIG. 4) formed at the base end of the projecting piece 15c are provided. , and three connector portions 15e (see FIG. 6) mounted on the projecting pieces 15c and connected to the electric wire 23. As shown in FIG.

The daylight LEDs 15b1 have a peak wavelength of 430 nm to 460 nm, and are arranged in a plurality of rows (for example, 9 rows) concentrically from the outer peripheral side to the inner peripheral side.

The light bulb-colored LEDs 15b2 have a peak wavelength of 550 nm to 650 nm, and are arranged with the daylight-colored LEDs 15b1 interposed in each row arranged concentrically. That is, the light bulb color LEDs 15b2 are arranged in each concentric row with two daylight color LEDs 15b1 sandwiched therebetween in the circumferential direction. The bulb-colored LEDs 15b2 in the second row from the inner peripheral side are arranged with one or two daylight-colored LEDs 15b1 sandwiched therebetween. In addition, the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged in each concentric row at equal or substantially equal intervals in the circumferential direction.

The blue LEDs 15b3 have a peak wavelength of 470 nm to 480 nm, and are circularly spaced apart in the circumferential direction between the outermost and innermost circumferences of the daylight-colored LEDs 15b1 and the bulb-colored LEDs 15b2 arranged in a plurality of rows concentrically. arranged in a circle. In the embodiment of FIG. 8, the rows in which the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged are arranged concentrically in five rows on the inner peripheral side of the blue LEDs 15b3 arranged in an annular shape, and concentrically in four rows on the outer peripheral side. It is arranged in rows.

The LED element group 15b shown in FIG. 8 includes, for example, 275 daylight color LEDs 15b1, 142 light bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and light bulb color LEDs 15b2.

The radiator plate 14 and the LED light source substrate 15 are coated with white paint for reflecting light from the LED element groups 15b toward the floor.

The LED cover 16 has a function of guiding the luminous flux emitted from the plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 so as to be in close contact with the heat sink 14, and a main lighting function. It has a function of covering the entire lower surface side of the LED element group 15b, which is a light source for lighting.

The LED cover 16 is integrally formed by injection molding or the like using a translucent and electrically insulating resin such as polystyrene (PS), polycarbonate (PC), acrylic (PMMA), or the like. In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. Further, the material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

As shown in FIG. 6, the LED cover 16 includes a substantially circular LED cover portion 16a that covers the entire light emitting surface (the surface on which the LED element group 15b is mounted) of the LED light source substrate 15, and an outer surface of the LED cover portion 16a. A cylindrical wall portion 16b extending from the peripheral portion toward the back side (ceiling side), a flange portion 16c projecting radially outward from the upper end (back side) of the wall portion 16b, and the LED light source substrate 15 are accommodated. and a substrate housing portion 16d.

In the LED cover 16, the LED cover portion 16a is screwed to the substrate support portion 14a of the heat sink 14, and the collar portion 16c is screwed to the annular portion 14c of the heat sink 14. As shown in FIG.

The wall portion 16b is formed extending in a direction substantially perpendicular to the LED cover portion 16a. A notch (not shown) is formed in the wall portion 16b so that the heat inside the LED cover 16 can escape to the outside. The opening area of the notch is set to a size that the user's finger cannot be inserted into. This prevents the user from directly touching the LED light source board 15 with his/her hand (finger).

The flange portion 16 c is a fixing portion that fixes the LED cover 16 to the heat dissipation plate 14 on the outer peripheral side of the LED light source substrate 15 . The flange portion 16c extends along the circumferential direction and is divided into three portions.

The substrate housing portion 16d is formed in a recessed state with an inclination from the flange portion 16c, and the LED light source substrate 15 is horizontally arranged on the inner bottom portion thereof to house the LED element group 15a.

