JP6877404B2 - Electronic device packaging tape - Google Patents

Description

The present invention relates to a tape for an electronic device package, and more particularly to a tape for an electronic device package having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs are required to be further thinned and miniaturized. Therefore, in order to make electronic device packages such as semiconductor packages mounted on electronic devices thinner and smaller, the number of electrodes of electronic devices and circuit boards is increased, and the pitch is also narrowed. Such electronic device packages include, for example, flip chip (FC) mounting packages.

In the flip chip mounting package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in the amount of heat generated is a problem. Therefore, as a heat dissipation structure of the flip chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

Further, in the flip chip mounting package, the coefficient of linear expansion of the electronic device and the coefficient of linear expansion of the circuit board may be significantly different. In this case, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, a difference in the amount of expansion and contraction occurs between the electronic device and the circuit board. This difference causes the electronic device package to warp. As a structure for suppressing such warpage, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 2).

Further, in a flip chip mounting package, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). ..

Further, in recent years, there is a case where another semiconductor chip of the same size is further laminated on the semiconductor chip to perform three-dimensional mounting. Here, in order to enable stacking of other semiconductor chips of the same size on the semiconductor chip, it is necessary to stack a spacer between the two. This is because other semiconductor chips are laminated on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (see, for example, Patent Document 4). In Patent Document 4, the spacer is a step of bonding a spacer adhesive sheet having a metal layer having an adhesive layer on at least one surface to a dicing sheet with the adhesive layer as a bonding surface, and a spacer adhesive sheet. To form a chip-shaped spacer with an adhesive layer by dicing, and a pickup used when the spacer is pushed up by a pin and the pushed-up spacer is peeled off from the dicing sheet together with the adhesive layer. It is described that the device is provided by a step of peeling from the dicing sheet together with the adhesive layer and a step of fixing the spacer to the adherend via the adhesive layer.

Japanese Unexamined Patent Publication No. 2007-23502 Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

As described above, the metal layer with the adhesive layer is useful for various electronic device packages, but from the viewpoint of productivity, as disclosed in Patent Document 4, it can be picked up by using an existing device. It is required to fix it to the adherend.

In the existing pickup device, the semiconductor chip is vacuum-sucked with a collet to pick up. At this time, since it is necessary to reliably pick up the semiconductor chip, the position of the semiconductor chip is recognized, the deviation of the semiconductor chip is detected, the position of the collet is corrected, and the semiconductor chip is picked up.

Pattern recognition is mainly used as a recognition method for semiconductor chips. In the method using pattern recognition, the circuit, alignment mark, chip outline, etc. of the semiconductor chip are registered as a template in advance, and the position of the semiconductor chip is determined by matching this template with the image of the semiconductor chip captured by the imaging device. It is to recognize. When no circuit or alignment mark is formed like a bare chip, a template composed of a chip outer shape and a uniform chip surface is registered.

When an attempt is made to pick up a metal layer with an adhesive layer from an adhesive tape using such an existing pickup device, since there is no circuit in the metal layer, the outer shape of the metal layer and the uniform metal layer surface are similar to those of a bare chip. A template composed of will be used. However, when the surface roughness of the metal layer is large, the image pickup apparatus detects the unevenness of the surface, and as a result of determining that the imaged metal layer surface is different from the template, there is a problem that the individual metal layer cannot be recognized. there were.

Therefore, the present invention is for an electronic device package that can satisfactorily recognize individual pieces of the metal layer with the adhesive layer to be picked up by the pick-up device when the metal layer with the adhesive layer is picked up from the adhesive tape. The purpose is to provide the tape.

In order to solve the above problems, the tape for electronic device packaging according to the present invention is provided by laminating an adhesive tape having a base film and an adhesive layer on the opposite side of the pressure-sensitive adhesive layer to the base film. The adhesive layer is provided with a metal layer laminated on the opposite side of the adhesive layer to the adhesive layer, and the metal layer is a ten-point average of the surfaces opposite to the adhesive layer. The surface roughness RzJIS due to roughness is less than 5.0 μm.

The electronic device package tape preferably has a mirror glossiness of less than 100% at an incident angle of 60 degrees of the metal layer.

The thickness of the metal layer of the electronic device packaging tape is preferably 5 μm or more and less than 200 μm.

The electronic device package tape has an adhesive strength of 0.03 to 0.5 N / 25 mm between the adhesive tape and the adhesive layer when the adhesive layer and the metal layer are picked up from the adhesive tape. Is preferable.

It is preferable that the metal layer of the tape for electronic device packaging contains copper or aluminum.

Further, in the tape for electronic device packaging, the adhesive layer contains (A) epoxy resin, (B) curing agent, (C) acrylic resin or phenoxy resin, and (D) surface-treated inorganic filler. It is preferable to do so.

Further, in the tape for electronic device packaging, the pressure-sensitive adhesive layer _{contains an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group. It is preferable to contain an acrylic polymer composed of a monomer and an isocyanate compound having a radically reactive carbon-carbon double bond in the molecule.

According to the present invention, when the metal layer with the adhesive layer is picked up from the adhesive tape, the pick-up device can satisfactorily recognize the individual pieces of the metal layer with the adhesive layer to be picked up.

It is sectional drawing which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. (A) is a plan view schematically showing the structure of a tape for an electronic device package according to an embodiment of the present invention, and (b) is a sectional view thereof. It is a perspective view which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the longitudinal sectional view which shows the bonding process of a metal layer, (B) is an adhesive. It is a longitudinal sectional view which shows the layer bonding process, (C) is a lateral sectional view which shows a precut process, and (D) is a perspective view which shows the removal process of an unnecessary part. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the short side sectional view which shows the bonding process of adhesive tape, (B) is precut. It is a short-side sectional view which shows the process, and (C) is a short-side sectional view which shows the removal process of an unnecessary part. It is sectional drawing which schematically explains the method of using the tape for electronic device packaging which concerns on embodiment of this invention. It is sectional drawing which schematically explains the method of using the tape for electronic device packaging which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device package which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is a cross-sectional view showing a tape 1 for an electronic device package according to an embodiment of the present invention. The electronic device package tape 1 has an adhesive tape 5 composed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer is placed on the adhesive layer 52. 4 and a metal layer 3 provided by being laminated on the adhesive layer 4 are provided. The metal layer 3 may be indirectly provided on the adhesive layer 4 via a primer layer or the like for improving the adhesion with the adhesive layer 4.

In the electronic device package tape 1 of the present invention, as shown in FIGS. 2 and 3, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 7), and the metal layer 3 and the adhesive layer are formed. 4 is also preferably cut into a predetermined shape (pre-cut processing) corresponding to this, and in the present embodiment, the pre-cut processing is performed.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention has an adhesive tape 5 (label portion 5a) cut into a shape corresponding to the metal layer 3, the adhesive layer 4, and the ring frame R. It is preferable that the long base material tape 2 on which a plurality of laminated bodies are formed is wound in a roll shape, and in the present embodiment, the base material is wound in a roll shape. The laminates provided on the tape 2 may be cut one by one.

