JP7112997B2 - Electronic device package tape - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electronic device packaging tape, and more particularly to an electronic device packaging tape having a metal layer.

2. Description of the Related Art In recent years, electronic devices such as mobile phones and notebook PCs are required to be further thinned and miniaturized. Therefore, in order to reduce the thickness and size of electronic device packages such as semiconductor packages mounted on electronic equipment, the number of electrodes on electronic devices and circuit boards is increased and the pitch is also narrowed. Such electronic device packages include, for example, flip chip (FC) mounted packages.

In the flip-chip mounting package, as described above, since the number of electrodes is increased and the pitch is narrowed, an increase in the amount of heat generated is a problem. Therefore, as a heat dissipation structure for a flip-chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

Moreover, in a flip-chip mounting package, the coefficient of linear expansion of the electronic device and the coefficient of linear expansion of the circuit board may differ greatly. In this case, when the intermediate product is heated and cooled in the manufacturing process of the electronic device package, there will be a difference in the amount of expansion and contraction between the electronic device and the circuit board. This difference causes the electronic device package to warp. As a structure for suppressing such warping, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 2).

Furthermore, in a flip-chip mounting package, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). . Patent Document 3 discloses an electronic device package in which the plane size of the electronic device is the same as the plane size of the metal layer and the adhesive layer.

Further, in recent years, there is a case where another semiconductor chip of the same size is further stacked on a semiconductor chip to perform three-dimensional mounting. Here, in order to stack another semiconductor chip of the same size on a semiconductor chip, it is necessary to stack a spacer between them. This is because another semiconductor chip is also laminated on the electrode pad portion of the semiconductor chip. It has been proposed to use a metal layer with an adhesive layer as the spacer (see, for example, Patent Document 4). Patent Document 4 describes a step of laminating a spacer adhesive sheet having a metal layer having an adhesive layer on at least one surface thereof to a dicing sheet using the adhesive layer as a lamination surface; dicing to form a chip-shaped spacer provided with an adhesive layer; pushing up the spacer with a pin; It is described that the spacer is provided by a process of peeling off from the dicing sheet together with the adhesive layer and a process of fixing the spacer to the adherend through the adhesive layer.

JP 2007-235022 A Japanese Patent No. 5487847 Japanese Patent No. 5419226 Japanese Patent No. 4954569

In Patent Document 4, a spacer adhesive sheet having a metal layer with an adhesive layer is attached to a dicing sheet using the adhesive layer as a bonding surface, and the spacer adhesive sheet is diced to remove the adhesive layer. It is described that the chip-shaped spacers are peeled off from the dicing sheet together with the adhesive layer after the chip-shaped spacers are formed. Convenient.

When the adhesive layer and the metal layer are pre-cut into individual pieces, it is usually considered to cut using a pressing tooth. When cutting with a press tooth, the metal layer may warp. If the metal layer is warped, it is conceivable to correct the warp using a pressure roller. However, when a pressure roller is used to apply pressure to the adhesive layer and the metal layer, which are separated into pieces and arranged in a plurality of lengthwise and crosswise directions, the pressure roller causes the portions where the adhesive layer and the metal layer are present and the portions where they are not. In order to follow the steps, excessive force is applied to the ends of the adhesive layer and the metal layer in the advancing direction of the pressure roller, wrinkling the metal layer and causing the metal layer to adhere to an electronic device such as a semiconductor chip. There is a problem that the adhesive layer may be peeled off from the electronic device when the adhesive layer is cured by pasting through the electronic device.

In order to solve this problem, along the adhesive layer and the metal layer which are singulated and arranged in rows in the advancing direction of the pressure roller, pressure is applied having a length similar to the length of the rows. It is conceivable to provide guide members for guiding the rollers. However, when the pressure roller is advanced while being guided by such a guide member, the protective tape applied to protect the metal layer is applied in the vicinity of the guide member when the pressure roller passes through the guide member. It is stretched by the pressure roller, and when the stress on the protective sheet is relieved after passing the pressure roller, the metal layer follows and wrinkles in a wavy manner, making it impossible to bond the electronic device package tape to the ring frame. There was a problem.

Therefore, the present invention corrects the warpage of the metal layer appropriately, bonds the metal layer to an electronic device such as a semiconductor chip through an adhesive layer, and when the adhesive layer is cured, the adhesive layer To provide an electronic device package tape which can reduce the peeling of a tape from an electronic device and can be satisfactorily bonded to a ring frame.

In order to solve the above problems, the electronic device package tape according to the present invention is an individual piece comprising a long base tape and a laminate of an adhesive layer and a metal layer provided on the base tape. and an adhesive tape having a label portion having a predetermined planar shape provided so as to cover the aggregate and to come into contact with the base tape around the aggregate. wherein the individual pieces in the assembly are arranged in a plurality of rows along the longitudinal direction of the base tape, and arranged in a row along the width direction of the base tape. A plurality of guide members are spaced apart from each other along the row, and the guide members are arranged so that the space and the gap between the pieces in the row are aligned in the row direction. are arranged so as not to overlap each other.

Preferably, in the electronic device package tape, the guide member is provided at a position protruding in the column direction from a line at the end of the assembly in the column direction.

Preferably, in the electronic device package tape, the guide members are provided on both sides of the assembly in the lateral direction of the base tape.

Preferably, in the electronic device package tape, the guide member is composed of the laminate.

In the electronic device package tape, the adhesive layer preferably has a loss tangent of 0.4 or more at 25° C. and 50% RH.

In the electronic device package tape, the metal layer preferably contains copper or aluminum.

In the electronic device packaging tape, the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. preferably.

In the electronic device package tape, the adhesive tape has an adhesive layer, and the adhesive layer is composed of CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms). ), a hydroxyl group-containing monomer, and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.

Further, the electronic device package tape is provided with other guide members along the rows, and the other guide members are provided on both sides of the assembly in the longitudinal direction of the base tape. preferably.

Further, in the electronic device package tape, it is preferable that a plurality of the other guide members are provided with a space therebetween.

According to the present invention, when the warpage of the metal layer is appropriately corrected, the metal layer is bonded to an electronic device such as a semiconductor chip through the adhesive layer, and the adhesive layer is cured, the adhesive layer detachment from the electronic device can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. (A) is a plan view schematically showing the structure of an electronic device package tape according to an embodiment of the present invention, and (B) is a cross-sectional view of the same. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages concerning embodiment of this invention, (A) is longitudinal sectional drawing which shows the lamination process of a metal layer, (B) is adhesive It is a longitudinal cross-sectional view showing a layer bonding step, (C) is a transverse cross-sectional view showing a pre-cutting step, and (D) is a perspective view showing an unnecessary portion removing step. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages based on embodiment of this invention, (A) is longitudinal sectional drawing which shows the bonding process of the protective tape 20, (B) pressurization It is a longitudinal sectional view showing a processing step. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is transverse direction sectional drawing which shows the lamination process of an adhesive tape, (B) is precut FIG. 4C is a cross-sectional view in the transverse direction showing the process, and (C) is a cross-sectional view in the transverse direction showing the process of removing an unnecessary portion; (A) is a plan view schematically showing the structure of an electronic device package tape according to a second embodiment of the present invention, and (B) is a cross-sectional view of the same. (A) is a plan view schematically showing the structure of an electronic device package tape according to a third embodiment of the present invention, and (B) is a cross-sectional view of the same. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which illustrates typically the usage method of the tape for electronic device packages which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the structure of the electronic device package using the tape for electronic device packages which concerns on embodiment of this invention.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below.

FIG. 1 is a cross-sectional view showing an electronic device package tape 1 according to an embodiment of the present invention. This electronic device package tape 1 has an adhesive tape 5 composed of a base film 51 and an adhesive layer 52 provided on the base film 51. On the adhesive layer 52, an adhesive layer 4 and a metal layer 3 laminated on the adhesive layer 4 are provided. The metal layer 3 may be indirectly provided on the adhesive layer 4 via a primer layer or the like for improving adhesion to the adhesive layer 4 .

In the electronic device package tape 1 of the present invention, as shown in FIGS. 2 and 3, the adhesive tape 5 is cut into a shape corresponding to the ring frame R (see FIG. 9), and the metal layer 3 and the adhesive layer 4 is also cut (pre-cut) into a predetermined shape corresponding to this.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention comprises a metal layer 3, an adhesive layer 4, and an adhesive tape 5 (label portion 5a) cut into a shape corresponding to the ring frame R. A long base tape 2 having a plurality of laminated layers is preferably wound into a roll, and in the present embodiment, it is wound into a roll.

As shown in FIGS. 2 and 3, the electronic device package tape 1 of the present invention has a base tape 2. On the base tape 2, a metal layer 3 and a base material for the metal layer 3 are formed. An adhesive layer 4 laminated on the metal layer 3 on the side opposite to the tape 2 side, and an adhesive layer 4 provided so as to cover the adhesive layer 4 and be in contact with the base tape 2 around the adhesive layer 4. An adhesive tape 5 having a predetermined planar label portion 5a and a peripheral portion 5b surrounding the outer side of the label portion 5a is provided.

