JP7062876B2 - Manufacturing method of individual substrate, manufacturing method of assembly, manufacturing method of optical device - Google Patents

Description

The present invention relates to a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device.

In the method for manufacturing an individual substrate described in Patent Document 1, a plurality of long substrates are arranged in the lateral direction, and adjacent substrates are connected by first connecting portions at a plurality of locations in the longitudinal direction, from the lateral direction. As you can see, the process of preparing a board group having a first part having a long first part and a short second part with a short connecting portion per unit length, a step of mounting parts on the surface of the board to be the first part, and a board. It includes a step of mounting a light emitting element on the back surface of the above and a step of cutting a plurality of connecting portions.

JP-A-2015-66793

When cutting out an individual substrate from a large substrate having multiple notches forming the outer shape of the individual substrate (unit substrate), the connecting piece between the outer edge of the large substrate and the notch, or adjacent notches. Individual pieces are cut out by punching out the connecting pieces between them. Then, when the portion constituting the notch constitutes the outermost part of the individual piece substrate in the width direction of the individual piece substrate, the dimensional accuracy of the width of the individual piece substrate is the position accuracy of the notch formed on the large substrate. Will depend on.

An object of the present invention is to control the accuracy of the width dimension of the individual substrate without depending on the position accuracy of the notch formed in the large substrate.

The method for manufacturing an individual substrate according to the first aspect of the present invention includes a preparatory step of preparing a large substrate in which a unit substrate and another substrate are connected by a connecting piece in the width direction of the unit substrate, and the connecting piece. The present invention is characterized by comprising a cutting step of cutting the unit substrate and making the cut edge thereof the outermost part in the width direction of the unit substrate.

In the method for manufacturing an individual substrate according to the second aspect of the present invention, in the method for manufacturing an individual substrate according to the first aspect , a plurality of the connecting pieces are formed side by side in an intersecting direction intersecting with the width direction. The cutting step is characterized in that a plurality of the connecting pieces are cut so that the cutting edges are arranged in a straight line when viewed from the plate thickness direction of the unit substrate.

The method for manufacturing an individual substrate according to a third aspect of the present invention is the method for manufacturing an individual substrate according to the first aspect or the second aspect , and in the cutting step, in the crossing direction intersecting the width direction. The connecting piece is cut so that the total length of the cut edges is shorter than the total length of the portions other than the cut edges.

The method for manufacturing an individual substrate according to a fourth aspect of the present invention is the method for producing an individual substrate according to any one of the first to third aspects , in the preparation step, with respect to the width direction. It is characterized in that the large-sized substrate in which the connecting pieces are formed only on both ends of the unit substrate in the intersecting directions is prepared.

The method for manufacturing an individual substrate according to a fifth aspect of the present invention is the method for manufacturing an individual substrate according to any one of the first to fourth aspects , wherein the connecting piece is relative to the width direction. Three or more are formed side by side in the intersecting intersecting directions, and in the cutting step, the cutting edges of the connecting pieces at both ends in the arrangement direction of the connecting pieces are in the width direction of the unit substrate. It is characterized in that the connecting piece is cut so as to form the outermost part.

The method for manufacturing an individual substrate according to a sixth aspect of the present invention is the method for manufacturing an individual substrate according to any one of the first to fifth aspects , and in the preparation step, the width of the unit substrate is described. It is characterized in that the large-sized substrate on which the connecting piece is formed is prepared on both sides in the direction.

The method for manufacturing an individual substrate according to a seventh aspect of the present invention is the method for producing an individual substrate according to any one of the first to sixth aspects , between the preparation step and the cutting step. Is characterized by comprising a mounting step of mounting a light emitting element or a light receiving element on the unit substrate.

In the method for manufacturing an assembly according to the eighth aspect of the present invention, the cut edge of the individual piece substrate manufactured by the method for manufacturing the individual piece substrate according to any one of the first to seventh aspects is used as a housing. It is characterized by including a positioning step of positioning the individual substrate in the housing by contacting the housing, and a mounting step of attaching the individual substrate in the positioned state to the housing.

In the method for manufacturing an exposure apparatus according to a ninth aspect of the present invention, the cut edge of the individual piece substrate manufactured by the method for manufacturing the individual piece substrate according to the seventh aspect is brought into contact with the housing to form the housing. The first positioning step of positioning the individual substrate, the first mounting step of attaching the individual substrate in the positioned state to the housing, and the light emitting element or the light receiving element positioned in the first positioning step. It is characterized by comprising a second positioning step of positioning the optical component in the housing so as to face the optical component, and a second mounting step of attaching the optical component in a positioned state to the housing.

According to the method for manufacturing an individual substrate according to the first aspect of the present invention, the accuracy of the width dimension of the individual substrate can be controlled without depending on the position accuracy of the notch formed in the large substrate.