When pre-cut and wound into a roll, as shown in FIGS. 2 and 3, the electronic device package tape 1 has a base tape 2, and is predetermined on the base tape 2. The metal layer 3 having the planar shape of the above, and the adhesive layer 4 provided by laminating the metal layer 3 on the side opposite to the base tape 2 side of the metal layer 3 and having a predetermined planar shape, and the adhesive layer 4 Adhesive having a predetermined flat label portion 5a provided around the adhesive layer 4 so as to come into contact with the base tape 2 and a peripheral portion 5b surrounding the outside of the label portion 5a. A tape 5 and the like are provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably a similar shape having substantially the same shape as the inside of the ring frame R and larger than the size of the inside of the ring frame R. Further, it does not necessarily have to be circular, but a shape close to circular is preferable, and circular shape is more preferable. The peripheral portion 5b includes a form that completely surrounds the outside of the label portion 5a and a form that does not completely surround the label portion 5a as shown in the figure. The peripheral portion 5b may not be provided, but if it is provided, the winding tension related to the label portion 5a can be dispersed in the form of winding in a roll shape.
The adhesive layer 4 has a predetermined planar shape, and this planar shape is such that a ring frame R is attached to the peripheral edge of the label portion 5a of the adhesive tape 5 and can be pushed up by a push-up member of the pickup device. (See FIG. 7C) The shape is smaller than that of the label portion 5a. It is preferable that the adhesive layer 4 has substantially the same shape as the label portion 5a and has a similar shape smaller than the size of the label portion 5a. The adhesive layer 4 does not necessarily have to be circular, but a shape close to a circular shape is preferable, and a circular shape is more preferable.

The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. In the lamination referred to here, it is sufficient that the main parts are laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have the same size, but from the convenience of manufacturing, they may have substantially the same shape. preferable. Each component will be described below.

<Base tape 2>
The base material tape 2 can be composed of a known separator, but the base material tape used for the pre-cut processing of the tape for electronic device packaging can also be used as it is. When the base material tape used for the precut processing of the tape for electronic device packaging is used as it is, the base material tape 2 needs to adhesively hold the metal layer 3 at the time of the precut processing. Therefore, for example, on one side of the resin film and the resin film. A tape having the provided pressure-sensitive adhesive layer for the base material tape can be preferably used.

A known material can be used as the material of the resin film constituting the base material tape 2, but for example, polyester (PET, PBT, PEN, PBN, PTT) type, polyolefin (PP, PE). Examples thereof include systems, copolymer (EVA, EEA, EBA) systems, and films in which these materials are partially replaced to further improve adhesiveness and mechanical strength. Further, it may be a laminate of these films. From the viewpoint of heat resistance, smoothness, and availability, it is preferable to select from polyethylene terephthalate, polypropylene, and polyethylene.

The thickness of the resin film constituting the base material tape 2 is not particularly limited and may be set as appropriate, but is preferably 10 to 150 μm.

As the resin used for the pressure-sensitive adhesive layer for the base material tape, known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive can be used. Acrylic adhesives using a polymer as a base polymer are preferable.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all of the (meta) of the present invention have the same meaning.

The acrylic polymer contains a unit corresponding to the (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, etc. You may. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic acid anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate , (Meta) acrylate 8-hydroxyoctyl, (meth) acrylate 10-hydroxydecyl, (meth) acrylate 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphonic acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or two or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The adhesive layer for the base tape preferably has a composition in which the content of low molecular weight substances is suppressed from the viewpoint of preventing contamination of the wafer, and from this point, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million. Since the adhesive containing the above as a main component is preferable, the pressure-sensitive adhesive may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer for the base material tape and improve the peelability from the pressure-sensitive adhesive tape 5, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, etc. A method of cross-linking with an appropriate external cross-linking agent such as a metal chelate compound, an amino resin compound, or a peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds to generate energy rays. It is possible to adopt an appropriate method such as a method of cross-linking by irradiating the compound. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for the base material tape is not particularly limited and can be appropriately determined, but is generally about 3 to 200 μm. Further, the pressure-sensitive adhesive layer for the base material tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
The adhesive tape 5 is not particularly limited, and a conventional dicing tape can be used. As the adhesive tape 5, for example, a base film 51 provided with an adhesive layer 52 can be preferably used.

As the base film 51, any conventionally known one can be used without particular limitation, but when a radiation-curable material is used as the pressure-sensitive adhesive layer 52 described later, it has radiation permeability. It is preferable to use one.

For example, the materials thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-acrylic. A homopolymer or copolymer of α-olefins such as methyl acid copolymer, ethylene-acrylic acid copolymer, and ionomer, or a mixture thereof, polyurethane, styrene-ethylene-butene or penten-based copolymer, polyamide-polypolymer. Thermoplastic elastomers such as copolymers and mixtures thereof can be listed. Further, the base film may be a mixture of two or more kinds of materials selected from these groups, or may be a single layer or a multi-layered film.

The thickness of the base film 51 is not particularly limited and may be set as appropriate, but it is preferably 50 to 200 μm in consideration of the expanding step at the time of picking up.

In order to improve the adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is chemically or physically treated with dichromic acid, ozone, flame, high piezoelectric, or ionizing radiation. Target surface treatment may be applied.

Further, in the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51, but a primer layer for improving adhesion, an anchor layer for improving machinability during dicing, and stress. It may be provided indirectly via a relaxation layer, an antistatic layer, or the like.

The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive are used. Although it can be used, an acrylic pressure-sensitive adhesive based on an acrylic polymer is preferable.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all of the (meta) of the present invention have the same meaning.

The acrylic polymer is a unit corresponding to the above-mentioned (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, crosslinkability and the like. May include. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic acid anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate , (Meta) acrylate 8-hydroxyoctyl, (meth) acrylate 10-hydroxydecyl, (meth) acrylate 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphonic acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or two or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low molecular weight substances is suppressed, and from this point of view, it is preferable that the pressure-sensitive adhesive layer 52 is mainly composed of an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million. The agent may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer 52 and improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, and an amino resin compound. A method of cross-linking with a compound or an appropriate external cross-linking agent such as peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds and cross-linking by irradiation with energy rays or the like. Etc., an appropriate method can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer. From the viewpoint of preventing deterioration and the like, the pressure-sensitive adhesive may contain various additives such as a pressure-sensitive adhesive and an anti-aging agent in addition to the above-mentioned components, if necessary.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation-curable pressure-sensitive adhesive is suitable. Examples of the radiation-curable pressure-sensitive adhesive include an additive-type radiation-curable pressure-sensitive adhesive in which a radiation-curable monomer component and a radiation-curable oligomer component are mixed with the above-mentioned pressure-sensitive adhesive.

Examples of the radiation-curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaeristol tetra (). Examples thereof include meta) acrylate, dipentaeristol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. These monomer components can be used alone or in combination of two or more.