The label portion 5a has a shape corresponding to the ring frame R for dicing. The shape corresponding to the shape of the ring frame R for dicing is preferably a similar shape that is substantially the same as the inner side of the ring frame R and larger than the inner side of the ring frame R. Moreover, the shape is not necessarily circular, but a shape close to a circle is preferable, and a circular shape is more preferable. The peripheral portion 5b includes a form that completely surrounds the outside of the label portion 5a and a form that does not completely surround the label portion 5a as shown. Note that the peripheral portion 5b may not be provided.

The metal layer 3 and the adhesive layer 4 are previously cut into individual pieces having a size corresponding to the plane of the electronic device to which the metal layer 3 and the adhesive layer 4 are to be attached. A plurality of individual pieces of the laminate of the cut adhesive layer 4 and the metal layer 3 are aggregated to form an aggregate 30, and the aggregate 30 is, as shown in FIG. 2 are provided in the longitudinal direction. Also, as shown in FIGS. 1 and 2, one assembly 30 is laminated so as to cover one label portion 5a.

A plurality of individual pieces in the assembly 30 are arranged along the longitudinal direction of the base tape 2 to form a row L, and a plurality of pieces are arranged along the width direction of the base tape 2 to form a row G. . Guide members 12 having the same shape as the individual pieces are provided along the row L on both sides of the assembly 30 in the lateral direction of the base tape 2 so as to alternate with the individual pieces in the row direction. .

The adhesive layer 4 and the metal layer 3 have a predetermined label shape (rectangular in this embodiment) as an assembly 30 in which individual pieces are arranged. A ring frame R is adhered to the peripheral portion, and the shape is smaller than the label portion 5a so that it can be pushed up by a pushing-up member T of the pickup device (see FIG. 9(C)T).

An adhesive layer 4 is laminated on the metal layer 3 . The lamination referred to here only requires that the main portion be laminated, and the metal layer 3 and the adhesive layer 4 do not necessarily have to have the same size. preferable.

Further, the electronic device package tape of the present invention does not necessarily have to be provided with the support member 6, but in the electronic device package tape 1 according to the present embodiment, both ends of the base tape 2 in the transverse direction A support member 6 is provided in the .

Each component will be described below.

<Base tape 2>
The base tape 2 can be composed of a known separator, but the base tape used for precut processing of the electronic device package tape can also be used as it is. When the base tape used for the precut processing of the electronic device package tape is used as it is, the base tape 2 needs to adhere and hold the metal layer 3 during the precut processing. A tape having an adhesive layer for a base tape provided can be preferably used.

Known materials can be used for the material of the resin film that constitutes the base tape 2. Examples include polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE). and copolymers (EVA, EEA, EBA), and films partially substituted with these materials to further improve adhesiveness and mechanical strength. A laminate of these films may also be used. It is preferably selected from polyethylene terephthalate, polypropylene, and polyethylene in terms of heat resistance, smoothness, and availability.

The thickness of the resin film that constitutes the base tape 2 is not particularly limited and may be set appropriately, but is preferably 10 to 150 μm.

As the resin used for the pressure-sensitive adhesive layer for the base tape, known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins, etc., which are used for pressure-sensitive adhesives, can be used. An acrylic pressure-sensitive adhesive having a polymer as a base polymer is preferred.

Examples of acrylic polymers include (meth)acrylic acid alkyl esters (e.g., methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, linear or branched alkyl esters having 1 to 30 carbon atoms, especially 4 to 18 carbon atoms of alkyl groups such as octadecyl esters and eicosyl esters) and (meth)acrylic acid cycloalkyl esters (eg, cyclopentyl esters) , cyclohexyl ester, etc.) as a monomer component. Incidentally, (meth)acrylic acid ester refers to acrylic acid ester and/or methacrylic acid ester, and (meth) in the present invention has the same meaning.

The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth)acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of improving cohesive strength, heat resistance, etc. You can Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride; , acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate , 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid, etc. Containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Furthermore, since the acrylic polymer is crosslinked, it can contain a polyfunctional monomer or the like as a monomer component for copolymerization, if necessary. Examples of such polyfunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, Pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate, polyester (meth)acrylate, urethane (meth)acrylate acrylates and the like. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total monomer components from the viewpoint of adhesion properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, etc. to a mixture of one or more component monomers. The pressure-sensitive adhesive layer for the base tape preferably has a composition in which the content of low-molecular weight substances is suppressed, and from this point, it is preferable that the acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, is the main component. Therefore, the pressure-sensitive adhesive can be of an appropriate cross-linking type such as an internal cross-linking system or an external cross-linking system.

In order to control the cross-linking density of the pressure-sensitive adhesive layer for the base tape and improve the releasability from the pressure-sensitive adhesive tape 5, for example, polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metal salt compounds, A method of cross-linking using an appropriate external cross-linking agent such as a metal chelate compound, an amino resin compound, or a peroxide, or a method of mixing a low-molecular weight compound having two or more carbon-carbon double bonds to generate an energy beam. A suitable method such as a method of cross-linking treatment by irradiation or the like can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined according to the balance with the base polymer to be cross-linked and further according to the application as an adhesive. In general, about 20 parts by weight or less, more preferably 0.1 to 20 parts by weight, is added to 100 parts by weight of the base polymer.

The thickness of the pressure-sensitive adhesive layer for base tape is not particularly limited and can be determined appropriately, but is generally about 5 to 200 μm. Moreover, the pressure-sensitive adhesive layer for the base tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>
The adhesive tape 5 is not particularly limited, and a conventional dicing tape can be used. As the adhesive tape 5, for example, a substrate film 51 provided with an adhesive layer 52 can be suitably used.

As the base film 51, any conventionally known one can be used without particular limitation. It is preferable to use the

For example, its materials include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic α-olefin homopolymers or copolymers such as methyl acid copolymers, ethylene-acrylic acid copolymers, ionomers, or mixtures thereof, polyurethanes, styrene-ethylene-butene or pentene copolymers, polyamide-polyols Thermoplastic elastomers, such as copolymers, and mixtures thereof may be mentioned. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or multiple layers thereof.

The thickness of the base film 51 is not particularly limited and may be set as appropriate, but it is preferably 50 to 200 μm in consideration of the expansion process when picking up.

In order to improve the adhesion between the base film 51 and the adhesive layer 52, the surface of the base film 51 is subjected to chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, and ionizing radiation treatment. surface treatment may be applied.

Further, in the present embodiment, the adhesive layer 52 is provided directly on the base film 51, but a primer layer for increasing adhesion, an anchor layer, a stress relaxation layer, an antistatic layer, etc. may be provided indirectly through

The resin used for the adhesive layer 52 of the adhesive tape 5 is not particularly limited, and known chlorinated polypropylene resins, acrylic resins, polyester resins, polyurethane resins, epoxy resins, etc. used for adhesives can be used. Although it can be used, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferred in order to control the adhesive strength to be suitable for suppressing pin marks on the metal layer.

Examples of acrylic polymers include (meth)acrylic acid alkyl esters (e.g., methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, linear or branched alkyl esters having 1 to 30 carbon atoms, especially 4 to 18 carbon atoms of alkyl groups such as octadecyl esters and eicosyl esters) and (meth)acrylic acid cycloalkyl esters (eg, cyclopentyl esters) , cyclohexyl ester, etc.) as a monomer component. Incidentally, (meth)acrylic acid ester refers to acrylic acid ester and/or methacrylic acid ester, and (meth) in the present invention has the same meaning.

For the purpose of improving cohesive strength, heat resistance, crosslinkability, etc., the acrylic polymer may optionally contain units corresponding to other monomer components copolymerizable with the (meth)acrylic acid alkyl ester or cycloalkyl ester. may contain Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride; , acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate , 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate and other hydroxyl group-containing monomers; Sulfonic acid groups such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalenesulfonic acid, etc. Containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less of the total monomer components.

Furthermore, since the acrylic polymer is crosslinked, it can contain a polyfunctional monomer or the like as a monomer component for copolymerization, if necessary. Examples of such polyfunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, Pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate, polyester (meth)acrylate, urethane (meth)acrylate acrylates and the like. One or more of these polyfunctional monomers can also be used. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total monomer components from the viewpoint of adhesion properties and the like.

The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, etc. to a mixture of one or more component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition in which the content of low-molecular weight substances is suppressed. The agent can also be of a suitable cross-linking type such as an internal cross-linking system or an external cross-linking system.