According to the method for manufacturing an individual piece substrate according to the second aspect of the present invention, as compared with the case where one connecting piece is formed in the intersecting direction intersecting the width direction, the individual piece substrate is relative to the positioning object. Positioning accuracy can be improved.

According to the method for manufacturing an individual substrate according to the third aspect of the present invention, as compared with the case of preparing a large substrate in which the total length of the cutting edges is longer than the total length of the portion other than the cutting edges in the crossing direction. Therefore, the accuracy of the width dimension of the individual substrate can be improved.

According to the method for manufacturing an individual substrate according to the fourth aspect of the present invention, the individual substrate is positioned with respect to the positioning object as compared with the case where the connecting pieces are formed only in the central portion of the unit substrate in the crossing direction. The accuracy can be improved.

According to the method for manufacturing an individual substrate according to a fifth aspect of the present invention, all three or more cutting edges form the outermost part of the unit substrate in the width direction, and the outermost positions are scattered in the width direction. It is possible to improve the positioning accuracy of the individual substrate with respect to the object to be positioned while making the bending rigidity of the unit substrate before the cutting step the same as in the case where the unit substrate is used.

According to the method for manufacturing an individual substrate according to the sixth aspect of the present invention, the accuracy of the width dimension of the individual substrate is effective as compared with the case where the connecting piece is formed only on one side in the width direction of the unit substrate. Can be improved.

According to the method for manufacturing an individual substrate according to the seventh aspect of the present invention, the individual substrate can be used for an optical device.

According to the method for manufacturing an assembly according to the eighth aspect of the present invention, as compared with the case where the individual piece substrate manufactured by the method for manufacturing the individual piece substrate according to any one of the first to seventh aspects is not used. Therefore, the individual substrate can be accurately positioned on the housing.

According to the method for manufacturing an exposure apparatus according to the ninth aspect of the present invention, as compared with the case where the individual substrate manufactured by the method for manufacturing the individual substrate according to the seventh aspect is not used, the optical component is subjected to the method. The light emitting element or the light receiving element can be positioned with high accuracy.

It is a top view which showed the individual piece substrate manufactured by the manufacturing method of the piece piece substrate which concerns on 1st Embodiment of this invention. It is a top view which showed a part of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 1st Embodiment of this invention. It is a top view which showed the connecting piece of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 1st Embodiment of this invention. It is a top view which showed the whole of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 1st Embodiment of this invention. It is a top view which showed the whole of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the exposure apparatus manufactured by the manufacturing method of the assembly and the manufacturing method of an optical apparatus which concerns on 1st Embodiment of this invention. It is an exploded perspective view which showed the exposure apparatus manufactured by the manufacturing method of the assembly and the manufacturing method of an optical apparatus which concerns on 1st Embodiment of this invention. It is a top view which showed the individual piece substrate manufactured by the manufacturing method of the piece piece substrate which concerns on 2nd Embodiment of this invention. It is a top view which showed the individual piece substrate manufactured by the manufacturing method of the piece piece substrate which concerns on 3rd Embodiment of this invention. It is a top view which showed a part of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 3rd Embodiment of this invention. It is a top view which showed the individual piece substrate manufactured by the manufacturing method of the piece piece substrate which concerns on 4th Embodiment of this invention. It is a top view which showed the whole of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 4th Embodiment of this invention. It is a top view which showed the individual piece substrate manufactured by the manufacturing method of the piece piece substrate which concerns on 5th Embodiment of this invention. It is a top view which showed the whole of the large-sized substrate used in the manufacturing method of the individual piece substrate which concerns on 5th Embodiment of this invention.

<First Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 7.

First, an exposure apparatus manufactured by the method for manufacturing an optical apparatus according to the present embodiment will be described. Next, a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device will be described.

(Exposure device)
The exposure apparatus 10 will be described with reference to FIGS. 1, 6, and 7. The arrow H shown in each figure indicates the device vertical direction (vertical direction), the arrow W indicates the device width direction (horizontal direction), and the arrow D indicates the device depth direction (horizontal direction). The exposure apparatus 10 is an example of an optical apparatus.

As shown in FIG. 6, the exposure apparatus 10 is arranged below the photoconductor drum 12 constituting the image forming apparatus (not shown). The exposure apparatus 10 includes an individual substrate 20, a housing 30, and a lens array 40.

[Individual board]
The individual substrate 20 is arranged so that the plate surface faces the photoconductor drum 12. As shown in FIG. 7, the individual substrate 20 includes a unit substrate 22 extending in the depth direction of the device and a plurality of LED arrays 24 mounted on the surface of the unit substrate 22. The LED array 24 is an example of a light emitting element.