Further, examples of the radiation-curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The amount of the radiation-curable monomer component or oligomer component to be blended can be appropriately determined according to the type of the pressure-sensitive adhesive layer 52 so that the adhesive strength of the pressure-sensitive adhesive layer 52 can be reduced. Generally, it is, for example, about 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of a base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

As the radiation-curable pressure-sensitive adhesive, in addition to the addition-type radiation-curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the end of the main chain was used. Intrinsic radiation curable adhesives can also be mentioned. Since the intrinsic radiation-curable pressure-sensitive adhesive does not need to contain the oligomer component, which is a low-molecular component, or does not contain a large amount, the oligomer component, etc. does not move in the pressure-sensitive adhesive over time and is stable. It is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

As the base polymer having a carbon-carbon double bond, one having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, one having an acrylic polymer as a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the above-exemplified acrylic polymer.

The method for introducing a carbon-carbon double bond into an acrylic polymer is not particularly limited, and various methods can be adopted, but it is easy to introduce a carbon-carbon double bond into a polymer side chain in terms of molecular design. is there. For example, after copolymerizing a monomer having a functional group with an acrylic polymer in advance, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is subjected to radiation curability of the carbon-carbon double bond. Examples thereof include a method of condensing or adding reaction while maintaining the above.

Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group, and the like. Among these combinations of functional groups, the combination of a hydroxyl group and an isocyanate group is preferable because of the ease of tracking the reaction. Further, as long as the combination of these functional groups produces an acrylic polymer having the carbon-carbon double bond, the functional group may be on either side of the acrylic polymer or the compound. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloylisocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzylisocyanate and the like. Further, as the acrylic polymer, a polymer obtained by copolymerizing the above-exemplified hydroxy group-containing monomer or an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, or diethylene glucol monovinyl ether is used.

In the intrinsic radiation-curable pressure-sensitive adhesive, the base polymer having a carbon-carbon double bond (particularly an acrylic polymer) can be used alone, but the radiation-curable monomer component does not deteriorate the properties. It is also possible to blend a photopolymerizable compound such as an oligomer component or an oligomer component. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably in the range of 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

The radiation-curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when it is cured by ultraviolet rays or the like.

Among the above-mentioned acrylic polymers, in particular _{, an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and intramolecules. Acrylic polymer A composed of an isocyanate compound having a radically reactive carbon-carbon double bond is preferable.

If the alkyl group of the acrylic acid alkyl ester has less than 4 carbon atoms, the polarity may be high and the peeling force may be too large to reduce the pick-up property. On the other hand, when the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature deteriorate. Peeling of the layer 4 and the metal layer 3 may occur.

The acrylic polymer A may contain units corresponding to other monomer components, if necessary.

In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a structure in which a double bond-containing isocyanate compound is added to a polymer composed of a monomer composition such as the acrylic acid ester or a hydroxyl group-containing monomer. Therefore, it is preferable that the acrylic polymer has a radical-reactive carbon-carbon double bond in its molecular structure. As a result, the active energy ray-curable pressure-sensitive adhesive layer (ultraviolet-curable pressure-sensitive adhesive layer, etc.) that is cured by irradiation with active energy rays (ultraviolet rays, etc.) can be formed, and the peeling force between the metal layer 3 and the pressure-sensitive adhesive layer 52 can be obtained. Can be reduced.

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like. The double bond-containing isocyanate compound can be used alone or in combination of two or more.

Further, in the active energy ray-curable pressure-sensitive adhesive, an external cross-linking agent can be appropriately used in order to adjust the pressure-sensitive adhesive strength before the activation energy ray irradiation and the adhesive strength after the activation energy ray irradiation. Specific means of the external cross-linking method include a method of adding and reacting a so-called cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, and a melamine-based cross-linking agent.

Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone. Alicyclic polyisocyanates such as diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane Aromatic polyisocyanates such as diisocyanate and xylylene diisocyanate can be mentioned, and other trimetylolpropane / tolylene diisocyanate trimeric adduct [manufactured by Toso Co., Ltd., trade name "Coronate L"], trimethylolpropane / hexa. Methylene diisocyanate trimeric adduct [manufactured by Toso Co., Ltd., trade name "Coronate HL"] and the like are also used. Examples of the epoxy compound include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, 1, 6-Hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta Ellisritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, Examples thereof include resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule.

When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. The amount of the external cross-linking agent used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) with respect to 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may contain, if necessary, various conventionally known additives such as a pressure-imparting agent, an anti-aging agent, and a foaming agent, in addition to the above-mentioned components.

In the present invention, instead of using a cross-linking agent, or while using a cross-linking agent, it is also possible to carry out the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Further, the pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited, and for example, the electronic device package 8 may contain at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel and copper. It is preferable from the viewpoint of preventing warpage. Among these, copper is particularly preferable from the viewpoint of high thermal conductivity and the effect of heat dissipation. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 is preferably 5 μm or more and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to prevent the metal layer from warping or peeling off from the adhesive tape even if the amount of expansion is increased, so that the distance between adjacent metal layers can be increased and the boundary can be easily identified. Further, if it is less than 200 μm, it is easy to process, and when it is necessary to bend it along the core or the bonding roll in winding or bonding, the metal layer is too stiff and creases occur. , The phenomenon that a recognition error occurs in the pickup device can be suppressed.

The surface roughness RzJIS based on the ten-point average roughness of the surface of the metal layer 3 opposite to the adhesive layer 4 is less than 5.0 μm. When the surface roughness RzJIS based on the ten-point average roughness of the metal layer 3 is set to less than 5.0 μm, the unevenness of the surface is detected, so that the imaged metal layer 3 is judged to be different from the template. Can be suppressed. Therefore, the registered template and the image of the individual piece of the metal layer 3 captured for the pickup can be matched, and the individual piece is recognized as the pickup target. The surface roughness RzJIS in this specification is the ten-point average roughness specified in Annex JA of JIS B 0601: 2013.

A metal foil can be used as such a metal layer 3, and the metal foil is an electrolytic foil if the surface roughness RzJIS of the surface opposite to the adhesive layer 4 is less than 5.0 μm. It may be a rolled foil. In the case of an electrolytic foil, the surface roughness RzJIS can be adjusted by the electrolytic conditions (liquid composition, liquid temperature, current, additives, etc.).

The mirror glossiness of the metal layer 3 at an incident angle of 60 degrees is preferably less than 100%. If the mirror glossiness is too high, depending on the angle and amount of illumination of the pickup device, the reflected light from the individual pieces of the metal layer 3 to be picked up or the neighboring individual pieces becomes glare, and the metal layer to be picked up. It becomes difficult to recognize the outer shape of each piece of 3. When the glossiness of the metal layer 3 is less than 100%, glare is suppressed and the outer shape of each piece of the metal layer 3 is well recognized. The glossiness is a value measured according to JIS Z 8741. The glossiness can be measured with a commercially available glossiness meter, and for example, a glossiness meter Handy Gloss Meter PG-1 manufactured by Nippon Denshoku Co., Ltd. can be used.