In order to control the cross-linking density of the adhesive layer 52 and improve pick-up properties, for example, polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metal salt compounds, metal chelate compounds, amino resin compounds, etc. A cross-linking method using a compound or an appropriate external cross-linking agent such as a peroxide, or a cross-linking method by mixing a low-molecular weight compound having two or more carbon-carbon double bonds and irradiating energy rays. etc. can be adopted. When an external cross-linking agent is used, the amount used is appropriately determined according to the balance with the base polymer to be cross-linked and further according to the application as an adhesive. In general, about 20 parts by weight or less, more preferably 0.1 to 20 parts by weight, is added to 100 parts by weight of the base polymer. In addition to the above components, additives such as various tackifiers and anti-aging agents may be used in the pressure-sensitive adhesive, if necessary, from the viewpoint of deterioration prevention.

A radiation-curable adhesive is suitable for the adhesive forming the adhesive layer 52 . Examples of the radiation-curable pressure-sensitive adhesive include additive-type radiation-curable pressure-sensitive adhesives obtained by blending a radiation-curable monomer component or a radiation-curable oligomer component with the above-described pressure-sensitive adhesive.

Radiation-curable monomer components to be blended include, for example, urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra( meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate and the like. These monomer components can be used singly or in combination of two or more.

The radiation-curable oligomer component includes various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers. The blending amount of the radiation-curable monomer component or oligomer component can be appropriately determined according to the type of the adhesive layer 52 so as to reduce the adhesive strength of the adhesive layer 52 . In general, it is, for example, 5 to 500 parts by weight, preferably about 70 to 150 parts by weight, per 100 parts by weight of the base polymer such as an acrylic polymer that constitutes the pressure-sensitive adhesive.

As the radiation-curable pressure-sensitive adhesive, in addition to the above-mentioned additive-type radiation-curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain, in the main chain, or at the end of the main chain was used. Intrinsic radiation-curable pressure-sensitive adhesives are also included. The embedded radiation-curing adhesive does not need to contain low-molecular-weight oligomer components, etc., or does not contain a large amount of such components. This is preferable because the pressure-sensitive adhesive layer 52 having a layered structure can be formed.

As the base polymer having carbon-carbon double bonds, those having carbon-carbon double bonds and adhesiveness can be used without particular limitation. As such a base polymer, one having an acrylic polymer as a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

The method of introducing carbon-carbon double bonds into acrylic polymers is not particularly limited, and various methods can be adopted. be. For example, after previously copolymerizing a monomer having a functional group with an acrylic polymer, a compound having a functional group capable of reacting with this functional group and a carbon-carbon double bond is added to the radiation-curable carbon-carbon double bond. A method of performing a condensation or addition reaction while maintaining is exemplified.

Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of the ease of tracking the reaction. In addition, the functional group may be on either side of the acrylic polymer or the compound as long as the combination of these functional groups produces an acrylic polymer having a carbon-carbon double bond. In the preferred combination described above, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate and the like. As the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxyl group-containing monomers, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and other ether compounds are used.

The intrinsic radiation-curable pressure-sensitive adhesive can use the base polymer having a carbon-carbon double bond (especially an acrylic polymer) alone, but the radiation-curable monomer component can be used to the extent that the properties are not deteriorated. and a photopolymerizable compound such as an oligomer component can also be blended. The amount of the photopolymerizable compound to be blended is generally within the range of 30 parts by weight or less, preferably within the range of 0 to 10 parts by weight, per 100 parts by weight of the base polymer.

The radiation-curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when it is cured by ultraviolet light or the like.

Among the acrylic polymers described above, in particular, an acrylic acid ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and in the molecule An acrylic polymer A comprising an isocyanate compound having a radically reactive carbon-carbon double bond is preferred.

When the number of carbon atoms in the alkyl group of the alkyl acrylate is less than 4, the polarity may be too high and the peeling force may be too large, resulting in a decrease in pick-up property. On the other hand, if the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature deteriorate. 3 detachment may occur.

The acrylic polymer A may contain units corresponding to other monomer components, if necessary.

The acrylic polymer A uses an isocyanate compound having a radically reactive carbon-carbon double bond. That is, the acrylic polymer preferably has a structure in which a double bond-containing isocyanate compound is added to a polymer of a monomer composition such as the acrylic acid ester or hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radical-reactive carbon-carbon double bond in its molecular structure. As a result, an active energy ray-curable adhesive layer (such as an ultraviolet curable adhesive layer) that is cured by irradiation with an active energy ray (such as ultraviolet rays) can be formed, and the peeling force between the metal layer 3 and the adhesive layer 52 can be can be reduced.

Double bond-containing isocyanate compounds include, for example, methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate and the like. The double bond-containing isocyanate compounds can be used alone or in combination of two or more.

In addition, an external cross-linking agent can be appropriately used in the active energy ray-curable pressure-sensitive adhesive in order to adjust the adhesive strength before and after the irradiation of the active energy ray. Specific means of the external cross-linking method include a method of adding a so-called cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine-based cross-linking agent and allowing the reaction to occur.

Examples of the polyisocyanate compounds include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone Alicyclic polyisocyanates such as diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane Aromatic polyisocyanates such as diisocyanate and xylylene diisocyanate, etc., and trimethylolpropane/tolylene diisocyanate trimer adduct [manufactured by Tosoh Corporation, trade name "Coronate L"], trimethylolpropane/hexa A trimer adduct of methylene diisocyanate [manufactured by Tosoh Corporation, trade name "Coronate HL"] and the like are also used. Examples of the epoxy compound include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane, 1, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta erythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalate diglycidyl ester, triglycidyl-tris(2-hydroxyethyl)isocyanurate, In addition to resorcinol diglycidyl ether and bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule can be used.

When an external cross-linking agent is used, the amount used is appropriately determined according to the balance with the base polymer to be cross-linked and further according to the application as an adhesive. The amount of the external cross-linking agent used is generally 20 parts by weight or less (preferably 0.1 to 10 parts by weight) per 100 parts by weight of the base polymer. Furthermore, the active energy ray-curable pressure-sensitive adhesive may optionally contain additives such as conventionally known various tackifiers, anti-aging agents, foaming agents, etc., in addition to the above components.

In the present invention, instead of using a cross-linking agent, or in addition to using a cross-linking agent, it is also possible to perform a cross-linking treatment by irradiation with an electron beam or ultraviolet rays.

The thickness of the adhesive layer 52 is not particularly limited and can be determined as appropriate, but is generally about 5 to 200 μm. Further, the adhesive layer 52 may be composed of a single layer or multiple layers.

<Metal layer 3>
The metal that constitutes the metal layer 3 is not particularly limited, and for example, it contains at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel and copper. It is preferable from the point of warp prevention. Among these, it is particularly preferable to contain copper from the viewpoint of high thermal conductivity and heat radiation effect. In addition, from the viewpoint of preventing the electronic device package 8 from warping, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 is 5 μm or more and less than 200 μm. By setting the thickness to 5 μm or more, it is possible to prevent the metal layer from being deformed by pushing up the pin of the pickup device and causing pin traces. Also, if the thickness is less than 200 μm, processing is easy, and when it is necessary to bend along the core or lamination roll in winding or lamination, the metal layer is too stiff and wrinkles are formed. phenomenon can be suppressed.

A metal foil can be used as such a metal layer 3, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive Layer 4>
The adhesive layer 4 is formed by forming an adhesive into a film in advance.

The adhesive layer 4 is made of at least a thermosetting resin, and preferably made of at least a thermosetting resin and a thermoplastic resin.

Examples of thermoplastic resins include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluorine resin etc. A thermoplastic resin can be used individually or in combination of 2 or more types. Among these thermoplastic resins, acrylic resin has few ionic impurities and is excellent in stress relaxation, and phenoxy resin has both flexibility and strength and high toughness. It is particularly preferable because reliability can be easily ensured.

The acrylic resin is not particularly limited, and is one or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group with 30 or less carbon atoms (preferably 1 to 18 carbon atoms). and the like as a component. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, pentyl group, isopentyl group, hexyl group, heptyl group and 2-ethylhexyl group. , octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

Further, other monomers (monomers other than alkyl esters of acrylic acid or methacrylic acid having alkyl groups of 30 or less carbon atoms) for forming the acrylic resin are not particularly limited, and examples thereof include acrylic acid, carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid; acid anhydride monomers such as maleic anhydride or itaconic anhydride; 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, (meth)acrylate hydroxyl group-containing monomers such as 10-hydroxydecyl acrylate, 12-hydroxylauryl (meth)acrylate or (4-hydroxymethylcyclohexyl)-methyl acrylate, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide -Sulfonic acid group-containing monomers such as 2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate or (meth)acryloyloxynaphthalenesulfonic acid, 2-hydroxyethyl acryloyl phosphate, etc. phosphate group-containing monomers or acrylonitrile. (Meth)acrylic acid means acrylic acid and/or methacrylic acid, and (meth) in the present invention has the same meaning.

Thermosetting resins include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, thermosetting polyimide resins, and the like. A thermosetting resin can be used individually or in combination of 2 or more types. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities that corrode semiconductor elements is particularly suitable. Moreover, a phenol resin can be preferably used as a curing agent for the epoxy resin.