FIG. 6 is a perspective view showing an example of a state in which an LED cover 16 having a partial cross section is attached to the lower side of the LED light source board 15. As shown in FIG. The LEDs of the LED element group shown in FIG. 8 are configured in the LED cover 16 shown in FIG. 6 so as to emit light to the floor side via a plurality of corresponding dome-shaped portions 16a2. In this embodiment, a set of two LEDs is housed in one dome-shaped portion 162a, but the number of LEDs housed in the dome-shaped portion 16a2 is not limited to this. For example, in one set of two LEDs arranged in one dome-shaped portion 16a2, one is the daylight color LED 15b1 and the other is the light bulb color LED 15b2.

The center cover 17 is a member that covers the mounting adapter 90 (FIG. 11) exposed at the center of the apparatus main body, and is made of, for example, a flame-retardant synthetic resin (eg, PP: polypropylene resin). Also, the center cover 17 is formed in a disc shape and is detachably attached to the LED cover 16 .

The transmissive part 18 has a substantially annular shape, the inner peripheral side of which is held by the outer peripheral side of the shade 19 made of a translucent material, and the outer peripheral side of the transparent part 18 which protrudes outward from the outer periphery of the shade 19 and the indirect light source substrate 20 . there is In order to receive the light emitted from the indirect light source substrate 20 and the light reflected by the ceiling 100, the length of the transmissive portion 20 protruding from the outer periphery of the indirect light source substrate 20 is preferably as long as possible in the outer peripheral direction. However, since the installation property of the LED lighting device 1 is deteriorated, it is preferable that the length of the projection of the transmission part 20 from the outer periphery of the indirect light source substrate 20 is about 1000 mm or less. If the length of the transmissive portion 20 protruding from the outer periphery of the indirect light source substrate 20 is short, the light receiving property of the light emitted from the indirect light source substrate 20 and the light reflected by the ceiling 100 is deteriorated. It is preferable that the outer diameter is For example, as shown in FIG. 12, a line SL passing through the center of the LED element 20a and perpendicular to the light emitting surface of the LED element 20a intersects with the surface of the ceiling 100 facing the light emitting surface of the LED element 20a. When the angle X formed by the line QL extending obliquely downward toward the Of the reflected light, about half of the high-intensity light component directed directly above the LED element 20a can be received by the transmitting portion 20, which is preferable. In order to distribute the light emitted from the LED light source substrate 15 and the indirect light source substrate 20 (second light source substrate) in the space where the LED lighting device 1 is installed, the transmission section 18 has light transmission properties. made of material. For example, it is integrally formed by injection molding or the like using translucent resin such as polystyrene (PS), polycarbonate (PC), acrylic (PMMA), or the like. In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. A diffusing agent for scattering light may be added to the material, and by adding the diffusing agent, glare is prevented or reduced, and the brightness in the space where the LED lighting device 1 is installed is made uniform. It has the effect of transforming

In addition, since the indirect light source board 20 (second light source board) is installed facing the ceiling 100, most of the light emitted from the LED elements 20a is emitted from the ceiling 100 as shown in FIG. , and returns to the lighting device 1 side. Therefore, the floor side is irradiated with light in an uncontrolled manner under the influence of the ceiling 100, which causes uneven brightness in the space where the LED lighting device 1 is installed. By including the agent, it is possible to scatter the light, significantly prevent glare, and uniform the brightness of the space where the LED lighting device 1 is installed.

Further, as shown in FIG. 13, the transmission part 18 may be formed integrally with the shade 19, for example, so that the number of parts can be reduced, the assembly is good, and the cost can be reduced. Play.

Furthermore, the transmission section 18 includes transmission section 1 (182a), transmission section 2 (182b), and transmission section 1 (182a) shown in FIG.
It may be composed of a plurality of transmission parts like the transmission part 3 (182c), and the plurality of transmission parts prevent or significantly reduce glare and reduce the brightness in the space where the LED lighting device 1 is installed. It has the effect of equalizing the thickness.