When adjusting the mirror glossiness, known surface treatments may be performed alone or in combination. For example, after roughening treatment such as Cu plating, it is preferable to reduce the size of the roughened particles, increase the number of roughened particles, and smooth the surface of the roughened particles by PR pulse electrolysis or the like. Further, if necessary, an alkali dipping treatment may be performed for the purpose of removing residues of surface contaminants such as foil-making additives and smoothing the surface of roughened particles.

<Adhesive layer 4>
The adhesive layer 4 is a film formed of an adhesive in advance.

The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, and polycarbonate resin. Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluororesin And so on. The thermoplastic resin can be used alone or in combination of two or more. Among these thermoplastic resins, acrylic resin has less ionic impurities and excellent stress relaxation property, and phenoxy resin has high toughness while achieving both flexibility and strength. This is particularly preferable because reliability can be easily ensured.

The acrylic resin is not particularly limited, and one or more kinds of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms (preferably 1 to 18 carbon atoms). Examples thereof include polymers containing. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group and a 2-ethylhexyl group. , Octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

Further, the other monomer for forming the acrylic resin (monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and for example, acrylic acid. Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth) 2-Hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) Hydrolyl group-containing monomers such as 10-hydroxydecyl acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl) -methylacrylate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide Sulfonic acid group-containing monomers such as -2-methylpropanesulfonic acid, (meth) acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalene sulfonic acid, 2-hydroxyethylacryloyl phosphate and the like. Examples thereof include a sulfonic acid group-containing monomer and acrylonitrile. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and all have the same meaning as (meth) of the present invention.

Examples of the thermosetting resin include an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, and the like, in addition to an epoxy resin and a phenol resin. The thermosetting resin can be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities and the like that corrode semiconductor elements is particularly preferable. Further, a phenol resin can be preferably used as the curing agent for the epoxy resin.

The epoxy resin is not particularly limited, and for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy. Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluonelen type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylol ethane type epoxy resin, etc. An epoxy resin such as a resin, a polyfunctional epoxy resin, a hidden-in type epoxy resin, a trisglycidyl isocyanurate type epoxy resin, or a glycidylamine type epoxy resin can be used.

As the epoxy resin, a novolak type epoxy resin, a biphenyl type epoxy resin, a trishydroxyphenylmethane type epoxy resin, and a tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins are highly reactive with phenol resins as curing agents and are excellent in heat resistance and the like.

Further, the phenol resin acts as a curing agent for the epoxy resin, and is, for example, a novolak type phenol resin such as a phenol novolac resin, a phenol aralkyl resin, a cresol novolac resin, a tert-butylphenol novolak resin, or a nonylphenol novolak resin, or a resol type. Examples thereof include phenol resin and polyoxystyrene such as polyparaoxystyrene. The phenolic resin can be used alone or in combination of two or more. Of these phenolic resins, phenol novolac resin and phenol aralkyl resin are particularly preferable. This is because the connection reliability of the semiconductor device can be improved.

The mixing ratio of the epoxy resin and the phenol resin is preferably, for example, such that the hydroxyl groups in the phenol resin are 0.5 equivalents to 2.0 equivalents per 1 equivalent of the epoxy groups in the epoxy resin component. More preferred are 0.8 equivalents to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, the curing reaction does not proceed sufficiently, and the characteristics of the cured epoxy resin product are likely to deteriorate.

Further, a thermosetting catalyst of an epoxy resin and a phenol resin may be used. The thermosetting accelerator is not particularly limited, and can be appropriately selected and used from known thermosetting accelerators. The thermosetting accelerator can be used alone or in combination of two or more. As the thermosetting catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

It is important that the adhesive layer 4 has adhesiveness (adhesiveness) to an adherend 9 such as an electronic device. Therefore, in order to cross-link the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer may be added as a cross-linking agent. As a result, the adhesive properties at high temperatures can be improved and the heat resistance can be improved.

The cross-linking agent is not particularly limited, and a known cross-linking agent can be used. Specifically, for example, in addition to isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, and peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, and metal salts. Examples thereof include a system cross-linking agent, a carbodiimide-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, and an amine-based cross-linking agent. As the cross-linking agent, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is suitable. In addition, the cross-linking agent can be used alone or in combination of two or more.

In the present invention, instead of using a cross-linking agent, or while using a cross-linking agent, it is also possible to carry out the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

Other additives can be appropriately added to the adhesive layer 4 as needed. Examples of other additives include fillers, flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, surfactants and the like.

The filler may be either an inorganic filler or an organic filler, but the inorganic filler is preferable. By blending a filler such as an inorganic filler, it is possible to improve the thermal conductivity of the adhesive layer 4 and adjust the elastic modulus. Examples of the inorganic filler include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, and silicon nitride, aluminum, copper, silver, gold, nickel, and chromium. Examples thereof include metals such as lead, tin, zinc, palladium and solder, alloys, and various inorganic powders made of carbon and the like. The filler can be used alone or in combination of two or more. Among them, silica or alumina is preferable as the filler, and molten silica is particularly preferable as the silica. The average particle size of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring device, and in the present application, the particle size when the cumulative volume in the particle size distribution is 50% is referred to as an average particle size.

The blending amount of the filler (particularly the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight. In the case of a functional inorganic filler such as heat conduction or conductivity, it is preferably 10% by weight to 98% by weight.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant can be used alone or in combination of two or more. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. The silane coupling agent can be used alone or in combination of two or more. Examples of the ion trap agent include hydrotalcites, bismuth hydroxide and the like. The ion trap agent can be used alone or in combination of two or more.

The adhesive layer 4 contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler, in particular from the viewpoint of adhesiveness and reliability. It is preferable to do so.

By using the epoxy resin (A), high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. As the curing agent (B), the above-mentioned known curing agent can be used.

(C) Acrylic resin has both flexibility and strength and high toughness. A preferable acrylic resin is obtained by polymerizing a monomer having a Tg (glass transition temperature) of −50 ° C. to 50 ° C. and having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer. Further, if it contains acrylonitrile or the like and exhibits rubber properties, higher toughness can be obtained.
Further, the phenoxy resin (C) has a long molecular chain and a structure similar to that of an epoxy resin, and acts as a flexible material in a composition having a high crosslink density and imparts high toughness, so that it has high strength. However, a toughness composition can be obtained. The preferred phenoxy resin has a main skeleton of bisphenol A type, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed phenoxy resin and brominated phenoxy resin can be mentioned as preferable ones.

