JP6935379B2 - Electronic device packaging tape - Google Patents

Description

The present invention relates to a tape for an electronic device package, and more particularly to a tape for an electronic device package having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs are required to be further thinned and miniaturized. Therefore, in order to make electronic device packages such as semiconductor packages mounted on electronic devices thinner and smaller, the number of electrodes of electronic devices and circuit boards is increased, and the pitch is also narrowed. Such electronic device packages include, for example, flip chip (FC) mounting packages.

In the flip chip mounting package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in the amount of heat generated is a problem. Therefore, as a heat dissipation structure of the flip chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

Further, in the flip chip mounting package, the coefficient of linear expansion of the electronic device and the coefficient of linear expansion of the circuit board may be significantly different. In this case, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, a difference in the amount of expansion and contraction occurs between the electronic device and the circuit board. This difference causes the electronic device package to warp. As a structure for suppressing such warpage, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 2).

Further, in a flip chip mounting package, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). .. Patent Document 3 discloses an electronic device package in which the plane size of the electronic device and the plane size of the metal layer and the adhesive layer are the same.

Further, in recent years, there is a case where another semiconductor chip of the same size is further laminated on the semiconductor chip to perform three-dimensional mounting. Here, in order to enable stacking of other semiconductor chips of the same size on the semiconductor chip, it is necessary to stack a spacer between the two. This is because other semiconductor chips are laminated on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (see, for example, Patent Document 4). In Patent Document 4, the spacer is a step of bonding a spacer adhesive sheet having a metal layer having an adhesive layer on at least one surface to a dicing sheet with the adhesive layer as a bonding surface, and a spacer adhesive sheet. To form a chip-shaped spacer with an adhesive layer by dicing, and a pickup used when the spacer is pushed up by a pin and the pushed-up spacer is peeled off from the dicing sheet together with the adhesive layer. It is described that the device is provided by a step of peeling from the dicing sheet together with the adhesive layer and a step of fixing the spacer to the adherend via the adhesive layer.

Japanese Unexamined Patent Publication No. 2007-23502 Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

In Patent Document 4, a spacer adhesive sheet having a metal layer provided with an adhesive layer is attached to a dying sheet with the adhesive layer as a bonding surface, and the spacer adhesive sheet is died to form an adhesive layer. It is described that after forming the provided chip-shaped spacer, the chip-shaped spacer is peeled off from the dicing sheet together with the adhesive layer, but the adhesive layer and the metal layer are pre-cut and separated. It's convenient.

When the adhesive layer and the metal layer are cut in advance and separated into individual pieces, it is usually considered to cut them using push-cut teeth. However, when cut using push-cut teeth, the metal layer is warped, and when the metal layer is attached to an electronic device such as a semiconductor chip via the adhesive layer and the adhesive layer is cured, the adhesive layer is formed. There was a problem that it may be peeled off from the electronic device.

Therefore, the present invention reduces the peeling of the adhesive layer from the electronic device when the metal layer is attached to an electronic device such as a semiconductor chip via the adhesive layer and the adhesive layer is cured. It is an object of the present invention to provide a tape for an electronic device package which can be used.

In order to solve the above problems, the tape for electronic device packaging according to the present invention is provided by laminating an adhesive tape having a base film and an adhesive layer on the opposite side of the pressure-sensitive adhesive layer to the base film. It has a laminate of the adhesive layer and the metal layer, and the adhesive layer and the metal layer are individualized to a size corresponding to an electronic device, and the individualized metal layer is obtained. The amount of warpage is 0.03 mm or less.

The tape for electronic device packaging preferably has a loss tangent of 0.4 or more at 25 ° C. and 50% RH of the adhesive layer.

The electronic device packaging tape preferably has a protrusion having a length of less than 10 μm protruding from the outer edge of the individualized metal layer.

Further, in the tape for electronic device packaging, it is preferable that the metal layer contains copper or aluminum.

Further, in the tape for electronic device packaging, the adhesive layer contains (A) epoxy resin, (B) curing agent, (C) acrylic resin or phenoxy resin, and (D) surface-treated inorganic filler. It is preferable to do so.

Further, in the above-mentioned tape for electronic device packaging, the pressure-sensitive adhesive layer is _{an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group. It is preferable to contain an acrylic polymer composed of a containing monomer and an isocyanate compound having a radically reactive carbon-carbon double bond in the molecule.

According to the present invention, when a metal layer is attached to an electronic device such as a semiconductor chip via an adhesive layer and the adhesive layer is cured, the adhesive layer is reduced from peeling from the electronic device. can do.

It is sectional drawing which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. (A) is a plan view schematically showing the structure of the tape for electronic device packaging according to the embodiment of the present invention, and (b) is a cross-sectional view of the same. It is a perspective view which shows typically the structure of the tape for electronic device package which concerns on embodiment of this invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the longitudinal sectional view which shows the bonding process of a metal layer, (B) is an adhesive. It is a longitudinal sectional view which shows the layer bonding process, (C) is a lateral sectional view which shows a precut process, and (D) is a perspective view which shows the removal process of an unnecessary part. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the longitudinal sectional view which shows the bonding process of the protective tape 20, (B) pressurization. It is a sectional view in the longitudinal direction which shows the processing process. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device package which concerns on embodiment of this invention, (A) is the short side sectional view which shows the bonding process of adhesive tape, (B) is precut. It is a short side sectional view which shows the process, and (C) is a short side sectional view which shows the removal process of an unnecessary part. It is sectional drawing which schematically explains the usage method of the tape for electronic device packaging which concerns on embodiment of this invention. It is sectional drawing which schematically explains the usage method of the tape for electronic device packaging which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device package which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is a cross-sectional view showing a tape 1 for an electronic device package according to an embodiment of the present invention. The electronic device package tape 1 has an adhesive tape 5 composed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer is placed on the adhesive layer 52. 4 and a metal layer 3 provided by being laminated on the adhesive layer 4 are provided. The metal layer 3 may be indirectly provided on the adhesive layer 4 via a primer layer or the like for improving the adhesion with the adhesive layer 4.

In the electronic device package tape 1 of the present invention, as shown in FIGS. 2 and 3, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 8), and the metal layer 3 and the adhesive layer are formed. No. 4 is also cut (pre-cut) into a predetermined shape corresponding to this.

As shown in FIGS. 2 and 3, the tape 1 for an electronic device package of the present invention has an adhesive tape 5 (label portion 5a) cut into a shape corresponding to a metal layer 3, an adhesive layer 4, and a ring frame R. It is preferable that the long base material tape 2 on which a plurality of laminated bodies are formed is wound in a roll shape, and in the present embodiment, the base material is wound in a roll shape. The laminates provided on the tape 2 may be cut one by one.