As shown in FIG. 1, the unit substrate 22 has a rectangular shape extending in the depth direction of the device when viewed from above. In the present embodiment, the length (L3 in FIG. 1) of the unit board 22 in the device depth direction (“board longitudinal direction” described later) is 300 [mm], and the device width direction of the unit board 22 (described later). The length (L4 in FIG. 1) (in the "board width direction") is 7 [mm].

Further, a wiring pattern 26 extending in the depth direction of the device is formed on the unit substrate 22, and elongated holes 28 extending in the width direction of the device are formed at both ends of the unit substrate 22 in the longitudinal direction. Further, a plurality of convex portions 62, 64 are formed on the outer periphery of the unit substrate 22.

Specifically, four convex portions 62 are formed on each of the pair of long sides 22A forming the unit substrate 22, and two convex portions 64 are formed on each of the short sides 22B.

The convex portions 62 are arranged at intervals in the device depth direction, and the convex portions 62 formed on the innermost side (upper side in the figure) in the device depth direction are one end portions of the unit substrate 22 in the device depth direction. Is formed in. Further, the convex portion 62 formed on the frontmost side (lower side in the drawing) in the device depth direction is formed on the other end of the unit substrate 22 in the device depth direction. The "one end of the unit substrate 22" is a range from one end of the unit substrate 22 to 20 [%] when the length L3 of the unit substrate 22 in the depth direction of the device is 100 [%]. , "The other end of the unit substrate 22" is a range from the other end of the unit substrate 22 to 20%.

Further, in the convex portion 62 formed on the long side 22A, the outer edge 62A in the device width direction (the substrate width direction described later) constitutes the outermost part in the width direction of the unit substrate 22 (individual piece substrate 20). There is. Further, the edge 62A is arranged on a straight line when viewed from above (plate thickness direction). Edge 62A is an example of a cutting edge.

Further, in each of the long sides 22A, the total length of the edges 62A is shorter than the total length of the portions other than the edges 62A. Specifically, the total length T1 of the edges 62A is M1 × N1 when the length of one edge 62A is M1 and the number of edges 62A is N1. On the other hand, the total length T2 of the portion other than the edge 62A is a value obtained by subtracting T1 from the length L3 of the unit substrate 22 described above.

Further, each LED array 24 is long and extends in the depth direction of the device, and is arranged in a staggered manner along the longitudinal direction of the unit substrate 22. Further, each LED array 24 includes a plurality of LEDs 24A (Light Emitting Diodes) arranged in the longitudinal direction thereof.

[Lens array]
The lens array 40 is an example of an optical component, and is arranged between the individual substrate 20 and the photoconductor drum 12 as shown in FIGS. 6 and 7, and has a rectangular parallelepiped shape extending in the depth direction of the device. There is.

[Case]
The housing 30 is arranged to face the photoconductor drum 12, has a trapezoidal shape when viewed from the depth direction of the device, and extends in the depth direction of the device.

Further, as shown in FIGS. 6 and 7, the housing 30 is formed with a hole 32 that penetrates in the vertical direction of the device and extends in the depth direction of the device. The housing 30 supports the lens array 40 by sandwiching the lens array 40 from the device width direction at the portion of the hole 32 on the photoconductor drum 12 side.

Specifically, the lens array 40 is formed by forming the hole 32 and bringing the pair of side surfaces 30A facing the device width direction into contact with the pair of side surfaces 40A facing the device width direction in the lens array 40. It is positioned on the body 30 and is sandwiched.

Further, a concave recess 34 is formed in the portion of the housing 30 opposite to the photoconductor drum 12. The housing 30 supports the individual substrate 20 by sandwiching the individual substrate 20 in the recess 34. In this embodiment, the length L7 of the recess 34 of the housing 30 in the device width direction is the same as the length L4 of the unit substrate 22 in the device width direction (see FIG. 1).

Specifically, the device width is formed by forming the recess 34 and bringing the pair of side surfaces 34A facing each other in the device width direction into contact with the edge 62A of the convex portion 62 of the unit board 22 constituting the individual substrate 20. In the direction, the individual substrate 20 is positioned and sandwiched by the housing 30 (details will be described later).

In this state, the lens array 40 is arranged between the LED array 24 of the individual substrate 20 and the photoconductor drum 12.

(Action of exposure equipment)
Next, the operation of the exposure apparatus 10 will be described.

The LED array 24 of the exposure apparatus 10 emits laser light toward the lens array 40 as shown in FIG. 6 based on the image data input from the outside. Then, the lens array 40 transmits the laser light emitted from the LED array 24 and forms an image on the charged photoconductor drum 12. As a result, an electrostatic latent image based on the image data is formed on the photoconductor drum 12.