Examples of the surface-treated inorganic filler (D) include an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic filler can be used, for example, silica and alumina. The surface treatment with the coupling agent improves the dispersibility of the inorganic filler. Therefore, since an adhesive layer having excellent fluidity can be obtained, the adhesive force with the metal layer 3 can be improved. Further, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, in the surface treatment of an inorganic filler with a silane coupling agent, the hydroxyl group existing on the surface of the inorganic filler and the silane coupling agent are treated by dispersing the inorganic filler in the silane coupling agent solution by a known method. It is carried out by reacting a hydrolyzing group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

The thickness of the adhesive layer 4 is not particularly limited, but from the viewpoint of sufficiently adhering the metal layer and the adherend, 3 μm or more is preferable, 5 μm or more is more preferable, and the thickness of the semiconductor package can be reduced. In order to contribute, it is preferably 150 μm or less, and more preferably 100 μm or less. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25 ° C. and 50% RH. Further, the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is preferably 3 or less.

The loss tangent tan δ is a value when the temperature is raised from 0 ° C. at a temperature rising rate of 5 ° C./min, measured at a measurement frequency of 1 Hz, and reaches 25 ° C. using a dynamic viscoelasticity measuring device.

When the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is 0.4 or more, the adhesive layer 4 can relieve the stress caused by pushing up the pin of the pickup device. Therefore, even if the amount of push-up of the pin is large, it is possible to suppress the occurrence of pin marks on the metal layer 3. When the loss tangent tan δ is 3 or less, good pick-up can be performed without impairing the responsiveness due to the pin pushing up.

In order to increase the loss tangent tan δ, it is preferable to increase the low molecular weight components such as epoxy resin and phenol resin and decrease the high molecular weight components such as acrylic resin. Further, when a filler is blended, the filler blending amount may be reduced.

Further, the adhesive layer 4 has an adhesive force (23 ° C., peeling angle 180 degrees, linear speed 300 mm / min) with the metal layer 3 in the B stage (uncured or semi-cured state) of 0.3 N / 25 mm or more. It is preferably 0.5 N / 25 mm or more, more preferably 1.0 N / 25 mm or more. If the adhesive strength is less than 0.3 N / 25 mm, peeling may occur between the adhesive layer 4 and the metal layer 3 when the individualized sample is expanded.

ここで、ｄはフィルムの密度である。
吸水率が１．５ｖｏｌ％を超えると、吸水した水分によりはんだリフロー時にパッケージクラックを生じるおそれがある。The water absorption rate of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring the water absorption rate is as follows. That is, using an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass is measured. Let's call it M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out, the surface of the sample is wiped off with a filter paper, and the sample is quickly weighed to obtain M2. The water absorption rate is calculated by the following equation (1).

Here, d is the density of the film.
If the water absorption rate exceeds 1.5 vol%, package cracks may occur during solder reflow due to the absorbed water.

ここで、ｄはフィルムの密度である。
飽和吸湿率が１．０ｖｏｌ％を超えると、リフロー時の吸湿により蒸気圧の値が高くなり、良好なリフロー特性が得られないおそれがある。The saturated hygroscopicity of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated hygroscopicity is as follows. That is, using a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured to obtain M1. To do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out and quickly weighed to obtain M2. The saturated hygroscopicity is calculated by the following equation (2).

Here, d is the density of the film.
If the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure becomes high due to the moisture absorption during reflow, and good reflow characteristics may not be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt% or less. The method for measuring the residual volatile components is as follows. That is, an adhesive layer 4 (film adhesive) having a size of 50 × 50 mm was used as a sample, the initial mass of the sample was measured and used as M1, and the sample was heated at 200 ° C. for 2 hours in a hot air circulation constant temperature bath and then weighed. And let it be M2. The residual volatile content is calculated by the following formula (3).
Residual volatile content (wt%) = [(M2-M1) / M1] x 100 (3)
If the residual volatile content exceeds 3.0 wt%, the solvent may be volatilized by heating during packaging, voids may be generated inside the adhesive layer 4, and package cracks may occur.

Further, the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is 0.03 to 0.5 N / 25 mm. Since the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is a radiation-curable adhesive. When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive tape 5 is irradiated with radiation to reduce the adhesive strength, the adhesive strength is the adhesive strength after the irradiation.

The adhesive strength conforms to JIS Z0237, and the adhesive tape 5 cut to a width of 25 mm and the adhesive layer 4 are bonded together in an environment of 23 ° C. and 50% RH, and peeled off using a universal tensile tester. Measure at an angle of 180 ° and a peeling speed of 300 mm / min.

In order to keep the adhesive strength within the above range, the viscoelasticity and surface energy of each of the adhesive layer 52 and the adhesive layer 4 of the adhesive tape 5 may be adjusted, or the combination thereof may be adjusted.

If the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.5 N / 25 mm or less, the push-up speed and the push-up amount of the pin are reduced when the adhesive layer and the metal layer 3 are picked up from the adhesive tape 5. Since it can be picked up even if the force applied to the metal layer is reduced, it is possible to suppress the formation of pin marks on the metal layer 3. When the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.03 N / 25 mm or more, when the metal layer 3 and the adhesive layer 4 are expanded, the metal layer 3 and the adhesive layer 4 are released from the adhesive tape 5. It is held well without peeling.

Next, an example of a method for manufacturing the tape 1 for an electronic device package according to the present embodiment will be described. First, a long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used. Next, as shown in FIG. 4A, the metal layer 3 is bonded to the adhesive surface of the long base material tape 2 using a bonding roller r or the like.

Separately, a long film-like adhesive layer 4 is formed. The adhesive layer 4 can be formed by using a conventional method in which a resin composition is prepared and formed into a film-like layer. Specifically, for example, the resin composition is applied onto an appropriate separator (release paper, etc.) and dried (when thermosetting is required, heat treatment is applied and dried as necessary). Examples thereof include a method of forming the adhesive layer 4. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4B, the adhesive layer 4 peeled off from the separator is bonded onto the metal layer 3 bonded to the base material tape 2 using a bonding roller r or the like.

In the above description, after the metal layer 3 is attached to the base material tape 2, the adhesive layer 4 is attached onto the metal layer 3, but the metal layer 3 and the adhesive layer 4 are attached to each other. After that, the surface on the metal layer 3 side may be attached to the base material tape 2.

Next, as shown in FIG. 4C, the adhesive layer 4 and the metal layer 3 are precut into a predetermined shape (here, a circular shape) using a push-cutting blade or the like, and as shown in FIG. 4D, the periphery is formed. The unnecessary portion 6 of the above is peeled off from the base material tape 2 and removed. The precut is not limited to the above, and the adhesive layer 4 and the metal layer 3 are preliminarily set to a predetermined size such as a size corresponding to the semiconductor chip C by using a lattice-shaped push-cut tooth having a circular outer edge. It may be individualized.