When pre-cut and wound into a roll, as shown in FIGS. 2 and 3, the electronic device package tape 1 has a base tape 2, and a metal is placed on the base tape 2. The layer 3 and the adhesive layer 4 provided by laminating the metal layer 3 on the side opposite to the base tape 2 side of the metal layer 3 and the adhesive layer 4 are covered and around the adhesive layer 4. An adhesive tape 5 having a predetermined flat-shaped label portion 5a provided in contact with the base material tape 2 and a peripheral portion 5b surrounding the outside of the label portion 5a is provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably a similar shape having substantially the same shape as the inside of the ring frame R and larger than the size of the inside of the ring frame R. Further, it does not necessarily have to be circular, but a shape close to circular is preferable, and circular shape is more preferable. The peripheral portion 5b includes a form that completely surrounds the outside of the label portion 5a and a form that does not completely surround the label portion 5a as shown in the figure. The peripheral portion 5b may not be provided.

The metal layer 3 and the adhesive layer 4 are pre-cut and individualized to a size corresponding to the plane of the electronic device to which the metal layer 3 and the adhesive layer 4 are planned to be bonded. The individualized metal layer 3 has a warp amount of 0.03 mm or less. Here, the amount of warpage is a value obtained by measuring the difference between the height (thickness) of one end portion of the individualized metal layer 3 and the height (thickness) of a portion 500 μm inside from the end portion. The amount of warpage can be measured, for example, by observing from the metal layer 3 side with a measuring microscope MF-J4020D manufactured by Mitutoyo Co., Ltd.

If the amount of warpage exceeds 0.03 mm, the probability that the adhesive layer will peel off from the electronic device when the metal layer is attached to an electronic device such as a semiconductor chip via the adhesive layer and the adhesive layer is cured. Will be higher.

The individualized metal layer 3 preferably has a protrusion having a length of less than 10 μm protruding from its outer edge. The protrusions are linear protrusions and burr-like protrusions having a width of 20 to 30 μm or less extending from the outer edge of the metal layer 3, which are confirmed when the metal layer 3 is observed with an optical microscope. The linear protrusions and the burr-like protrusions are generated, for example, when the metal layer 3 is diced with a blade when the metal layer 3 is separated into individual pieces.
If the length of the protrusion is 10 μm or more, it may cause problems such as contamination due to adhesion to the surface of the electronic device, poor bonding, and short circuit due to contact with an adjacent chip.

In the adhesive layer 4, the entire surface on which the individual pieces are arranged has a predetermined label shape. In this embodiment, the label shape is rectangular as shown in FIGS. 2 (A), 3 and 4 (D), and the ring frame R is formed on the peripheral edge of the label portion 5a of the adhesive tape 5. The shape is smaller than that of the label portion 5a so that it can be pushed up by the push-up member of the pickup device (see FIG. 7B).

The entire surface of the metal layer 3 in which the individual pieces are arranged has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. In the lamination referred to here, it is sufficient that the main parts are laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have the same size, but from the convenience of manufacturing, they may have substantially the same shape. preferable. Each component will be described below.

<Base tape 2>
The base material tape 2 can be composed of a known separator, but the base material tape used for the pre-cut processing of the tape for electronic device packaging can also be used as it is. When the base material tape used for the precut processing of the tape for electronic device packaging is used as it is, the base material tape 2 needs to adhesively hold the metal layer 3 at the time of the precut processing. Therefore, for example, on one side of the resin film and the resin film. A tape having the provided pressure-sensitive adhesive layer for the base material tape can be preferably used.

A known material can be used as the material of the resin film constituting the base material tape 2, but for example, polyester (PET, PBT, PEN, PBN, PTT) type, polyolefin (PP, PE). Examples thereof include systems, copolymer (EVA, EEA, EBA) systems, and films in which these materials are partially substituted to further improve adhesiveness and mechanical strength. Further, it may be a laminate of these films. From the viewpoint of heat resistance, smoothness, and availability, it is preferable to select from polyethylene terephthalate, polypropylene, and polyethylene.

The thickness of the resin film constituting the base material tape 2 is not particularly limited and may be set as appropriate, but is preferably 10 to 150 μm.

As the resin used for the pressure-sensitive adhesive layer for the base material tape, known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive can be used. An acrylic pressure-sensitive adhesive using a polymer as a base polymer is preferable.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all have the same meaning as the (meth) of the present invention.

The acrylic polymer contains a unit corresponding to the (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, etc. You may. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate , (Meta) acrylate 8-hydroxyoctyl, (meth) acrylate 10-hydroxydecyl, (meth) acrylate 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate and other hydroxyl group-containing monomers; Sulfuric acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphoric acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or two or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer for the base material tape preferably has a composition in which the content of low molecular weight substances is suppressed, and from this point of view, it is preferable that the pressure-sensitive adhesive layer contains an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million as a main component. Therefore, the pressure-sensitive adhesive may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer for the base material tape and improve the peelability from the pressure-sensitive adhesive tape 5, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, etc. A method of cross-linking with an appropriate external cross-linking agent such as a metal chelate compound, an amino resin compound, or a peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds to generate energy rays. It is possible to adopt an appropriate method such as a method of cross-linking by irradiating the compound. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for the base material tape is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Further, the pressure-sensitive adhesive layer for the base material tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
The adhesive tape 5 is not particularly limited, and a conventional dicing tape can be used. As the adhesive tape 5, for example, a base film 51 provided with an adhesive layer 52 can be preferably used.

The base film 51 can be used without particular limitation as long as it is conventionally known, but when a radiation-curable material is used as the pressure-sensitive adhesive layer 52 described later, it has radiation permeability. It is preferable to use one.

For example, the materials thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-acrylic. Monopolymers or copolymers of α-olefins such as methyl acid copolymers, ethylene-acrylic acid copolymers, ionomers or mixtures thereof, polyurethanes, styrene-ethylene-butene or penten-based copolymers, polyamide-polypolymers. Thermoplastic elastomers such as copolymers and mixtures thereof can be listed. Further, the base film may be a mixture of two or more kinds of materials selected from these groups, or may be a single layer or a multi-layered film.

The thickness of the base film 51 is not particularly limited and may be set as appropriate, but it is preferably 50 to 200 μm in consideration of the expanding step at the time of picking up.

In order to improve the adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is chemically or physically treated with chromic acid, ozone, flame, high piezoelectric, ionizing radiation, etc. Target surface treatment may be applied.

Further, in the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51, but a primer layer, an anchor layer, a stress relaxation layer, an antistatic layer, etc. for improving adhesion are provided. It may be provided indirectly via.