(Production method)
Next, a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device will be described. The arrows X shown in FIGS. 1 to 5 indicate the substrate longitudinal direction of each substrate (large substrate 90 and unit substrate 22 described later), and the arrow Y indicates the substrate width direction of each substrate. Further, the substrate longitudinal direction when explaining the unit substrate 22 corresponds to the device depth direction (arrow D) used when explaining the exposure apparatus 10, and the substrate width direction when explaining the unit substrate 22 is exposure. It corresponds to the device width direction (arrow W) used when the device 10 is described.

[Manufacturing method of individual substrate]
First, a method of manufacturing the individual substrate 20 (see FIG. 7) using the large substrate 90 will be described. The individual substrate 20 is manufactured by a process including a preparation step, a mounting step, and a cutting step.

[Preparation process]
In the preparation step, as shown in FIG. 5, a large substrate 90 having a plurality of slits 92 defining the unit substrate 22 is prepared. Hereinafter, the large substrate 90 will be specifically described.

The large substrate 90 is a substrate on which a plurality of unit substrates 22 (see FIG. 1) are formed, and has a rectangular shape extending in the longitudinal direction of the substrate when viewed from the plate thickness direction. In this embodiment, as an example, the length of the large substrate 90 in the longitudinal direction of the substrate (L1 in FIG. 5) is 320 [mm], and the length of the large substrate 90 in the width direction of the substrate (FIG. 5). L2) is 95 [mm].

When mounting the plurality of slits 92 that define the outer shape of each unit board 22, the wiring pattern 26 formed on each unit board 22, and the LED array 24 on the unit board 22 on the large board 90. A reference elongated hole 28 is formed. Further, a portion of the outer peripheral portion of the large substrate 90 that surrounds the plurality of unit substrates 22 is a discarded substrate 96.

Further, in the discarded substrate 96 of the large substrate 90, circular holes 98 are formed at both ends in the substrate width direction at the other portion (lower part in the drawing) in the longitudinal direction of the substrate.

Further, the slit 92 is divided into a slit 92A extending in the longitudinal direction of the substrate, which defines the width direction of the unit substrate 22, and a slit 92B extending in the longitudinal direction of the substrate, which defines the longitudinal direction of the unit substrate 22. .. The slit 92A is an example of a notch.

A plurality of the slits 92A are formed at intervals in the longitudinal direction of the substrate. Further, a plurality of slits 92A formed at intervals in the longitudinal direction of the substrate are formed at intervals in the width direction of the substrate. The slits 92B are formed between a pair of slits 92A that define one side of the unit substrate 22 in the longitudinal direction.

The space between the slits 92A and the slits 92A is a connecting piece 94A connecting the adjacent unit substrates 22 or a connecting piece 94A connecting the unit substrate 22 and the discarded substrate 96. In other words, the unit substrate 22 and the other substrate are connected by the connecting piece 94A in the substrate width direction. Here, the "other substrate" is a substrate used as a unit substrate, a substrate used for a purpose different from that of the unit substrate, or a substrate that is discarded without being used as a substrate.

Further, the space between the slit 92A and the slit 92B is a connecting piece 94B for connecting the unit substrate 22 and the discard substrate 96. The width of the slit 92A formed in the large substrate 90 (L5 in FIG. 2) is 0.8 [mm], and the length of the connecting piece 94A between the adjacent slits 92A (L6 in FIG. 2). Is 0.8 [mm].

Here, a plurality of slits 92A are formed. As a result, a plurality of connecting pieces 94A are formed side by side at intervals in the longitudinal direction of the substrate. In the present embodiment, four connecting pieces 94A are formed side by side at intervals in the longitudinal direction of the substrate.

Further, the connecting piece 94A formed on the most one side (upper side in the drawing) in the longitudinal direction of the substrate is formed at one end of the unit substrate 22 in the longitudinal direction of the substrate. Further, the connecting piece 94A formed on the outermost side (lower side in the drawing) in the longitudinal direction of the substrate is formed on the other end of the unit substrate 22 in the longitudinal direction of the substrate.

Further, by cutting the connecting piece 94A in a cutting step described later, a convex portion 62 (see FIG. 1) is formed at an end portion of the unit substrate 22 in the substrate width direction. Then, as described above, the lengths of the slit 92A and the connecting piece 94A in the substrate longitudinal direction are shortened so that the total length of the edges 62A of the convex portion 62 is shorter than the total length of the portions other than the edges 62A. Has been decided.

Further, the wiring pattern 26 is formed on each of the unit substrates 22, and extends in the longitudinal direction of the substrate. Further, two elongated holes 28 are formed with respect to each unit substrate 22 so as to sandwich each wiring pattern 26 from the longitudinal direction of the substrate.

[Mounting process]
In the mounting process, as shown in FIG. 4, a plurality of LED arrays 24 are mounted on the N unit boards 22 formed on the large board 90, respectively.