The method of forming the metal layer 3 and the adhesive layer 4 having a predetermined shape on the base material tape 2 is not limited to the above, and the long metal layer 3 is formed into the long base material tape 2. After bonding, punching into a predetermined shape and removing unnecessary portions 6, the adhesive layer 4 formed in the predetermined shape may be bonded onto the metal layer 3 having the predetermined shape, or each of them may have a predetermined shape in advance. The metal layer 3 and the adhesive layer 4 formed in 1 may be bonded to the base material tape 2, but due to the simplicity of the manufacturing process, the metal layer 3 and the adhesive layer 4 are manufactured by the steps shown in FIGS. 4 (A) to 4 (D) described above. Is preferable.

Separately, the adhesive tape 5 is produced. The base film can be formed by a conventionally known film-forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry laminating method. Next, the pressure-sensitive adhesive layer composition is applied onto the base film 51 and dried (by heat-crosslinking if necessary) to form the pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. The pressure-sensitive adhesive layer composition may be directly applied to the base film to form the pressure-sensitive adhesive layer 52 on the base film 51, or the pressure-sensitive adhesive layer composition may be peeled off on the surface thereof. After applying to paper or the like to form the pressure-sensitive adhesive layer 52, the pressure-sensitive adhesive layer may be transferred to the base film 51. As a result, the pressure-sensitive adhesive tape 5 in which the pressure-sensitive adhesive layer 52 is formed on the base film 51 is produced.

After that, as shown in FIG. 5A, the adhesive layer side of the adhesive tape 5 is placed on the surface of the metal layer 3 and the adhesive layer 4 having a predetermined shape provided on the base tape 2 on the adhesive layer 4 side. The adhesive tape 5 is laminated so that the surfaces of 52 are in contact with each other.

Next, as shown in FIG. 5 (B), the adhesive tape 5 is pre-cut into a predetermined shape using a pressing blade or the like, and as shown in FIG. 5 (C), the peripheral unnecessary portion 7 is removed from the base tape 2. By peeling and removing, the tape 1 for the electronic device package is made. After that, the base material tape 2 used for the pre-cut processing may be peeled off, and a known separator may be attached to the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5.

<How to use>
Next, a method of manufacturing the electronic device package 8 using the electronic device package tape 1 of the present embodiment will be described with reference to FIGS. 6 to 8. In the present embodiment, the semiconductor chip C flip-chip connected on the adherend 9 will be described as an example of the electronic device package 8.

[Semiconductor wafer W mounting process]
First, a separate dicing tape D similar to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared, and a semiconductor is provided at the center of the dicing tape D as shown in FIG. 6 (A). The wafer W is attached, and this is adhesively held and fixed (semiconductor wafer W mounting step), and the ring frame R is attached to the peripheral edge of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, or the like). The sticking method is not particularly limited, but a heat-bonding method is preferable. The crimping is usually performed while pressing with a pressing means such as a crimping roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 6B, dicing of the semiconductor wafer W is performed. As a result, the semiconductor wafer W is cut into a predetermined size and individualized (small pieces) to manufacture the semiconductor chip C. Dicing is performed, for example, from the circuit surface side of the semiconductor wafer W according to a conventional method. Further, in this step, for example, a cutting method called a full cut that cuts up to the dicing tape D can be adopted. The dicing apparatus used in this step is not particularly limited, and conventionally known dicing apparatus can be used. When expanding the dicing tape D, the expansion can be performed using a conventionally known expanding device.

[Semiconductor chip C pickup process]
As shown in FIG. 6C, the semiconductor chip C is picked up and the semiconductor chip C is peeled off from the dicing tape D. The pickup method is not particularly limited, and various conventionally known methods can be adopted. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed on the stage S of the pickup device with the base film side facing down, and the ring frame R is fixed in a hollow cylindrical shape. The push-up member T is raised to expand the dicing tape D. In this state, a method in which each semiconductor chip C is pushed up from the base film side of the dicing tape D by a pin N and the pushed-up semiconductor chip C is picked up by a pickup device and the like can be mentioned.

[Flip chip connection process]
As shown in FIG. 6D, the picked up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is always attached to the adherend 9 in a form in which the circuit surface (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, etc.) of the semiconductor chip C faces the adherend 9. Fix according to the law. For example, first, the flux is attached to the bump 10 as the connecting portion formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 of the semiconductor chip C is brought into contact with and pressed against the conductive material 11 (solder or the like) for joining attached to the connection pad of the adherend 9, and the bump 10 and the conductive material 11 are melted. The electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance thereof is generally about 30 μm to 300 μm. The flux remaining on the facing surface and the gap between the semiconductor chip C and the adherend 9 is washed and removed.

As the adherend 9, various substrates such as a lead frame and a circuit board (wiring circuit board, etc.) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, a polyimide substrate and the like. Further, a chip-on-chip structure can be obtained by using another semiconductor chip as an adherend 9 and connecting the semiconductor chip C with a flip chip.

Next, as shown in FIG. 7A, the base material tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive tape 5. The peripheral edge of the pressure-sensitive adhesive layer 52 is fixed to the ring frame R.

Next, as shown in FIG. 7B, the metal layer 3 and the adhesive layer 4 are cut into pieces having a size corresponding to the semiconductor chip C. The cutting can be performed in the same process as the dicing process of the semiconductor wafer W described above. If the metal layer 3 and the adhesive layer 4 have been pre-cut in advance, this step is not performed.

Next, as shown in FIG. 7C, the individualized metal layer 3 and the adhesive layer 4 are picked up and peeled off from the adhesive tape 5. The pickup can be performed in the same process as the above-mentioned pickup process of the semiconductor chip C.

Next, as shown in FIG. 8, the picked-up metal layer 3 and the adhesive layer 4 side of the adhesive layer 4 are bonded to the back surface of the semiconductor chip C connected to the flip chip. After that, a sealing material (sealing resin or the like) is filled in the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 to seal the semiconductor chip C. Sealing is performed according to a conventional method. At this time, since the metal layer 3 is provided on the back surface of the semiconductor chip C, the warp caused by the difference in the coefficient of thermal expansion between the semiconductor chip C and the adherend 9 in the flip chip bonding step is caused by the difference between the semiconductor chip C and the metal layer. It is offset by the difference in the coefficient of thermal expansion from 3. Further, since the metal layer 3 is provided on the back surface of the semiconductor chip C, heat generated during use as an electronic device is dissipated by the metal layer 3.

In the above description, the package structure in which the metal layer 3 is directly provided on the back surface of the semiconductor chip C via the adhesive layer 4 and the metal layer 3 is also sealed together with the semiconductor chip C has been described, but the semiconductor chip C is sealed. After that, the metal layer 3 may be provided on the upper surface of the sealing body via the adhesive layer 4. Since the electronic device package 8 also warps during sealing, the warpage at the time of sealing can be offset by providing the metal layer 3 on the upper surface of the sealed body.

In the above description, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example of the electronic device package 8, but the present invention is not limited to this, and for example, the same size on the semiconductor chip. In an electronic device package structure in which other semiconductor chips are laminated, in order to use the metal layer 3 of the electronic device package tape 1 of the present invention as a spacer between the two chips, the lower semiconductor chip is interposed via the adhesive layer 4. A metal layer 3 may be provided on the metal layer 3.