The resin used for the pressure-sensitive adhesive layer 52 of the pressure-sensitive adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin and the like used for the pressure-sensitive adhesive are used. Although it can be used, an acrylic pressure-sensitive adhesive based on an acrylic polymer is preferable in order to control the adhesive strength suitable for suppressing the formation of pin marks on the metal layer.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Alkyl groups such as octadecyl esters and eicosyl esters have 1 to 30 carbon atoms, especially linear or branched alkyl esters having 4 to 18 carbon atoms) and (meth) acrylic acid cycloalkyl esters (eg, cyclopentyl esters). , Cyclohexyl ester, etc.), or an acrylic polymer using one or more of them as a monomer component. The (meth) acrylic acid ester means an acrylic acid ester and / or a methacrylic acid ester, and all have the same meaning as the (meth) of the present invention.

The acrylic polymer is a unit corresponding to the above-mentioned (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, crosslinkability and the like. May include. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride. , Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate , (Meta) acrylate 8-hydroxyoctyl, (meth) acrylate 10-hydroxydecyl, (meth) acrylate 12-hydroxylauryl, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate and other hydroxyl group-containing monomers; Sulfuric acid groups such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalene sulfonic acid. Containing monomer; Phosphoric acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like can be mentioned. One or two or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low molecular weight substances is suppressed, and from this point of view, it is preferable that the pressure-sensitive adhesive layer 52 is mainly composed of an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3 million. The agent may be an appropriate cross-linking type by an internal cross-linking method, an external cross-linking method, or the like.

Further, in order to control the crosslink density of the pressure-sensitive adhesive layer 52 and improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, and an amino resin compound. A method of cross-linking with a compound or an appropriate external cross-linking agent such as peroxide, or a method of mixing low molecular weight compounds having two or more carbon-carbon double bonds and cross-linking by irradiation with energy rays or the like. Etc., an appropriate method can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferably blended in an amount of about 20 parts by weight or less, more preferably 0.1 parts by weight to 20 parts by weight, based on 100 parts by weight of the base polymer. In addition to the above-mentioned components, various tackifiers, antiaging agents, and other additives may be used as the pressure-sensitive adhesive, if necessary, from the viewpoint of preventing deterioration and the like.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation-curable pressure-sensitive adhesive is suitable. Examples of the radiation-curable pressure-sensitive adhesive include an additive-type radiation-curable pressure-sensitive adhesive in which a radiation-curable monomer component and a radiation-curable oligomer component are mixed with the above-mentioned pressure-sensitive adhesive.

Examples of the radiation-curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaeristol tetra (). Examples thereof include meta) acrylate, dipentaeristol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. These monomer components can be used alone or in combination of two or more.

Examples of the radiation-curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The amount of the radiation-curable monomer component or oligomer component to be blended can be appropriately determined according to the type of the pressure-sensitive adhesive layer 52 so that the adhesive strength of the pressure-sensitive adhesive layer 52 can be reduced. Generally, it is, for example, about 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of a base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

As the radiation-curable pressure-sensitive adhesive, in addition to the addition-type radiation-curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the end of the main chain was used. Also included is an intrinsic radiation curable adhesive. Since the intrinsic radiation-curable pressure-sensitive adhesive does not need to contain the oligomer component, which is a small molecule component, or does not contain a large amount, the oligomer component, etc. does not move in the pressure-sensitive adhesive over time and is stable. It is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

As the base polymer having a carbon-carbon double bond, a base polymer having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, one having an acrylic polymer as a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the above-exemplified acrylic polymers.

The method for introducing a carbon-carbon double bond into an acrylic polymer is not particularly limited, and various methods can be adopted, but it is easy to introduce a carbon-carbon double bond into a polymer side chain in terms of molecular design. be. For example, after copolymerizing a monomer having a functional group with an acrylic polymer in advance, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is subjected to radiation curability of the carbon-carbon double bond. A method of condensing or adding reaction while maintaining the above can be mentioned.

Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group, and the like. Among these combinations of functional groups, the combination of a hydroxyl group and an isocyanate group is preferable because of the ease of tracking the reaction. Further, as long as the combination of these functional groups produces an acrylic polymer having the carbon-carbon double bond, the functional group may be on either side of the acrylic polymer or the compound. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloylisocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzylisocyanate and the like. Further, as the acrylic polymer, one obtained by copolymerizing the above-exemplified hydroxy group-containing monomer, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, ether compound of diethylene glucol monovinyl ether and the like is used.

In the intrinsic type radiation-curable pressure-sensitive adhesive, the base polymer having a carbon-carbon double bond (particularly an acrylic polymer) can be used alone, but the radiation-curable monomer component is not deteriorated to the extent that the properties are not deteriorated. It is also possible to blend a photopolymerizable compound such as an oligomer component or an oligomer component. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably in the range of 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

The radiation-curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when it is cured by ultraviolet rays or the like.

Among the above-mentioned acrylic polymers, in particular _{, an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and intramolecules. An acrylic polymer A composed of an isocyanate compound having a radically reactive carbon-carbon double bond is preferable.

If the alkyl group of the acrylic acid alkyl ester has less than 4 carbon atoms, the polarity may be high and the peeling force may be too large to reduce the pick-up property. On the other hand, when the number of carbon atoms of the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature deteriorate. As a result, the metal layer during dicing Peeling of 3 may occur.

The acrylic polymer A may contain units corresponding to other monomer components, if necessary.

In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a structure in which a double bond-containing isocyanate compound is added to a polymer composed of a monomer composition such as the acrylic acid ester or a hydroxyl group-containing monomer. Therefore, it is preferable that the acrylic polymer has a radical-reactive carbon-carbon double bond in its molecular structure. As a result, the active energy ray-curable pressure-sensitive adhesive layer (ultraviolet-curable pressure-sensitive adhesive layer, etc.) that is cured by irradiation with active energy rays (ultraviolet rays, etc.) can be formed, and the peeling force between the metal layer 3 and the pressure-sensitive adhesive layer 52 can be obtained. Can be reduced.

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like. The double bond-containing isocyanate compound can be used alone or in combination of two or more.

Further, in the active energy ray-curable pressure-sensitive adhesive, an external cross-linking agent can be appropriately used in order to adjust the adhesive strength before irradiation with active energy rays and the adhesive strength after irradiation with active energy rays. Specific means of the external cross-linking method include a method of adding a so-called cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, and a melamine-based cross-linking agent to cause a reaction.

Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone. Alicyclic polyisocyanates such as diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane Aromatic polyisocyanates such as diisocyanate and xylylene diisocyanate can be mentioned, and in addition, trimethylolpropane / trilylene diisocyanate trimer adduct [manufactured by Toso Co., Ltd., trade name "Coronate L"], trimethylolpropane / hexa. Methylene diisocyanate trimeric adduct [manufactured by Toso Co., Ltd., trade name "Coronate HL"] and the like are also used. Examples of the epoxy compound include N, N, N', N'-tetraglycidyl-m-xylene diamine, diglycidyl aniline, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, 1, 6-Hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta Ellisritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, Examples thereof include resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule.

