JP6996007B2 - Circuit manufacturing system - Google Patents

Description

The present disclosure relates to a circuit manufacturing system in which conductor circuits are inspected and repaired.

Conventionally, various techniques have been proposed for a circuit manufacturing system in which a conductor circuit is inspected and repaired. For example, the technique described in Patent Document 1 below is a solder paste printing system in which a solder paste is applied onto a substrate surface via a mask. When the inspection unit detects a printing defect of printing defects, the dispenser unit prints defects. To repair the area, apply cream solder to the area. On the other hand, when the inspection unit detects the printing defect of the cream solder dripping, the bridge and the bleeding, the substrate is conveyed to the dispenser unit provided with the suction dispenser, and the excess cream solder is sucked there.

Japanese Unexamined Patent Publication No. 2007-96153

As a result, the technique described in Patent Document 1 can repair a soldering defective portion, but is not suitable for repairing a conductor circuit manufactured through various steps other than coating.

The present disclosure has been made in view of the above-mentioned points, and an object of the present invention is to provide a circuit manufacturing system suitable for repairing a conductor circuit manufactured by a full additive.

This specification is a circuit manufacturing system that manufactures a conductor circuit in a full additive manner, and inspects a modeling unit that forms a plurality of conductor circuits according to a modeling design having a plurality of circuit patterns, and an inspection that inspects a plurality of conductor circuits. A unit and a control unit are provided, and the control unit identifies repair points of a plurality of conductor circuits based on the inspection results of the inspection unit, and determines whether or not repair is possible based on the state of the repair points. When it is determined that repair is possible, the repair process of repairing the repaired part by the modeling unit, and when it is determined by the determination process that the repair is not possible, the modeling design used in the modeling unit after the determination of the determination process is related to the repaired part. Disclosed is a circuit manufacturing system that executes a change process for changing the modeling design used in the modeling unit by deleting the circuit pattern to be performed.

According to the present disclosure, the circuit manufacturing system is suitable for repairing conductor circuits manufactured in full additive.

It is a figure which shows the circuit manufacturing apparatus. It is a block diagram which shows the circuit forming apparatus. It is a flowchart which shows the flow of each operation of a circuit forming apparatus. It is a figure which shows the modeling design. It is a figure which shows the conductor circuit of the 1st layer. It is a figure which shows the change of the modeling design. It is a figure which shows the change of the modeling design. It is a figure which shows the repair to the repair part in a short circuit state. It is a figure which shows the repair to the repair part in an open state. It is a figure which shows the repair pattern. It is a figure which shows the repair to the repair part in a high resistance state. It is a figure which shows the repair pattern.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. However, in the drawings, a part of the structure is omitted, and the dimensional ratio of each drawn part is not always accurate.

As shown in FIG. 1, the circuit manufacturing apparatus 10 includes a transfer device 20, a first modeling unit 22, a second modeling unit 24, an inspection unit 26, a removal unit 200, and a control device 27. The transfer device 20, the first modeling unit 22, the second modeling unit 24, the inspection unit 26, and the removal unit 200 are arranged on the base 28. The base 28 is generally rectangular. In the following description, the longitudinal direction of the base 28 will be referred to as the X-axis direction, the lateral direction of the base 28 will be referred to as the Y-axis direction, and the direction orthogonal to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction. ..

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. On the other hand, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52.

In the X-axis slide mechanism 30, the X-axis slide rail 34 is provided on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38. When the electromagnetic motor 38 is driven, the X-axis slider 36 moves to an arbitrary position in the X-axis direction.

In the Y-axis slide mechanism 32, the Y-axis slide rail 50 is provided on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. The stage 52 is slidably held in the Y-axis direction by the Y-axis slide rail 50. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56. When the electromagnetic motor 56 is driven, the stage 52 moves to an arbitrary position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 28 by the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 includes a base 60, a holding device 62, and an elevating device 64. The base 60 is formed in a flat plate shape. A substrate is placed on the upper surface of the base 60. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The substrate placed on the base 60 is fixed on the base 60 by sandwiching both edges in the X-axis direction between the holding devices 62. The elevating device 64 is provided below the base 60, and raises and lowers the base 60 in the Z-axis direction.

The first modeling unit 22 is a unit that forms wiring on a substrate fixed to a base 60. The first modeling unit 22 includes a first printing unit 72 and a firing unit 74.