<Example>
Next, in order to further clarify the effect of the present invention, Examples and Comparative Examples will be described in detail, but the present invention is not limited to these Examples.

(1) Preparation of Adhesive Tape <Adhesive Layer Composition (1)>
A copolymer composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid as an acrylic copolymer (A1) having a functional group, having a ratio of 2-ethylhexyl acrylate of 80 mol% and a mass average molecular weight of 700,000. Was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 15, and an acrylic copolymer (a-) having a glass transition temperature of −70 ° C., a hydroxyl value of 20 mgKOH / g, and an acid value of 5 mgKOH / g was added. 1) was prepared.

To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of Coronate L (manufactured by Toso Co., Ltd.) was added as a polyisocyanate, and 3 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. The partially added mixture was dissolved in ethyl acetate and stirred to obtain the pressure-sensitive adhesive layer composition (1).

<Adhesive layer composition (2)>
The acrylic copolymer (A1) having a functional group is composed of butyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, the ratio of 2-ethylhexyl acrylate is 50 mol%, and the mass average molecular weight is 65. An acrylic copolymer (a-2) having a glass transition temperature of −60 ° C., a hydroxyl value of 25 mgKOH / g, and an acid value of 6 mgKOH / g was prepared.

A mixture of 100 parts by mass of the acrylic copolymer (a-2) and 10 parts by mass of coronate L (manufactured by Tosoh Corporation) as a polyisocyanate is dissolved in ethyl acetate and stirred to form a pressure-sensitive adhesive layer. I got the thing (2).

<Adhesive layer composition (3)>
A mixture of 100 parts by mass of the acrylic copolymer (a-2) and 8 parts by mass of coronate L (manufactured by Tosoh Corporation) as a polyisocyanate is dissolved in ethyl acetate and stirred to form a pressure-sensitive adhesive layer. I got the thing (3).

The following was prepared as a base film.
<Base film (1)>
Resin beads of a mixture of polypropylene PP and thermoplastic elastomer HSBR (PP: HSBR = 80: 20) are melted at 200 ° C. and molded into a long film having a thickness of 80 μm using an extruder to form a base film (1). ) Was prepared. As the polypropylene PP, F-300SP (trade name) manufactured by Idemitsu Petrochemical Co., Ltd. was used, and as the thermoplastic elastomer HSBR, Dynalon 1320P (trade name) manufactured by JSR Corporation was used.

<Adhesive tape (1)>
The pressure-sensitive adhesive layer composition (1) is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and the pressure-sensitive adhesive is dried at 110 ° C. for 3 minutes. After forming a layer, it was bonded to the base film (1) to prepare an adhesive tape (1).

<Adhesive tape (2)>
An adhesive tape (2) was produced in the same manner as the adhesive tape (1) except that the adhesive layer composition (2) was used.

<Adhesive tape (3)>
An adhesive tape (3) was produced in the same manner as the adhesive tape (1) except that the adhesive layer composition (3) was used.

(2) Preparation of adhesive layer

<Adhesive layer (1)>
80 parts by mass of acrylic resin (manufactured by Nagase Chemtex Co., Ltd., trade name "Taisan Resin SG-P3", Mw 850,000, Tg 12 ° C.) and naphthalene type epoxy resin (manufactured by DIC Corporation, trade name "HP-4700") 10 An adhesive layer composition solution was prepared by dissolving 10 parts by mass and 10 parts by mass of a phenol resin (manufactured by Meiwa Kasei Co., Ltd., trade name "MEH7851") as a curing agent in methyl ethyl ketone. This adhesive layer composition solution was applied on a release-treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm treated with silicone, and then dried at 130 ° C. for 5 minutes. As a result, an adhesive layer (1) having a thickness of 20 μm was prepared.

<Adhesive layer (2)>
Bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumitomo Metal Corporation, trade name "YP-50S", Mw 60,000, Tg 84 ° C) 100 parts by mass and cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name "EOCN-" 1020 ”, epoxy equivalent 198, softening point 64 ° C) 40 parts by mass, liquid bisphenol A type epoxy resin (Nippon Steel & Sumitomo Metal Chemical Co., Ltd., trade name“ YD-128 ”, Mw400, epoxy equivalent 190) 100 parts by mass, as a curing agent Imidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name "2PHZ-PW") 1.5 parts by mass, silica filler (manufactured by Admatex Co., Ltd., trade name "SO-C2", average particle size 0.5 μm) 20 mass The parts were dissolved or dispersed in methyl ethyl ketone to prepare an adhesive layer composition solution. Using this adhesive layer composition solution, an adhesive layer (2) having a thickness of 20 μm was prepared in the same manner as the adhesive layer (1).

The following metal layers were prepared.
<Metal layer (1)>
F3-WS (Furukawa Electric, copper foil, thickness 12 μm, surface roughness RzJIS 2.8 μm)
<Metal layer (2)>
GTS (Furukawa Electric, copper foil, thickness 9 μm, surface roughness RzJIS 6.0 μm)
<Metal layer (3)>
1085 (UACJ, aluminum foil, thickness 20 μm, surface roughness RzJIS 1.9 μm)
<Metal layer (4)>
1085 (UACJ, aluminum foil, thickness 20 μm, surface roughness RzJIS 4.9 μm)
<Metal layer (5)>
SUS304 (Nippon Steel & Sumikin Materials, Stainless Steel Foil, Thickness 20 μm, Surface Roughness RzJIS2.1um)
<Metal layers (6) to (11)>
After degreasing and pickling an electrolytic copper foil having a thickness of 35 μm, a glossiness of the M surface of 230%, and a glossiness of the S surface of 100%, roughening treatment and PR pulse under the conditions shown in Tables 1 and 2 below. The metal layers (6) to (11) were prepared by electrolysis and alkali dipping treatment.
In the metal layers (1) to (11), the surface roughness RzJIS is the surface roughness RzJIS based on the ten-point average roughness of the surfaces that are not bonded to the adhesive layer of the metal layer. Further, the glossiness of the metal layers (6) to (11) was measured in accordance with JIS Z 8741 using a glossiness meter Handy Gloss Meter PG-1 manufactured by Nippon Denshoku Co., Ltd. This is the mirror glossiness at an incident angle of 60 degrees on the surface that is not bonded.

(5) Preparation of Tape for Electronic Device Package <Example 1>
The adhesive layer (1) and the metal layer (1) formed on the above-mentioned release liner were bonded together under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s to prepare a single-sided adhesive film. The adhesive tape (1) was pre-cut into a circular shape so that it could be attached to the ring frame, and the single-sided adhesive film was precut into a circular shape smaller than the adhesive tape (1). The adhesive layer (1) side exposed by peeling off the release-treated film of the single-sided adhesive film and the adhesive layer of the adhesive tape (1) are exposed so that the adhesive layer is exposed around the single-sided adhesive film. To produce an electronic device package tape according to Example 1 as shown in FIG.