When an external cross-linking agent is used, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. The amount of the external cross-linking agent used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) with respect to 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may contain, if necessary, various conventionally known additives such as a pressure-imparting agent, an anti-aging agent, and a foaming agent, in addition to the above-mentioned components.

In the present invention, instead of using a cross-linking agent, or while using a cross-linking agent, it is also possible to carry out the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. Further, the pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited, and for example, the electronic device package 8 may contain at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel and copper. It is preferable from the viewpoint of preventing warpage. Among these, copper is particularly preferable from the viewpoint of high thermal conductivity and the effect of heat dissipation. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 is 5 μm or more and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to prevent the metal layer from being deformed by pushing up the pin of the pickup device and causing pin marks. Further, if it is less than 200 μm, it is easy to process, and when it is necessary to bend it along the core or the bonding roll in winding or bonding, the metal layer is too stiff and creases occur. The phenomenon can be suppressed.

A metal foil can be used as such a metal layer 3, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive layer 4>
The adhesive layer 4 is a film formed of an adhesive in advance.

The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, and polycarbonate resin. Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluororesin And so on. The thermoplastic resin can be used alone or in combination of two or more. Among these thermoplastic resins, acrylic resins have less ionic impurities and excellent stress relaxation properties, and phenoxy resins have high toughness while achieving both flexibility and strength. This is particularly preferable because reliability can be easily ensured.

The acrylic resin is not particularly limited, and one or more kinds of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms (preferably 1 to 18 carbon atoms). Examples thereof include polymers containing. That is, in the present invention, the acrylic resin has a broad meaning including a methacrylic resin. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group and a 2-ethylhexyl group. , Octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

Further, the other monomer for forming the acrylic resin (monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and for example, acrylic acid. Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth) 2-Hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) Hydroxyl group-containing monomers such as 10-hydroxydecyl acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl) -methylacrylate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide. Sulphonic acid group-containing monomers such as -2-methylpropanesulfonic acid, (meth) acrylamide propanesulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalene sulfonic acid, 2-hydroxyethylacryloyl phosphate and the like. Examples thereof include a phosphoric acid group-containing monomer and acrylonitrile. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and all have the same meaning as (meth) of the present invention.

Examples of the thermosetting resin include an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, and the like, in addition to an epoxy resin and a phenol resin. The thermosetting resin can be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities and the like that corrode semiconductor elements is particularly preferable. Further, a phenol resin can be preferably used as the curing agent for the epoxy resin.

The epoxy resin is not particularly limited, and for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy. Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluonelen type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylol ethane type epoxy resin, etc. An epoxy resin such as a resin, a polyfunctional epoxy resin, a hidden-in type epoxy resin, a trisglycidyl isocyanurate type epoxy resin, or a glycidylamine type epoxy resin can be used.

As the epoxy resin, a novolak type epoxy resin, a biphenyl type epoxy resin, a trishydroxyphenylmethane type epoxy resin, and a tetraphenylolethane type epoxy resin are particularly preferable. This is because these epoxy resins are highly reactive with phenol resins as curing agents and are excellent in heat resistance and the like.

Further, the phenol resin acts as a curing agent for the epoxy resin, and is, for example, a novolak type phenol resin such as a phenol novolac resin, a phenol aralkyl resin, a cresol novolac resin, a tert-butylphenol novolak resin, or a nonylphenol novolak resin, or a resol type. Examples thereof include phenol resin, polyoxystyrene such as polyparaoxystyrene, and the like. The phenolic resin can be used alone or in combination of two or more. Of these phenolic resins, phenol novolac resin and phenol aralkyl resin are particularly preferable. This is because the connection reliability of the semiconductor device can be improved.

The mixing ratio of the epoxy resin and the phenol resin is preferably, for example, such that the hydroxyl groups in the phenol resin are 0.5 equivalents to 2.0 equivalents per 1 equivalent of the epoxy groups in the epoxy resin component. More preferred are 0.8 equivalents to 1.2 equivalents. That is, if the blending ratio of both is out of the above range, the curing reaction does not proceed sufficiently, and the characteristics of the cured epoxy resin product are likely to deteriorate.

Further, a thermosetting catalyst of an epoxy resin and a phenol resin may be used. The thermosetting accelerating catalyst is not particularly limited, and can be appropriately selected and used from known thermosetting accelerating catalysts. The thermosetting accelerator can be used alone or in combination of two or more. As the thermal curing accelerator, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

It is important that the adhesive layer 4 has adhesiveness (adhesiveness) to an adherend 9 such as an electronic device. Therefore, in order to cross-link the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer may be added as a cross-linking agent. As a result, the adhesive properties at high temperatures can be improved and the heat resistance can be improved.

The cross-linking agent is not particularly limited, and a known cross-linking agent can be used. Specifically, for example, in addition to isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, and peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, and metal salts. Examples thereof include a system-based cross-linking agent, a carbodiimide-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, and an amine-based cross-linking agent. As the cross-linking agent, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is suitable. In addition, the cross-linking agent can be used alone or in combination of two or more.

In the present invention, instead of using a cross-linking agent, or while using a cross-linking agent, it is also possible to carry out the cross-linking treatment by irradiation with an electron beam, ultraviolet rays, or the like.

Other additives can be appropriately added to the adhesive layer 4 as needed. Examples of other additives include fillers, flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, surfactants and the like.

The filler may be either an inorganic filler or an organic filler, but the inorganic filler is preferable. By blending a filler such as an inorganic filler, it is possible to improve the thermal conductivity of the adhesive layer 4 and adjust the elastic modulus. Examples of the inorganic filler include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, and silicon nitride, aluminum, copper, silver, gold, nickel, and chromium. Examples thereof include metals such as lead, tin, zinc, palladium and solder, alloys, and various inorganic powders made of carbon and the like. The filler can be used alone or in combination of two or more. Among them, silica or alumina is preferable as the filler, and molten silica is particularly preferable as the silica. The average particle size of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring device, and in the present application, the particle size when the cumulative volume in the particle size distribution is 50% is referred to as an average particle size.

The blending amount of the filler (particularly the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight. In the case of a functional inorganic filler such as heat conduction or conductivity, it is preferably 10% by weight to 98% by weight.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant can be used alone or in combination of two or more. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. The silane coupling agent can be used alone or in combination of two or more. Examples of the ion trap agent include hydrotalcites, bismuth hydroxide and the like. The ion trap agent can be used alone or in combination of two or more.

The adhesive layer 4 contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler, in particular from the viewpoint of adhesiveness and reliability. It is preferable to do so.

By using the epoxy resin (A), high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. As the curing agent (B), the above-mentioned known curing agent can be used.