The diffusing agent added to the material is formed of fine particles with a size of about 1 to 100 μm, such as calcium carbonate, silica, and silicone, which have high light diffusing properties and can maintain high transmittance when added to the material. . Especially calcium carbonate is excellent in terms of cost. When adding to polystyrene or polycarbonate having a refractive index of about 1.6, it is preferable to use calcium carbonate or silica having a refractive index of about 1.5 to 1.6 without a large difference. If the refractive indices are significantly different, the reflection inside the transmissive portion 18 increases, the transmittance is remarkably lowered, and the brightness is reduced. Further, the shape of the microparticles of the diffusing agent added to the material is preferably spherical from the viewpoint of uniformity of light scattering, and it is preferable that the diffusing agent to be added has the same shape and size.

In addition, when the size of the fine particles of the diffusing agent is sufficiently smaller than the wavelength of the light to be transmitted, the scattering characteristic becomes Rayleigh scattering, and the wavelength dependence of the light becomes significant. 15 and the indirect light source substrate 20 are dispersed to cause light color unevenness. Therefore, it is preferable that the thickness is about 1 μm or more, which is about the wavelength of light. Effective.
FIG. 15 shows an example of the calculation result of the scattering coefficient according to the Mie scattering theory when the particle shape is spherical and the light wavelength is 600 nm. FIG. 16 shows an example of calculation results of the forward scattering coefficient according to the Mie scattering theory when the particle shape is spherical and the light wavelength is 600 nm. The larger the scattering coefficient, the larger the scattering, which indicates that it contributes to the prevention of glare and the uniformity of the brightness of the space in which the LED lighting device 1 is installed. Moreover, the larger the forward scattering coefficient, the more the light is scattered in the direction in which the light travels when it is scattered.
According to the calculation results shown in FIGS. 15 and 16, the scattering coefficient is maximized when the particle diameter is about 2 μm, and good results are obtained when the forward scattering coefficient is about 3 μm. Therefore, the particle diameter is preferably about 3 μm from the viewpoint of both scattering and transmittance, but if there is variation in the particle diameter, the scattering coefficient changes greatly with respect to the particle diameter in order to obtain more stable light scattering. It is preferred to use microparticles with a particle diameter of 4 μm or greater, except for particle diameters of 3 μm or less.

By configuring the transmission part 18 in this way, the space in which the LED lighting device 1 is installed, such as the ceiling and the floor, is illuminated in a wide range, and the brightness is made uniform.

As shown in FIG. 5 (also shown in FIGS. 3 and 4), the LED cover portion 16a has a circular through hole 16a1 formed in the center portion in the radial direction. Dome-shaped portions 16a2 are formed in the LED cover portion 16a at positions corresponding to the LED element groups 15b (daylight color LED 15b1, light bulb color LED 15b2, blue LED 15b3) of the LED light source substrate 15, respectively. The dome-shaped portion 16a2 has a lens function, and is a member that polarizes the light from the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3.

The shade 19 is a translucent cover made of resin (for example, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white) and is configured in a dome shape. The shade 19 diffuses the luminous flux emitted from the light source (the LED element group 15b) to reduce glare when the user looks directly at the LED lighting device 1, or to reduce the glare of the space in which the LED lighting device 1A is installed. It plays the role of equalizing the brightness. The shade 19 is detachably engaged and held by a receiving member 14d of the radiator plate 14. As shown in FIG.

As shown in FIG. 9, the indirect light source board 20 (second light source board) is arranged on the outer periphery on the upper surface side of the heat sink so that light is emitted from the entire outer periphery. The indirect light source substrate 20 is configured by connecting four substantially fan-shaped substrates arranged in a C shape, and is mounted with a plurality of LED elements 20a as auxiliary light sources. The indirect light source board 20 includes connectors 20b for board connection provided at the ends in the circumferential direction, electric wires 20c for board connection wired between the connectors 20b, electric wires 23 for power supply connection, and these electric wires. 23, and a power supply connector 20d attached near the cutout 20e. The indirect light source substrate 20 is arranged by screwing onto the annular portion 14c of the peripheral portion on the upper surface side of the radiator plate 14 .