<Examples 2 to 12, Comparative Example 1>
For electronic device packages of Examples 2 to 12 and Comparative Example 1 by the same method as in Example 1 except that the combination of the adhesive tape, the adhesive layer composition, and the metal layer is the combination shown in Tables 3 and 4. A tape was made.

The following measurements and evaluations were performed on the tapes for electronic device packaging according to Examples 1 to 12 and Comparative Example 1. The results are shown in Tables 3 and 4.

(Adhesive strength between adhesive tape and adhesive layer)
The adhesive layer according to each example and comparative example is peeled off from the release liner, and a shape-retaining tape (manufactured by Sekisui Chemical Industry Co., Ltd., trade name "Forte") is attached to the surface of the adhesive layer with a 2 kg roller to 25 mm. It was cut into strips of width to prepare a test piece in which a base film, an adhesive layer, an adhesive layer, and a shape-retaining tape were laminated in this order. Among the prepared test pieces, Examples 1, 3, 4 and 7 to 12 were irradiated with ultraviolet rays at 200 mJ / cm ² by an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 100 mm). After that, a strograph (trade name "VE10") manufactured by Toyo Seiki Seisakusho Co., Ltd. was used to separately grasp the laminated body of "base film and adhesive layer" and the laminated body of "adhesive layer and shape-retaining tape". The adhesive strength between the adhesive layer and the adhesive layer was measured at a linear velocity of 300 mm / min. The unit of adhesive strength is [N / 25 mm]. The measurement was carried out by a 180 ° peeling method, the measurement temperature was 23 ° C., and the measurement humidity was 50%. Further, the laminate of the "base film and the pressure-sensitive adhesive layer" and the laminate of the "adhesive layer and the shape-retaining tape" are separated from the "base film and the pressure-sensitive adhesive layer" to the "adhesive layer and shape-retaining". The reason why the "tape" is peeled off is that if only the adhesive layer is grasped and peeled off, the adhesive layer may be stretched.

(Loss tangent tan δ of adhesive layer)
The adhesive layers according to each Example and Comparative Example were cut into a size of 5.0 cm × 5.0 cm, laminated, and bonded on a hot plate at a stage of 70 ° C. with a hand roller to obtain a thickness of about 1. A test piece having a size of 0 mm was obtained. This test piece was heated in a temperature range of 10 to 150 ° C. and a heating rate of 5 ° C./min using a rheometer manufactured by Haake (trade name “RS6000”), and a loss tangent tan δ at 25 ° C. was determined. The measurement was performed at 50% RH and a measurement frequency of 1 Hz.

(Recognition)
The metal layer and the adhesive layer of the tape for electronic device packaging of each of the above-mentioned Examples and Comparative Examples were separated into samples having a size of 5 mm × 5 mm. Then, the pressure-sensitive adhesive layer was irradiated with ^{ultraviolet rays at 200 mJ / cm 2} from the base film side with an air-cooled high-pressure mercury lamp (80 W / cm, irradiation distance 10 cm). For 100 individual sample samples in the center of the tape for electronic device packaging, individualized samples can be recognized in the same way as silicon wafer chips by using a die spiker device (trade name "CAP-300II") manufactured by Canon Machinery Co., Ltd. I confirmed. Those that are recognized as chips are evaluated as good products, those that are recognized as chips by changing the irradiation angle or irradiation amount are evaluated as acceptable products, and those that are not recognized are evaluated as defective products. did. The results are shown in Tables 3 and 4.

(Pickup property)
After the above recognition test, a pickup test was performed on 250 of the above individual samples under the following pickup conditions, and the height (pin height) of the pins that could be picked up by 200 or more samples was calculated. The upper limit of the pin height was set to 400 μm. The results are shown in Tables 3 and 4. Since the adhesive strength between the adhesive tape and the adhesive layer of the tape for electronic device packaging according to Example 6 was too high to pick up individual samples under the present test conditions, the pin height could be calculated. could not. However, there is no problem because the individualized sample can be recognized and can be picked up if the pin height is set higher than 400 μm. If the pin height is high, pin marks may be generated on the metal layer. However, if pin marks are generated, the metal layer is pressed to press the pin when the metal layer and the adhesive layer are bonded to the back surface of the semiconductor chip. It is good to flatten the marks. Further, the child device package tape according to Comparative Example 1 could not recognize the individual sample and could not be picked up, so that the pin height could not be calculated.
<Pickup conditions>
Pickup device: CAP-300II manufactured by Canon Machinery Co., Ltd.
Push-up pin shape: radius 0.7 mm, tip radius of curvature R = 0.25 mm, tip θ = 15
Pin push-up speed: 50 mm / sec

As shown in Tables 3 and 4, the tapes for electronic device packaging according to Examples 1 to 12 have a surface roughness RzJIS of less than 5.0 μm due to the ten-point average roughness of the surface opposite to the adhesive layer of the metal layer. Therefore, good results were obtained in the recognition evaluation. As shown in Table 4, the tape for electronic device packaging according to Example 8 has a mirror glossiness of 117% at an incident angle of 60 degrees of the metal layer, so it is necessary to change the light irradiation angle and irradiation amount. However, after adjusting the irradiation angle and amount, the individualized sample could be recognized, which is within the permissible range.

On the other hand, the tape for electronic device packaging according to Comparative Example 1 has a surface roughness RzJIS of 6.0 μm due to the ten-point average roughness of the surface opposite to the adhesive layer of the metal layer, so that the recognition is evaluated. The result was inferior.

1: Electronic device package tape 2: Base material tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label part 5b: Peripheral part

Claims (7)

An adhesive tape having a base film and an adhesive layer,
An adhesive layer laminated on the opposite side of the pressure-sensitive adhesive layer to the base film,
It has a metal layer laminated on the opposite side of the adhesive layer to the adhesive layer, and has a metal layer.
The metal layer is a tape for electronic device packaging, characterized in that the surface roughness RzJIS due to the ten-point average roughness of the surface opposite to the adhesive layer is less than 5.0 μm. The tape for an electronic device package according to claim 1, wherein the metal layer has a mirror glossiness of less than 100% at an incident angle of 60 degrees. The tape for an electronic device package according to claim 1 or 2, wherein the metal layer has a thickness of 5 μm or more and less than 200 μm. Claim 1 is characterized in that the adhesive strength between the adhesive tape and the adhesive layer in a state where the adhesive layer and the metal layer are picked up from the adhesive tape is 0.03 to 0.5 N / 25 mm. The tape for an electronic device package according to any one of claims 3. The tape for an electronic device package according to any one of claims 1 to 4, wherein the metal layer contains copper or aluminum. From claim 1, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. The tape for an electronic device package according to any one of claim 5. The pressure-sensitive adhesive layer _{contains an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reactivity in the molecule. The tape for an electronic device package according to any one of claims 1 to 6, which contains an acrylic polymer composed of an isocyanate compound having a carbon-carbon double bond.

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