The epoxy resin is not particularly limited, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, and bisphenol AF type epoxy resin. Bifunctional epoxies such as resins, biphenyl-type epoxy resins, naphthalene-type epoxy resins, fluorene-type epoxy resins, phenol novolac-type epoxy resins, ortho-cresol novolak-type epoxy resins, trishydroxyphenylmethane-type epoxy resins, and tetraphenylolethane-type epoxy resins A resin, a polyfunctional epoxy resin, or an epoxy resin such as a hydantoin-type epoxy resin, a trisglycidyl isocyanurate-type epoxy resin, or a glycidylamine-type epoxy resin can be used.

As the epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, and tetraphenylolethane type epoxy resin are particularly preferable among examples. This is because these epoxy resins are highly reactive with phenolic resins as curing agents and are excellent in heat resistance and the like.

Furthermore, phenolic resins act as curing agents for epoxy resins. Examples include phenol resins and polyoxystyrenes such as polyparaoxystyrene. A phenol resin can be used individually or in combination of 2 or more types. Of these phenol resins, phenol novolak resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

The mixing ratio of the epoxy resin and the phenol resin is preferably such that the hydroxyl groups in the phenol resin are in an amount of 0.5 to 2.0 equivalents per equivalent of the epoxy groups in the epoxy resin component. More preferred is between 0.8 and 1.2 equivalents. That is, if the mixing ratio of the two is outside the above range, the curing reaction will not proceed sufficiently, and the properties of the cured epoxy resin will tend to deteriorate.

Also, a thermosetting acceleration catalyst for epoxy resin and phenol resin may be used. The heat curing acceleration catalyst is not particularly limited, and can be appropriately selected and used from known heat curing acceleration catalysts. A thermosetting acceleration catalyst can be used individually or in combination of 2 or more types. As the thermosetting acceleration catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, and the like can be used.

As the curing agent for the epoxy resin, it is preferable to use the phenol resin as described above, but it is also possible to use known curing agents such as imidazoles, amines, and acid anhydrides.

It is important that the adhesive layer 4 has adhesiveness (adhesion) to an adherend 9 such as an electronic device. Therefore, in order to preliminarily crosslink the adhesive layer 4 to some extent, a polyfunctional compound that reacts with the functional groups at the ends of the molecular chains of the polymer may be added as a crosslinker. As a result, it is possible to improve the adhesive properties at high temperatures and improve the heat resistance.

The cross-linking agent is not particularly limited, and known cross-linking agents can be used. Specifically, for example, isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salts cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amine-based cross-linking agents, and the like. As the cross-linking agent, an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is suitable. Moreover, the said crosslinking agent can be used individually or in combination of 2 or more types.

In the present invention, instead of using a cross-linking agent, or in addition to using a cross-linking agent, it is also possible to perform a cross-linking treatment by irradiation with an electron beam or ultraviolet rays.

The adhesive layer 4 may contain other additives, if necessary. Examples of other additives include fillers, flame retardants, silane coupling agents, ion trapping agents, extenders, anti-aging agents, antioxidants, and surfactants.

The filler may be either an inorganic filler or an organic filler, but an inorganic filler is preferred. By blending a filler such as an inorganic filler, it is possible to improve the thermal conductivity of the adhesive layer 4, adjust the elastic modulus, and the like. Examples of inorganic fillers include silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, ceramics such as silicon nitride, aluminum, copper, silver, gold, nickel, chromium, Metals such as lead, tin, zinc, palladium, and solder, alloys, and various inorganic powders made of carbon and the like are included. A filler can be used individually or in combination of 2 or more types. Silica or alumina is particularly suitable as a filler, and fused silica is particularly suitable as silica. Incidentally, the average particle diameter of the inorganic filler is preferably within the range of 0.001 μm to 80 μm. The average particle size of the inorganic filler can be measured by, for example, a laser diffraction particle size distribution measuring device, and in the present application, the particle size when the cumulative volume in the particle size distribution is 50% is referred to as the average particle size.

The amount of filler (especially inorganic filler) compounded is preferably 98% by weight or less (0% to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% to 70% by weight. In the case of functional inorganic fillers such as thermally conductive and electrically conductive fillers, the content is preferably 10% to 98% by weight.

Examples of flame retardants include antimony trioxide, antimony pentoxide, and brominated epoxy resins. A flame retardant can be used individually or in combination of 2 or more types. Silane coupling agents include, for example, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane and the like. A silane coupling agent can be used individually or in combination of 2 or more types. Examples of ion trapping agents include hydrotalcites and bismuth hydroxide. An ion trap agent can be used individually or in combination of 2 or more types.

From the viewpoint of adhesion and reliability, the adhesive layer 4 contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or phenoxy resin, and (D) a surface-treated inorganic filler. preferably.

(A) By using an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the known epoxy resins described above can be used. (B) The curing agent may be the known curing agent described above.

(C) The acrylic resin has both flexibility and strength and has high toughness. Preferred acrylic resins have a Tg (glass transition temperature) of −50° C. to 50° C. and are obtained by polymerizing a monomer having an epoxy group, glycidyl group, alcoholic hydroxyl group, phenolic hydroxyl group or carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth)acrylic copolymer. Furthermore, if acrylonitrile or the like is contained to exhibit rubber properties, higher toughness can be obtained.
In addition, the phenoxy resin (C) has a long molecular chain and a structure similar to that of an epoxy resin, and acts as a flexible material in a composition with a high crosslink density, imparting high toughness and high strength. However, a tough composition can be obtained. Preferable phenoxy resins have a bisphenol A-type main skeleton, but commercially available phenoxy resins such as bisphenol F-type phenoxy resins, bisphenol A/F mixed-type phenoxy resins, and brominated phenoxy resins are also preferred.

(D) Surface-treated inorganic fillers include inorganic fillers surface-treated with a coupling agent. As the inorganic filler, the known inorganic fillers described above can be used, such as silica and alumina. The surface treatment with the coupling agent improves the dispersibility of the inorganic filler. As a result, an adhesive layer having excellent fluidity can be obtained, and the adhesive strength with the metal layer 3 can be improved. In addition, since the inorganic filler can be highly filled, the water absorption can be lowered and the moisture resistance can be improved.

For example, the surface treatment of an inorganic filler with a silane coupling agent is carried out by dispersing the inorganic filler in a silane coupling agent solution by a known method, thereby separating hydroxyl groups present on the surface of the inorganic filler and the silane coupling agent. Hydrolyzable groups such as alkoxy groups react with hydrolyzed silanol groups to form Si--O--Si bonds on the surface of the inorganic filler.

Although the thickness of the adhesive layer 4 is not particularly limited, it is preferably 3 μm or more, more preferably 5 μm or more, from the viewpoint of sufficient adhesion between the metal layer and the adherend. 150 μm or less is preferable, and 100 μm or less is more preferable to contribute. The adhesive layer 4 may be composed of a single layer or multiple layers.

Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25° C. and 50% RH. Also, the loss tangent tan δ of the adhesive layer 4 at 25° C. and 50% RH is preferably 3 or less.

The loss tangent tan δ is the value obtained when the temperature is raised from 0°C at a temperature elevation rate of 5°C/min using a dynamic viscoelasticity measuring device and measured at a measurement frequency of 1 Hz, and the temperature reaches 25°C.

If the loss tangent tan δ of the adhesive layer 4 at 25° C. and 50% RH is 0.4 or more, the adhesive layer 4 can relax the stress caused by the pin of the pickup device being pushed up. Therefore, even if the amount of push-up of the pin becomes large, it is possible to suppress the occurrence of traces of the pin on the metal layer 3 . If the loss tangent tan δ is 3 or less, good pick-up can be achieved without impairing the responsiveness due to pushing up of the pin.

In order to increase the loss tangent tan δ, it is preferable to increase low molecular weight components such as epoxy resins and phenol resins and decrease high molecular weight components such as acrylic resins. Moreover, when blending a filler, you may reduce a filler compounding quantity.

In addition, the adhesive layer 4 has a peeling force (23° C., peeling angle of 180 degrees, linear velocity of 300 mm/min) from the metal layer 3 in the B stage (uncured state or semi-cured state) of 0.3 N/25 mm or more. It is preferably 0.5 N/25 mm or more, more preferably 1.0 N/25 mm or more. When the peel force is less than 0.3 N / 25 mm, when the electronic device packaging tape in which the adhesive layer 4 and the metal layer 3 are singulated is expanded, between the adhesive layer 4 and the metal layer 3 Delamination may occur.