Specifically, the LED array 24 is mounted on each unit board 22 with reference to the elongated holes 28 formed in each unit board 22. For example, the center positions of the two elongated holes 28 formed on one unit substrate 22 are detected from the image including the elongated holes 28 captured by the image pickup apparatus. Then, the LED array 24 is mounted in a staggered manner on the unit substrate 22 on which the reference long holes 28 are formed with reference to the center positions of the two long holes 28.

As described above, the large substrate 90 is formed with N unit substrates 22. Therefore, the center positions of the two elongated holes 28 are detected N times, and the LED array 24 is mounted on the unit substrate 22 on which the reference elongated holes 28 are formed each time.

[Cutting process]
In the cutting step, the connecting pieces 94A and 94B are punched out by a so-called punching method, and N individual piece substrates 20 are cut out from the large substrate 90 (see FIG. 1).

First, the pins fixed to the punch stand are inserted into the two holes 98 (see FIG. 4) formed in the large board 90, and the large board 90 is placed on the punch stand. In this way, the large substrate 90 is positioned on the punch stand by using the holes 98.

Further, as shown in FIG. 3, in the connecting piece 94A, a portion having a width of 0.4 [mm] around the center line C of the slit 92A (hatched portion in the figure) is punched out with a punch.

As a result, as shown in FIGS. 1 and 2, four convex portions 62 are formed on the pair of long sides 22A forming the unit substrate 22, and two convex portions 64 are formed on the short sides 22B, respectively. Individually formed.

As described above, the convex portion 62 formed on one end side in the longitudinal direction of the substrate is formed on one end portion of the unit substrate 22 in the longitudinal direction of the substrate. Further, the convex portion 62 formed on the other end side in the longitudinal direction of the substrate is formed on the other end portion of the unit substrate 22 in the longitudinal direction of the substrate.

Further, as described above, the edge 62A of the convex portion 62 formed on the long side 22A constitutes the outermost part of the unit substrate 22 (individual piece substrate 20) in the substrate width direction. Further, the edges 62A of the convex portions 62 arranged in the longitudinal direction of the substrate are arranged on a straight line when viewed from above (plate thickness direction).

Further, as described above, in each of the long sides 22A, the total length of the edges 62A is shorter than the total length of the portions other than the edges 62A.

In this way, the individual substrate 20 is manufactured from the large substrate 90.

[Manufacturing method of assembly, manufacturing method of optical device]
Next, a method for manufacturing the assembly and a method for manufacturing the optical device will be described by a step of manufacturing the exposure apparatus 10 (see FIG. 6) using the individual substrate 20. The exposure apparatus 10 is manufactured by a first positioning step, a first mounting step, a second positioning step, and a second mounting step.

[First positioning process]
In the first positioning step, as shown in FIG. 6, the individual substrate 20 is positioned in the recess 34 formed in the housing 30. Specifically, the edges 62A of the convex portions 62 formed on the pair of long sides 22A (see FIG. 1) of the unit substrate 22 are abutted (contacted) against the pair of side surfaces 34A constituting the concave portions 34. Then, the individual piece substrate 20 is fitted into the recess 34, and the plate surface of the individual piece substrate 20 is brought into contact with the bottom surface 34B of the recess 34.

In this way, the individual substrate 20 is positioned on the housing 30.

[First mounting process]
In the first mounting step, an adhesive (not shown) is applied to the peripheral edge of the individual piece substrate 20 positioned in the housing 30 and the side surface 34A of the recess 34, and the individual piece substrate 20 is attached to the housing 30.

[Second positioning process]
In the second positioning step, the lens array 40 is sandwiched from the width direction of the device in the hole 32 formed in the housing 30 at the upper portion in the vertical direction of the device.

Specifically, the pair of side surfaces 30A facing the device width direction in the housing 30 and the pair of side surfaces 40A facing the device width direction in the lens array 40 are brought into contact with each other. As a result, the LED array 24 of the individual substrate 20 and the lens array 40 face each other.

In this way, the lens array 40 is positioned in the housing 30.

[Second mounting process]
In the second mounting step, an adhesive (not shown) is applied to the peripheral edge of the lens array 40 and the housing 30, and the lens array 40 is mounted on the housing 30.

(summary)
As described above, in the cutting step, by punching the connecting pieces 94A and 94B, four convex portions 62 are formed on each of the pair of long sides 22A forming the unit substrate 22. The edge 62A of the convex portion 62 formed on the long side 22A constitutes the outermost part of the unit substrate 22 (individual piece substrate 20) in the substrate width direction. As a result, the accuracy of the width dimension (L4 in FIG. 1) of the individual substrate 20 is managed without depending on the position accuracy of the slit 92A formed in the large substrate 90.