(C) Acrylic resin has both flexibility and strength and high toughness. A preferable acrylic resin is obtained by polymerizing a monomer having a Tg (glass transition temperature) of −50 ° C. to 50 ° C. and having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer. Further, if it contains acrylonitrile or the like and exhibits rubber properties, higher toughness can be obtained.
Further, the phenoxy resin (C) has a long molecular chain and a structure similar to that of an epoxy resin, and acts as a flexible material in a composition having a high cross-linking density to impart high toughness, and thus has high strength. However, a toughness composition can be obtained. The preferred phenoxy resin has a main skeleton of bisphenol A type, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed phenoxy resin and brominated phenoxy resin are preferable.

Examples of the surface-treated inorganic filler (D) include an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic filler can be used, and for example, silica and alumina. By surface-treating with a coupling agent, the dispersibility of the inorganic filler is improved. Therefore, since an adhesive layer having excellent fluidity can be obtained, the adhesive force with the metal layer 3 can be improved. Further, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, in the surface treatment of an inorganic filler with a silane coupling agent, the hydroxyl group existing on the surface of the inorganic filler and the silane coupling agent are treated by dispersing the inorganic filler in the silane coupling agent solution by a known method. It is carried out by reacting a hydrolyzable group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

The thickness of the adhesive layer 4 is not particularly limited, but from the viewpoint of sufficiently adhering the metal layer and the adherend, 3 μm or more is preferable, 5 μm or more is more preferable, and the thickness of the semiconductor package can be reduced. In order to contribute, it is preferably 150 μm or less, and more preferably 100 μm or less. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25 ° C. and 50% RH. Further, the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is preferably 3 or less.

The loss tangent tan δ is a value when the temperature is raised from 0 ° C. at a temperature rising rate of 5 ° C./min, measured at a measurement frequency of 1 Hz, and reaches 25 ° C. using a dynamic viscoelasticity measuring device.

When the loss tangent tan δ of the adhesive layer 4 at 25 ° C. and 50% RH is 0.4 or more, the adhesive layer 4 can relieve the stress caused by pushing up the pin of the pickup device. Therefore, even if the amount of push-up of the pin is large, it is possible to suppress the occurrence of pin marks on the metal layer 3. When the loss tangent tan δ is 3 or less, good pick-up can be performed without impairing the responsiveness due to the pin pushing up.

In order to increase the loss tangent tan δ, it is preferable to increase the low molecular weight components such as epoxy resin and phenol resin and decrease the high molecular weight components such as acrylic resin. Further, when the filler is blended, the filler blending amount may be reduced.

Further, the adhesive layer 4 has a peeling force (23 ° C., peeling angle 180 degrees, linear speed 300 mm / min) of 0.3 N / 25 mm or more from the metal layer 3 in the B stage (uncured or semi-cured state). It is preferably 0.5 N / 25 mm or more, more preferably 1.0 N / 25 mm or more. When the peeling force is less than 0.3 N / 25 mm, when the tape for the electronic device package in which the adhesive layer 4 and the metal layer 3 are separated is expanded, the adhesive layer 4 and the metal layer 3 are separated from each other. Peeling may occur.

The water absorption rate of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring the water absorption rate is as follows. That is, using an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass is measured. Let's call it M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out, the surface of the sample is wiped off with a filter paper, and the sample is quickly weighed to obtain M2. The water absorption rate is calculated by the following equation (1).
Water absorption rate (vol%) = [(M2-M1) / (M1 / d)] x 100 (1)
Here, d is the density of the film.
If the water absorption rate exceeds 1.5 vol%, package cracks may occur during solder reflow due to the absorbed water.

The saturated hygroscopicity of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated hygroscopicity is as follows. That is, using a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured to obtain M1. do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out and quickly weighed to obtain M2. The saturated hygroscopicity is calculated by the following equation (2).
Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1 / d)] × 100 (2)
Here, d is the density of the film.
If the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure becomes high due to the moisture absorption during reflow, and good reflow characteristics may not be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt% or less. The method for measuring the residual volatile components is as follows. That is, an adhesive layer 4 (film-like adhesive) having a size of 50 × 50 mm was used as a sample, the initial mass of the sample was measured to obtain M1, and the sample was heated at 200 ° C. for 2 hours in a hot air circulation constant temperature bath. Weigh it to M2. The residual volatile content is calculated by the following formula (3).
Residual volatile content (wt%) = [(M2-M1) / M1] x 100 (3)
If the residual volatile content exceeds 3.0 wt%, the solvent may be volatilized by heating during packaging, voids may be generated inside the adhesive layer 4, and package cracks may occur.

Further, the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is 0.03 to 0.5 N / 25 mm. Since the adhesive strength between the adhesive tape 5 and the adhesive layer 4 in a state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is a radiation-curable adhesive. When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive tape 5 is irradiated with radiation to reduce the adhesive strength, the adhesive strength is the adhesive strength after the irradiation.

The adhesive strength conforms to JIS Z0237, and the adhesive tape 5 cut to a width of 25 mm and the adhesive layer 4 are bonded together in an environment of 23 ° C. and 50% RH, and peeled off using a universal tensile tester. Measure at an angle of 180 ° and a peeling speed of 300 mm / min.

In order to keep the adhesive strength within the above range, the viscoelasticity and surface energy of each of the adhesive layer 52 and the adhesive layer 4 of the adhesive tape 5 may be adjusted, or the combination thereof may be adjusted.

If the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.5 N / 25 mm or less, the push-up speed and the push-up amount of the pin are reduced when the adhesive layer and the metal layer 3 are picked up from the adhesive tape. Since it can be picked up even if the force applied to the metal layer is reduced, it is possible to suppress the formation of pin marks on the metal layer 3. If the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.03 N / 25 mm or more, the metal layer 3 and the adhesive layer 4 are peeled off from the adhesive tape when the metal layer 3 and the adhesive layer 4 are expanded. It is held well without any trouble.

Next, an example of a method for manufacturing the electronic device package tape 1 according to the present embodiment will be described. First, a long metal layer 3 is prepared. As the metal layer 3, a commercially available metal foil may be used.

In addition, a long film-shaped adhesive layer 4 is separately formed. The adhesive layer 4 can be formed by using a conventional method in which a resin composition is prepared and formed into a film-like layer. Specifically, for example, the resin composition is applied onto an appropriate separator S (release paper or the like) and dried (when thermosetting is required, heat treatment is performed and dried as necessary). , A method of forming the adhesive layer 4 and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4A, the metal layer 3 and the adhesive layer 4 are heat-bonded at 80 ° C. using a bonding roller r or the like. Next, as shown in FIG. 4B, the adhesive layer 4 peeled off from the separator S is bonded to the base material tape 2 using a bonding roller r or the like.