The first printing unit 72 includes an inkjet head (see FIG. 2) 76. The inkjet head 76 linearly ejects metal ink on a substrate fixed to a base 60. The metal ink is a metal ink in which fine metal particles are dispersed in a solvent. The inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element. Although not shown, the first modeling unit 22 is provided with a unit for performing maintenance such as capping on the inkjet head 76.

The firing unit 74 includes a first laser irradiation device (see FIG. 2) 78. The first laser irradiation device 78 irradiates the metal ink with a laser on a substrate fixed to the base 60. As a result, the metal ink is fired to form wiring. Here, in the firing of metal ink, by applying energy to the metal ink, the solvent is vaporized, the metal fine particle protective film is decomposed, and the metal fine particles are in contact with each other or fused to each other, so that the conductivity becomes conductive. It means the phenomenon that becomes high. When the metal ink is fired in this way, metal wiring is formed.

In the following description, the material obtained by firing the metal ink on the substrate is referred to as a conductor. Therefore, the wiring is composed of conductors.

The second modeling unit 24 is a unit that forms an insulating resin layer on a substrate fixed to the base 60. The second modeling unit 24 includes a second printing unit 84 and a curing unit 86.

The second printing unit 84 includes an inkjet head (see FIG. 2) 88. The inkjet head 88 ejects an ultraviolet curable resin on a substrate fixed to a base 60. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which an ultraviolet curable resin is heated to generate bubbles and discharged from a nozzle. Although not shown, the second modeling unit 24 is provided with a unit for performing maintenance such as capping on the inkjet head 88.

The cured portion 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin on the substrate fixed to the base 60. The flattening device 90 makes the thickness of the UV curable resin uniform by scraping off the excess resin while leveling the surface of the UV curable resin with, for example, a roller or a blade. The irradiation device 92 includes a mercury lamp or an LED as a light source. The mercury lamp or LED irradiates the ultraviolet curable resin with ultraviolet rays on a substrate fixed to the base 60. As a result, the ultraviolet curable resin is cured to become an insulating resin layer.

In the following description, the cured resin on the substrate is referred to as an insulating resin body. Therefore, the insulating resin layer is composed of an insulating resin body.

The inspection unit 26 includes an electrical unit 100 and an appearance unit 102. The electric unit 100 includes an electric checker 110 (see FIG. 2). The exterior portion 102 includes a camera 112 (see FIG. 2). The operation of the electric checker 110 and the camera 112 will be described later.

The removal unit 200 includes a second laser irradiation device 202 (see FIG. 2). The second laser irradiation device 202 irradiates the conductor with a laser on the substrate fixed to the base 60. The conductor at the point irradiated with the laser is burnt out and removed.

As shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 include the above-mentioned electromagnetic motors 38 and 56, holding device 62, elevating device 64, inkjet head 76, first laser irradiation device 78, inkjet head 88, flattening device 90, irradiation device 92, and electric checker. It is connected to 110, a camera 112, and a second laser irradiation device 202. The controller 120 includes a CPU, ROM, RAM, and the like. The controller 120 is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operation of the transfer device 20, the first modeling unit 22, the second modeling unit 24, the inspection unit 26, and the removal unit 200 is controlled by the controller 120.

In the circuit manufacturing apparatus 10, a plurality of conductor circuits are manufactured on the substrate fixed to the base 60 by the above-described configuration. Each conductor circuit is composed of an insulating resin layer and wiring.

Specifically, first, the stage 52 is moved below the second modeling unit 24 with the substrate fixed on the base 60. Further, in the second modeling unit 24, the ultraviolet curable resin is ejected from the inkjet head 88 on the substrate fixed to the base 60, and the ejected ultraviolet curable resin is flattened and irradiated by the flattening device 90. Irradiation of ultraviolet rays by the device 92 is repeated. As a result, the insulating resin layer is formed on the substrate.

Discharge of the UV curable resin is performed according to the modeling design for the UV curable resin. The modeling design has a plurality of resin patterns arranged in a grid pattern and is stored in the ROM of the controller 120 as data for forming the insulating resin layer (hereinafter referred to as insulating resin layer forming data). The controller 120 controls the inkjet head 88 based on the insulating resin layer formation data. As a result, the inkjet head 88 ejects the ultraviolet curable resin according to the modeling design (that is, a plurality of resin patterns).

When the insulating resin layer is formed on the substrate, the stage 52 is moved below the first modeling unit 22. Further, in the first modeling unit 22, the metal ink is ejected from the inkjet head 76 on the upper surface of the insulating resin layer on the substrate fixed to the base 60, and the ejected metal ink is irradiated with the first laser. Laser irradiation by 78 is performed. As a result, wiring is formed on the upper surface of the insulating resin layer on the substrate.