Further, in the cutting step, by punching the connecting pieces 94A and 94B, the edges 62A of the four convex portions formed on one long side 22A of the unit substrate 22 are viewed from above (in the plate thickness direction). Arranged on a straight line. As a result, as compared with the case where one convex portion is formed on one long side, the individual piece substrate 20 is suppressed from being tilted with respect to the side surface 34A of the concave portion 34 when viewed from above, and the individual piece is prevented. The positioning accuracy of the substrate 20 with respect to the housing 30 is improved.

Further, in the cutting step, by punching the connecting pieces 94A and 94B, the total length of the edges 62A on each of the long sides 22A becomes shorter than the total length of the portions other than the edges 62A. Therefore, the accuracy of the width dimension of the individual substrate 20 is improved as compared with the case where the total length of the edge 62A is longer than the total length of the portion other than the edge 62A.

Further, in the preparation step, a large substrate 90 in which the connecting pieces 94A are formed on both sides of the unit substrate 22 in the substrate width direction is prepared, and in the cutting step, the connecting pieces 94A on both sides of the unit substrate 22 in the substrate width direction are prepared. Punch out. As a result, the convex portions 62 on both sides of the unit substrate 22 in the substrate width direction form the outermost part of the unit substrate 22 in the substrate width direction. Therefore, for example, as compared with the case where the connecting piece 94A is formed only on one side of the unit substrate 22 in the substrate width direction, the punching accuracy of the connecting piece 94A in the cutting step is improved to improve the punching accuracy of the unit substrate 22 ( The accuracy of the width dimension of the individual substrate 20) is effectively improved.

By using the individual substrate 20 as a method of manufacturing the assembly, the individual substrate 20 is accurately positioned on the housing 30.

As a method of manufacturing the optical device, by using the individual substrate 20, the individual substrate 20 is accurately positioned on the lens array 40 via the housing 30.

<Second Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a second embodiment of the present invention will be described with reference to FIG. In addition, about the 2nd Embodiment, the part different from the 1st Embodiment will be mainly described.

In the preparation step, a large substrate 90 (see FIG. 5) similar to that of the first embodiment is prepared.

Further, in the cutting step, by punching the connecting pieces 94A and 94B using a punch mold different from that of the first embodiment, as shown in FIG. 8, a pair of lengths of the unit boards 122 constituting the individual piece boards 120 are obtained. Two convex portions 62 and two convex portions 66 are formed on the side 122A.

The convex portions 62 and the convex portions 66 are arranged at intervals in the longitudinal direction of the substrate, and convex portions 62 are formed at both ends of the unit substrate 122 in the longitudinal direction of the substrate. The two convex portions 66 are arranged at intervals in the longitudinal direction of the substrate so as to be sandwiched between the convex portions 62 formed at both ends of the unit substrate 122.

Further, in the convex portion 66, the outer edge 66A in the substrate width direction is located on the inner side in the substrate width direction as compared with the edge 62A of the convex portion 62. That is, the edge 62A of the convex portion 62 formed on the long side 122A constitutes the outermost part of the unit substrate 122 in the substrate width direction.

As described above, in the preparation step, a large substrate 90 similar to that in the first embodiment is prepared. That is, before the cutting step, the bending rigidity of the unit substrate 122 is equivalent to the bending rigidity of the unit substrate 22 of the first embodiment.

Further, convex portions 62 forming the outermost side of the unit substrate 122 in the substrate width direction are formed only at both ends of the unit substrate 122 in the substrate longitudinal direction. Therefore, the convex portions formed on the long side 122A are in the longitudinal direction of the substrate due to the positional variation of the outermost portion in the substrate width direction as compared with the unit substrate 22 which all constitutes the outermost portion in the substrate width direction. It is suppressed that the convex portion on the center side becomes the outermost part in the width direction of the substrate.

Further, by suppressing the convex portion on the central side in the longitudinal direction of the substrate from becoming the outermost portion in the width direction of the substrate, the individual substrate 120 is suppressed from tilting with respect to the side surface 34A of the concave portion 34. The positioning accuracy of the individual substrate 120 with respect to the housing 30 is improved.

In other words, in the method for manufacturing an individual substrate according to the second embodiment, all the convex portions formed on the long side 22A form the outermost portion in the substrate width direction, and the outermost position in the substrate width direction is located. Compared with the case of variation, the bending rigidity of the unit substrate 122 before the cutting process is made equal, and the positioning accuracy with respect to the housing 30 is improved.

Other actions are the same as in the first embodiment.

<Third Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a third embodiment of the present invention will be described with reference to FIGS. 9 and 10. In addition, about the 3rd Embodiment, the part different from the 1st Embodiment will be mainly described.