For this reason, as shown in FIGS. 11 and 12, the LED elements 20a are arranged so as to irradiate light from the entire periphery of the upper surface side of the radiator plate . Also, the LED elements 20a are arranged on the outer peripheral side of the LED light source substrate 15 relative to the outer peripheral portion thereof.

On the upper side of the indirect light source board 20 (second light source board), an indirect light cover 21 (upper cover) made of an annular translucent resin is provided to cover the indirect light source board 20 from above ( See Figure 3).

As shown in FIGS. 3 and 4, the sensor unit 22 changes the power supplied to the LED element group 15b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example, so that the LED lighting It provides a function for obtaining a constant illuminance under the device 1 . Also, the illuminance under the LED lighting device 1 is detected. The sensor unit 22 is attached to the upper portion of the indirect light source substrate 20 where the C-shaped notch is formed.

Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described mainly with reference to FIGS. 5, 11 and 12. FIG.

The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with power from a power supply and a power supply circuit (not shown). The power supply circuit has the function of adjusting the power of the power supply to a predetermined voltage or current. The LED lighting device 1 also has a function of receiving a signal (for example, infrared light) output from a remote control at a light receiving section (not shown) and transmitting the received signal to a control section (not shown).

A lighting circuit (not shown) has a function of driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 based on the control signal received from the control unit. Further, the lighting circuits 102, 103, and 104 have a function of individually changing the drive currents for driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 based on the control signals received from the daylight color LED 15b1 and the control unit.

A remote control (not shown) has a function of outputting a set signal by operating a button, for example, full lighting mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition. mode can be set.

By the way, in order to make the characters in books and newspapers easier to see, when a predetermined button on the remote controller is pressed, the brightness of the daylight color LED 15b1 and the light bulb color LED 15b2 increases, and the blue LED 15b3 lights up to add bluish green light, making it even brighter. Realize natural lighting closer to sunlight. This makes it easier to see characters, pictures, and the like.

When the LED element group 15b of the main light source shown in FIG. The LED element group 15b also emits heat when irradiated with light.

As shown in FIG. 5, the LED cover 16 is screwed to the heat sink 14 with the LED light source board 15 interposed between the heat sink 14 and the LED cover 16 . As a result, the adhesion of the LED light source substrate 15 to the heat sink 14 is increased, and the heat dissipation can be improved. Therefore, it is possible to realize the LED lighting device 1 in which the density of the light emitting surface of the main light source is uniform and the light emitting efficiency of the LED element group 15b is excellent. Furthermore, the heat sink 14 corrects the arrangement of the LEDs of the LED element group 15 to a proper position with respect to the LED cover 17, and also has the effect of reducing warpage and deformation of the LED light source substrate 15. FIG.

As shown in FIG. 3, the LED light source substrate 15 (first light source substrate) is arranged on the lower surface side of the heat sink 14 so as to emit light downward. An indirect light source substrate 20 (second light source substrate) is arranged on the upper surface side so as to emit light upward. That is, since the indirect light source substrate 20 is composed of a flat substrate that is horizontally arranged and connected in a C-shape, the height is lowered in the vertical direction, and the overall size and thickness of the LED lighting device 1 are reduced. can do.

As shown in FIGS. 11 and 12, a large number of LED elements 20a of the indirect light source board 20 are arranged on the outer peripheral portion of the upper surface side of the heat sink 14 so that light is emitted from the entire outer peripheral portion. ing.

In addition, since a translucent indirect light cover 21 that covers the indirect light source board 20 from above is provided on the upper surface side of the heat sink 14, the ceiling direction (upward direction) and the outer peripheral direction (horizontal direction) are irradiated, It can illuminate the whole room brightly.