The ejection of the metal ink is performed according to the modeling design for the metal ink. In the modeling design, a plurality of wiring patterns are arranged in a grid pattern, and are stored in the ROM of the controller 120 as data for forming wiring (hereinafter referred to as wiring formation data). The controller 120 controls the inkjet head 76 based on the wiring formation data. As a result, the inkjet head 76 ejects metal ink according to the modeling design (that is, a plurality of wiring patterns).

In this way, in the circuit manufacturing apparatus 10, the insulating resin layer is formed by the ultraviolet curable resin, and the wiring is formed by the metal ions. As a result, a plurality of conductor circuits arranged in a grid pattern on the substrate are fully additively manufactured. When the formation of the insulating resin layer and the formation of the wiring are repeated, a plurality of electronic devices having a plurality of layers of conductor circuits are three-dimensionally laminated and formed on the substrate.

Further, in the circuit manufacturing apparatus 10, the inspection unit 26 inspects the wiring of the manufactured plurality of conductor circuits on the substrate fixed to the base 60, and the removal unit 200 or the like repairs the wiring. Will be done. Further, in the case where the circuit manufacturing apparatus 10 is performing three-dimensional laminated modeling, when the wiring cannot be repaired, the repair is not possible among the plurality of electronic devices three-dimensionally laminated on the substrate. Subsequent modeling designs will be modified to prevent the manufacture of electronic devices with wiring.

Next, the operation flow of the circuit manufacturing apparatus 10 will be described with reference to the flowchart shown in FIG. The control program shown in the flowchart of FIG. 3 is composed of each process of S10 to S32, is stored in the ROM of the controller 120, and is executed by the CPU of the controller 120 when the three-dimensional laminated modeling is performed. .. Further, various data used in the control program shown in the flowchart of FIG. 3 are stored in the ROM or RAM of the controller 120.

Hereinafter, a case where the circuit manufacturing apparatus 10 forms a three-dimensional laminated model of an electronic device composed of a two-layer conductor circuit will be described. At the time of the three-dimensional laminated modeling, the four modeling designs D1, D2, D3, D4 shown in FIG. 4 are used.

The modeling design D1 is used when forming the first insulating resin layer. In the modeling design D1, 12 resin patterns 130 are arranged in a grid pattern. Each resin pattern 130 is composed of a figure showing a square insulating resin layer. The modeling design D2 is used when forming the wiring of the first layer. In the modeling design D2, 12 wiring patterns 132 are arranged in a grid pattern. Each wiring pattern 132 is located at a position corresponding to each resin pattern 130 of the modeling design D1, and is composed of a figure showing three wirings (and pads at both ends thereof).

The modeling design D3 is used when forming the second insulating resin layer. In the modeling design D3, 12 resin patterns 134 are arranged in a grid pattern. Each resin pattern 134 is located at a position corresponding to each wiring pattern 132 of the modeling design D2, and is composed of a figure showing a square-shaped insulating resin layer. The modeling design D4 is used when forming the wiring of the second layer. In the modeling design D4, 12 wiring patterns 136 are arranged in a grid pattern. Each wiring pattern 136 is located at a position corresponding to each resin pattern 134 of the modeling design D3, and is composed of a figure showing three wirings (and pads at both ends thereof).

First, when the modeling process S10 is executed, the modeling design D1 is used in the second modeling unit 24, and the modeling design D2 is used in the first modeling unit 22, so that the first layer conductor circuit is modeled. .. Specifically, as shown in FIG. 5, the first insulating resin layer 142 and the first layer wiring 144 are formed on the substrate 140. As a result, 12 conductor circuits 146 arranged in a grid pattern are formed on the substrate 140. Each conductor circuit 146 is composed of an insulating resin layer 142 and wiring 144. In the following description, the 12 conductor circuits 146 may be referred to as the first layer conductor circuit 146.

In the electrical inspection process S12, the stage 52 is moved below the inspection unit 26. Further, in the inspection unit 26, the resistance value of the conductor circuit 146 (the wiring 144 constituting the first layer) of the first layer is measured by the electric checker 110 of the electric unit 100. In this way, in the electrical inspection process S12, the electrical inspection of the conductor circuit 146 of the first layer is performed.

After that, the controller 120 determines whether or not there is a repair portion in the conductor circuit 146 of the first layer (S14). The determination in S14 is performed based on the electrical inspection result of the electrical inspection process S12. When there is no repair point in the conductor circuit 146 of the first layer (S14: NO), the controller 120 determines whether or not the conductor circuit to be inspected is of the final layer (S16).