In the preparation step, as shown in FIG. 10, a large substrate 190 in which the connecting piece 94A is formed only at both ends of the unit substrate 172 in the longitudinal direction of the substrate is prepared. That is, in the large substrate 190, the number of slits 192A extending in the longitudinal direction of the substrate is smaller than the number of slits 92A of the large substrate 90 of the first embodiment.

Further, in the cutting step, by punching the connecting pieces 94A and 94B, as shown in FIG. 9, two convex portions 62 are provided on each of the pair of long sides 172A of the unit substrate 172 constituting the individual substrate 170. It is formed. The convex portions 62 are formed only at both ends of the unit substrate 172 in the longitudinal direction of the substrate.

As described above, the convex portions 62 are formed only on both ends of the unit substrate 172 in the longitudinal direction of the substrate. Therefore, for example, as compared with the case where the convex portion is formed only in the central portion of the unit substrate in the longitudinal direction of the substrate, the individual piece substrate 170 is suppressed from being tilted with respect to the side surface 34A of the concave portion 34, and the individual substrate is suppressed. The positioning accuracy of the single substrate 170 with respect to the housing 30 is improved.

Other actions are the same as in the first embodiment.

<Fourth Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a fourth embodiment of the present invention will be described with reference to FIGS. 11 and 12. In addition, about 4th Embodiment, the part different from 1st Embodiment will be mainly described.

In the preparation step, as shown in FIG. 12, a large substrate 240 in which only one unit substrate 222 is formed is prepared.

The large substrate 240 has a rectangular shape extending in the longitudinal direction of the substrate, and has a pair of outer edges 240A extending in the longitudinal direction of the substrate and a pair of outer edges 240B extending in the width direction of the substrate. The large substrate 240 is formed with one slit 192A extending in the longitudinal direction of the substrate, which defines the width direction of the unit substrate 222, on both sides of the unit substrate 222. The slit 192A is an example of a notch.

Further, between each slit 192A and each outer edge 240B is a connecting piece 194 that connects the discarded substrate 196 and the unit substrate 222.

Further, in the cutting step, by punching out the connecting piece 194, as shown in FIG. 11, two convex portions 262 are formed on each of the pair of long sides 222A of the unit substrate 222 constituting the individual substrate 220. Will be done.

The convex portions 262 are formed only at both ends of the unit substrate 222 in the longitudinal direction of the substrate. In the convex portion 262, the outer edge 262A in the width direction of the substrate is formed on a straight line extending in the longitudinal direction of the substrate, and constitutes the outermost side in the width direction of the unit substrate 222. Edge 262A is an example of a cutting edge.

The action is the same as that of the first embodiment.

<Fifth Embodiment>
An example of a method for manufacturing an individual substrate, a method for manufacturing an assembly, and a method for manufacturing an optical device according to a fifth embodiment of the present invention will be described with reference to FIGS. 13 and 14. In addition, about the 5th Embodiment, the part different from the 1st Embodiment will be mainly described.

In the preparation step, as shown in FIG. 14, a large substrate 290 in which only one unit substrate 272 is formed is prepared.

The large substrate 290 has a rectangular shape extending in the longitudinal direction of the substrate, and has a pair of outer edges 290A extending in the longitudinal direction of the substrate and a pair of outer edges 290B extending in the width direction of the substrate. Then, in the large substrate 290, a slit 242A extending in the longitudinal direction of the substrate, which defines the substrate width direction of the unit substrate 272, is formed only on one side (right side in the figure) of the unit substrate 222 in the substrate width direction. .. The slit 242A is an example of a notch.

Further, between the slit 242A and each outer edge 290B is a connecting piece 244 connecting the discarded substrate 246 and the unit substrate 272.

Further, in the cutting step, by punching out the connecting piece 244, as shown in FIG. 13, a convex portion 312 is formed on the long side 272A on one side in the board width direction of the unit board 272 constituting the individual piece board 270. Two are formed.

The convex portions 312 are formed only at both ends in the longitudinal direction of the substrate on the long side 272A of the unit substrate 272. Further, in the convex portion 312, the outer edge 312A in the width direction of the substrate is formed on a straight line extending in the longitudinal direction of the substrate, and constitutes the outermost part in the width direction of the unit substrate 272.

Further, the long side of the unit substrate 272 on the other side in the substrate width direction is composed of the outer edge 290A of the large substrate 290.

The action is the same as that of the first embodiment except for the action caused by the formation of convex portions on both sides of the unit substrate in the substrate width direction.

Although the present invention has been described in detail with respect to specific embodiments, the present invention is not limited to such embodiments, and various other embodiments can be taken within the scope of the present invention. That is clear to those skilled in the art. For example, in the above embodiment, the slits 92A, 192A, and 242A extend in one direction when viewed from the plate thickness direction of the substrate, but the shape of the slit may be another shape, for example, a circle. It may have a shape, an elliptical shape, a polygonal shape, or the like.