The water absorption rate of the adhesive layer 4 is preferably 1.5 vol % or less. The method for measuring water absorption is as follows. That is, an adhesive layer 4 (film adhesive) having a size of 50 × 50 mm is used as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass is measured. and M1. The sample is soaked in distilled water at room temperature for 24 hours, then taken out, the surface of the sample is wiped with filter paper, and quickly weighed to obtain M2. The water absorption is calculated by the following formula (1).
Water absorption (vol%) = [(M2-M1) / (M1 / d)] × 100 (1)
where d is the density of the film.
If the water absorption exceeds 1.5 vol %, the absorbed water may cause package cracks during solder reflow.

The saturated moisture absorption rate of the adhesive layer 4 is preferably 1.0 vol % or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film adhesive) having a diameter of 100 mm is used as a sample, the sample is dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and the dry mass is measured and measured as M1. do. The sample is soaked in a thermo-hygrostat at 85° C. and 85% RH for 168 hours, then taken out and quickly weighed to obtain M2. The saturated moisture absorption rate is calculated by the following formula (2).
Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1 / d)] × 100 (2)
where d is the density of the film.
If the saturated moisture absorption exceeds 1.0 vol %, moisture absorption during reflow increases the vapor pressure value, and there is a risk that good reflow characteristics cannot be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt % or less. The method for measuring the remaining volatile components is as follows. That is, an adhesive layer 4 (film adhesive) having a size of 50×50 mm was used as a sample, and the initial mass of the sample was measured to obtain M1. Weigh M2. The residual volatile matter is calculated by the following formula (3).
Residual volatile content (wt%) = [(M1-M2) / M1] × 100 (3)
If the residual volatile content exceeds 3.0 wt %, the solvent may volatilize due to heating during packaging, voids may occur inside the adhesive layer 4, and package cracks may occur.

Further, the adhesive force between the adhesive tape 5 and the adhesive layer 4 in the state where the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5 is preferably 0.03 to 0.5 N/25 mm. Since it is the adhesive force between the adhesive tape 5 and the adhesive layer 4 when the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is a radiation-curable adhesive. When the adhesive layer 4 and the metal layer 3 are picked up after the adhesive tape 5 is irradiated with radiation to reduce the adhesive strength, the adhesive strength after the radiation irradiation is used.

Adhesive strength is determined by laminating an adhesive tape 5 cut to a width of 25 mm and an adhesive layer 4 in an environment of 23° C. and 50% RH in accordance with JIS Z0237, and peeling using a universal tensile tester. Measured at an angle of 180° and a peeling speed of 300 mm/min.

To keep the adhesive force within the above range, the viscoelasticity and surface energy of the adhesive layer 52 and the adhesive layer 4 of the adhesive tape 5 may be adjusted, or a combination thereof may be adjusted.

If the adhesive strength between the adhesive tape 5 and the adhesive layer 4 is 0.5 N/25 mm or less, the pin push-up speed and push-up amount are reduced when the adhesive layer 4 and the metal layer 3 are picked up from the adhesive tape 5. Since the pin can be picked up even if the force applied to the metal layer is reduced, it is possible to suppress the occurrence of pin traces on the metal layer 3 . If the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 N/25 mm or more, the metal layer 3 and the adhesive layer 4 are separated from the adhesive tape when the metal layer 3 and the adhesive layer 4 are expanded. It is held well without

<Guide member 12>
A plurality of guide members 12 are provided along a row L of individual pieces of the metal layer 3 and the adhesive layer 4 with spaces between each other, and the spaces and the gaps between the pieces in the row L are aligned with the row G They are arranged so that they do not overlap in terms of direction. In the present embodiment, the guide members 12 having the same shape as the individual pieces of the metal layer 3 and the adhesive layer 4 are alternately arranged in the row G direction, ie, staggered. Further, the guide members 12 located at both ends in the longitudinal direction of the base tape 2 in the label portion 5a are located at positions protruding in the row L direction from the line of the end of the assembly 30 in the row L direction. is provided.

In this embodiment, the guide member 12 is made of the same material as the laminate 30, that is, the metal layer 3 and the adhesive layer 4. As shown in FIG. For this reason, a pressure roller R (see FIG. 5(B)) is used to correct the warp that occurs in the metal layer 3 when the metal layer 3 and the adhesive layer 4 are separated into individual pieces using a press-cut tooth. When applying pressure, the pressure roller R rolls while being supported by the guide member 12 . The guide members 12 are arranged so that the spaces between the guide members 12 and the gaps between the pieces in the row L do not overlap in the row G direction. Warpage of the metal layer 3 can be corrected without wrinkling the metal layer 3 due to excessive force being applied to the ends of the pieces between the pieces.

The guide member 12 is provided at a position protruding in the row L direction from the line at the end of the assembly 30 in the row L direction. Therefore, when the pressure roller R is run, the pressure roller R rides on the guide member 12 before the piece of the adhesive layer 4 and the metal layer 3 positioned at the head of the row L, and is positioned at the tail end of the row L. Since the pressure roller R passes through the guide member 12 after the pieces of the adhesive layer 4 and the metal layer 3 that are attached to each other, the ends of the piece positioned at the head of the row L and the piece positioned at the end of the row L The warpage of the metal layer 3 can be corrected without wrinkling the metal layer 3 due to the application of excessive force. The amount of protrusion is preferably 0.5 mm or more.

In this embodiment, the guide member 12 has the same shape as the pieces of the metal layer 3 and the adhesive layer 4. It is not limited to this as long as it is arranged in the shape of the individual pieces, and may have a shape different from that of the individual pieces. For example, a guide member longer in the row L direction than the individual pieces may be provided, such as having a shape having the same length from the front end to the rear end of two adjacent individual pieces in the row L direction. If the direction side is too long, the protective tape 20 applied to protect the metal layer 3 is stretched by the pressure roller R in the vicinity of the guide member when the pressure roller R passes through the guide member. When the stress applied to the masking tape 20 is relieved after passing through the pressure roller R, the metal layer 3 may follow and wrinkle like waving.

In this embodiment, the guide member 12 is provided at a position protruding in the row L direction from the line of the end of the assembly 30 in the row L direction. It may be provided at the same position as , or may be provided inside the line of the end portion in the row L direction of the assembly 30 . In this case, the metal layer 3 of the individual pieces located at the leading end and the trailing end in the traveling direction of the pressure roller of the assembly is wrinkled, and voids are generated when they are bonded to the electronic device. Since such voids do not occur in most of the individual pieces, there is no major problem.

The guide member 12 may be made of a material different from that of the assembly 30 , but the thickness of the guide member 12 is preferably the same as the thickness of the laminate 30 . When composed of different materials, it can be composed of resin and/or metal.

<Support member 6>
The thickness of the support member 6 corresponds to the level difference between the laminated portion of the metal layer 3, the adhesive layer 4, and the label portion 5a of the adhesive tape 5 on the base tape 2 and the peripheral portion 5b of the adhesive tape 5. It is sufficient if the thickness is equal to or greater than the thickness of the metal layer 3 and the adhesive layer 4 . Since the support member 6 has such a thickness, when the electronic device packaging tape 1 is wound into a roll, there is a space between the adhesive tape 5 and the back surface of the base tape 2 overlapping the surface thereof. Therefore, when the electronic device packaging tape 1 is rolled and stored, the thickness of the metal layer 3 and the adhesive layer 4 is present in the overlapping portion of the electronic device packaging tape 1. It can prevent scarring.

The support member 6 is not limited to both ends in the width direction of the base tape 2, and may be provided anywhere as long as it corresponds to the outer side of the label portion 5a of the adhesive tape 5. When the adhesive tape 5 is wound into a product, the step between the metal layer 3, the adhesive layer 4, the circular label portion 5a of the adhesive tape 5, the laminated portion of the support member 6, and the peripheral portion 5b of the adhesive tape 5 overlap. On the other hand, from the viewpoint of preventing the step from being transferred to the surface of the thin and flexible metal layer 3, it should be provided in the region from both ends in the width direction of the base tape 2 to the metal layer 3 and the adhesive layer 4. is preferred.

Moreover, it is preferable to provide the support member 6 on the second surface opposite to the first surface on which the metal layer 3, the adhesive layer 4 and the adhesive tape 4 of the base tape 2 are provided.

When the supporting members 6 are provided at both ends of the base tape 2 in the short direction, they can be provided intermittently or continuously along the longitudinal direction of the base tape 2. From the viewpoint of suppressing the thickness, it is preferable to provide the base tape 2 continuously along the longitudinal direction.

As the support member 6, for example, an adhesive tape obtained by applying an adhesive to a resin film substrate can be preferably used. By attaching such an adhesive tape to predetermined positions on both end portions of the second surface of the base tape 2, the electronic device package tape 1 of the present embodiment can be formed. Only one layer of the adhesive tape may be attached, or thin tapes may be laminated.

The base resin of the adhesive tape is not particularly limited, but should be selected from polyethylene terephthalate (PET), polypropylene, and high-density polyethylene in terms of heat resistance, smoothness, and availability. is preferred. The composition and physical properties of the adhesive of the adhesive tape are not particularly limited as long as it does not separate from the base tape 2 in the winding process and storage process of the electronic device package tape 1 .