In the above description, after the metal layer 3 and the adhesive layer 4 are bonded together, the base material tape 2 is bonded to the surface on the adhesive layer 4 side, but the adhesive layer 4 is bonded to the base material tape 2. The metal layer 3 may be bonded onto the adhesive layer 4.

Next, as shown in FIG. 4C, the adhesive layer 4 and the metal layer 3 are preliminarily made into a predetermined size by using a lattice-shaped stamping tooth having a predetermined label shape (here, a rectangular shape) on the outer edge. At the same time as being separated, the entire surface on which the individual pieces are arranged is pre-cut so as to have a predetermined label shape, and as shown in FIG. 4 (D), the peripheral unnecessary portion 6 is peeled off from the base tape 2 and removed. ..

Here, after the metal layer 3 and the adhesive layer 4 are individualized using the push-cut teeth, the outer edge of the individualized metal layer 3 is pushed toward the adhesive layer 4. Warpage (not shown) has occurred. Therefore, as shown in FIG. 5 (A), the protective tape 20 is attached to the surface of the metal layer 3 and the adhesive layer 4 opposite to the base tape 2 side, and as shown in FIG. 5 (B). , The protective tape 20, the metal layer 3, the adhesive layer 4, and the base tape 2 are pressure-processed using a pair of pressure rollers R, and the amount of warpage of the metal layer 3 is 0.03 mm. Make it as follows. As the protective tape 20, the same one as the base tape 2 or a known separator can be used. The pressure processing is not limited to the one using the pressure roller R, but can also be performed by using the pressure plate.

Further, the method of forming the metal layer 3 and the adhesive layer 4 having a predetermined shape on the base material tape 2 is not limited to the above, and the long metal layer 3 is formed into the long base material tape 2. After bonding, punching into a predetermined shape and removing unnecessary portions 6, the adhesive layer 4 formed in the predetermined shape may be bonded onto the metal layer 3 having the predetermined shape, or each of them may have a predetermined shape in advance. The metal layer 3 and the adhesive layer 4 formed in 1 may be bonded to the base material tape 2, but due to the simplicity of the manufacturing process, the metal layer 3 and the adhesive layer 4 are manufactured by the steps shown in FIGS. 4 (A) to 4 (D) described above. Is preferable. When the metal layer 3 and the adhesive layer 4 are punched into individual shapes, the metal layer 3 is subjected to roll press processing or the like so that the amount of warpage of the metal layer 3 is 0.03 mm or less. To be.

Further, after the metal layer 3 and the adhesive layer 4 are bonded together, the metal layer 3 and the adhesive layer 4 may be diced to be individualized, or the unnecessary portion may be etched to be individualized. May be good.

Separately, the adhesive tape 5 is produced. The base film 51 can be formed by a conventionally known film forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry laminating method. Next, the pressure-sensitive adhesive composition is applied onto the base film 51 and dried (by heat-crosslinking if necessary) to form the pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. The pressure-sensitive adhesive composition may be directly applied to the base film 51 to form the pressure-sensitive adhesive layer 52 on the base film 51, or the release paper obtained by peeling the surface of the pressure-sensitive adhesive composition. Etc. may be applied to form the pressure-sensitive adhesive layer 52, and then the pressure-sensitive adhesive layer may be transferred to the base film 51. As a result, the adhesive tape 5 in which the adhesive layer 52 is formed on the base film 51 is produced.

After that, the base material tape 2 was peeled off from the laminate of the protective tape 20, the metal layer 3, the adhesive layer 4, and the base material tape 2 that had been subjected to pressure processing, and protected as shown in FIG. 6 (A). The adhesive tape 5 is laminated so that the surface of the adhesive tape 5 on the adhesive layer 52 side of the adhesive layer 3 and the metal layer 3 of the predetermined shape provided on the tape 20 is in contact with the surface of the adhesive layer 4 on the adhesive layer 4. ..

Next, as shown in FIG. 6 (B), the adhesive tape 5 is pre-cut into a predetermined shape using a pressing blade or the like, and as shown in FIG. 6 (C), the peripheral unnecessary portion 7 is peeled off from the protective tape 20. The tape 1 for the electronic device package is produced by removing the tape. When the same protective tape 20 as the base tape 2 is used, the protective tape 20 functions as the base tape 2 in FIGS. 2 and 3. When the protective tape 20 is made of a different material, the protective tape 20 used for the pressure processing may be peeled off, and the base material tape 2 or a known separator may be attached to the adhesive layer 52 of the adhesive tape 5. ..

<How to use>
Next, a method of manufacturing the electronic device package 8 using the electronic device package tape 1 of the present embodiment will be described with reference to FIGS. 7 to 9. In the present embodiment, the semiconductor chip C flip-chip connected on the adherend 9 will be described as an example of the electronic device package 8.

[Semiconductor wafer W mounting process]
First, a separate dicing tape D similar to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared, and a semiconductor is provided at the center of the dicing tape D as shown in FIG. 7 (A). The wafer W is attached, and the wafer W is adhesively held and fixed (mounting step of the semiconductor wafer W), and the ring frame R is attached to the peripheral edge of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, or the like). The sticking method is not particularly limited, but a heat-bonding method is preferable. The crimping is usually performed while pressing with a pressing means such as a crimping roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 7B, dicing of the semiconductor wafer W is performed. As a result, the semiconductor wafer W is cut into a predetermined size and individualized (small pieces) to manufacture the semiconductor chip C. Dicing is performed, for example, from the circuit surface side of the semiconductor wafer W according to a conventional method. Further, in this step, for example, a cutting method called a full cut that cuts up to the dicing tape D can be adopted. The dicing apparatus used in this step is not particularly limited, and conventionally known dicing apparatus can be used. When expanding the dicing tape D, the expansion can be performed using a conventionally known expanding device.

[Semiconductor chip C pickup process]
As shown in FIG. 7C, the semiconductor chip C is picked up and the semiconductor chip C is peeled off from the dicing tape D. The pickup method is not particularly limited, and various conventionally known methods can be adopted. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed on the stage S of the pickup device with the base film side facing down, and the ring frame R is fixed in a hollow cylindrical shape. The push-up member T is raised to expand the dicing tape D. In this state, a method in which each semiconductor chip C is pushed up from the base film side of the dicing tape D by a pin N and the pushed-up semiconductor chip C is picked up by a pickup device and the like can be mentioned.

[Flip chip connection process]
As shown in FIG. 7D, the picked up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is always attached to the adherend 9 in a form in which the circuit surface (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, etc.) of the semiconductor chip C faces the adherend 9. Fix according to the law. For example, first, flux is attached to the bump 10 as a connecting portion formed on the circuit surface side of the semiconductor chip C. Next, the bump 10 of the semiconductor chip C is brought into contact with and pressed against the conductive material 11 (solder or the like) for joining attached to the connection pad of the adherend 9, and the bump 10 and the conductive material 11 are melted. The electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance thereof is generally about 30 μm to 300 μm. The flux remaining on the facing surface and the gap between the semiconductor chip C and the adherend 9 is washed and removed.