Further, in the first embodiment, four connecting pieces 94A arranged in the longitudinal direction of the substrate are formed on one long side 22A, but a number other than four connecting pieces may be formed.

Further, in the above embodiment, the light emitting element is mounted on the individual substrate, but for example, when the individual substrate is not used for the exposure device (optical device), the light emitting element may not be mounted. .. For example, as an example in which the individual substrate is not used in the exposure apparatus, the individual substrate on which functional components other than the light emitting element are mounted may be used in other electronic devices such as an arithmetic unit and a measuring device. Functional components include electronic components such as connectors and structural components such as positioning pins. When the light emitting element is mounted on the individual piece substrate, the positioning accuracy of the light emitting element with respect to the housing is improved by positioning the individual piece substrate of the above embodiment on the housing. Further, when the functional component other than the light emitting element is mounted on the individual substrate, the positional accuracy of the functional component with respect to the housing is improved.

Further, although not particularly described in the above embodiment, as a method of manufacturing the assembly, the lens array 40 does not have to be attached to the housing 30, and both ends of the individual substrate 20 in the width direction are attached to the housing. By making contact with each other, the individual substrate may be positioned on the housing and attached.

Further, in the above embodiment, the connecting pieces 94A, 94B, 194, and 244 are cut by a so-called punching method, but may be cut by another method such as a laser.

Further, in the above embodiment, the exposure device 10 is manufactured by the manufacturing method of the optical device, but by mounting the light receiving element on the individual substrate, the reading unit (for example, Contact Image Sensor) is manufactured by the manufacturing method of the optical device. You may.

Further, in the method for manufacturing an optical device according to the above embodiment, the lens array 40 is attached to the housing 30 after the individual substrate 20 is attached to the housing 30, but after the lens array 40 is attached to the housing 30, the lens array 40 is attached to the housing 30. The individual substrate 20 may be attached to the housing 30. That is, the first positioning step and the first mounting step may be performed after the second positioning step and the second mounting step.

10 Exposure equipment (an example of optical equipment)
20 Single substrate 22 Unit substrate 24 LED array (example of light emitting element)
30 Housing 40 Lens array (an example of optical components)
62A edge (an example of cutting edge)
90 Large substrate 92A Slit (example of notch)
94A Connecting piece 120 pieces Single board 122 Unit board 170 Pieces board 172 Unit board 190 Large board 192A Slit (example of notch)
194 Connecting pieces 220 pieces Single board 222 Unit board 240 Large board 242A Slit (example of notch)
244 Connecting piece 262A edge (example of cutting edge)
270 Single substrate 272 Unit substrate 290 Large substrate 312A Edge (example of cutting edge)

Claims (6)

A large substrate in which a unit substrate and another substrate are connected by a connecting piece in the width direction of the unit substrate, and the connection is made only to both ends of the unit substrate in an intersecting direction intersecting the width direction. The preparatory process for preparing the large substrate on which the pieces are formed, and
A cutting step of cutting the connecting piece and making the cut edge the outermost part in the width direction of the unit substrate.
A method for manufacturing an individual substrate. A plurality of the connecting pieces are formed side by side in the intersecting direction intersecting the width direction.
The method for manufacturing an individual substrate according to claim 1, wherein in the cutting step, a plurality of the connecting pieces are cut so that the cutting edges are arranged in a straight line when viewed from the plate thickness direction of the unit substrate. In the cutting step, the connecting piece is cut so that the total length of the cutting edges is shorter than the total length of the portions other than the cutting edges in the intersecting directions intersecting the width directions. Item 2. The method for manufacturing an individual substrate according to Item 1 or 2. The method for manufacturing an individual substrate according to any one of claims 1 to 3, further comprising a mounting step of mounting a light emitting element or a light receiving element on the unit substrate between the preparation step and the cutting step. Positioning for positioning the individual substrate in the housing by bringing the cut edge of the individual substrate manufactured by the method for manufacturing the individual substrate according to any one of claims 1 to 4 into contact with the housing. Process and
The mounting process of attaching the individual board in the positioned state to the housing,
A method of manufacturing an assembly comprising. A first positioning step of positioning the individual substrate in the housing by bringing the cut edge of the individual substrate manufactured by the method for manufacturing the individual substrate according to claim 4 into contact with the housing.
The first mounting process of mounting the individual substrate in the positioned state to the housing, and
A second positioning step of positioning the optical component in the housing so that the light emitting element or the light receiving element positioned in the first positioning step and the optical component face each other.
The second mounting process of mounting the optical component in the positioned state to the housing,
A method of manufacturing an optical device comprising.

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