Next, an example of a method for manufacturing the electronic device package tape 1 according to the present embodiment will be described. First, a long metal layer 3 is prepared. A commercially available metal foil may be used as the metal layer 3 .

Separately, a long film-like adhesive layer 4 is formed. The adhesive layer 4 can be formed using a conventional method of preparing a resin composition and forming it into a film-like layer. Specifically, for example, the resin composition is applied onto a suitable separator S (release paper, etc.) and dried (in cases such as when heat curing is required, heat treatment is performed as necessary and then dried). , a method of forming the adhesive layer 4, and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 4A, the metal layer 3 and the adhesive layer 4 are heat-bonded at 80° C. using a bonding roller r or the like. Next, as shown in FIG. 4(B), the adhesive layer 4 separated from the separator S is bonded to the supporting tape 200 using a bonding roller r or the like.

In the above description, after laminating the metal layer 3 and the adhesive layer 4, the supporting tape 200 is laminated on the surface of the adhesive layer 4 side. After laminating , the metal layer 3 may be laminated on the adhesive layer 4 . As the supporting tape 200, the same material as the base tape 2 can be used.

Next, as shown in FIG. 4(C), an adhesive layer is formed by using press-cutting teeth having a predetermined label shape (rectangular shape in this case) on the outer edge and rectangular teeth arranged on the sides of grid-shaped teeth. 4 and the metal layer 3 are separated into pieces of a predetermined size in advance, and a guide member 12 having the same shape as the pieces of the metal layer 3 and the adhesive layer 4 is placed on the side of the assembly of the pieces. Pre-cutting is performed so as to be alternately formed in the row G direction, and the peripheral unnecessary portions F are peeled off and removed from the supporting tape 200 as shown in FIG. 4(D).

Here, after the metal layer 3 and the adhesive layer 4 are separated into individual pieces using the press-cut teeth, the outer edge of the separated metal layer 3 is pressed into the adhesive layer 4 side. warpage (not shown) occurs. Therefore, as shown in FIG. 5(A), a protective tape 20 is attached to the surface of the metal layer 3 and the adhesive layer 4 opposite to the side of the supporting tape 200, and as shown in FIG. , the protective tape 20, the metal layer 3, the adhesive layer 4, and the support tape 200 are pressurized using a pair of pressure rollers R to correct warping. At this time, the pressure roller R rolls while being supported by the guide member 12 . The guide members 12 are arranged so that the spaces between the guide members 12 and the gaps between the pieces in the row L do not overlap in the row G direction. Warpage of the metal layer 3 can be corrected without wrinkling the metal layer 3 due to excessive force being applied to the ends of the pieces between the pieces. Further, the pressure roller R rides on the guide member 12 before the piece of the adhesive layer 4 and the metal layer 3 located at the head of the row L, and the guide member 12 moves behind the piece located at the end of the row L. Since the pressure roller R passes through the metal layer 3, wrinkles are not applied to the ends of the piece located at the head of the row L and the piece located at the end of the row L, and the metal layer 3 is not wrinkled. Warping of the layer 3 can be corrected.
As the protective tape 20, the same material as the base tape 2 or a known separator can be used.

Separately, an adhesive tape 5 is produced. The base film 51 can be formed by a conventionally known film forming method. Examples of the film-forming method include a calendar film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, and the like. Next, an adhesive composition is applied onto the base film 51 and dried (heated and crosslinked as necessary) to form an adhesive layer 52 . Coating methods include roll coating, screen coating, gravure coating, and the like. The pressure-sensitive adhesive composition may be applied directly to the base film 51 to form the pressure-sensitive adhesive layer 52 on the base film 51. Alternatively, the pressure-sensitive adhesive composition may be applied to the surface of a release paper that has undergone a release treatment. or the like to form the adhesive layer 52 , and then the adhesive layer may be transferred to the base film 51 . As a result, the adhesive tape 5 having the adhesive layer 52 formed on the base film 51 is produced.

After that, the support tape 200 is peeled off from the laminate of the protective tape 20, the metal layer 3, the adhesive layer 4, and the support tape 200, which has been pressurized, and the protective tape 20 is removed as shown in FIG. The adhesive tape 5 is laminated so that the adhesive layer 52 side surface of the adhesive tape 5 is in contact with the adhesive layer 4 side surface of the predetermined shaped metal layer 3 and adhesive layer 4 provided thereon.

Next, as shown in FIG. 6B, the adhesive tape 5 is pre-cut into a predetermined shape using a press cutting blade or the like, and as shown in FIG. to remove. If the protective tape 20 is the same as the base tape 2, it becomes the base tape 2 in FIGS. When a protective tape 20 different from the base tape 2 is used, the protective tape 20 is peeled off and the base tape 2 is laminated. As the supporting member 6, the electronic device package tape 1 is formed by attaching an adhesive tape obtained by applying an adhesive to a resin film base material at predetermined positions on both ends of the second surface of the base tape 2. made.

<How to use>
Next, a method for manufacturing an electronic device package 8 using the electronic device package tape 1 of this embodiment will be described with reference to FIGS. 9 to 11. FIG. In this embodiment, a semiconductor chip C flip-chip connected on an adherend 9 will be described as an example of the electronic device package 8 .

[Mounting process of semiconductor wafer W]
First, a separate dicing tape D similar to the adhesive tape 5 of the electronic device package tape 1 of the present invention is prepared. A wafer W is adhered and fixed by adhesive holding (mounting process of the semiconductor wafer W), and a ring frame R is adhered to the peripheral portion of the dicing tape D. As shown in FIG. At this time, the dicing tape D is adhered to the back surface of the semiconductor wafer W. As shown in FIG. The back surface of the semiconductor wafer W means the surface opposite to the circuit surface (also called non-circuit surface, non-electrode forming surface, etc.). The method of adhesion is not particularly limited, but a method of thermocompression bonding is preferred. The crimping is usually performed while pressing with a pressing means such as a crimping roll.

[Dicing process of semiconductor wafer W]
Next, as shown in FIG. 9B, the semiconductor wafer W is diced. As a result, the semiconductor wafer W is cut into pieces of a predetermined size and individualized (small pieces) to manufacture the semiconductor chips C. As shown in FIG. Dicing is performed, for example, from the circuit surface side of the semiconductor wafer W according to a conventional method. In addition, in this step, for example, a cutting method called full cut, in which the dicing tape D is cut, can be employed. The dicing device used in this step is not particularly limited, and conventionally known devices can be used. When expanding the dicing tape D, the expansion can be carried out using a conventionally known expanding device.

[Step of picking up semiconductor chip C]
As shown in FIG. 9C, the semiconductor chip C is picked up and separated from the dicing tape D. Then, as shown in FIG. The pickup method is not particularly limited, and conventionally known various methods can be employed. For example, the dicing tape D to which the semiconductor chip C and the ring frame R are bonded is placed on the stage S of the pickup device with the base film side facing down, and with the ring frame R fixed, the dicing tape D is shaped like a hollow cylinder. push-up member T to extend the dicing tape D. In this state, the individual semiconductor chips C are pushed up from the base film side of the dicing tape D with pins N, and the pushed-up semiconductor chips C are picked up by a pick-up device.

[Flip chip connection process]
The picked up semiconductor chip C is fixed to an adherend 9 such as a substrate by a flip chip bonding method (flip chip mounting method), as shown in FIG. 9(D). Specifically, the semiconductor chip C is always attached to the adherend 9 in such a manner that the circuit surface of the semiconductor chip C (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, etc.) faces the adherend 9. Fixed according to law. For example, first, flux is applied to the bumps 10 as connection portions formed on the circuit surface side of the semiconductor chip C. Then, as shown in FIG. Next, the bumps 10 of the semiconductor chip C are brought into contact with the bonding conductive material 11 (such as solder) adhered to the connection pads of the adherend 9 and pressed while the bumps 10 and the conductive material 11 are melted. Electrical conduction between the semiconductor chip C and the adherend 9 can be ensured, and the semiconductor chip C can be fixed to the adherend 9 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 9, and the gap distance is generally about 30 μm to 300 μm. Flux remaining on the facing surfaces and gaps between the semiconductor chip C and the adherend 9 is removed by washing.

As the adherend 9, various substrates such as a lead frame and a circuit board (such as a wiring circuit board) can be used. Materials for such a substrate are not particularly limited, but include ceramic substrates and plastic substrates. Examples of plastic substrates include epoxy substrates, bismaleimide triazine substrates, and polyimide substrates. A chip-on-chip structure can also be obtained by using another semiconductor chip as the adherend 9 and flip-chip connecting the semiconductor chip C. FIG.

Next, as shown in FIG. 10A, the base tape 2 of the electronic device package tape 1 according to the present embodiment is peeled off to expose the metal layer 3 and the adhesive layer 52 of the adhesive tape 5, The peripheral portion of the adhesive layer 52 is fixed to the ring frame R.