As the adherend 9, various substrates such as a lead frame and a circuit board (wiring circuit board, etc.) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, a polyimide substrate and the like. Further, a chip-on-chip structure can be obtained by using another semiconductor chip as the adherend 9 and connecting the semiconductor chip C with a flip chip.

Next, as shown in FIG. 8A, the base material tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive tape 5. The peripheral edge of the pressure-sensitive adhesive layer 52 is fixed to the ring frame R.

Next, as shown in FIG. 8B, the individualized metal layer 3 and adhesive layer 4 are picked up and peeled off from the adhesive tape 5. The pickup can be performed in the same process as the above-mentioned pickup process of the semiconductor chip C.

Next, as shown in FIG. 9, the picked-up metal layer 3 and the adhesive layer 4 side of the adhesive layer 4 are bonded to the back surface of the semiconductor chip C connected to the flip chip. At this time, since the amount of warpage of the metal layer 3 is 0.03 mm or less, the metal layer 3 is bonded to the semiconductor chip C without involving voids. After that, the adhesive layer 4 is cured, and a sealing material (sealing resin or the like) is filled in the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 to seal the adhesive layer 4. Sealing is performed according to a conventional method.

Further, in the above description, as the electronic device package 8, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example, but the present invention is not limited to this, and for example, the same size on the semiconductor chip. In an electronic device package structure in which other semiconductor chips are laminated, in order to use the metal layer 3 of the electronic device package tape 1 of the present invention as a spacer between the two chips, the lower semiconductor chip is interposed via the adhesive layer 4. A metal layer 3 may be provided on the metal layer 3.

Further, in the present embodiment, the pressure-sensitive adhesive layer 52, the adhesive layer 4, and the metal layer 3 are provided in this order, but the pressure-sensitive adhesive layer 52, the metal layer 3, and the adhesive layer 4 are provided in this order. May be good. In this case, after picking up from the adhesive tape 5, the surfaces of the metal layer 3 and the adhesive layer 4 are inverted and bonded to the back surface of the semiconductor chip C.

<Example>
Next, in order to further clarify the effect of the present invention, Examples and Comparative Examples will be described in detail, but the present invention is not limited to these Examples.

(1) Preparation of Adhesive Tape <Adhesive Composition (1)>
A copolymer composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid as an acrylic copolymer (A1) having a functional group, having a ratio of 2-ethylhexyl acrylate of 80 mol% and a mass average molecular weight of 700,000. Was prepared. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value was 15, and an acrylic copolymer (a-) having a glass transition temperature of −70 ° C., a hydroxyl value of 20 mgKOH / g, and an acid value of 5 mgKOH / g was added. 1) was prepared.

To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of Coronate L (manufactured by Tosoh Corporation) was added as a polyisocyanate, and 3 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. The partially added mixture was dissolved in ethyl acetate and stirred to obtain the pressure-sensitive adhesive composition (1).

The following was prepared as a base film.
<Base film (1)>
The resin beads of the ethylene-methacrylic acid copolymer were melted at 200 ° C. and molded into a long film having a thickness of 150 μm using an extruder to prepare a base film (1). As the ethylene-methacrylic acid copolymer, Nuclel NO35C (trade name) manufactured by Mitsui DuPont Polychemical Co., Ltd. was used.

<Adhesive tape (1)>
The pressure-sensitive adhesive composition (1) is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and the pressure-sensitive adhesive layer is dried at 110 ° C. for 3 minutes. Then, it was bonded to the base film (2) to prepare an adhesive tape (1).

(2) Preparation of adhesive layer

<Adhesive layer (1)>
80 parts by mass of acrylic resin (manufactured by Nagase Chemtex Co., Ltd., trade name "Taisan Resin SG-P3", Mw 850,000, Tg 12 ° C.) and naphthalene type epoxy resin (manufactured by DIC Co., Ltd., trade name "HP-4700") 10 An adhesive composition solution was prepared by dissolving 10 parts by mass and 10 parts by mass of a phenol resin (manufactured by Meiwa Kasei Co., Ltd., trade name "MEH7851") as a curing agent in methyl ethyl ketone. This adhesive composition solution was applied on a release-treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm treated with silicone, and then dried at 130 ° C. for 5 minutes. As a result, an adhesive layer (1) having a thickness of 20 μm was prepared.
(3) Preparation of metal layer <Metal layer (1)>
GTS-MP (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 35 μm)

(4) Preparation of base material tape The following materials were prepared as the base material tape.
<Resin film (1)>
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by Kuraray Co., Ltd., trade name "Septon KF-2104") and homopropylene (PP) (manufactured by Ube Kosan Co., Ltd., trade name "J-105G" ) Was mixed at a blending ratio of 40:60, and the resin beads were melted at 200 ° C. and molded into a long film having a thickness of 90 μm using an extruder to prepare a resin film (1).

<Adhesive layer composition for base tape (1)>
As an acrylic copolymer (A2) having a functional group, it is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 70 mol%, the mass average molecular weight is 500,000, and the glass transition temperature. An acrylic copolymer (a2) having a hydroxyl value of 30 gKOH / g and an acid value of 5 mgKOH / g at −50 ° C. was prepared. To 100 parts by mass of the acrylic copolymer (a2), 8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation) was added, dissolved in ethyl acetate, stirred, and the substrate was stirred. A pressure-sensitive adhesive layer composition (1) for tape was obtained.
<Base tape (1)>

The prepared pressure-sensitive adhesive layer composition (1) for a base material tape is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and the thickness after drying is 10 μm, and the temperature is 110 ° C. for 3 minutes. After drying, it was bonded to the resin film (1) to prepare a base material tape (1) having an adhesive layer for a base material tape formed on the resin film.

(5) Preparation of Tape for Electronic Device Package <Example 1>
The metal layer (1) obtained as described above and the adhesive layer (1) side of the adhesive layer with separator (1) are bonded together at an angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m /. After bonding under the condition of min, the separator is peeled off and the base material tape (1) is bonded on the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. rice field. The adhesive layer (1) and the metal layer (1) are separated into 10.6 × 10.6 mm squares using push-cut teeth in a rectangular label shape smaller than the precut shape of the adhesive tape (1). Pre-cut like. After that, another base material tape (1) is attached to the metal layer (1) side as a protective tape, and protected by a pressure roller having a width of 400 mm under the conditions of a linear pressure of 50 kgf / cm and a speed of 1 m / min. The laminate of the base material tape (1), the metal layer (1), the adhesive layer (1), and the base material tape (1) as tapes was pressure-processed. After that, the base material tape (1) is peeled off from the adhesive layer (1), and the exposed adhesive layer (1) side and the adhesive layer (1) of the adhesive tape (1) are separated from each other by the metal layer (1). And the adhesive layer (1) was attached around the adhesive layer (1) so as to be in contact with the base material tape (1) as a protective tape. Next, the adhesive tape (1) is pre-cut into a circular shape so that the metal layer (1) and the adhesive layer (1) are arranged in the center, and unnecessary portions around the adhesive tape (1) are peeled off from the base material tape (1) and removed. Then, the tape for the electronic device package according to Example 1 was produced.