When the conductor circuit to be inspected is of the final layer (S16: YES), the controller 120 terminates the control program shown in the flowchart of FIG. This completes the full additive manufacturing of the conductor circuit and the inspection of the conductor circuit. On the other hand, when the conductor circuit to be inspected is not the one in the final layer (S16: NO), the controller 120 re-executes the above-mentioned modeling process S10.

Here, the inspection target is the conductor circuit 146 of the first layer, not the final layer. Therefore, when there is no repair point in the conductor circuit 146 of the first layer (S14: NO), the modeling process S10 is executed again. In such a case, when the modeling process S10 is executed again, the stage 52 is moved below the second modeling unit 24 and the first modeling unit 22. Further, the modeling design D3 is used in the second modeling unit 24, and the modeling design D4 is used in the first modeling unit 22, so that the second layer conductor circuit is modeled. After that, each process after S12 described above is executed for the conductor circuit of the second layer.

On the other hand, when the conductor circuit 146 of the first layer has a repaired portion (S14: YES), the visual inspection process S18 is executed. In the appearance inspection process S18, in the inspection unit 26, the image of the conductor circuit 146 (wiring 144) of the first layer is captured by the camera 112 of the appearance unit 102. The captured image is compared and collated with the reference image. As a result, in the visual inspection processing S18, the visual inspection of the conductor circuit 146 of the first layer is performed by the image processing of pattern matching.

After that, the controller 120 identifies the repaired portion and the state thereof in the conductor circuit 146 of the first layer, and determines whether or not the specified repaired portion can be repaired (S20). The identification of S20 is performed based on the electrical inspection result of the electrical inspection process S12 and the visual inspection result of the visual inspection process S18. The determination of S20 is performed based on the electrical inspection result of the electrical inspection process S12, the visual inspection result of the visual inspection process S18, and the design rules of the conductor circuit and the like.

When the repair location cannot be repaired (S20: repair failure), the controller 120 determines whether or not the conductor circuit to be determined is of the final layer (S22). When the conductor circuit to be determined is of the final layer (S22: YES), the controller 120 terminates the control program shown in the flowchart of FIG. This completes the full additive manufacturing of the conductor circuit and the inspection of the conductor circuit. On the other hand, when the conductor circuit to be determined is not the one in the final layer (S22: NO), the controller 120 executes the design change process S24.

In the design change process S24, the modeling design used in the subsequent modeling process S10 is changed. In the following, as shown in FIG. 5, the design change process S24 will be described with reference to a specific example in which the conductor circuit 146A has a repair portion R1 that cannot be repaired among the conductor circuits 146 of the first layer.

In such a specific example, as shown in FIG. 6, in the modeling design D3 used when forming the second insulating resin layer, the controller 120 is shown in FIG. 5 out of the 12 resin patterns 134. The modeling design D5 is created by deleting the resin pattern 134A at the position corresponding to the conductor circuit 146A. Therefore, the modeling design D5 is composed of 11 resin patterns 134. Further, the controller 120 changes the modeling design D3 to the modeling design D5. As a result, the modeling design D5 is used when forming the second insulating resin layer in place of the modeling design D3.

Subsequently, as shown in FIG. 7, the controller 120 has the conductor circuit 146A (and FIG. 5) of FIG. 5 out of the 12 wiring patterns 136 in the modeling design D4 used when forming the wiring of the second layer. The modeling design D6 is created by deleting the wiring pattern 136A at the position corresponding to the resin pattern 134A) of 6. Therefore, the modeling design D6 is composed of 11 wiring patterns 136. Further, the controller 120 changes the modeling design D4 to the modeling design D6. Thereby, the modeling design D6 is used when forming the wiring of the second layer instead of the modeling design D4.

After that, the modeling process S10 is executed again, so that the production of the conductor circuit by the full additive is continued. When the modeling process S10 is executed again, the stage 52 is moved below the second modeling unit 24 and the first modeling unit 22. Further, the modeling design D5 is used in the second modeling unit 24, and the modeling design D6 is used in the first modeling unit 22, so that the second layer conductor circuit is modeled. Therefore, on the substrate 140, of the conductor circuit 146 of the first layer, the insulating resin layer of the second layer and the wiring of the second layer are formed (laminated) for the conductor circuit 146A having the repair portion R1 that cannot be repaired. ) Not done.