Next, as shown in FIG. 10B, the metal layer 3 and the adhesive layer 4 that have been separated into individual pieces are picked up and separated from the adhesive tape 5. Next, as shown in FIG. The pick-up can be performed in the same process as the above-described pick-up process for the semiconductor chip 10C.

Next, the adhesive layer 4 side of the picked up metal layer 3 and adhesive layer 4 is bonded to the back surface of the semiconductor chip C flip-chip connected as shown in FIG. At this time, since the warpage of the metal layer 3 has been corrected, the metal layer 3 is bonded to the semiconductor chip C without entraining voids. . Thereafter, the adhesive layer 4 is cured, and the periphery of the semiconductor chip C with the metal layer 3 and the gap between the semiconductor chip C and the adherend 9 are filled with a sealing material (sealing resin or the like) for sealing. Sealing is performed according to a conventional method.

In the above description, the semiconductor chip C flip-chip connected on the adherend 9 has been described as an example of the electronic device package 8. However, it is not limited to this. In the electronic device package structure in which other semiconductor chips are laminated, in order to use the metal layer 3 of the electronic device package tape 1 of the present invention as a spacer between both chips, the semiconductor chip on the lower side through the adhesive layer 4 A metal layer 3 may be provided thereon.

Further, in the present embodiment, the adhesive layer 52, the adhesive layer 4, and the metal layer 3 are provided in this order, but the adhesive layer 52, the metal layer 3, and the adhesive layer 4 are provided in this order. good too.

Further, in the present embodiment, the guide members 12 are provided along the row L on both sides of the assembly 30 in the lateral direction of the base tape 2. Along L, one or more may be provided. Further, it may be provided on both sides of the assembly 30 in the lateral direction of the base tape 2 and between the rows L and L.

In the above-described first embodiment, the guide member 12 is provided only along the row L, but as a second embodiment, as shown in FIG. In addition to providing the guide member 12b, another guide member 12a may be provided along the row G on both sides of the assembly 30 in the longitudinal direction of the base tape 2. FIG. A plurality of other guide members 12a are provided with a space therebetween, and in the present embodiment, they are formed in a rectangular shape with sides in the row G direction larger than the individual pieces of the metal layer 3 and the adhesive layer 4. ing.

Also in the present embodiment, a pressure roller R (see FIG. 5B) is used to correct the warp that occurs in the metal layer 3 when the metal layer 3 and the adhesive layer 4 are separated into individual pieces using a press-cut tooth. ), the pressure roller R rolls while being supported by the guide members 12a and 12b. The warpage of the metal layer 3 can be corrected without wrinkling the metal layer 3 due to the application of force.

In the first embodiment described above, since no other guide member 12a is provided, a pressure roller is used to smooth the adhesive layer 4 and the metal layer 3 after pre-cutting the adhesive layer 4 and the metal layer 3 . (See FIG. 5(B)), when R is run, an extra force is applied to the ends of the piece located at the head of the row L and the piece located at the end of the row L, and the metal layer 3 is damaged. Although the occurrence of wrinkles can be prevented, excessive load is applied to the guide members 12 located at both ends of the row L, and the guide members 12 alone cannot support the individual pieces of metal located at both ends of the row L. Some distortion may occur at the edges of layer 3 . Due to this distortion, voids may be involved when the adhesive layer 4 is bonded to the semiconductor chip C. However, since the distortion is small, the voids are eliminated during the process of curing the adhesive layer 4 thereafter. However, in the present embodiment, since another guide member 12a is provided, it is possible to prevent the end portions of the individual metal layers 3 located at both ends of the row L from being distorted, and voids are more reliably formed. occurrence can be prevented.

As for the other guide members 12a, long guide members 12a may be provided on each side of the assembly 30 in the longitudinal direction of the base tape 2, but they are formed by one guide member 12a as in the present embodiment. In the manufacturing process of the electronic device packaging tape 1, it is preferable to provide a plurality of guide members 12a that are shorter than the length of the guide member 12a. In addition, when pre-cutting is performed so that the guide members 12a and 12b are formed, and the peripheral unnecessary portion F is removed from the base tape 2 (see FIG. 4(D)), the unnecessary portion F and the guide are removed. It is possible to more reliably prevent the member 12a from being taken away.

The other guide member 12a may have the same shape as the individual piece of the metal layer 3 and the adhesive layer 4 like the guide member 12b, but is formed in the same shape as the individual piece as in the present embodiment. If the longer guide member 12a is provided, the metal layer 3 and the adhesive layer 4, which are separated into individual pieces for bonding to the back surface of the semiconductor chip C in the process of manufacturing the electronic device package 8, are used. (see FIG. 10(B)), it is possible to reliably prevent picking up other guide members mistakenly for individual pieces of the metal layer 3 and the adhesive layer 4 .

In addition, in this embodiment, each component has the same configuration as that of the above-described first embodiment except for the arrangement of another guide member 12a.

In the second embodiment described above, the guide members 12b are provided along the rows L in the same manner as the guide members 12, and along the rows G, metal A rectangular guide member 12a having a larger side in the row G direction than the individual pieces of the layer 3 and the adhesive layer 4 is provided. As a third embodiment, as shown in FIG. The guide members positioned at the four corners may be L-shaped guide members 12c formed by connecting other guide members 12a and 12b in FIG.

Also in the present embodiment, a pressure roller R (see FIG. 5B) is used to correct the warp that occurs in the metal layer 3 when the metal layer 3 and the adhesive layer 4 are separated into individual pieces using a press-cut tooth. ), the pressure roller R rolls while being supported by the guide members 12a and 12b. The warpage of the metal layer 3 can be corrected without wrinkling the metal layer 3 due to the application of force. In addition, as in the second embodiment described above, when the pressure roller R is run to smooth the adhesive layer 4 and the metal layer 3 (see FIG. 5B), at both ends of the row L, It is possible to prevent the end portion of the metal layer 3 of the individual piece from being distorted, and to more reliably prevent the generation of voids.

In addition, in this embodiment, each component has the same configuration as that of the above-described first embodiment except for the arrangement of other guide members 12a and 12c.

<Example>
EXAMPLES Next, examples and comparative examples will be described in detail in order to further clarify the effects of the present invention, but the present invention is not limited to these examples.

(1) Preparation of adhesive tape <Adhesive composition (1)>
As the acrylic copolymer (A1) having a functional group, a copolymer composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, having a ratio of 2-ethylhexyl acrylate of 80 mol% and a mass average molecular weight of 700,000. was prepared. Next, 2-isocyanatoethyl methacrylate is added so that the iodine value is 15, and the acrylic copolymer (a- 1) was prepared.

10 parts by mass of Coronate L (manufactured by Tosoh Corporation) as a polyisocyanate is added to 100 parts by mass of the acrylic copolymer (a-1), and 3 masses of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. The added mixture was dissolved in ethyl acetate and stirred to obtain an adhesive composition (1).

The following substrate films were produced.
<Base film (1)>
Resin beads of an ethylene-methacrylic acid copolymer were melted at 200° C. and formed into a long film having a thickness of 150 μm using an extruder to prepare a substrate film (1). The ethylene-methacrylic acid copolymer used was Nucrel NO35C (trade name) manufactured by DuPont Mitsui Polychemicals.

<Adhesive tape (1)>
The pressure-sensitive adhesive composition (1) is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying is 10 μm, and dried at 110° C. for 3 minutes to form a pressure-sensitive adhesive layer. After that, it was laminated with the base film (2) to prepare an adhesive tape (1).

(2) Preparation of adhesive layer

<Adhesive layer (1)>
Acrylic resin (manufactured by Nagase ChemteX Corporation, product name “Teisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.) 80 parts by mass and naphthalene type epoxy resin (manufactured by DIC Corporation, product name “HP-4700”) 10 Parts by mass and 10 parts by mass of a phenolic resin (manufactured by Meiwa Kasei Co., Ltd., product name "MEH7851") as a curing agent were dissolved in methyl ethyl ketone to prepare an adhesive composition solution. This adhesive composition solution was applied onto a release treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to silicone release treatment, and then dried at 130° C. for 5 minutes. This produced an adhesive layer (1) having a thickness of 20 μm.
(3) Preparation of metal layer <metal layer (1)>
F2-WS (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 35 μm)

(4) Production of base tape The following were produced as base tapes.
<Resin film (1)>
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by Kuraray Co., Ltd., trade name “Septon KF-2104”) and homopropylene (PP) (manufactured by Ube Industries, Ltd., trade name “J-105G”) ) were mixed at a compounding ratio of 40:60, melted at 200° C., and molded into a long film having a thickness of 90 μm using an extruder to prepare a resin film (1).