<Example 2>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. , The separator was peeled off, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are separated into 10.6 × 10.6 mm squares using push-cut teeth in a rectangular label shape smaller than the precut shape of the adhesive tape (1). Pre-cut like. After that, another base material tape (1) is attached to the metal layer (1) side as a protective tape, and a base as a protective tape ^{is used under the conditions of a pressure of 50 kg / cm 2 and a pressurization time of 2 s using a press device.} The laminated body of the material tape (1), the metal layer (1), the adhesive layer (1) and the base material tape (1) was pressure-processed. After that, the base material tape (1) is peeled off from the adhesive layer (1), and the exposed adhesive layer (1) side and the adhesive layer (1) of the adhesive tape (1) are separated from each other by the metal layer (1). And the adhesive layer (1) was attached around the adhesive layer (1) so as to be in contact with the base material tape (1) as a protective tape. Next, the adhesive tape (1) is pre-cut into a circular shape so that the metal layer (1) and the adhesive layer (1) are arranged in the center, and unnecessary portions around the adhesive tape (1) are peeled off from the base material tape (1) and removed. Then, the tape for the electronic device package according to Example 2 was produced.

<Example 3>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. , The separator was peeled off, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. After punching the adhesive layer (1) and the metal layer (1) into a rectangular label shape smaller than the precut shape of the adhesive tape (1) using push-cut teeth, the adhesive layer (1) and the metal layer (1) Was precut using a dicing blade so as to be fragmented into 10.6 × 10.6 mm squares. Then, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape (1) was bonded around the metal layer (1) and the adhesive layer (1) so that the pressure-sensitive adhesive layer (1) was in contact with the base material tape (1). Next, the adhesive tape (1) is pre-cut into a circular shape so that the metal layer (1) and the adhesive layer (1) are arranged in the center, and unnecessary portions around the adhesive tape (1) are peeled off from the base material tape (1) and removed. Then, the tape for the electronic device package according to Example 3 was produced.

<Comparative example 1>
After bonding the metal layer (1) and the adhesive layer (1) side of the adhesive layer with separator (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, a temperature of 80 ° C., and a speed of 1 m / min. , The separator was peeled off, and the base material tape (1) was bonded onto the adhesive layer (1) under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. The adhesive layer (1) and the metal layer (1) are separated into 10.6 × 10.6 mm squares using push-cut teeth in a rectangular label shape smaller than the precut shape of the adhesive tape (1). Pre-cut like. After that, the pressure-sensitive adhesive layer (1) of the pressure-sensitive adhesive tape (1) is attached around the metal layer (1) and the adhesive layer (1) so that the pressure-sensitive adhesive layer (1) is in contact with the base material tape (1). I matched it. Next, the adhesive tape (1) is pre-cut into a circular shape so that the metal layer (1) and the adhesive layer (1) are arranged in the center, and unnecessary portions around the adhesive tape (1) are peeled off from the base material tape (1) and removed. Then, the tape for the electronic device package according to Comparative Example 1 was produced.

The following measurements and evaluations were performed on the electronic device package tapes according to Examples 1 to 4 and Comparative Example 1. The results are shown in Table 1.

(Amount of warpage)
The tapes for electronic device packaging according to each example and comparative example were observed from the metal layer side with a measuring microscope MF-J4020D manufactured by Mitutoyo Co., Ltd., and the height (thickness) of one end of the individualized metal layer was observed. ) And the height (thickness) of the portion 500 μm inside from the end portion were measured and used as the amount of warpage of the metal layer.

(Removability)
Ten chips of 10.6 × 10.6 mm square were prepared, and a metal layer of the tape for electronic device packaging according to each of the above-described Examples and Comparative Examples was bonded to the chips via an adhesive layer. Then, the adhesive layer was heated at 150 ° C. for 1 hour to cure, and 10 samples were prepared. Then, the presence or absence of peeling of the adhesive layer from the chip was observed with an optical microscope. Those with no peeled samples or those with 1 to 6 peeled samples were evaluated as non-defective products, and those with 7 or more peeled samples were evaluated as defective products with x.
(Protrusion from the outer edge of the metal layer)
Ten chips of 10.6 × 10.6 mm square were prepared, the metal layer was observed with an optical microscope, and the length of the protrusion protruding from the outer edge of the metal layer was measured. Those having no protrusions of 10 μm or more per chip were evaluated as good products, and those having whiskers of 10 μm or more were evaluated as acceptable products with Δ.

As shown in Table 1, since the amount of warpage of the metal layer of the tapes for electronic device packaging according to Examples 1 to 4 was 0.03 mm or less, good results were obtained in the evaluation of peelability. In the tape for electronic device packaging according to Example 3, protrusions having a protrusion length of 10 μm or more protruding from the outer edge of the metal layer were confirmed, which is within the permissible range.

On the other hand, in the tape for electronic device packaging according to Comparative Example 1, the amount of warpage of the metal layer was more than 0.03 mm, so that the evaluation of peelability was inferior.

1: Electronic device package tape 2: Base material tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label part 5b: Peripheral part

Claims (5)

An adhesive tape having a base film and an adhesive layer,
It has a laminate of an adhesive layer and a metal layer provided on the opposite side of the pressure-sensitive adhesive layer from the base film.
The adhesive layer and the metal layer are individualized to a size corresponding to an electronic device.
The amount of warpage of the individualized metal layer is 0.03 mm or less, and the amount of warpage is 0.03 mm or less.
The stripped metal layer is a tape for an electronic device package, characterized in that the length of linear or burr-shaped protrusions protruding from the outer edge of the stripped metal layer is less than 10 μm. The tape for electronic device packaging according to claim 1, wherein the adhesive layer has a loss tangent of 0.4 or more at 25 ° C. and 50% RH. The tape for an electronic device package according to claim 1 or 2, wherein the metal layer contains copper or aluminum. From claim 1, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. The tape for an electronic device package according to any one of claim 3. The pressure-sensitive adhesive layer _{contains an acrylic acid ester represented by CH 2} = CHCOOR (in the formula, R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reactivity in the molecule. The tape for an electronic device package according to any one of claims 1 to 4, which contains an acrylic polymer composed of an isocyanate compound having a carbon-carbon double bond.

Images