When the repair location is short-circuited and the repair location can be repaired (S20: repair possible (short circuit)), the controller 120 executes the area generation process S26 and the removal process S28. In the following, among the conductor circuits 146 of the first layer on the substrate 140, as shown in the upper part of FIG. 8, the area generation process S26 and the removal are performed by using a specific example of the conductor circuit 146B having the short-circuit repair portion R2. Process S28 will be described.

In such a specific example, at the repair point R2 of the conductor circuit 146B, the two wirings 144 are connected by the conductor 148. In the area generation process S26, the area of the conductor 148 on the substrate 140 is specified based on the visual inspection result of the visual inspection process S18.

In the removal process S28, the stage 52 is moved below the removal unit 200. Further, in the removal unit 200, the second laser irradiation device 202 irradiates the area specified by the area generation process S26 with the laser. As a result, the conductor 148 is burnt out and removed. Therefore, as in the conductor circuit 146B shown in the lower part of FIG. 8, the short-circuited state of the two wirings 144 is repaired.

After the removal process S28, the controller 120 re-executes the above-mentioned electrical inspection process S12. As a result, the inspection of conductor circuits and the production of conductor circuits by full additive will be continued.

The controller 120 executes the design generation process S30 and the additional process S32 when the repair location is in a state of poor continuity and the repair location can be repaired (S20: repair possible (conduction failure)). .. Hereinafter, the design generation process S30 and the additional process S32 will be described separately for the case where the continuity failure is open and the case where the resistance is high.

As a specific example in the case where the continuity failure is open, among the conductor circuits 146 of the first layer on the substrate 140, for example, as shown in the upper part of FIG. 9, there is a conductor circuit 146C having an open repair portion R3. .. In such a specific example, the wiring 144 is in a disconnected state at the repair portion R3.

In the design generation process S30, as shown in FIG. 10, the repair pattern 156 is created by performing image processing based on the difference between the modeling pattern 152 and the reference pattern 154. The modeling pattern 152 is a pattern of the conductor circuit 146C having an open repair portion R3, and is extracted from the image captured by the camera 112 in the visual inspection process S18. The reference pattern 154 is a wiring pattern 132 of the conductor circuit 146C, and is created from the modeling design D2. The repair pattern 156 is a conductor pattern corresponding to the repair location R3.

Further, in the design generation process S30, in the modeling design D2 used when forming the wiring of the first layer, among the 12 wiring patterns 132, the wiring pattern 132 at the position corresponding to the conductor circuit 146C is the repair pattern. It will be changed to 156.

In the additional process S32, the stage 52 is moved below the first modeling unit 22. In the first modeling unit 22, by using a modeling design having only the repair pattern 156, the conductor 150 is added to the repair location R3 in the area of the conductor circuit 146C, as shown in FIG. As a result, in the conductor circuit 146C, the open state of the wiring 144 is repaired.

On the other hand, as a specific example in the case where the conduction failure is high resistance, among the conductor circuits 146 of the first layer on the substrate 140, for example, as shown in the upper part of FIG. 11, the high resistance repair portion R4 There is a conductor circuit 146D having. In such a specific example, the wiring 144 is in a linear state in which a part of the wiring 144 is missing at the repair portion R4.

In the design generation process S30, as shown in FIG. 12, the repair pattern 160 is created by performing image processing based on the difference between the modeling pattern 158 and the reference pattern 154. The modeling pattern 158 is a pattern of the conductor circuit 146D having the repair portion R4 having high resistance, and is extracted from the image captured by the camera 112 in the visual inspection process S18. The repair pattern 160 is a conductor pattern corresponding to the repair location R4.

Further, in the design generation process S30, in the modeling design D2 used when forming the wiring of the first layer, among the 12 wiring patterns 132, the wiring pattern 132 at the position corresponding to the conductor circuit 146D is the repair pattern. It will be changed to 160.

In the additional process S32, the stage 52 is moved below the first modeling unit 22. In the first modeling unit 22, by using a modeling design having only the repair pattern 160, the conductor 151 is added to the repair location R4 in the area of the conductor circuit 146D, as shown in FIG. As a result, in the conductor circuit 146D, the high resistance state of the wiring 144 is repaired.

After the additional process S32, the controller 120 re-executes the above-mentioned electrical inspection process S12. As a result, the inspection of conductor circuits and the production of conductor circuits by full additive will be continued.

As described in detail above, the circuit manufacturing apparatus 10 of the present embodiment is suitable for repairing a conductor circuit composed of a plurality of layers constituting an electronic device being manufactured by full additive (three-dimensional laminated modeling).