The LED elements 20a of the indirect light source board 20 are arranged closer to the outer periphery than the outer periphery of the LED light source board 15 (first light source board). Therefore, the heat-generating LED elements 20a on the indirect light source substrate 20 and the heat-generating LED element groups 15a arranged on the LED light source substrate 15 can be arranged with being shifted from each other on the radiator plate 14. , can be efficiently dissipated and cooled. In addition, since the LED element 20a can be arranged at a position closer to the outer peripheral edge of the LED lighting device 1, the outer peripheral direction of the LED lighting device 1 can be brightly illuminated.

As shown in FIGS. 5, 11, and 12, an indirect light cover 21 (upper cover) is attached to the cover attachment portion 14e on the outer periphery of the radiator plate 14. As shown in FIGS. Further, the LED elements 20a of the indirect light source board 20 (second light source board) are arranged above the cover mounting portion 14e.

Therefore, the LED element 20a can illuminate the light emitted from the LED element 20a in the outer peripheral direction and upward direction without being blocked by other members. In addition, the amount of light can be increased compared to conventional devices, and bright illumination can be achieved.

As described above, the LED lighting device 1 according to the embodiment of the present invention can reduce the height (thickness) of the lighting device and direct the light of the indirect light source substrate 20 outward. Since it is possible to illuminate the ceiling surface and the upper surface of the wall in the room, the brightness of the room can be increased. In addition, the LED lighting device 1 can be made thinner and smaller by reducing the height of the entire LED lighting device 1 .

In addition, in this embodiment, the light that is emitted from the LEDs of the indirect light source board 20 and returned from the ceiling to the floor can be scattered by the translucent part 18. is prevented or remarkably reduced, and the uniformity of the brightness of the space can be realized.

<Modified Example of Indirect Light Source Board>
FIG. 15 is a diagram showing a modification of the indirect light source board 20A, and is a perspective view showing the LED lighting device with the indirect light cover removed.

In the above-described embodiment, as an example of the indirect light source board 20 (see FIG. 9), the case where three divided circuit boards are connected in a C shape when viewed from the top has been described, but the present invention is not limited to this. .

As shown in FIG. 15, the indirect light source board 20A may be a single C-shaped circuit board.

Also, the indirect light source board 20A may be a circuit board formed in a single annular shape.

Reference Signs List 1 LED lighting device 11 backbone 14 heat sink 14e cover mounting portion 15 LED light source board (first light source board)
15b LED element group (LED element)
16 LED cover 18 transmission part 182 transmission part (Modification 1)
20 indirect light source board (second light source board)
20a LED element 21 indirect light cover (upper cover)

Claims (4)

An LED lighting device,
a first light source substrate including a plurality of LED elements as a light source and emitting light to the side opposite to the side on which the LED lighting device is installed;
a second light source substrate that includes a plurality of LED elements as a light source and irradiates a side on which the LED lighting device is installed with light;
a base member;
The second light source board is arranged on the side of the base member on which the LED lighting device is installed,
The first light source board is arranged on the side of the base member opposite to the side on which the LED lighting device is installed,
a transmitting portion projecting outward from the second light source substrate is arranged so that part or all of the light emitted from the second light source substrate is incident even indirectly once and diffused;
The transmission part receives light emitted from the second light source substrate and reflected by the building material on which the LED lighting device is installed, and receives a plurality of lights reflected by the building material on which the LED lighting device is installed. An LED illumination device characterized in that it is configured to scatter at a portion of. 2. The LED lighting device according to claim 1, further comprising a cover that covers the second light source substrate, and wherein the transmitting portion is arranged separately from the cover. 3. The LED lighting device according to claim 1, wherein the transmitting portion contains a light diffusing agent made up of fine particles. 3. The LED lighting device according to claim 1, wherein the transmitting portion contains a light diffusing agent composed of microparticles having a length of 4 [mu]m or more.

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