<Adhesive layer composition for base tape (1)>
The acrylic copolymer (A2) having a functional group consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 70 mol%, the mass average molecular weight is 500,000, the glass transition temperature An acrylic copolymer (a2) having a temperature of −50° C., a hydroxyl value of 30 g KOH/g and an acid value of 5 mg KOH/g was prepared. Add 8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Tosoh Corporation) to 100 parts by mass of the acrylic copolymer (a2), dissolve in ethyl acetate, stir, and prepare a base material. A pressure-sensitive adhesive layer composition (1) for tape was obtained.
<Base tape (1)>

The prepared pressure-sensitive adhesive layer composition (1) for base tape is applied to a release liner made of a release-treated polyethylene-terephthalate film so that the thickness after drying becomes 10 μm, and the composition is applied at 110° C. for 3 minutes. After drying, it was laminated with the resin film (1) to prepare a base tape (1) in which a pressure-sensitive adhesive layer for a base tape was formed on the resin film.

(5) Preparation of electronic device package tape <Example 1>
The metal layer (1) obtained as described above and the adhesive layer (1) side of the adhesive layer (1) with a separator were laminated at an angle of 120°, a pressure of 0.2 MPa, a temperature of 80°C, and a speed of 1 m/m. After laminating under the condition of min, the separator is peeled off, and the base tape (1) is laminated on the adhesive layer (1) under the conditions of a lamination angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s. rice field. The adhesive layer (1) and the metal layer (1) are cut using a press-cut tooth into a rectangular label shape whose outer edge of the assembly is smaller than the precut shape of the adhesive tape (1), and is 10.6 x 10.6 mm square. As shown in FIG. 7(A), a first guide member (12b in FIG. 7(A)) is formed along the row L, and an aggregate in the longitudinal direction of the base tape 2 A second guide member (12a in FIG. 7(A)) was formed along the row G on both sides of 30. As shown in FIG. The first guide members have the same shape as the individual pieces of the metal layer and the adhesive layer, and alternately with the individual pieces in the row G direction, and as shown in FIG. The guide members located at both ends in the longitudinal direction of the assembly 30 were arranged so as to be located outside the lines of the ends of the assembly 30 in the row L direction (that is, protrude in the row L direction). The second guide member had a side in the row G direction and a side in the column L direction of 21.8×10.6 mm square.

After that, another base tape (1) is attached as a protective tape to the metal layer (1) side, and a pressure roller with a width of 400 mm is used to protect it under the conditions of a linear pressure of 50 kgf/cm and a speed of 1 m/min. A laminate of the base tape (1) as a tape, the metal layer (1), the adhesive layer (1) and the base tape (1) was pressurized. After that, the base tape (1) is peeled off from the adhesive layer (1), and the exposed adhesive layer (1) side and the adhesive layer (1) of the adhesive tape (1) are separated from the metal layer (1). And the adhesive layer (1) was laminated around the adhesive layer (1) so that the adhesive layer (1) was in contact with the base tape (1) as a protective tape. Next, the pressure-sensitive adhesive tape (1) is pre-cut into a circular shape so that the metal layer (1) and the adhesive layer (1) are arranged in the center, and the unnecessary peripheral portions are removed by peeling from the base tape (1). Then, an electronic device package tape according to Example 1 was produced.

<Example 2>
An electronic device package tape according to Example 2 was produced in the same manner as in Example 1, except that the second guide member was not provided.

<Example 3>
The first guide members are arranged so that the guide members positioned at both ends in the longitudinal direction of the base tape 2 in the label portion 5a are positioned 5 mm inside the line of the end portion in the row L direction of the assembly 30. An electronic device package tape according to Example 3 was produced in the same manner as in Example 2.

<Example 4>
The length of the first guide member is such that the guide members positioned at both longitudinal ends of the base tape 2 in the label portion 5a can be positioned on the same line as the ends of the assembly 30 in the row L direction. produced an electronic device package tape according to Example 4 in the same manner as in Example 2. The first guide members positioned at both ends in the row L direction have sides in the row L direction that are approximately half the length of the other first guide members.

<Comparative Example 1>
The shape of the first guide member is one long one continuous in the row L direction, and both ends in the row L direction are long enough to be positioned outside the line of the ends in the row L direction of the assembly 30 An electronic device package tape according to Comparative Example 1 was produced in the same manner as in Example 2, except that the tape was arranged in such a manner that

<Comparative Example 2>
The shape of the first guide member is one long one continuous in the row L direction, and both ends in the row L direction are long enough to be positioned outside the line of the ends in the row L direction of the assembly 30 An electronic device package tape according to Comparative Example 2 was produced in the same manner as in Example 1, except that the tape was arranged in such a way as to be .

The electronic device package tapes according to Examples 1 to 4 and Comparative Examples 1 and 2 were subjected to the following measurements and evaluations. Table 1 shows the results.

(Wrinkles near the first guide member)
Similarly, it was confirmed whether or not wrinkles were generated in the metal layer of the piece positioned near the first guide member. A product with no wrinkles was evaluated as good, and a product with wrinkles was evaluated as defective with x.

(Individual voids located at the leading end and trailing end of the pressure roller in the aggregate)
Ten 10.6 × 10.6 mm square glass chips were prepared, and on the chips, the leading end portion and the trailing portion of the pressure roller of the assembly of the electronic device package tapes according to the above-described Examples and Comparative Examples were applied. Pieces positioned at the ends were pasted together. Each chip was observed from the glass side with an optical microscope, and after confirming the presence or absence of voids, the adhesive layer was cured under the conditions of a temperature of 140°C, a pressure of 0.7 MPa, and a time of 30 minutes, and the presence or absence of voids was again confirmed. did. Good products are those in which no voids were observed after lamination or after curing of the adhesive layer. ○ was evaluated. In the case where voids were generated after lamination and did not disappear even after curing of the adhesive layer, the voids were generated in individual pieces located at the leading end and the trailing end of the pressure roller of the assembly in the running direction. Since most of the other individual pieces can be used without any problem, they are evaluated as acceptable.

As shown in Table 1, in the electronic device package tapes according to Examples 1 to 4, the first guide member having the same shape as the individual piece of the metal layer and the adhesive layer is arranged along the column L, and the individual piece and the row Since they were alternately arranged in the G direction, good results were obtained in the evaluation of wrinkles near the first guide member. Further, in Example 1, since the second guide member was provided, excellent results were obtained in the evaluation of voids in the individual pieces located at the leading end and the trailing end in the traveling direction of the pressure roller of the assembly. In Example 2, the second guide member was not provided. Because of the arrangement, good results were obtained in the evaluation of voids in the individual pieces located at the leading end and trailing end of the pressure roller in the running direction of the assembly. In Examples 3 and 4, the guide members positioned at both ends in the longitudinal direction of the first guide member are not positioned outside the line of the ends in the row L direction of the aggregate 30, so the aggregate In the evaluation of voids in individual pieces located at the leading end and the trailing end of the pressure roller in the running direction, the results were inferior to those of Examples 1 and 2.

On the other hand, in the electronic device package tapes according to Comparative Examples 1 and 2, since the first guide member is formed in a single elongated rectangular shape, the evaluation of wrinkles near the first guide member is inferior. result.

1: Electronic device package tape 2: Base tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label part 5b: Peripheral part 6: Support member 12: Guide member 30: Aggregate

Claims (10)

a long base tape;
an aggregate formed by assembling a plurality of individual pieces each formed of a laminate of an adhesive layer and a metal layer provided on the base tape;
an adhesive tape covering the assembly and having a label portion having a predetermined planar shape provided so as to come into contact with the base tape around the assembly,
A plurality of the individual pieces in the assembly are arranged in a row along the longitudinal direction of the base tape, and arranged in a row along the width direction of the base tape,
a plurality of guide members spaced apart from each other along the row;
The electronic device package tape, wherein the guide members are arranged so that the spaces and the gaps between the pieces in the row do not overlap in the row direction. 2. The electronic device package tape according to claim 1 , wherein the guide member is provided at a position protruding in the column direction from a line at the end of the assembly in the column direction. 3. The electronic device package tape according to claim 1, wherein the guide members are provided on both sides of the assembly in the lateral direction of the base tape. 4. The electronic device package tape according to claim 1, wherein the guide member is composed of the laminate. The tape for electronic device packaging according to any one of claims 1 to 4, wherein the adhesive layer has a loss tangent of 0.4 or more at 25°C and 50% RH. 6. The tape for electronic device packaging according to any one of claims 1 to 5, wherein the metal layer contains copper or aluminum. 2. From claim 1, wherein the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic or phenoxy resin, and (D) a surface-treated inorganic filler. The electronic device package tape according to claim 6 . The adhesive tape has an adhesive layer, and the adhesive layer is composed of an acrylic acid ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms). , a hydroxyl group-containing monomer, and an acrylic polymer comprising an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule. 1. The electronic device package tape according to claim 1. Another guide member is provided along the row,
The electronic device package according to any one of claims 1 to 8, wherein the other guide members are provided on both sides of the aggregate in the longitudinal direction of the base tape. tape. 10. The electronic device package tape according to claim 9, wherein a plurality of said other guide members are provided with a space therebetween.

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