Incidentally, in the present embodiment, the circuit manufacturing apparatus 10 is an example of a circuit manufacturing system. The first modeling unit 22 is an example of a modeling unit. The second modeling unit 24 is an example of a modeling unit. The control device 27 is an example of a control unit. The electric checker 110 is an example of a measuring unit. The camera 112 is an example of an imaging unit. Each resin pattern 130, 134 and each wiring pattern 132, 136 are examples of circuit patterns. The resin pattern 134A and the wiring pattern 136A are examples of circuit patterns related to the repair location. The conductor 148 is an example of a conductor removed by the repair process. The conductors 150 and 151 are examples of conductors added by the repair process. The modeling designs D3 and D4 are examples of modeling designs used in the modeling unit after the determination of the determination process. Each of the processes S14 and S20 is an example of the determination process. The design change process S24 is an example of the change process. The removal process S28 is an example of a repair process. The design generation process S30 is an example of the generation process. The additional process S32 is an example of the repair process.

The present disclosure is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention.
For example, in the circuit manufacturing apparatus 10, a plurality of conductor circuits 146 may be manufactured in three or more layers or only one layer may be manufactured on a substrate fixed to the base 60.

Further, in the circuit manufacturing apparatus 10, the modeling design may be changed or an insulating resin body may be added by inspecting the insulating resin layer 142 constituting each conductor circuit 146.

Further, the first modeling unit 22, the second modeling unit 24, the inspection unit 26, or the removal unit 200 may be provided at a position away from the base 28. The control device 27 may be incorporated in any of the first modeling unit 22, the second modeling unit 24, the inspection unit 26, or the removal unit 200. In the additional processing S32, a first modeling unit separate from the first modeling unit 22 may be used.

Further, the inspection unit 26 may include at least one of the electric checker 110 of the electric unit 100 and the camera 112 of the appearance unit 102.

10 Circuit manufacturing equipment 22 1st modeling unit 24 2nd modeling unit 26 Inspection unit 27 Control device 110 Electric checker 112 Camera 130, 134 Resin pattern 132, 136 Wiring pattern 134A Resin pattern 136A related to repair location Wiring related to repair location Pattern 146 Conductor circuit 148,150,151 Conductor 152,158 Modeling pattern 154 Reference pattern 156,160 Repair pattern 200 Removal unit D1, D2, D3, D4 Modeling design R1, R2, R3, R4 Repair location of conductor circuit S14, S20 Judgment process S24 Design change process S28 Removal process S30 Design generation process S32 Addition process

Claims (6)

It is a circuit manufacturing system that manufactures conductor circuits with full additive.
A modeling unit that models multiple conductor circuits according to a modeling design that has multiple circuit patterns,
An inspection unit that inspects the plurality of conductor circuits and
Equipped with a control unit,
The control unit is
Based on the inspection result of the inspection unit, the repair points of the plurality of conductor circuits are specified, and the determination process of determining whether or not the repair is possible from the state of the repair points is performed.
When it is determined by the determination process that repair is possible, the repair process of repairing the repaired portion by the modeling unit and the repair process.
When it is determined in the determination process that repair is not possible, the modeling design used in the modeling unit is deleted from the modeling design used in the modeling unit after the determination in the determination process, by deleting the circuit pattern related to the repair location. A circuit manufacturing system that performs change processing and changes. A removal unit for removing the conductors of the plurality of conductor circuits is provided.
The control unit is
The circuit control system according to claim 1, wherein when it is determined in the determination process that repair is possible, the repair location is repaired by the removal unit or the modeling unit in the repair process. According to claim 2, when the control unit determines in the determination process that the state of the repair location is a short circuit, the removal unit removes the conductor of the repair location to execute the repair process. The circuit manufacturing system described. 2. When the control unit determines in the determination process that the state of the repair location is poor in continuity, the control unit executes the repair process by adding a conductor to the repair location in the modeling unit. The circuit manufacturing system described in. The control unit claims to execute a generation process of generating a repair pattern corresponding to a conductor added to the repair location in the modeling unit by the difference between the modeling pattern of the conductor circuit having the repair location and the reference pattern. 4. The circuit manufacturing system according to 4. One of claims 1 to 5, wherein the inspection unit includes at least one of a measuring unit for performing an electrical inspection of the plurality of conductor circuits and an imaging unit for performing an visual inspection of the plurality of conductor circuits. The circuit manufacturing system described in one.

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